JPH0369138B2 - - Google Patents
Info
- Publication number
- JPH0369138B2 JPH0369138B2 JP59021760A JP2176084A JPH0369138B2 JP H0369138 B2 JPH0369138 B2 JP H0369138B2 JP 59021760 A JP59021760 A JP 59021760A JP 2176084 A JP2176084 A JP 2176084A JP H0369138 B2 JPH0369138 B2 JP H0369138B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- holding
- wafer
- support member
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Beam Exposure (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、半導体基板ウエハ(以下ウエハと呼
ぶ)等の試料保持装置に係り、特に真空中におい
て、ウエハ等の試料を保持するのに好適な試料保
持装置に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a device for holding a sample such as a semiconductor substrate wafer (hereinafter referred to as a wafer), and particularly to a device suitable for holding a sample such as a wafer in a vacuum. Related to a sample holding device.
走査形電子顕微鏡あるいは電子線描画装置等で
ウエハ等の試料を観察もしくはウエハ等の試料表
面に電子線描画する場合には、大気中にあるウエ
ハ等の試料を試料台に装置してこれを真空中に導
入し真空下でウエハ等の試料を観察もしくは描画
する方法が採られている。
When observing a sample such as a wafer using a scanning electron microscope or an electron beam lithography device, or performing electron beam lithography on the surface of a sample such as a wafer, the sample such as a wafer in the atmosphere is placed on a sample stage and placed under vacuum. A method of observing or drawing a sample such as a wafer under vacuum is adopted.
従来のこの種の試料保持装置としては例えばウ
エハを保持する場合には試料保持台に固設された
板部に真空ピンセツト等でウエハの円周上の一部
を直線状に切り取つた部分(この部分をオリエン
テーシヨンフラツトと呼ぶ)の端面を押し当て且
つ前記試料保持台に固設された、ウエハの外周部
を支持する支持体に対向して該ウエハの外周部の
上面をばね等で押圧することによりウエハを保持
していた。 For example, when holding a wafer, a conventional sample holding device of this type has a plate fixed to the sample holding table, and a part of the circumference of the wafer is cut out in a straight line using vacuum tweezers or the like. The upper surface of the outer periphery of the wafer is pressed with a spring or the like against a support that supports the outer periphery of the wafer and is fixed to the sample holding table. The wafer was held by pressing.
しかし上記した従来の試料保持装置にあつては
試料を保持させる為のセツトをピンセツト等を用
いて手動で行なう為に、ごみの付着確率が大であ
り、またウエハの端部もしくは上部を、ばね等で
押さえる為にウエハに傷が付く。更にウエハの位
置決めが正確に行なえない等の欠点を有してい
た。 However, in the conventional sample holding device described above, since the setting to hold the sample is done manually using tweezers, etc., there is a high probability that dust will adhere to the device, and the edge or top of the wafer is held by a spring. The wafer gets scratched because it is pressed down with etc. Furthermore, it has the disadvantage that the wafer cannot be positioned accurately.
本発明の目的は試料を損傷することなく正確に
試料の位置決めを行い得る試料保持装置を提供す
ることにある。
An object of the present invention is to provide a sample holding device that can accurately position a sample without damaging the sample.
本発明は、真空中でウエハ等の試料を保持する
試料保持装置において、基台に固設された支持部
材と、基台で固設され支持部材に載置された試料
端面を保持する複数の保持部材と、支持部材に載
置された試料端面を保持する複数の保持部材と、
支持部材に載置された試料端面を前記保持部材と
共に保持するための保持体を先端に有し周囲の圧
力変化により変位する手段とからなり、該変位手
段は周囲の圧力が大気圧から真空圧に変化した時
に先端の保持体が試料端面に押圧する位置まで変
位することを特徴とするものである。
The present invention provides a sample holding device that holds a sample such as a wafer in a vacuum, including a support member fixed to a base, and a plurality of support members fixed to the base and holding the end face of the sample placed on the support member. a holding member; a plurality of holding members that hold the end surface of the sample placed on the supporting member;
The displacing means has a holder at its tip for holding the end face of the sample placed on the support member together with the holding member, and is displaced by changes in surrounding pressure, and the displacement means changes from atmospheric pressure to vacuum pressure. The holder at the tip is displaced to a position where it presses against the end surface of the sample when the sample changes to .
