JPH0368513B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC mounting type socket in which an IC lead is mounted on a contact of a socket substrate and a contact pressure is obtained by closing a presser cover.

Prior Art and Problems Figure 1 shows a typical example of a conventional IC mounting socket.

The socket is constructed by rotatably attaching a holding cover 2 to one end of the socket board 1 via a hinge 3, and closing this onto the board 1 on which the IC 8 is mounted, thereby allowing the IC leads 5 mounted on the contacts 4 to be attached. It is configured to press against the elasticity of the contact 4 to obtain contact pressure, and has a presser pad 6 protruding from the inner surface of the presser cover 2 to press the IC lead 5.
In the figure, 7 is a lock lever provided to keep the presser cover 2 closed.

As mentioned above, in the conventional IC socket, the presser pad 6 is provided integrally with the presser cover 2.

Therefore, when attempting to hold an IC with the presser cover 2 having the above structure, as the presser cover 2 rotates, the presser pad 6 on the hinge 3 side will inevitably move forward and move toward the hinge 3 side. Press the placed IC lead 5,
After that, the presser pad 6 on the free end side of the cover 2 presses the IC lead 5 placed on the free end side.
It is difficult to press them simultaneously, and there is a drawback that an uneven load is applied to one of the leads 5 arranged horizontally with respect to the hinge during the process of closing the cover 2. For this reason, it was pressed in advance
There is a possibility that the IC lead 5 may be deformed.

In addition, since the IC leads 5 arranged vertically against the hinge are sequentially pressed from one end of the lead row (hinge side) to the other end (cover free end side), the width of the leads 5 is increased. A biasing force in the direction acts,
Similarly, there is a risk of deformation or lateral displacement.

Purpose of the Invention The present invention provides the above-mentioned method when the presser foot cover is closed.
To provide an IC mounting type socket capable of appropriately holding an IC lead without applying an uneven load to the IC lead and without causing deformation or lateral displacement of the IC lead due to the uneven load. It is.

Structure of the Invention As a means for achieving the above object, the present invention is configured so that when the presser cover is closed, the lead presser member adjusts itself to press the IC leads in each row substantially simultaneously with a substantially perpendicular pressing force. It is something.

Embodiments of the Invention Examples of the present invention will be described below with reference to FIGS. 2 to 7.

The embodiment of the present invention will be described by taking as an example a socket in which a presser cover 12 is rotatably attached to one end of a socket base plate 11 via a hinge 13, as described above.

The socket substrate 11 has contacts 14 located in the area where the IC 18 is mounted. IC18 on the other hand
is a lead 15 protruding from two or four sides thereof.
has. The contact 14 is connected to the IC lead 15
They are arranged in rows on two or four sides of the IC mounting area.

The presser cover 12 can be opened and closed via the hinge 13 with respect to the upper surface of the socket board 11 on which the contacts are arranged, and as described above, the lead presser and the IC are held by closing, and this is released by releasing. .

In order to maintain the above-mentioned closed state, a lock lever 17 is provided at the free end of the presser cover 12 to be engaged with and detached from the socket base plate 11. The lock lever 17 may be provided on the socket board 11 side.

As the lead pressing means, a lead pressing member 16 is movably provided on the pressing cover 12. As an example of the adjustable structure, the lead pressing member 16 is
It is disposed above the IC mounting area and is pivotally connected to the presser cover 12 by a shaft 19, and is rotatable in the lead pressing direction using the shaft 19 as a fulcrum. Presser foot cover 1
2 is rotatably attached by a hinge 13 as in the illustrated target socket, it is rotatable in the opening/closing direction of the presser cover 12.

The lead pressing member 16 as described above is integrally provided with a lead pressing pad 16a corresponding to the lead arrangement (contact arrangement).

In FIG. 2, the center part of the lead presser member 16 is pivoted on an axis parallel to the rotating axis of the presser cover 12 to enable lever movement, and the center part of the lead presser member 16 is supported on both ends of the shaft 19 with the shaft 19 in between. The above IC presser pad 16a is on the side.
will be established.

