JPH0370932B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sealed electronic component and a multiple case member used for manufacturing the same.

[Prior Art] As a method of manufacturing electronic components such as resonators, case members for electronic components are configured in multiple series, electronic components are loaded in the case members in advance and sealed, and then,
A method is known in which the case member is divided to obtain a plurality of sealed electronic components.

For example, in FIG.
An example is shown in which it is enclosed in a pair of case members 34 made of a pair of resin case members 32 and 33. The lower case member 33 described above has a pair of left and right storage sections 35, 35 for storing the resonator 31, and both storage sections 3.
It has a connecting part 36 that connects 5 and 35 together,
On the other hand, the upper case member 32 includes a pair of left and right cap parts 37, 37 that are ultrasonically welded to each storage part 35, and a connecting part 3 that connects both cap parts 37, 37 together.
8. In this case, in order to increase the durability of the case, the upper and lower case members 32 and 33 are made of relatively hard resin.

By the way, when manufacturing a sealed resonator unit using multiple case members 34, the connecting portion 3
6, 38, the upper and lower case members 32,
33, the connecting portion 36 or 38 is formed as shown in the figure.
There was a problem in that warping often occurred in the case, which caused variations in adhesion between the upper and lower case members 32 and 33. In this type of sealed electronic component, in order to increase the adhesive strength between the storage section 35 and the cap section 37,
Generally, the storage portion 35 and the cap portion 37 are bonded together by ultrasonic welding, but in that case, bonding becomes more difficult and cannot be bonded uniformly. As a result, the sealing performance of the resonator 31 deteriorates.

As a countermeasure to this problem, it is possible to make the connecting parts 36, 38 thinner to improve the fit between both case members 32, 33, but if the connecting parts 36, 38 are made thinner, the connecting parts 36, 38 will not only warp but also have a horizontal surface. Various deformations such as twisting of curvature within the tube are more likely to occur, which is not necessarily preferable.

Furthermore, if the connecting parts 36 and 38 are made thinner, when molding both case members 32 and 33, the resin will be difficult to flow at the connecting parts 36 and 38 in the mold, and the molding accuracy of both case members 32 and 33 will be reduced. descend.

[Objectives of the Invention] The present invention aims to facilitate the production of sealed electronic components and improve the sealing performance of the electronic components, and to facilitate the molding of multiple case members used in the production of sealed electronic components. The purpose is

[Structure of the Invention] Therefore, the method for manufacturing a sealed electronic component according to the present invention includes a lower case member formed by integrally connecting a plurality of storage sections for storing electronic components with a connecting section, and a cover for each of the storage sections. When resin molding an upper case member formed by integrally connecting a plurality of cap parts at a connecting part, holes or recesses are provided in the connecting part of at least one of the case members, leaving both ends in the width direction. , the storage parts and the cap parts are successively bonded together, and then the connecting parts are separated.

That is, since the hole or recess is provided in the connecting portion of at least one of the case members, the connecting portion is easily bent, and both case members can be easily brought into close contact with each other.

Further, in the present invention, the multiple case member used in the manufacturing process of sealed electronic components includes a lower case member formed by integrally connecting a plurality of storage sections for storing electronic components with a connecting section, and a lower case member that is formed by connecting a plurality of storage sections for storing electronic components together, and and an upper case member formed by integrally connecting a plurality of cap parts that cover the parts at a connecting part, and a hole or a recess is provided in the connecting part of at least one of the case members except at both ends in the width direction. It is characterized by

[Effects of the Invention] As described above, in the present invention, since a hole or a recess is provided in the connecting portion of one of the case members, the fitting of both case members is good, and the adhesion between both case members is improved. Therefore, with both case members in close contact with each other, each housing section and the cap section can be easily and uniformly adhered, and the sealing performance of the electronic components can be improved.

In addition, since holes or recesses are formed in the connecting portion leaving both ends in the width direction, the connecting portion may curve in the horizontal plane despite the provision of the holes or recesses.
There is no twisting. Furthermore, since the connecting portion can have a certain width, the molding accuracy of the case member can be improved.

[Example] Next, an example of the present invention will be described based on the accompanying drawings.

That is, as shown in FIG. 1, when electronic components such as resonators are sealed in a case, a method is adopted in which a plurality of electronic components are sealed in advance in a case member formed in multiple series. In the example shown, the upper and lower 1
Case member 1 consisting of a pair of case members 2 and 3 is 2
The lower case member 3 has a pair of left and right storage parts 6, 6 for storing two resonators 4, 4, while the upper case member 2 covers each of the storage parts 6, 6. A pair of left and right cap portions 5, 5 are provided. The cap parts 5, 5 and the storage parts 6, 6 are integrally connected by connecting parts 7, 8, respectively.