本発明の実施例を図面に基づいて説明する。第
1図には本発明に係る試料保持装置の一実施例の
構成が示されており、同図において1は基台であ
り、該基台1には試料としてのウエハ4が載置さ
れる支持部材3が固設されており、更にウエハ4
の端面を保持する保持部材2が固設されている。
Embodiments of the present invention will be described based on the drawings. FIG. 1 shows the configuration of an embodiment of a sample holding device according to the present invention, and in the figure, 1 is a base, and a wafer 4 as a sample is placed on the base 1. A support member 3 is fixedly provided, and a wafer 4
A holding member 2 that holds the end face of the holding member 2 is fixedly provided.
また基台1には支持部材3に載置されたウエハ
4の端面を保持部材2と共に保持するための保持
体7を先端に有する変位手段(本実施例では金属
ベローズ)6が固設されている。金属ベローズ6
内部には気体または液体が封入されており、金属
ベローズ6は、その内外の圧力差により保持体7
を変位させる。更に5は金属ベローズ6が周囲圧
力の変化により変位した時に保持体7の移動方向
を規制するためのガイドである。 Further, a displacement means 6 (metal bellows in this embodiment) having a holder 7 at its tip for holding the end face of the wafer 4 placed on the support member 3 together with the holding member 2 is fixed to the base 1. There is. metal bellows 6
Gas or liquid is sealed inside the metal bellows 6, and the holding body 7
Displace. Furthermore, 5 is a guide for regulating the direction of movement of the holder 7 when the metal bellows 6 is displaced due to a change in ambient pressure.
上記構成からなる試料保持装置の動作を第2図
及び第3図により説明する。第2図は動作前の状
態を示し、第3図は動作後の状態を示している。 The operation of the sample holding device having the above configuration will be explained with reference to FIGS. 2 and 3. FIG. 2 shows the state before operation, and FIG. 3 shows the state after operation.
金属ベローズ6は周囲の圧力が大気圧になつて
いる時には第2図に示す状態にあり、周囲の圧力
が真空圧に変化すると、ウエハ4を2方向にウエ
ハ4を3箇の支持部材3上部を滑りながら進ま
せ、ウエハ4のオリエンテーシヨンフラツト部と
保持部材2の2箇が接触し、3箇の保持部材2と
保持体7で保持されるまで伸び方向に変位し続け
ることによりウエハ4を保持する状態に至る(第
3図)。 When the surrounding pressure is atmospheric pressure, the metal bellows 6 is in the state shown in FIG. The wafer is moved forward while sliding and continues to be displaced in the elongation direction until the orientation flat part of the wafer 4 contacts the holding member 2 and is held by the three holding members 2 and the holder 7. 4 (Fig. 3).
本実施例における実験結果は4インチウエハ中
心部で最大5ミクロン、ウエハ端で15ミクロンの
ずれを観測した。この時用いた保持部材2及び保
持体7の偏心量は最大1ミクロンであつた。 In the experimental results of this example, a maximum deviation of 5 microns at the center of a 4-inch wafer and a deviation of 15 microns at the edge of the wafer was observed. The eccentricity of the holding member 2 and the holding body 7 used at this time was 1 micron at most.
本実施例によれば、上記したように真空室中に
おいて、下記のような特徴及び効果を有してい
る。 According to this embodiment, as described above, the following features and effects are achieved in the vacuum chamber.
(1) 真空室中において、上記保持装置は真空室中
の圧力の変化のみだけで自動的にウエハを保持
することが可能である。(1) In a vacuum chamber, the above-mentioned holding device can automatically hold a wafer only by changing the pressure in the vacuum chamber.
(2) 上述第1項において、圧力の低下は除々に行
なわれる為にウエハをウエハ保持位置に静動的
に保持することが可能である。(2) In the above-mentioned item 1, since the pressure decreases gradually, it is possible to statically and dynamically hold the wafer at the wafer holding position.
(3) ウエハを保持する為の保持力は、真空室内部
の圧力変化が大気圧からある任意の圧力までを
反復して行なわれるために保持装置における保
持部材がウエハ端面に与える保持力はほぼ一定
であり、しかも上記事項は再現性に対し非常に
効果がある。(3) The holding force for holding the wafer is that the pressure inside the vacuum chamber changes repeatedly from atmospheric pressure to a certain arbitrary pressure, so the holding force exerted by the holding member in the holding device on the wafer end surface is approximately Moreover, the above matters are very effective for reproducibility.
