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JPH0371801B2 - - Google Patents
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JPH0371801B2 - - Google Patents

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Publication number
JPH0371801B2
JPH0371801B2 JP60226941A JP22694185A JPH0371801B2 JP H0371801 B2 JPH0371801 B2 JP H0371801B2 JP 60226941 A JP60226941 A JP 60226941A JP 22694185 A JP22694185 A JP 22694185A JP H0371801 B2 JPH0371801 B2 JP H0371801B2
Authority
JP
Japan
Prior art keywords
metal plate
dielectric substrate
layer
stripline
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60226941A
Other languages
Japanese (ja)
Other versions
JPS6286903A (en
Inventor
Juichi Takahashi
Masanori Ejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Keiki Inc
Original Assignee
Tokyo Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Keiki Co Ltd filed Critical Tokyo Keiki Co Ltd
Priority to JP60226941A priority Critical patent/JPS6286903A/en
Publication of JPS6286903A publication Critical patent/JPS6286903A/en
Publication of JPH0371801B2 publication Critical patent/JPH0371801B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はストリツプラインによつて形成される
超高周波フイルタの構造に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an ultra-high frequency filter formed by striplines.

〔従来の技術〕[Conventional technology]

レーダに使用される幅広い周波数帯域のマイク
ロ波の受信は、このマイクロ波を波周波数の異
なる複数の超高周波フイルタによつて波し、
波して得られた各周波数のマイクロ波を局部発信
器によつて中間周波数に変換するのが一般に行わ
れる方法である。この際、複数の超高周波フイル
タは同一ストリツプライン平面上又は同軸ケーブ
ル等によつて互いに接続配線される。
To receive microwaves in a wide frequency band used in radar, these microwaves are passed through multiple ultra-high frequency filters with different wave frequencies.
A commonly used method is to convert the resulting microwaves of each frequency into an intermediate frequency using a local oscillator. At this time, a plurality of ultra-high frequency filters are connected and wired to each other on the same stripline plane or by coaxial cables or the like.

係る超高周波フイルタは、ストリツプラインに
よつて誘電体基板上に形成される。この場合、超
高周波フイルタを構成する容量素子はストリツプ
ラインのパターン幅を広くすることによつて得ら
れ、インダクタンスはストリツプラインのパター
ン幅を狭くすることによつて得られる。又、直列
容量素子は誘電体基板を挟んでストリツプライン
を重ね合わせることによつて形成されることは周
知の通りである。
Such a super high frequency filter is formed on a dielectric substrate using strip lines. In this case, the capacitive element constituting the ultra-high frequency filter can be obtained by widening the stripline pattern width, and the inductance can be obtained by narrowing the stripline pattern width. Furthermore, it is well known that a series capacitive element is formed by overlapping strip lines with a dielectric substrate interposed therebetween.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、ストリツプラインによつて超高周波
フイルタを形成することによつて、マイクロ波受
信器の小型化を図ることができるが、上述したよ
うに複数の超高周波フイルタを接続配線使用する
ことによつて、マイクロ波受信器の小型化が難し
くなる場合が生じるという問題があつた。
Incidentally, it is possible to downsize a microwave receiver by forming an ultra-high frequency filter using striplines, but as mentioned above, it is possible to downsize the microwave receiver by using connection wiring to connect multiple ultra-high frequency filters. This has led to the problem that it may be difficult to miniaturize the microwave receiver.

本発明は上記問題点を解決するためになされた
もので、マイクロ波受信器の小型化を容易にする
超高周波フイルタの構造を提供することを目的と
する。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a structure of an ultra-high frequency filter that facilitates miniaturization of a microwave receiver.

〔問題点を解決するための手段〕[Means for solving problems]

