JPH0371024B2 - - Google Patents
Info
- Publication number
- JPH0371024B2 JPH0371024B2 JP6348084A JP6348084A JPH0371024B2 JP H0371024 B2 JPH0371024 B2 JP H0371024B2 JP 6348084 A JP6348084 A JP 6348084A JP 6348084 A JP6348084 A JP 6348084A JP H0371024 B2 JPH0371024 B2 JP H0371024B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulating layer
- edge
- substrate
- common electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
この発明はサーマルプリントヘツドおよびその
製造法に関する。DETAILED DESCRIPTION OF THE INVENTION This invention relates to a thermal print head and method of manufacturing the same.
この種のサーマルプリントヘツドにおいて、プ
リント用の発熱体を、基板の一方の端縁にできる
限り接近させて設置することは、プリント直後に
感熱紙へのプリント文字を判読することができる
点で有利である。しかし発熱体の幅方向に横切る
ように通電用の電極を設置する構成では、発熱体
の一方の側縁と基板の一方の端縁との間に前記電
極の設置面積を確保する必要がある。そのためこ
の設置面積の分だけは発熱体を基板の一方の端縁
に接近させることはできないものとされていた。 In this type of thermal print head, it is advantageous to install the heating element for printing as close as possible to one edge of the board, since characters printed on thermal paper can be read immediately after printing. It is. However, in a configuration in which current-carrying electrodes are installed across the width of the heating element, it is necessary to secure an installation area for the electrodes between one side edge of the heating element and one end edge of the substrate. Therefore, it was considered impossible to bring the heating element close to one edge of the substrate due to this installation area.
これを解決するために発熱体の両端に連る一方
の電極と他方の電極とをともに基板の反対側の端
縁に向けて延長させ、一方の電極は共通電極に接
続し、他方の電極は前記共通電極の表面に形成さ
れた絶縁層の表面にまで延長し、又前記一方の、
共通電極に接続された一方の電極も前記絶縁層の
表面にまで同じように延長させた構成が本発明者
によつて別途提案された。このような構成によれ
ば、発熱体の一方の側縁と基板の端縁との間に電
極を設置する必要がなくなるので、発熱体を基板
の一方の端縁に十分接近して設置することができ
るようになつて、極めて都合がよい。 To solve this problem, one electrode and the other electrode connected to both ends of the heating element are both extended toward the opposite edge of the substrate, one electrode is connected to the common electrode, and the other electrode is connected to the common electrode. extending to the surface of the insulating layer formed on the surface of the common electrode;
The inventor separately proposed a configuration in which one electrode connected to the common electrode also extends to the surface of the insulating layer. According to such a configuration, there is no need to install an electrode between one side edge of the heating element and the edge of the substrate, so the heating element can be installed sufficiently close to one edge of the substrate. This is extremely convenient.
ところでこの種の発熱体は、これからの熱が基
板にできるだけ伝導されないようにするためにグ
レーズ層の表面に設置することが要求される。そ
のため前記した既提案の構成では基板の表面に全
面的にグレーズ層を形成し、その一部、つまり基
板の一方の端縁に接近する一部分の表面に発熱体
を形成するようにしている。そのためこのグレー
ズ層と、前記した絶縁層のためのグレーズ層とを
それぞれ別工程で形成せざるを得なかつた。した
がつてその製作のみならず、構成が極めて煩雑と
なる欠点がある。 Incidentally, this type of heating element is required to be installed on the surface of the glaze layer in order to prevent heat from being conducted to the substrate as much as possible. Therefore, in the previously proposed configuration, a glaze layer is formed on the entire surface of the substrate, and a heating element is formed on a portion of the glaze layer, that is, a portion of the surface near one edge of the substrate. Therefore, this glaze layer and the glaze layer for the above-mentioned insulating layer had to be formed in separate steps. Therefore, there is a drawback that not only the production but also the configuration is extremely complicated.
又各電極の形成にあたつても、既提案では共通
電極及び発熱体を幅方向に横切る各電極とをそれ
ぞれ別個のエツチング工程によつているため、そ
の意味においても製作が面倒となる。 Furthermore, in forming each electrode, in the existing proposal, the common electrode and each electrode that crosses the heating element in the width direction are subjected to separate etching processes, which makes the manufacturing process complicated.
この発明は、発熱体と基板の端縁との間に電極
を設置しないことにより、発熱体を基板の端縁に
十分接近させるようにするための構成の簡易化を
図ることを目的とする。又この発明は前記の構成
の製造の容易化を図ることを目的とする。 An object of the present invention is to simplify the configuration in order to bring the heating element sufficiently close to the edge of the substrate by not installing an electrode between the heating element and the edge of the substrate. Another object of the present invention is to facilitate the manufacture of the above structure.
