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JPH0376416B2 - - Google Patents
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JPH0376416B2 - - Google Patents

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Publication number
JPH0376416B2
JPH0376416B2 JP58052111A JP5211183A JPH0376416B2 JP H0376416 B2 JPH0376416 B2 JP H0376416B2 JP 58052111 A JP58052111 A JP 58052111A JP 5211183 A JP5211183 A JP 5211183A JP H0376416 B2 JPH0376416 B2 JP H0376416B2
Authority
JP
Japan
Prior art keywords
signal
flaw detection
factor
influence
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58052111A
Other languages
Japanese (ja)
Other versions
JPS59176664A (en
Inventor
Takeo Kamimura
Yasuo Araki
Mamoru Nakamoto
Yoshihiko Watanabe
Hideo Myamoto
Koji Kidera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Seiryo Engineering Co Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Seiryo Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd, Seiryo Engineering Co Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP5211183A priority Critical patent/JPS59176664A/en
Publication of JPS59176664A publication Critical patent/JPS59176664A/en
Publication of JPH0376416B2 publication Critical patent/JPH0376416B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/72Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
    • G01N27/82Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
    • G01N27/90Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
    • G01N27/9046Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents by analysing electrical signals

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Magnetic Means (AREA)

Description

【発明の詳細な説明】 本発明は多重周波数渦電流探傷分析装置に係
り、特に腹水器冷却用伝熱管や高圧給水加熱管等
の火力、原子力プラント用熱交換器細管等の探傷
試験に適用できる多重周波数渦電流探傷分析装置
に関する。
[Detailed Description of the Invention] The present invention relates to a multi-frequency eddy current flaw detection and analysis device, and is particularly applicable to flaw detection testing of heat exchanger tubes for thermal power plants, nuclear power plants, etc., such as heat exchanger tubes for cooling ascites and high pressure feed water heating tubes. This invention relates to a multi-frequency eddy current flaw detection and analysis device.

渦電流(電磁誘導)探傷試験においてここ数年
来多重周波数渦電流探傷試験法が適用されるよう
になり、それに伴い例えば原子力蒸気発生器伝熱
管(SGチユーブ)検査の信頼性向上のため、細
管外面の支持板部およびFe3O4のような付着物又
は細管自身のデント(打痕)信号と複合している
欠陥を判別する方法として、近年欠陥以外の要因
を除去する演算方式が応用されるようになつてき
た。しかしながら従来の演算方式では、例えば細
管支持板と欠陥が複合している場合、又はデント
部の信号若しくは内径変化信号が複合している場
合の如く、欠陥信号と欠陥識別の妨害となる要因
が一つだけ含まれている場合には、この一つの妨
害要因の消去は可能であるが、例えば欠陥識別の
妨害となりうる複数の要因すなわち細管支持板
部、デント部、細管内径変化、および細管外面の
付着物信号等の複数の要因が同時に欠陥信号と重
複するような場合には、欠陥検出能力が低下して
欠陥識別が困難となる欠点があつた。これは従来
の演算方式では、欠陥識別の妨害となる複数の要
因が欠陥信号と同時に重複している場合には演算
器としての機能を充分発揮できなかつたからであ
る。
Over the past few years, multi-frequency eddy current testing has been applied to eddy current (electromagnetic induction) testing. In recent years, a calculation method that removes factors other than defects has been applied as a method for determining defects that are combined with dent signals from the supporting plate and deposits such as Fe 3 O 4 or the capillary itself. It has become like that. However, in the conventional calculation method, factors that interfere with the defect signal and defect identification, such as when the defect is combined with the thin tube support plate, or when the signal of the dent part or the internal diameter change signal are combined, are not included. If only one interference factor is included, it is possible to eliminate this one interfering factor, but for example, there are multiple factors that can interfere with defect identification, such as the tube support plate, dent, change in the tube inner diameter, and the outer surface of the tube. When a plurality of factors, such as a deposit signal, overlap with a defect signal at the same time, the defect detection ability decreases, making it difficult to identify the defect. This is because in the conventional calculation method, if multiple factors that interfere with defect identification overlap at the same time as the defect signal, the function as a calculation unit cannot be fully demonstrated.