そこで本発明では、下層金属板と、前記下層金
属板の上方に該下層金属板と所定の間隔を隔てて
配置され、下面に下層ストリツプラインによる超
高周波フイルタが形成された下層誘電体基板と、
前記下層誘電体基板の上方に該下層誘電体基板と
所定の間隔を隔てて配置された中層金属板と、前
記中層金属板の上方に該中層金属板と所定の間隔
を隔てて配置され、上面に上層ストリツプライン
による超高周波フイルタが形成された上層誘電体
基板と、前記上層誘電体基板の上方に該上層誘電
体基板と所定の間隔を隔てて配置された上層金属
板と、前記上層ストリツプラインと前記下層スト
リツプラインを導通接続する接続部材とを有する
超高周波フイルタの構造において、前記下層誘電
体基板の下層ストリツプラインの始端部分を臨む
位置、及び前記上層誘電体基板の上層ストリツプ
ラインの終端部分を臨む位置に所定の同じ大きさ
の穴を設けるとともに、前記中層金属板の前記上
層及び下層誘電体基板の穴穿設位置に対応する位
置に両誘電体基板の穴よりも大きい穴を穿設し、 かつ、前記上層及び下層誘電体基板、中層金属
板に設けられた穴を介して前記上層及び下層スト
リツプラインを導通接続する中心導体と、前記中
層金属板の穴に嵌挿される円柱状の誘電体であつ
て、前記上層誘電体基板の下面及び前記下層誘電
体基板の上面にそれぞれ当接する肩部を両端面に
有するとともに、該両端面よりそれぞれ前記上層
及び下層誘電体基板を貫通して上層金属板の下面
及び下層金属板の上面に当接する突出部を有し、
前記中心導体を被覆して一体形成された誘電体と
から構成された接続部材を備えることによつて、
上記の問題点を解決している。
Therefore, the present invention includes a lower metal plate, a lower dielectric substrate arranged above the lower metal plate at a predetermined distance from the lower metal plate, and having an ultra-high frequency filter formed by lower strip lines on the lower surface thereof. ,
an intermediate metal plate disposed above the lower dielectric substrate at a predetermined distance from the lower dielectric substrate; an intermediate metal plate disposed above the intermediate metal plate at a predetermined interval from the intermediate metal plate; an upper dielectric substrate on which an ultra-high frequency filter is formed by an upper strip line; an upper metal plate disposed above the upper dielectric substrate at a predetermined distance from the upper dielectric substrate; In the structure of an ultra-high frequency filter having a strip line and a connection member for electrically connecting the lower layer stripline, a position facing the starting end of the lower layer stripline of the lower layer dielectric substrate and an upper layer stripline of the upper layer dielectric substrate; A predetermined hole of the same size is provided at a position facing the end portion of the lip line, and a hole of the same size is provided at a position corresponding to the hole drilling position of the upper and lower dielectric substrates of the intermediate layer metal plate, which is larger than the hole of both dielectric substrates. A center conductor that connects the upper and lower strip lines electrically through holes provided in the upper and lower dielectric substrates and the middle metal plate, and a center conductor that connects the upper and lower strip lines through holes provided in the upper and lower dielectric substrates and the middle metal plate; A cylindrical dielectric body to be fitted and inserted, having shoulders on both end faces that abut the lower surface of the upper dielectric substrate and the upper surface of the lower dielectric substrate, respectively. a protrusion that penetrates the body substrate and comes into contact with the lower surface of the upper metal plate and the upper surface of the lower metal plate;
By providing a connecting member formed of a dielectric material integrally formed to cover the center conductor,
This solves the above problems.

〔作 用〕[Effect]

上記構成の超高周波フイルタの構造は、下層金
属板、下層誘電体基板、中層金属板、上層誘電体
基板及び上層金属板をそれぞれ所定の間隔を隔て
て積層して配置し、上層誘電体基板の穴からの突
出部分が上層金属板の下面に当接し、下層誘電体
基板の穴からの突出部分が下層金属板の上面に当
接し、下層誘電体基板の下面から下層誘電体基板
の上面までの部分が中層金属板の穴に嵌挿し得る
形状の誘電体で被覆された中心導体によつて上層
ストリツプラインと下層ストリツプラインとを接
続する。
The structure of the ultra-high frequency filter having the above configuration is such that a lower metal plate, a lower dielectric substrate, a middle metal plate, an upper dielectric substrate, and an upper metal plate are stacked at predetermined intervals, and the upper dielectric substrate is laminated. The protruding part from the hole contacts the lower surface of the upper metal plate, the protruding part from the hole of the lower dielectric substrate contacts the upper surface of the lower metal plate, and the distance from the lower surface of the lower dielectric substrate to the upper surface of the lower dielectric substrate The upper layer stripline and the lower layer stripline are connected by a center conductor coated with a dielectric material whose portion can be inserted into a hole in the intermediate layer metal plate.

〔実施例〕〔Example〕

以下、本発明の一実施例を添付図面を参照して
詳細に説明する。
Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.

第1図は本発明に係る超高周波フイルタの構造
の概略図であつて、第1図aが側面図、第1図b
が正面図である。第1図において、1は下層金属
板、2は下層金属板1の上方に下層金属板1と所
定の間隔を隔てて配置された下層誘電体基板、3
は下層誘電体基板2の下面に形成された超高周波
フイルタを構成する下層ストリツプライン、2a
は下層ストリツプライン3の始端部分を臨む位置
に穿設された所定の大きさの穴、4は下層誘電体
基板2の下面両端部と下層金属板1の上面両端部
との間に介在されたスペーサ、5は下層誘電体基
板2の上方に下層誘電体基板2と所定の間隔を隔
てて配置された中層金属板、5aは下層誘電体基
板2の穴穿設位置に対応する位置に穿設された下
層誘電体基板2の穴2aよりも大きい穴、6は中
層金属板5の下面両端部と下層誘電体基板2の上
面両端部との間に介在されたスペーサ、7は中層
金属板5の上方に中層金属板5と所定の間隔を隔
てて配置された上層誘電体基板、8は上層誘電体
基板7の上面に形成された超高周波フイルタを構
成する上層ストリツプライン、7aは上層ストリ
ツプライン8の終端部分を臨む位置であつて、下
層誘電体基板2の穴穿設位置に対応する位置に穿
設された下層誘電体基板2の穴2aと同じ大きさ
の穴、9は上層誘電体基板7の下面両端部と中層
金属板5の上面両端部との間に介在されたスペー
サ、10は上層誘電体基板7の上方に上層誘電体
基板7と所定の間隔を隔てて配置された上層金属
板、11は上層誘電体基板7の上面両端部と上層
金属板10との間に介在されたスペーサ、12は
上層ストリツプライン8と下層ストリツプライン
3とを接続する接続部材である。接続部材12は
第2図に示すように、上層ストリツプライン8と
下層ストリツプライン3とを接続する中心導体1
2aと中心導体12aを被覆している誘電体12
bとから構成されている。中心導体12aは上層
誘電体基板7の穴7a、中層金属板5の穴5a及
び下層誘電体基板2の穴2aに嵌挿されており、
上端部が上層ストリツプライン8に、下端部が下
層ストリツプライン3にそれぞれ接続されてい
る。又、誘電体12bは中心導体12aを上層ス
トリツプライン8に接続するために必要な部分を
除き、上層誘電体基板7の穴7aからの突出部分
が上層金属板10の下面に当接し、中心導体12
aを下層ストリツプライン3に接続するために必
要な部分を除き、下層誘電体基板2の穴2aから
の突出部分が下層金属板1の上面に当接し、さら
に上層誘電体基板7の下面から下層誘電体基板2
の上面までの部分が中層金属板5の穴5aに拒挿
し得る円柱形状になつている。
FIG. 1 is a schematic diagram of the structure of an ultra-high frequency filter according to the present invention, in which FIG. 1a is a side view and FIG. 1b is a side view.
is a front view. In FIG. 1, 1 is a lower metal plate, 2 is a lower dielectric substrate disposed above the lower metal plate 1 at a predetermined distance from the lower metal plate 1, and 3
2a is a lower layer strip line forming an ultra-high frequency filter formed on the lower surface of the lower dielectric substrate 2;
4 is a hole of a predetermined size drilled at a position facing the starting end of the lower layer stripline 3, and 4 is interposed between both ends of the lower surface of the lower dielectric substrate 2 and both ends of the upper surface of the lower metal plate 1. A spacer 5 is a middle layer metal plate disposed above the lower dielectric substrate 2 at a predetermined distance from the lower dielectric substrate 2, and 5a is a spacer bored at a position corresponding to the hole drilling position of the lower dielectric substrate 2. A hole larger than the hole 2a of the lower dielectric substrate 2 provided, 6 a spacer interposed between both ends of the lower surface of the middle layer metal plate 5 and both ends of the upper surface of the lower dielectric substrate 2, 7 a middle layer metal plate An upper layer dielectric substrate is placed above 5 at a predetermined distance from the middle layer metal plate 5, 8 is an upper layer strip line forming an ultra-high frequency filter formed on the upper surface of the upper layer dielectric substrate 7, and 7a is an upper layer dielectric substrate. A hole 9 of the same size as the hole 2a of the lower dielectric substrate 2 is bored at a position facing the end of the stripline 8 and corresponding to the hole drilling position of the lower dielectric substrate 2. A spacer 10 interposed between both ends of the lower surface of the upper dielectric substrate 7 and both ends of the upper surface of the middle layer metal plate 5 is arranged above the upper dielectric substrate 7 at a predetermined distance from the upper dielectric substrate 7. 11 is a spacer interposed between both ends of the upper surface of the upper dielectric substrate 7 and the upper metal plate 10; 12 is a connecting member connecting the upper layer stripline 8 and the lower layer stripline 3; It is. As shown in FIG.
2a and a dielectric 12 covering the center conductor 12a.
It is composed of b. The center conductor 12a is fitted into the hole 7a of the upper dielectric substrate 7, the hole 5a of the middle metal plate 5, and the hole 2a of the lower dielectric substrate 2,
The upper end is connected to the upper layer stripline 8, and the lower end is connected to the lower layer stripline 3. In addition, the dielectric 12b, excluding the part necessary for connecting the center conductor 12a to the upper stripline 8, has a protruding part from the hole 7a of the upper dielectric substrate 7 in contact with the lower surface of the upper metal plate 10, and the center conductor 12
The protruding portion of the lower dielectric substrate 2 from the hole 2a contacts the upper surface of the lower metal plate 1, except for the portion necessary for connecting the lower dielectric substrate 2 to the lower stripline 3, and the portion protruding from the lower surface of the upper dielectric substrate 7 Lower dielectric substrate 2
The portion up to the upper surface of the metal plate 5 has a cylindrical shape that can be inserted into the hole 5a of the middle layer metal plate 5.

上層ストリツプライン8を伝搬されてきたマイ
クロ波は上層ストリツプライン8の終端部分から
中心導体12aを介して下層ストリツプライン3
の始端部分に伝搬され、さらに下層ストリツプラ
イン3を伝搬されていくことになる。
The microwave propagated through the upper stripline 8 is transmitted from the terminal end of the upper stripline 8 to the lower stripline 3 via the center conductor 12a.
The signal is propagated to the starting end of the strip line 3, and is further propagated through the lower stripline 3.

なお、上層ストリツプライン8と中心導体12
aとの接続及び下層ストリツプライン3と中心導
体12aとの接続はハンダ付け等によつてなされ
ている。又、誘電体12bの材料としてはテフロ
ン(登録商標)等を用いる。
Note that the upper layer stripline 8 and the center conductor 12
The connection to a and the connection between the lower stripline 3 and the center conductor 12a are made by soldering or the like. Furthermore, Teflon (registered trademark) or the like is used as the material of the dielectric 12b.

なお、本実施例では2層構造の超高周波フイル
タについて説明したが、これに限らず3層以上の
超高周波フイルタを構成するようにしてもよい。
In this embodiment, a two-layer ultra-high frequency filter has been described, but the present invention is not limited to this, and an ultra-high frequency filter having three or more layers may be configured.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、下層金属
板、下層誘電体基板、中層金属板、上層誘電体基
板及び上層金属板を所定の間隔を隔てて積層して
配置し、上層誘電体基板の穴、中層金属板の穴及
び下層誘電体基板の穴に嵌挿されており、上層ス
トリツプライン及び下層ストリツプラインとに接
続されている中心導体、この中心導体を被覆して
おり、上層誘電体基板の穴からの突出部分が上層
金属板の下面に当接し、下層誘電体基板の穴から
の突出部分が下層金属板の上面に当接し、上層誘
電体基板の下面から下層誘電体基板の上面までの
部分が中層金属板の穴に嵌挿し得る形状の誘電体
から構成された接続部材によつて上層ストリツプ
ラインと下層ストリツプラインとを接続すること
によつて、積み重ねた超高周波フイルタの構造が
得られるので、かかる超高周波フイルタの構造を
使用するマイクロ波受信器の小型化を実現でき
る。
As explained above, according to the present invention, the lower metal plate, the lower dielectric substrate, the middle metal plate, the upper dielectric substrate, and the upper metal plate are stacked and arranged at predetermined intervals, and the upper dielectric substrate A center conductor that is inserted into the hole, the hole in the middle layer metal plate, and the hole in the lower dielectric substrate, and is connected to the upper layer stripline and the lower layer stripline. The protruding portion from the hole in the body substrate contacts the lower surface of the upper metal plate, the protruding portion from the hole in the lower dielectric substrate contacts the upper surface of the lower metal plate, and the lower dielectric substrate is exposed from the lower surface of the upper dielectric substrate. By connecting the upper layer stripline and the lower layer stripline with a connecting member whose part up to the top surface is made of a dielectric material that can be inserted into a hole in the middle layer metal plate, a stacked ultra-high frequency filter can be formed. Therefore, it is possible to realize miniaturization of a microwave receiver using such an ultra-high frequency filter structure.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係る超高周波フイルタの構造
の概略図、第2図は第1図に示した部材の斜視図
である。 1…下層金属板、2…下層誘電体基板、3,8
…ストリツプライン、4,6,9,11…スペー
サ、5…中層金属板、7…上層誘電体基板、10
…上層金属板、12…接続部材。
FIG. 1 is a schematic diagram of the structure of an ultra-high frequency filter according to the present invention, and FIG. 2 is a perspective view of the members shown in FIG. 1. 1... Lower layer metal plate, 2... Lower layer dielectric substrate, 3, 8
... Stripline, 4, 6, 9, 11... Spacer, 5... Middle layer metal plate, 7... Upper layer dielectric substrate, 10
...upper layer metal plate, 12... connection member.

Claims (1)

【特許請求の範囲】 1 下層金属板と、前記下層金属板の上方に該下
層金属板と所定の間隔を隔てて配置され、下面に
下層ストリツプラインによる超高周波フイルタが
形成された下層誘電体基板と、前記下層誘電体基
板の上方に該下層誘電体基板と所定の間隔を隔て
て配置された中層金属板と、前記中層金属板の上
方に該中層金属板と所定の間隔を隔てて配置さ
れ、上面に上層ストリツプラインによる超高周波
フイルタが形成された上層誘電体基板と、前記上
層誘電体基板の上方に該上層誘電体基板と所定の
間隔を隔てて配置された上層金属板と、前記上層
ストリツプラインと前記下層ストリツプラインを
導通接続する接続部材とを有する超高周波フイル
タの構造において、 前記下層誘電体基板の下層ストリツプラインの
始端部分を臨む位置、及び前記上層誘電体基板の
上層ストリツプラインの終端部分を臨む位置には
所定の同じ大きさの穴が設けられるとともに、前
記中層金属板の前記上層及び下層誘電体基板の穴
穿設位置に対応する位置には両誘電体基板の穴よ
りも大きい穴が穿設され、 かつ、前記上層及び下層誘電体基板、中層金属
板に設けられた穴を介して前記上層及び下層スト
リツプラインを導通接続する中心導体と、前記中
層金属板の穴に嵌挿される円柱状の誘電体であつ
て、前記上層誘電体基板の下面及び前記下層誘電
体基板の上面にそれぞれ当接する肩部を両端面に
有するとともに、該両端面よりそれぞれ前記上層
及び下層誘電体基板を貫通して上層金属板の下面
及び下層金属板の上面に当接する突出部を有し、
前記中心導体を被覆して一体形成された誘電体と
から構成された接続部材を備えたことを特徴とす
る超高周波フイルタの構造。
[Scope of Claims] 1. A lower metal plate, and a lower dielectric body disposed above the lower metal plate at a predetermined distance from the lower metal plate, and having an ultra-high frequency filter formed by a lower strip line on its lower surface. a substrate, an intermediate metal plate disposed above the lower dielectric substrate at a predetermined distance from the lower dielectric substrate; and an intermediate metal plate disposed above the intermediate metal plate at a predetermined distance from the intermediate metal plate. an upper dielectric substrate on which an ultra-high frequency filter is formed by upper strip lines; an upper metal plate disposed above the upper dielectric substrate at a predetermined distance from the upper dielectric substrate; In the structure of an ultra-high frequency filter having a connection member that electrically connects the upper layer stripline and the lower layer stripline, a position of the lower layer dielectric substrate facing the starting end of the lower layer stripline, and the upper layer dielectric substrate Holes of the same predetermined size are provided at positions facing the end portions of the upper layer stripline, and holes of both dielectrics are provided at positions corresponding to the holes in the upper and lower dielectric substrates of the middle layer metal plate. a center conductor having a hole larger than the hole in the body substrate and electrically connecting the upper and lower strip lines through the holes provided in the upper and lower dielectric substrates and the middle metal plate; A cylindrical dielectric that is inserted into a hole in a middle layer metal plate, and has shoulders on both end faces that abut the lower surface of the upper dielectric substrate and the upper surface of the lower dielectric substrate, respectively, and having protrusions that penetrate the upper and lower dielectric substrates and abut on the lower surface of the upper metal plate and the upper surface of the lower metal plate, respectively;
A structure of an ultra-high frequency filter, comprising a connecting member formed of a dielectric material integrally formed to cover the center conductor.
JP60226941A 1985-10-14 1985-10-14 Structure of ultra high frequency filter Granted JPS6286903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60226941A JPS6286903A (en) 1985-10-14 1985-10-14 Structure of ultra high frequency filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60226941A JPS6286903A (en) 1985-10-14 1985-10-14 Structure of ultra high frequency filter

Publications (2)

Publication Number Publication Date
JPS6286903A JPS6286903A (en) 1987-04-21
JPH0371801B2 true JPH0371801B2 (en) 1991-11-14

Family

ID=16853007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60226941A Granted JPS6286903A (en) 1985-10-14 1985-10-14 Structure of ultra high frequency filter

Country Status (1)

Country Link
JP (1) JPS6286903A (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3303439A (en) * 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
JPS5240664Y2 (en) * 1973-02-13 1977-09-14

Also Published As

Publication number Publication date
JPS6286903A (en) 1987-04-21

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