Electrodes 9, 9 are formed on the upper and lower surfaces of each resonator 4, and this resonator 4 is connected to contact portions 10a, 11 of a pair of upper and lower terminal plates 10, 11 via the electrodes 9, 9.
It is supported at the node of vibration by a. The resonator 4 and the terminal plates 10, 11 are enclosed between the opposing cap portions 5 and storage portions 6 of both the upper and lower case members 2, 3.

The terminal plate 11 has, for example, a planar shape as shown in FIG.
It is equipped with Note that the terminal board 10 is also configured in substantially the same manner. Then, both terminal boards 10, 11 are connected via the drawer part.
By applying an electric signal between them, the resonator 4 can be vibrated.

As shown in FIGS. 2 and 3, in the vicinity of the cap portion 5 and storage portion 6 of the connecting portions 7 and 8 of the upper case member 2 and lower case member 3, there are square holes 1 facing each other.
2 and 13 are dawning. These square holes 12,1
A plurality of holes 3 may be arranged in the width direction of the connecting portions 7 and 8, and instead of the square holes 12 and 13, round holes, oval holes, etc. may be provided, or recesses may be formed. Note that the square holes 12, 13, etc. may be provided only in the connecting portions 7, 8 of one of the case members 2, 3.

Here, the manufacturing procedure of the sealed resonator will be explained.

() A resin material is poured into a predetermined mold, and an upper case member 2 having cap parts 5, 5, a connecting part 7, square holes 12, 12 made in the connecting part 7, and an absorbing part 6 are formed. , 6, the connecting part 8, and the square hole 1
3 and 13 are molded.

() The terminal plate 11, the resonator 4, and the terminal plate 10 manufactured in advance are sequentially inserted into each storage portion 6 of the lower case member 3.

() The upper case member 2 is joined to the lower case member 3, and ultrasonic vibration is applied to the cap parts 5, 5 of the upper case member 2 to melt the overlays 14, 14 on the lower surface of the cap parts 5, 5 with frictional heat. Then, the opposing cap portion 5 and storage portion 6 are welded to seal the resonator 4 and the terminal plates 10 and 11.

(v) Separate both ends of the connecting parts 7 and 8 at cutting planes AA and BB to obtain two sealed resonators.

As mentioned above, the square holes 12, 12,
13, 13, etc., both case members 2, 3
The case members 2 and 3 can be easily brought into close contact with each other when bonding the case members 2 and 3 together. Therefore, the opposing cap portion 5
The housing portion 6 can be easily and uniformly ultrasonically welded, and the sealing performance of the resonator 4 can be greatly improved.

In addition, since the square holes 12, 12, 13, 13, etc. are formed in the continuous parts 7, 8 by leaving both ends in the width direction, the connecting parts 7, 8 are prevented from curving or twisting in the horizontal plane. It disappears. Moreover, since a certain width can be secured in the connecting parts 7 and 8, when resin is injected into a mold to mold the case members 2 and 3, resin can be easily injected, and the case members 2 and 8 can be easily injected. 3. The molding accuracy improves.

Note that 15 to 18 in FIG. 3 are lower case members 3.
20 and 21 are grooves through which the lead-out portions of the terminal boards 10 and 11 pass, and 22 is a sealing resin (not shown).
This is a protrusion to prevent it from coming off.

In embodying the present invention, each case member 2,
It is also possible to provide three or more pairs of cap portions 5, 5, . . . and storage portions 6, 6, . Furthermore, the present invention is applicable to various electronic components other than resonators.

[Brief explanation of drawings]

Fig. 1 is a schematic cutaway front view of a multiple case member enclosing a resonator, Fig. 2 is a partial bottom view of the upper case member, Fig. 3 is a partial plan view of the lower case member, and Fig. 4 is a plan view of the terminal board. FIG. 5 is a schematic cutaway front view of a conventional multiple case member. 1... Multiple case member, 2... Upper case member,
3...Lower case member, 5...Cap part, 6...
Storage section, 7, 8...Connection section, 12, 13...hole.

Claims (1)

[Scope of Claims] 1. A lower case member formed by integrally connecting a plurality of storage parts for storing electronic components at a connecting part, and a plurality of cap parts covering each of the above-mentioned storage parts integrally connected by a connecting part. When resin molding the upper case member, a hole or a recess is provided in the connecting portion of at least one of the case members, leaving both ends in the width direction, and then each storage portion and the cap portion are adhered,
A method for manufacturing a sealed electronic component, characterized in that the connecting portion is then separated. 2 Used in the manufacturing process of sealed electronic components,
A multiple case member consisting of a lower pair of case members, the lower case member having a plurality of storage parts for storing electronic components connected together by a connecting part, and a plurality of caps covering each of the storage parts. and an upper case member formed by integrally connecting two parts at a connecting part, and a hole or a recess is provided in the connecting part of at least one of the case members, leaving both widthwise ends thereof. Continuous case parts.