第4図は本発明の他の実施例を示すもので、第
1図と異なるのはウエハ4のオリエンテーシヨン
フラツト部を直接金属ベロース6にはオリエンテ
ーシヨンフラツト押板8を固定した保持部材でも
つて、オリエンテーシヨンフラツト端部を押圧す
ることによりウエハ保持位置にウエハ4を保持す
るものである。 FIG. 4 shows another embodiment of the present invention, which differs from FIG. 1 in that an orientation flat pressing plate 8 is fixed directly to the metal bellows 6 on the orientation flat portion of the wafer 4. The holding member holds the wafer 4 at the wafer holding position by pressing the end of the orientation flat.
本実施例では、保持部材2の数量を第1図に示
した実施例に比して少なく出来ることから、上記
保持装置における保持部材2の偏心が原因で発生
するウエハの位置ずれを減少させることが可能で
ある。 In this embodiment, since the number of holding members 2 can be reduced compared to the embodiment shown in FIG. 1, it is possible to reduce misalignment of the wafer caused by eccentricity of the holding members 2 in the holding device. is possible.
また実施例によれば被保持物体はウエハに限ら
ず三角形以上の多角形形状を有する被保持体を
も、オリエンテーシヨンフラツト押板8の形状を
相当させることにより真空中において、確実に保
持することが可能である。 Furthermore, according to the embodiment, objects to be held are not limited to wafers, but also objects having a polygonal shape larger than a triangle can be reliably held in a vacuum by making the shape of the orientation flat press plate 8 correspond to the shape of the orientation flat press plate 8. It is possible to do so.
第4図において、第1図と同一番号を付した部
材は同一部材を示すものであるので、ここでは説
明を省く。 In FIG. 4, members given the same numbers as those in FIG. 1 indicate the same members, so a description thereof will be omitted here.
本発明によれば、ウエハ等の試料を真空室中に
おいて、上記室中の圧力の変化のみでもつて自動
的かつ静動的に保持可能であり、しかも再現性が
良好であるので、試料を損傷することなく、所定
位置に正確に保持することが可能となる。
According to the present invention, it is possible to automatically and statically hold a sample such as a wafer in a vacuum chamber by changing the pressure in the chamber, and the reproducibility is good, so that the sample can be It is possible to accurately hold it in a predetermined position without having to do so.
尚、上記実施例においてはウエハの保持につい
て詳述したが、これは単にウエハのみに限ること
ではなく、例えば磁気デスク、オーデイオデスク
等の板材あるいはブロツク等であつても同様であ
る。また変位手段として実施例では金属ベローズ
を用いているがこれらに限らず、ゴム等の弾性体
であつてもよい。 In the above embodiments, the holding of the wafer has been described in detail, but this is not limited to just the wafer, but also applies to plates or blocks such as magnetic desks, audio desks, etc. Furthermore, although metal bellows are used as the displacement means in the embodiment, the present invention is not limited to these, and an elastic body such as rubber may be used.
第1図は本発明に係る試料保持装置の一実施例
の構成を示す平面図、第2図及び第3図は第1図
に示した試料保持装置の正面図の要部を示し、第
2図は動作前の状態を、第3図は動作後の状態を
それぞれ示す図、第4図は本発明に試料保持装置
の他の実施例の構成を示す平面図である。
1…基台、2…保持部材、3…支持部材、4…
ウエハ、5…ガイド、6…変位手段、7…保持
体、8…オリエンテーシヨン押板。
FIG. 1 is a plan view showing the configuration of an embodiment of the sample holding device according to the present invention, FIGS. 2 and 3 are main parts of the front view of the sample holding device shown in FIG. 3 is a diagram showing the state before operation, FIG. 3 is a diagram showing the state after operation, and FIG. 4 is a plan view showing the configuration of another embodiment of the sample holding device according to the present invention. DESCRIPTION OF SYMBOLS 1...Base, 2...Holding member, 3...Supporting member, 4...
Wafer, 5... Guide, 6... Displacement means, 7... Holder, 8... Orientation press plate.