この発明の実施例を図によつて説明する。1は
アルミナセラミツクのような絶縁性の基板であ
る。この発明ではこの基板1の一方の絶縁1A側
に接近させてプリント用の発熱体を設置しようと
している。2は基板1の表面に設置される共通電
極で、その一方の端縁2Aと端縁1Aとは空所3
を介して相対している。2Bは共通電極2の導出
部である。4は共通電極2の表面を覆う絶縁層
で、たとえば後記するようにグレーズ層等から構
成される。この絶縁層4は、共通電極2の端縁2
A側において一定のピツチP毎に、その端縁2A
が露出するように共通電極2を覆つている。具体
的には共通電極2の端縁2Aに、ピツチP毎に分
岐電極2Cを形成しておき(第2図以降の図を参
照。)、この分岐電極2Cを残して絶縁層4をもつ
て共通電極2を覆うようにする。 Embodiments of the invention will be described with reference to the drawings. 1 is an insulating substrate such as alumina ceramic. In the present invention, a heating element for printing is installed close to one side of the insulation 1A of the substrate 1. 2 is a common electrode installed on the surface of the substrate 1, and one edge 2A and edge 1A are connected to the space 3.
are relative through. 2B is a lead-out portion of the common electrode 2. Reference numeral 4 denotes an insulating layer covering the surface of the common electrode 2, which is composed of, for example, a glaze layer as described later. This insulating layer 4 covers the edge 2 of the common electrode 2.
At every fixed pitch P on the A side, the edge 2A
The common electrode 2 is covered so that it is exposed. Specifically, a branch electrode 2C is formed at each pitch P on the edge 2A of the common electrode 2 (see the figures after FIG. 2), and the insulating layer 4 is formed by leaving this branch electrode 2C. It is made to cover the common electrode 2.
基板1の端縁1A側の表面に絶縁層5を、同じ
くグレーズ層等によつて構成する。そしてこの絶
縁層5から空所3を介して絶縁層4の表面にまで
またがるように電極6,7を形成する。電極6は
個別用の電極としての役目を果し、電極7同志の
間に配置されている。電極7は共通用の電極とし
ての役目を果し、空所3において、絶縁層5から
露出している各分岐電極2Cと重なり合つてい
る。8はプリント用の発熱体で絶縁層5の表面
に、各電極6,7をその幅方向に横切るように形
成される。9は発熱体8を各電極6,7で区分さ
れた発熱領域8Aを選択的に通電発熱させるため
の、集積回路等からなる駆動回路で、絶縁層4の
表面に設置される。10は駆動回路9に駆動信号
を外部から与える端子電極、11は電極6、端子
電極10と、駆動回路9とを接続する金線のよう
なワイヤである。なお図示していないがこれらの
表面には保護膜、耐摩耗性膜等が必要により形成
される。 An insulating layer 5 is formed on the surface of the substrate 1 on the side of the edge 1A, also made of a glaze layer or the like. Then, electrodes 6 and 7 are formed so as to extend from this insulating layer 5 to the surface of the insulating layer 4 via the space 3. Electrode 6 serves as an individual electrode and is arranged between electrodes 7. The electrode 7 serves as a common electrode, and overlaps each branch electrode 2C exposed from the insulating layer 5 in the space 3. Reference numeral 8 denotes a heating element for printing, which is formed on the surface of the insulating layer 5 so as to cross each of the electrodes 6 and 7 in its width direction. Reference numeral 9 denotes a drive circuit made of an integrated circuit or the like, which is installed on the surface of the insulating layer 4 to selectively energize the heat generating region 8A of the heat generating element 8 divided by the electrodes 6 and 7 to generate heat. Reference numeral 10 denotes a terminal electrode that externally supplies a drive signal to the drive circuit 9, and 11 a wire such as a gold wire that connects the electrode 6, the terminal electrode 10, and the drive circuit 9. Although not shown, a protective film, a wear-resistant film, etc. are formed on these surfaces as necessary.
以上の構成において、導出部2Bを発熱用の電
源の一方の端子に接続すれば、すべての発熱領域
8Aの一端は導出部2B、分岐電極2C及び電極
7を介して前記電源の一方の端子に接続されるこ
とになる。したがつてあとは駆動回路9の出力信
号に応じて電極7を選択的に前記電源の他方の端
子にすれば、発熱領域8Aは選択的に発熱される
ことになる。これらの動作はこの種のサーマルプ
リントヘツドのそれと特別相違するものではな
い。 In the above configuration, if the lead-out portion 2B is connected to one terminal of the power source for heat generation, one end of all the heat-generating regions 8A is connected to one terminal of the power source via the lead-out portion 2B, the branch electrode 2C, and the electrode 7. It will be connected. Therefore, if the electrode 7 is then selectively made the other terminal of the power source in accordance with the output signal of the drive circuit 9, the heat generating area 8A will selectively generate heat. These operations are not particularly different from those of this type of thermal print head.
しかし前記した説明から理解されるように、こ
の構成では、既提案のように基板1の表面に一様
にグレーズ層を形成せずに、さきに形成された共
通電極の表面と、基板1の端縁1A側とに絶縁層
4,5を設けるようにしている。そして共通電極
2と基板1との間にはグレーズ層を設けてはいな
い。そのため既提案のような共通電極の表裏面で
のグレーズ層の設置は省略されるので、それだけ
共通電極の絶縁のための構成が簡易となる。換言
すれば既提案の構成では、基板1の表面において
最下層のグレーズ層と、共通電極と、その表面の
グレーズ層との三層構造となるのに対して、この
発明では最下層のグレーズ層を省略した二層構造
ですむことになるのである。このように二層構造
ですますことができるようになつたのは、発熱体
8のみの絶縁層5を設けたことにより可能となつ
たのである。そして後記するように両絶縁層4,
5を同時にグレースの印刷、焼成を実行すれば、
一回の処理で形成でき、それだけ製作も容易とな
る。 However, as can be understood from the above explanation, in this configuration, the glaze layer is not uniformly formed on the surface of the substrate 1 as in the previous proposal, but the glaze layer is formed on the surface of the previously formed common electrode and on the surface of the substrate 1. Insulating layers 4 and 5 are provided on the edge 1A side. Further, no glaze layer is provided between the common electrode 2 and the substrate 1. Therefore, the provision of glaze layers on the front and back surfaces of the common electrode as previously proposed is omitted, which simplifies the configuration for insulating the common electrode. In other words, in the previously proposed configuration, the surface of the substrate 1 has a three-layer structure consisting of the lowermost glaze layer, the common electrode, and the glaze layer on the surface, whereas in this invention, the lowermost glaze layer This means that a two-layer structure can be used without the . This two-layer structure was made possible by providing the insulating layer 5 of only the heating element 8. Then, as described later, both insulating layers 4,
If you execute Grace printing and firing at the same time in step 5,
It can be formed in a single process, which makes manufacturing easier.
次にこの発明による製作方法を第3図によつて
説明する。 Next, the manufacturing method according to the present invention will be explained with reference to FIG.
まず基板1の表面に第3図のAのように共通電
極2、導体部2Bをスクリーン印刷による形成す
る。このとき分岐電極2Cをも同時に形成する。
しかしこの分岐電極2Cとしては図示するように
電極7よりも充分広い幅に形成しておく。これは
後記するように電極7のエツチングの際のマスク
の位置合わせを容易にするためである。2C′はエ
ツチングによつて分岐電極2Cとなる電極部分で
ある。共通電極2の端縁2Aは基板1の端縁1A
より離隔していることは前記したとおりである。 First, the common electrode 2 and the conductor portion 2B are formed on the surface of the substrate 1 by screen printing as shown in A of FIG. At this time, branch electrodes 2C are also formed at the same time.
However, this branch electrode 2C is formed to have a width sufficiently wider than the electrode 7 as shown in the figure. This is to facilitate alignment of the mask when etching the electrode 7, as will be described later. 2C' is an electrode portion that becomes a branch electrode 2C by etching. The edge 2A of the common electrode 2 is the edge 1A of the substrate 1.
As mentioned above, they are further apart.
既提案のものは、共通電極2のエツチングによ
り形成していた。これは電極7との重なり精度を
維持するために、その重なり部分の位置を高精度
に設定する必要があつたからである。しかし前述
のように電極7よりも幅の広い電極部分2C′を使
用すれば、その位置合わせは容易となるから、位
置の高精度はあまり要求されない。したがつてエ
ツチングによる形成によらず、位置精度の低いス
クリーン印刷によつて共通電極2を形成しても特
別な支障は生じないようになる。 In the existing proposals, the common electrode 2 was formed by etching. This is because in order to maintain the accuracy of overlapping with the electrode 7, it was necessary to set the position of the overlapping portion with high accuracy. However, as described above, if the electrode portion 2C' which is wider than the electrode 7 is used, the positioning becomes easy, and therefore high positional accuracy is not required. Therefore, even if the common electrode 2 is formed not by etching but by screen printing with low positional accuracy, no particular trouble will occur.
