JPH0370374B2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention provides a method for connecting an IC (integrated circuit) module by means of a lead having one end connected to a terminal of the module and the other end forming a contact surface. This invention relates to an IC module support that is supported within a window provided in a film-like support member.

(Prior art) The above-mentioned IC module support is, for example, an IC module support.
The module can be used to integrate into data carriers such as ID cards. Moreover, such an IC module support can also be used as an alternative to a so-called dual in-line package. ID such IC module support
Special problems arise in the manufacture and use of ID cards when incorporated into flexible data carriers such as cards.

In order to protect the module and its terminal leads, it has been proposed to support the module (integrated circuit) and its lead network (so-called spider connection) on the same relatively vertical support member (West German Application No. 2659573). ). The spider connection consists of a plurality of leads with one end connected to a terminal of the module and the other end forming a contact surface on the support member. Its IC module support is I.
D. Heat-seal or glue its edges to the card film.

IC proposed in the above West German application
The module support is relatively large compared to the size of the module alone. This is mainly due to the fact that the contact surfaces are all arranged around the module. IC module supports with large surface areas are susceptible to damage due to mechanical stress when incorporated into ID cards, for example.

A structural shape adapted to the size of the module is also advantageous in other applications, for example when integrating IC module supports into miniature hybrid circuits.

Conventional IC module supports are cumbersome to incorporate into ID cards and are not suitable for mass production. That is, conventional IC module support I.
D. When assembled into a card, it should be possible to make contact with the contact surface fixed to its support.
An appropriate cutout must be provided on the ID card. In order to prevent the contact surfaces from getting dirty in a short time, the notches must be filled with conductive material. Apart from increasing the number of processes required for this, this method increases the number of contact points, making the ID
The probability that disturbance or interference will occur during card operation increases.

(Object of the Invention) In view of the above circumstances, the present invention provides an IC module support of the type described above, the overall size of which is very close to that of an IC module, and which is suitable for IC modules.
The object is to provide an IC module support that protects the module well and is extremely easy to incorporate into data carriers such as ID cards, and is therefore suitable for mass production.

According to the invention, this object is achieved in that the leads extend beyond the edges of the support member and are thereby free to bend.

That is, the protruding portion of the lead extending beyond the edge of the support member can be bent to a desired position as needed.

For example, by bending the protruding part of the lead along the surface of the support member and holding the contact surface close to the module or to a position where it overlaps with the module, you can create a compact IC module that is extremely close to the size of the IC module. Becomes a support. The IC module support thus obtained is extremely advantageous for use in parts where small size is important, such as hybrid circuits for watches.

Furthermore, the IC module support of the present invention can be incorporated into a data carrier such as an ID card by simply making a very small blind hole in the data carrier and gluing it into the hole.

Since the IC module support of the present invention is small,
Since the area exposed to mechanical stress is reduced accordingly, the degree of operational safety of the card is increased.

The IC module support of the present invention can be incorporated into an ID card in a very simple manner. That is, the free end of the lead is first passed through a pre-made recess in the cover film of the card, the lead is bent toward the part of the cover film that will overlie the module, and the cover film is laminated with the other layers. Sometimes it can be pushed into the cover film. The card manufactured in this manner has no seams between the contact portion and the cover film, and has a good appearance. Also, the IC module support fixed in the center of the card is very well protected, and the module is connected to the external contact surface by one contact.

(Example) Examples of the present invention will be described in detail below with reference to the drawings.

1 to 3 show an example of a method for manufacturing an IC module support according to an embodiment of the present invention. Film materials can be used as supports for IC modules. The perforation 2 provided on the film material 1 can be used for transporting the film material 1 during each manufacturing process or for positioning it, for example in a bonding device.

The spider connection with a plurality of leads 4 used to connect the module 3 to the film material 1 is formed in this example by etching a conductive thin film by known methods.

In the bonding of semiconductor modules, it is also known to manufacture spider connections in a separate process from the supporting film material. In this case, the spider connections are placed on a supporting film during the bonding process and are then bonded to the supporting film and to the terminals of the module.