Claims (1)
装置において、基台に固設された支持部材と、基
台に固設され支持部材に載置された試料端面を保
持する複数の保持部材と、支持部材に載置された
試料端面を保持する複数の保持部材と、支持部材
に載置された試料端面を前記保持部材と共に保持
するための保持体を先端に有し周囲の圧力変化に
より変位する手段とからなり、該変位手段は周囲
の圧力が大気圧から真空圧に変化した時に先端の
保持体が試料端面に押圧する位置まで変位するこ
とを特徴とする試料保持装置。 2 前記変位手段は金属ベローズまたはゴム等の
弾性体に気体または液体を封入した構造としたこ
とを特徴とする特許請求の範囲第1項記載の試料
保持装置。[Claims] 1. A sample holding device that holds a sample such as a wafer in a vacuum, including a support member fixed to a base and an end face of the sample fixed to the base and placed on the support member. a plurality of holding members that hold the end face of the sample placed on the support member, and a holder for holding the end face of the sample placed on the support member together with the holding member at the tip. A sample holder comprising a means for displacing due to a change in surrounding pressure, and the displacing means displaces to a position where the holder at the tip presses against the end surface of the sample when the surrounding pressure changes from atmospheric pressure to vacuum pressure. Device. 2. The sample holding device according to claim 1, wherein the displacement means has a structure in which gas or liquid is sealed in an elastic body such as a metal bellows or rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59021760A JPS60167245A (en) | 1984-02-10 | 1984-02-10 | Sample holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59021760A JPS60167245A (en) | 1984-02-10 | 1984-02-10 | Sample holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60167245A JPS60167245A (en) | 1985-08-30 |
| JPH0369138B2 true JPH0369138B2 (en) | 1991-10-31 |
Family
ID=12064019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59021760A Granted JPS60167245A (en) | 1984-02-10 | 1984-02-10 | Sample holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60167245A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0749789Y2 (en) * | 1986-11-19 | 1995-11-13 | 富士通株式会社 | Electronic beam exposure system |
| US4817556A (en) * | 1987-05-04 | 1989-04-04 | Varian Associates, Inc. | Apparatus for retaining wafers |
| US6509564B1 (en) | 1998-04-20 | 2003-01-21 | Hitachi, Ltd. | Workpiece holder, semiconductor fabricating apparatus, semiconductor inspecting apparatus, circuit pattern inspecting apparatus, charged particle beam application apparatus, calibrating substrate, workpiece holding method, circuit pattern inspecting method, and charged particle beam application method |
| EP1890325B1 (en) * | 2005-05-18 | 2014-01-01 | Murata Manufacturing Co., Ltd. | Aligning stage, bump forming apparatus and bump forming method using such aligning stage |
| JP6731668B2 (en) * | 2016-08-08 | 2020-07-29 | 国立研究開発法人産業技術総合研究所 | Microscope observation method and microscope observation auxiliary device |
-
1984
- 1984-02-10 JP JP59021760A patent/JPS60167245A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60167245A (en) | 1985-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2001298072A (en) | Electrostatic chucking device and vacuum processing device using the same | |
| US5532903A (en) | Membrane electrostatic chuck | |
| US3920233A (en) | Spherical support and translation device for wafers | |
| JPH0828205B2 (en) | Wafer transfer device | |
| US4711438A (en) | Mask holding | |
| JPH07136885A (en) | Vacuum chuck | |
| CN1140913C (en) | Workpiece vibration buffer | |
| JPH0369138B2 (en) | ||
| ATE319185T1 (en) | ARRANGEMENT FOR SUPPORTING A SUBSTRATE DURING A CUTTING PROCESS | |
| JP3349572B2 (en) | Thin plate fixing device | |
| JPH07302831A (en) | Common sample holder | |
| JPH0729814A (en) | Mask substrate holding mechanism | |
| JPH08313815A (en) | Positioning and holding device for substrate member | |
| JPH04177856A (en) | Sample-fixing device | |
| JP2000100920A (en) | Wafer holding device | |
| JP2922408B2 (en) | Substrate fixing method and substrate fixing structure | |
| JPH0722035Y2 (en) | Sample fixing device | |
| JPH08264629A (en) | Vacuum tweezers | |
| JP3425249B2 (en) | Sample holder fixing device | |
| JPH05109791A (en) | Pellet bonder and pellet adsorption unit exchange device | |
| JP2562147Y2 (en) | Plate-like processed material holding device | |
| JPH10144777A (en) | Vacuum suction device | |
| JP2006324312A (en) | Substrate holding device | |
| JPH0617299Y2 (en) | Device for fixing processed material to the stage for semiconductor manufacturing equipment | |
| JPH07130824A (en) | Substrate processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |