JPH0372158B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a selective chemical processing apparatus, and relates to an apparatus that performs selective plating, selective etching, etc. using an energy beam such as a laser.

[Conventional technology]

FIG. 3 is a block diagram showing a conventional selective electroplating apparatus. (Described in Japanese Patent Publication No. 1797-1987.) In the figure, 1 is a plating tank filled with a chemical solution, for example, an electrolytic plating solution 2, 3 is a plating power supply, 4 is an anode, and 5 is a An energy beam such as a laser, 6 an energy beam generator, 7 a cathode, an insulating substrate 8 such as glass or other dielectric, and a thin metal layer 9 attached to the surface of the insulating substrate 8
It is made up of.

With the device configured in this way, the electrolytic plating solution 2
Inside, the cathode 7 and the anode 4 are opposed to each other, and a voltage is applied from the plating power source 3. In synchronization with the application of this voltage, the energy beam generator 6 irradiates the cathode 7 with an energy beam 5 having an appropriate wavelength and energy density. In the cathode 7, energy is absorbed in the area irradiated with the energy beam 5, causing local heating, and the plating speed increases dramatically compared to the background plating speed in the area that is not affected by the thermal effect. For this purpose, selective electroplating is carried out.

[Problem that the invention seeks to solve]

In conventional selective electroplating equipment such as the one described above, in order to limit thermal diffusion of the cathode due to energy beam heating and to minimize background plating in adjacent areas, the cathode must be placed on an insulating substrate such as the one described above. It had to be constructed by depositing a thin metal film on top. For this reason, there was a problem that an arbitrary cathode material could not be used.

The present invention was made in order to solve these problems, and it is an object of the present invention to provide a selective chemical processing apparatus that can perform selective plating, selective etching, etc. on any conductive or non-conductive cathode material. It is an object.

[Means for solving problems]

The selective chemical processing apparatus according to the present invention includes a workpiece immersed in a chemical solution, an energy beam generator that irradiates an energy beam onto a processed portion of the workpiece, and a device that irradiates an energy beam along the surface of the processed portion. It is equipped with a jet nozzle that sprays a chemical solution, and a pump that supplies the chemical solution to the jet nozzle.

[Effect]

The jet nozzle and pump of the present invention generate a jet of chemical solution on the surface of the processed portion of the workpiece. This jet jet functions to maintain the interface temperature at a constant temperature, suppresses thermal diffusion of the chemical solution and workpiece material due to heating by the energy beam, and improves the resolution of selective chemical processing.

〔Example〕

FIG. 1 is a block diagram showing one embodiment of the present invention, and shows, for example, a selective electroplating apparatus. In the figure, reference numeral 10 denotes a jet nozzle that sprays the plating liquid 2 as a jet jet along the surface of a portion to be processed, for example, a portion to be plated, of a cathode 15, which is a material to be processed. 1
1 is an arbitrary cathode 1 by changing the angle of the jet nozzle 10.
5 is a nozzle joint capable of applying a jet jet to the surface area; 12 is a plating liquid circulation pipe; 13 is a pump for supplying a chemical solution to the jet nozzle 10; for example, a circulation pump; 14 is a plating liquid temperature control pipe; It is a device. Also, arrow A and arrow B
This shows the flow of the fitting liquid, and arrow A shows a jet jet.

In the selective chemical processing apparatus configured as described above, when performing selective plating by irradiating the energy beam 5 onto the workpiece part of the cathode 15, the jet shown by arrow A is applied along the surface of the workpiece part. The plating liquid 2 is caused to flow by the jet stream. As a result, the tamping liquid 2 whose temperature has increased around the plated portion due to heating by the energy beam 5 is forcibly removed. Furthermore, thermal diffusion of the workpiece constituting the cathode 15 suppresses an increase in the temperature of the portion of the cathode 15 that is not irradiated with the energy beam 5 . Therefore, it is possible to prevent a decrease in the resolution of selective plating, and there is no need for the cathode 15 to have a structure in which a thin metal film is adhered to an insulating substrate as in the past, and selective plating can be applied to any conductive material. be able to.

In the above embodiment, the selective plating is performed by electroplating, but in other embodiments, selective plating can be performed by electroless method. Figure 2 shows a block diagram when electroless plating is performed, and 16 is a workpiece suitable for electroless plating, which is any conductive or non-conductive material, and 17 is a workpiece suitable for electroless plating. It is a liquid. This electroless plating liquid 17 is kept at a temperature lower than the temperature at which full-surface plating occurs in the plating liquid temperature control device 14, and to the extent that plating occurs in the portion of the workpiece 16 that is irradiated with the energy beam 5 and heated. temperature is controlled. In the selective electroless plating apparatus configured as described above, when irradiating the energy beam 5, the jet nozzle 10 and the pump 13 generate a jet jet of the electroless plating solution 17 as shown by the arrow A. If this occurs, the same effect as in the above embodiment can be obtained.

Further, in the above embodiment, the plating liquid in the plating tank 1 is circulated to generate a jet jet, but the plating liquid in the external container is used. Good too.

(Also, the energy beam 5 is not limited to a laser, but may be a light beam, etc.) Furthermore, in the above embodiment, the case where electrolytic or chemical plating is selectively performed is described, but instead of using electrolytic or chemical plating liquid, By using an electrolytic or chemical etching solution, it is possible to selectively etch the workpiece.

〔Effect of the invention〕

As explained above, this invention consists of a workpiece immersed in a chemical solution, an energy beam generator that irradiates the workpiece with an energy beam, and a chemical solution that is sprayed along the surface of the workpiece. The jet nozzle is equipped with a pump that supplies a chemical solution to the jet nozzle, suppresses thermal diffusion of the chemical solution and the workpiece during energy beam irradiation, and improves the resolution of selective chemical processing such as selective plating or selective etching. This has the effect of preventing deterioration and thus making it possible to use any material as the workpiece.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a selective electroplating apparatus showing one embodiment of the invention, FIG. 2 is a block diagram of a selective electroless plating apparatus showing another embodiment of the invention, and FIG. 1 is a configuration diagram showing a conventional selective electroplating device. 2 is a chemical solution, 5 is an energy beam, 6 is an energy beam generator, 10 is a jet nozzle, 13
1 is a pump, 15 and 16 are workpieces, and 17 is a chemical solution. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] 1. A workpiece immersed in a chemical solution, an energy beam generator that irradiates an energy beam onto the processed portion of the workpiece, and sprays the chemical solution along the surface of the processed portion. A selective chemical processing device comprising a jet nozzle for producing a chemical solution and a pump for supplying a chemical solution to the jet nozzle. 2. The selective chemical processing apparatus according to claim 1, wherein the energy beam is a laser or a light beam.