Whichever way the spider connection is made, each lead 4 connects to a corresponding terminal 6 on the module 3.
One end is connected to. The end 4a of the lead 4 forming the contact surface is in this embodiment made freely movable over a window 7 cut in the film material 1.

FIG. 2 is a sectional view of FIG. 1. module 3
The film material 1 supporting the module 3 has a thickness greater than the sum of the thickness of the module 3 and the thickness of the lead 4. This provides good protection for the module 3 and leads 4.

The lead 4 is bonded to the film material 1 over a relatively small area so that the end 4a can move freely.

FIG. 3 shows one IC module support 10 separated from the film material 1 by cutting the portion 11 shown in broken lines in FIG. When the length of the lead 4 is longer than the width of the window 7 to the extent that it straddles the window 7, as shown by the broken line in FIG. 1, the lead 4 is also cut in the cutting process.

Next, an example of a preferred method of using the support shown in FIGS. 1 to 3 will be described.

In the example shown in FIGS. 4a and 4b, each lead 4 is folded back along the surface of the film material 1 so that the end 4a overlaps the module 3. The space 15 is then filled with a material suitable for protecting the module 3 and the leads 4. In this process,
The folded end 4a is also buried within the material and thereby secured.

In order to simplify the process, it is desirable to bend the leads 4 and fill the spaces 15 with material before separating the individual supports from the film material 1. In this example, a support 16 is obtained as shown in FIG. 4b. This support is extremely compact and does not grow much compared to the size of the IC module.

Figures 5a and 5b show an example in which the spider connection leads are manufactured in a separate process from the supporting film. In this case, apply a suitable adhesive 1 during or before bonding.
The lead 4 of the spider connection must be glued to the film material 1 by means 7. The bending of the lead 4 and the filling into the space 15 are performed as described above.

Also in this example, each lead 4 is passed through and sealed within a recess 18 provided in the edge of the film material. This makes it possible to strengthen the bond between the lead 4 and the film material.

In the embodiment shown in FIGS. 6a-6c, the thickness of the film material 25 used to bond the module 3 is smaller than the thickness of the module 3. Further, in this embodiment, the protruding end portion 4a of the lead 4 is connected to the movable portion 26 of the film material 25.
placed above. This movable part 26 is connected to other parts only by a thin connecting part 27,
It is arranged so that it can be moved in a direction perpendicular to the plane of the film material 25. After bonding the module 3, the protruding end 4a of the lead 4 is folded back together with the movable portion 26 of the film material to the back side of the lead 4 as shown by the arrow 28 in FIG. 6b. The space 29 thus formed around the module 3 is filled with a material that protects the module 3.

In this embodiment, the IC module support 30 from which the film material 25 is separated by cutting the connecting portion 52 along the broken line does not become much larger than the module 3. Further, since the film material is folded back and overlapped, the module 3 is located approximately at the center of the thickness of the support 30, so that the module 3 is well protected.

Next, a method for easily incorporating the IC module support according to the present invention into a data carrier such as an ID card will be explained with reference to FIG.

First, the support 40 is inserted into an opening 45 in the core 42 of the card, which is approximately the same size as the support 40, and is held in place by the cover film 43 below the core 42. Next, the front cover film 41 is placed over the core 42 so that the protruding ends 4a of the leads are passed through the slots 44 provided in the front cover film 41. After the portion of the next lead protruding from the cover film 41 is bent onto the cover film 41, each film and the support 40 are bonded to each other by heat lamination or the like.

As shown in FIG. 8, in the finally completed ID card, the protruding end portion 4a of the lead, that is, the contact surface, is seamlessly pushed into the front cover film 41. This improves the appearance of the card and makes it easier to keep the contact surfaces clean.

Further, as shown in FIG. 8, the IC module is connected by only one contact to a contact surface 4a located on the surface of the card and directly electrically connected to surrounding devices. Therefore, it is more reliable than traditional ID cards with integrated circuits.

Figures 9a and 9b show examples of cover films suitable for use in the above-described method of incorporating the IC module support of the present invention into ID cards. In Figures 9a and 9b, the cover film 48
is provided with a slot 49 to facilitate passage of the end of the lead. Furthermore, the ends of the leads are bent toward the surface of the cover film 48 as they are passed through the slots 49. The ends of the leads are thereby automatically pushed by the laminate during the lamination process into their final positions as shown in FIG.

Figure 10 shows the film 5 in which the IC module 3 is bonded to the supporting film member 1 before bonding.
An example is shown in which it is first fixed to 0 with a suitable adhesive 51. In this example, film 50 is shown in FIG.
Advantageously, it can be used as a cover film for ID cards, making the production of ID cards easier.

Figures 11 to 13 show an embodiment in which a cast casing is used as a support member for an IC module.

In this embodiment, first, the module 3 is bonded as described in FIGS. 1-3. Next, a casting casing 63 is placed only around the module 3 disposed within the window 61 of the film member 60 using a suitable casting device (not shown). Window 61 of film member 60 at protruding end 4a of lead
The IC module support 64 punched from
This is shown in Figure 3. The end 4a of the lead protruding from the cast casing 63 can be bent freely, for example along the surface of the cast casing 63.

The IC module support of this embodiment is extremely compact and is not much different in size from the module 3 itself. Further, the IC module support of this embodiment includes only the IC module and leads, and the support film member 60 to which the leads were fixed during bonding has been removed.

FIG. 14 shows an embodiment in which the support film member is not used even during bonding. In this embodiment, a conductive film 65 is used to bond the module 3, and the leads 4 are formed from the conductive film 65 by etching or punching. Perforation 66 of film 65 is used to transport film 65 at each step.

After enclosing the module in the cast casing 63, an IC module support similar to that shown in FIG. 13 is obtained by cutting the connecting portion 68 (in this example, the same as the end 4a of the lead).

[Brief explanation of drawings]

Figures 1 to 3 are diagrams showing an example of a method for manufacturing an IC module support according to an embodiment of the present invention, and Figures 4a to 5
Figure b is a diagram illustrating an example of the use of the IC module support of the present invention, Figures 6a to 6c are diagrams illustrating a method of manufacturing an IC module support of another embodiment of the present invention and a method of using the same, Figure 7 The figure is a diagram explaining the method of incorporating the IC module support of the present invention into an ID card, FIG. 8 is a cross-sectional view of an ID card manufactured by the method of FIG. 7, and FIGS. 9a and 9b are diagrams of FIG. FIG. 10 is a diagram showing an example of a cover film suitable for use in the method of the present invention, FIG. 10 is a diagram showing an example in which a film supporting a module and a cover film of an ID card are integrated, and FIGS. Diagrams showing the manufacturing process of IC module supports of other examples,
Figure 14 is manufactured by the method shown in Figures 11-13.
It is a figure which shows another manufacturing method of an IC module support body. 1...Film member, 3...IC module,
4...Lead, 4a...Protruding end.

Claims (1)

[Scope of Claims] 1. An integrated circuit module comprising a support film provided with freely bendable conductive leads having one end connected to a terminal of the integrated circuit module and the other end forming a contact surface. In the support, the other end of the lead is connected to at least one part of the film.
It is noted that the independent parts 26 are arranged on two independent parts 26, which are connected to the support film 1 in such a way that they can be folded to the opposite side of the support film 1, thereby doubling the thickness of the support film. Features an integrated circuit module support. 2. The integrated circuit module is surrounded by a material suitable for protecting the integrated circuit module and the portions of the leads not supported by a support film. Integrated circuit module support as described in Section 1. 3. Claim 1, characterized in that said support is provided in a window of a filmstrip, and said support is connected to said filmstrip by an easily separable connection. An integrated circuit module support according to item 1 or 2. 4. A supporting film provided with electrically conductive leads which are freely bendable and extend beyond the edges of the supporting film, with one end connected to the terminals of the integrated circuit module and the other end forming a contact surface. In the integrated circuit module support, a further film 41, 48, 50 having slots 44, 49 is attached to the support film, and the freely bendable ends of the leads pass through the slot to the further film 41, 4.
An integrated circuit module support, characterized in that it is folded over a surface of 8,50. 5. An integrated circuit module support according to claim 4, characterized in that the ends of the leads are pressed into the surface of the further film.