次に絶縁層4,5を第3図のBのように形成す
る。これはグレーズのスクリーン印刷によつて形
成するとよく、両絶縁層4,5は一回のスクリー
ン印刷、焼成によつて同時に形成することができ
るようになる。 Next, insulating layers 4 and 5 are formed as shown in FIG. 3B. This is preferably formed by glaze screen printing, and both insulating layers 4 and 5 can be formed simultaneously by one screen printing and firing.
ついで電極6,7及び端子電極10のためにエ
ツチング処理を行なう。そのためにまず第3図の
Cに示すように電極層12を基板1の表面にたと
えばスクリーン印刷によつて形成する。そしてこ
れを所要のパターンどおりにエツチングする。こ
のとき電極7よりも電極部分2C′が幅広とされて
いるので、電極7の形成のマスクの位置合わせに
それだけ余裕がとれるので、そのマスクの位置が
容易となる。又電極7の形成位置の両側に電極部
分2C′がはみ出るようになる。このはみ出し部分
にレジストを塗布しないようにするなどして、同
時に他の部分とともにエツチングによつて除去し
てしまう。これによつて電極7と分岐電極2Cと
は互いにその側面が揃うようにして重なり合つて
形成されることになる。 Next, an etching process is performed for the electrodes 6, 7 and the terminal electrode 10. For this purpose, first, as shown in FIG. 3C, an electrode layer 12 is formed on the surface of the substrate 1 by, for example, screen printing. This is then etched according to the required pattern. At this time, since the electrode portion 2C' is wider than the electrode 7, there is a corresponding margin for positioning the mask for forming the electrode 7, so that the mask can be easily positioned. Further, the electrode portions 2C' protrude on both sides of the formation position of the electrode 7. By not applying resist to this protruding portion, the resist is simultaneously removed along with other portions by etching. As a result, the electrode 7 and the branch electrode 2C are formed to overlap each other with their side surfaces aligned.
このあと絶縁層5の表面に、電極6,7を横切
るように発熱体8を形成し、或いは絶縁層4の表
面に駆動回路9を設置する。そしてワイヤ11に
よる接続後、保護膜、耐摩耗性膜等で被覆する。 Thereafter, a heating element 8 is formed on the surface of the insulating layer 5 so as to cross the electrodes 6 and 7, or a driving circuit 9 is installed on the surface of the insulating layer 4. After connection with the wire 11, it is covered with a protective film, a wear-resistant film, etc.
この方法によつて製造するときは、既提案の構
成に比較して絶縁層の形成処理が1回ですむほか
に電極形成のエツチング処理も1回ですむように
なり、したがつて製造工程が極めて簡略となるよ
うになる。 When manufactured using this method, compared to the previously proposed configuration, not only the insulating layer formation process is required only once, but also the electrode formation etching process is required once, so the manufacturing process is extremely simplified. It will become as follows.
以上詳述したようにこの発明によれば、発熱体
を基板の一方の端縁に接近させて設置するにあた
り、そのための構成を既提案のそれに比較して簡
易とすることができるとともに、その製造工程に
おいてもエツチング処理、絶縁層形成処理をとも
に減少させることによつてそれだけ簡略化が可能
となるといつた効果を奏する。 As described in detail above, according to the present invention, when a heating element is installed close to one edge of a substrate, the configuration for this purpose can be simplified compared to the previously proposed one, and the manufacturing thereof can be simplified. Also in the process, by reducing both the etching process and the insulating layer forming process, the process can be simplified accordingly.
第1図はこの発明の実施例を示す平面図、第2
図は一部の拡大斜視図、第3図はこの発明の製造
工程を説明するための平面図である。
1……基板、1A……端縁、2……共通電極、
2A……端縁、2C……分岐電極、4……第2の
絶縁層、5……第2の絶縁層、6……第2の電
極、7……第1の電極、8……発熱体、12……
電極層。
Figure 1 is a plan view showing an embodiment of the invention, Figure 2 is a plan view showing an embodiment of the invention.
The figure is a partially enlarged perspective view, and FIG. 3 is a plan view for explaining the manufacturing process of the present invention. 1...Substrate, 1A...Edge, 2...Common electrode,
2A... Edge, 2C... Branch electrode, 4... Second insulating layer, 5... Second insulating layer, 6... Second electrode, 7... First electrode, 8... Heat generation Body, 12...
electrode layer.