In the embodiment shown in FIG. 3, the hinge 13 side end of the presser member 16 is pivotally supported in an axis parallel to the rotating axis of the presser cover 12, and a spring biases the presser cover free end side in the presser direction. It is configured to be held at 20. The embodiments shown in FIGS. 2 and 3 both show cases in which the shaft can be adjusted in two directions using the shaft as the fulcrum.

FIG. 4 shows an embodiment in which the presser member 16 in each of the embodiments shown in FIGS. 2 and 3 is movably connected via a universal joint mechanism instead of the pivot mechanism. That is, the presser member 16 and the presser cover 12 are connected via a ball 19' provided on either one,
Adjustable in all directions.

Furthermore, FIG. 5 shows the presser cover 12 holding the holding member 16.
An embodiment is shown in which the presser member 16 is movably attached to the
A space 12 is provided with an outward flange 16b, and the outward flange 16b is provided on the inner surface of the presser cover 12.
a and engages with the inward flange 12b provided in the space 12a, so that it is movable in the lateral and vertical directions, and is adjusted when holding the IC. In this case, the inner surface 12c of the space 12a facing the upper surface of the holding member 16 is sloped so as to protrude at the center.

Each of the embodiments described above shows a case where the IC lead 15 is pressed against the contacts 14 arranged in each direction by the holding member 16 formed of a single member. On the other hand, in the embodiment shown in FIG. 6, the presser member 16 that operates as described above is composed of a plurality of members.

For example, when the contacts 14 and IC leads 15 are arranged in four directions, a pressing member 16' that presses a pair of opposing leads 15 is rotatably supported on a left-right axis 19a, and the other opposing leads 15 are A holding member 16'' which is to press a pair of leads 15 is rotatably supported by a shaft 19b in the front-rear direction so as to obtain adjustment when pressing the leads.

Furthermore, like the embodiment shown in FIG. 6, FIG. 7 shows an embodiment in which a plurality of lead pressing members 16 are carried by the holding cover 12 so that the IC leads 15 arranged in each direction can be pressed row by row. As shown in the figure, a pedestal 12b is provided on the inner surface side of the presser cover 12, and a space 12a is formed inside the pedestal 12b.
The presser member 16 is movably housed in the pedestal 1.
2b, and a presser pad 16a integrally provided with the presser member 16 is inserted into a hole 21 provided in the pedestal 12b and protrudes outward to be movable laterally and vertically. The upper limit of upward movement of the top surface of the lead presser member 16 is set by the inner surface of the presser cover 12 or another regulating member provided integrally with the presser cover 12 to generate a pressing force.

In the embodiment described above, the presser cover is connected to the socket board via a hinge so that it can be opened and closed. Depending on the posture, problems similar to those in the embodiment may occur. The present invention can be practiced and expected to be effective even when the presser cover is separated as described above.

Effects of the Invention As explained above, according to the present invention, when the presser cover is closed, the presser member self-adjusts to absorb and correct the incorrect pressing posture against the IC lead, and always presses the lead in a proper pressing posture. be able to. Therefore, inconveniences caused by the closed posture of the presser cover, such as in conventional contact type IC sockets in which a lead presser is provided integrally with the presser cover, especially when the presser cover is rotated to close the IC lead. Effectively prevents deformation and lateral displacement, and prevents contact and
Highly reliable mounting of each IC lead can be ensured.

Further, even if the presser cover is not hinged to the socket substrate but is separated from it, a similar problem occurs depending on its closed position, and the present invention can be expected to have the above-mentioned effects in this case as well.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view of a conventional IC mounting socket.
FIG. 2 is a sectional view of an IC mounting type socket showing one embodiment of the present invention, FIG. 3 is a sectional view of another example, FIG. 4 is a sectional view of another example, and FIG. FIG. 6 is a cross-sectional view of a presser member showing still another example in plan view, and FIG. 7 is a cross-sectional view of an IC mounting type IC socket showing still another example. 11...Socket board, 12...Press cover,
13...hinge, 14...contact, 15...
IC lead, 16...Press member, 18...IC, 1
9... Axis.

Claims (1)

[Claims] 1 Mount the IC on the socket board, place the IC leads on the contacts of the socket board, close the holding cover on the socket board, and press the IC leads with the holding member provided on the holding cover to make contact with the contacts. An IC mounting type socket adapted to obtain pressure, characterized in that the IC lead holding member is movably attached to the holding cover.