Claims (1)
つてグレーズからなる第1の絶縁層を、又前記第
1の絶縁層と離間した位置に共通電極を設け、前
記共通電極の表面に、前記共通電極の、前記第1
の絶縁層側の端縁に沿つて所定の間隔を置いて前
記共通電極の一部である分岐電極が露呈するよう
に第2の絶縁層を設け、更に前記第1及び第2の
両絶縁層の表面にまたがる第1及び第2の電極の
複数を前記基板の一方の端縁に沿つて交互に並設
し、前記第1の電極を前記分岐電極に重ね合せて
前記共通電極に接続し、又前記第2の電極を個別
用の電極として選択的に通電自在とし、更に前記
第1の絶縁層の表面に前記第1及び第2の電極を
横切るようにプリント用の発熱体を設けてなるサ
ーマルプリント。 2 絶縁性の基板の表面に、前記基板の一方の端
縁から一方の端縁が離間するように共通電極をス
クリーン印刷によつて形成する第1の工程と、前
記基板の一方の端縁に沿つて第1の絶縁層を、お
よび前記共通電極の表面に、前記共通電極の一方
の端縁側に所定の間隔を置いて通電用の電極より
幅広の分岐電極が露呈するように第2の絶縁層
を、グレーズの印刷焼成によつてともに同時に形
成する第2の工程と、少くとも発熱体への通電の
ための電極形成位置を含む領域に電極層を形成す
る第3の工程と、前記第1の絶縁層と第2の絶縁
層の表面にまたがる第1および第2の電極が前記
基板の一方の端縁に沿つて交互に位置するように
形成するとともに、前記第1の電極と重なり合う
前記分岐電極を前記第1の電極と同じ幅となるよ
う前記電極層をエツチングで処理する第4の工程
と、前記第1の絶縁層の表面に、前記第1および
第2の電極を横切るようにプリント用の発熱体を
形成する第5の工程とからなるサーマルプリント
ヘツドの製造法。[Claims] 1. A first insulating layer made of glaze is provided on the surface of an insulating substrate along one edge thereof, and a common electrode is provided at a position spaced apart from the first insulating layer, The first layer of the common electrode is disposed on the surface of the common electrode.
A second insulating layer is provided along the edge of the insulating layer side at a predetermined interval so that a branch electrode that is a part of the common electrode is exposed, and further both the first and second insulating layers are A plurality of first and second electrodes are arranged alternately in parallel along one edge of the substrate, and the first electrode is overlapped with the branch electrode and connected to the common electrode, Further, the second electrode can be selectively energized as an individual electrode, and a heating element for printing is provided on the surface of the first insulating layer so as to cross the first and second electrodes. Thermal print. 2. A first step of forming a common electrode on the surface of an insulating substrate by screen printing so that one edge of the substrate is spaced apart from one edge of the substrate; a first insulating layer along the surface of the common electrode, and a second insulating layer on the surface of the common electrode such that a branch electrode wider than the current-carrying electrode is exposed at a predetermined interval on one edge side of the common electrode. a second step of simultaneously forming the layers by printing and baking a glaze; a third step of forming an electrode layer in a region including at least an electrode formation position for energizing the heating element; first and second electrodes spanning the surfaces of the first insulating layer and the second insulating layer are formed so as to be alternately located along one edge of the substrate, and the first electrode overlaps with the first electrode. a fourth step of etching the electrode layer so that the branch electrode has the same width as the first electrode; and a fourth step of etching the electrode layer so that the branch electrode has the same width as the first electrode; A method for manufacturing a thermal print head, comprising a fifth step of forming a heating element for printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6348084A JPS60206675A (en) | 1984-03-31 | 1984-03-31 | Thermal printing head and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6348084A JPS60206675A (en) | 1984-03-31 | 1984-03-31 | Thermal printing head and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60206675A JPS60206675A (en) | 1985-10-18 |
| JPH0371024B2 true JPH0371024B2 (en) | 1991-11-11 |
Family
ID=13230442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6348084A Granted JPS60206675A (en) | 1984-03-31 | 1984-03-31 | Thermal printing head and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60206675A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4635075A (en) * | 1985-12-04 | 1987-01-06 | Datametrics Corporation | Thermal print head and process for producing |
-
1984
- 1984-03-31 JP JP6348084A patent/JPS60206675A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60206675A (en) | 1985-10-18 |
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