本発明は上記事情に鑑みて提案されたもので、
その目的とするところは欠陥識別の妨害となる複
数の要因例えば細管支持板部、細管外面の付着
物、デント部、細管内径変化(寸法変化)等の複
数の複合信号を同時に除去し、欠陥信号のみを識
別し得る多重周波数渦電流探傷分析装置を提供す
るにある。
The present invention was proposed in view of the above circumstances, and
The purpose of this is to simultaneously remove multiple composite signals from multiple factors that interfere with defect identification, such as the capillary support plate, deposits on the outer surface of the capillary, dents, and changes in the inner diameter of the capillary (dimensional changes). The purpose of the present invention is to provide a multi-frequency eddy current flaw detection and analysis device that can identify only

本発明による多重周波数渦電流探傷分析装置
は、複数の試験周波数による探傷出力が同時に得
られる多重周波数渦電流探傷器本体からの出力を
入力とする多重演算装置において、f1周波数によ
る水平成分及び垂直成分からなる探傷出力とf3
波数による水平成分及び垂直成分からなる探傷出
力とを組み合わせ、第1の演算回路に入力し、第
1番目の要因の影響を除去し、f3周波数による水
平成分及び垂直成分からなる探傷出力とf2周波数
による水平成分及び垂直成分からなる探傷出力と
を組み合わせ、第2の演算回路に入力し、第1番
目の要因の影響を除去し、第1の演算回路の水平
成分及び垂直成分からなる出力と第2の演算回路
の水平成分及び垂直成分からなる出力を組み合わ
せ第3の演算回路に入力し、第2番目の要因の影
響を除去し、これらにより、第1番目と、第2番
目の要因の影響とを除去し、第3番目の要因の影
響のみを出力させる機能を有することを特徴と
し、多重周波数渦電流探傷分析装置において、欠
陥識別の妨害となり得る要因を複数同時に除去し
て欠陥信号のみを検出するため、例えば周波数f1
およびf2信号に含まれるデント又は内径変化(寸
法変化)信号成分を周波数f3信号で消去し、その
後の信号成分に含まれる欠陥信号以外の妨害信号
成分をf1およびf2信号の減算処理により消去して
実質的に欠陥信号のみを検出して分析し得るもの
である。
The multi-frequency eddy current flaw detection and analysis device according to the present invention is a multi-processing device that receives as input the output from the main body of the multi-frequency eddy current flaw detector, which can simultaneously obtain flaw detection outputs based on a plurality of test frequencies. The flaw detection output consisting of the f3 frequency component and the flaw detection output consisting of the horizontal component and the vertical component due to the f3 frequency are combined and input to the first calculation circuit, the influence of the first factor is removed, and the flaw detection output consisting of the horizontal component and the vertical component due to the f3 frequency are combined. The flaw detection output consisting of the vertical component and the flaw detection output consisting of the horizontal component and the vertical component due to the f2 frequency are combined and input to the second arithmetic circuit, the influence of the first factor is removed, and the flaw detection output of the first arithmetic circuit is The output consisting of a horizontal component and a vertical component and the output consisting of a horizontal component and a vertical component of the second arithmetic circuit are combined and inputted to a third arithmetic circuit to remove the influence of the second factor. It is characterized by having a function of removing the influence of the second factor and the influence of the second factor and outputting only the influence of the third factor, which is a factor that can interfere with defect identification in a multi-frequency eddy current flaw detection analysis device. For example, frequency f 1
And the dent or inner diameter change (dimensional change) signal component included in the f 2 signal is erased with the frequency f 3 signal, and the interference signal components other than the defect signal included in the subsequent signal components are subtracted from the f 1 and f 2 signals. This makes it possible to detect and analyze substantially only defective signals.

本発明の一実施例を添付図面に基いて詳細に説
明する。
An embodiment of the present invention will be described in detail with reference to the accompanying drawings.

第1図は本発明の一実施例の多重周波数渦電流
探傷分析装置の全体の構成を示す概略図、 第2図は第1図における多重演算装置の回路構
成を示すブロツク線図、 第3図および第4図はそれぞれ第2図の各部の
詳細回路図、 第5図は第2図の概略ブロツク線図である。
FIG. 1 is a schematic diagram showing the overall configuration of a multi-frequency eddy current flaw detection and analysis device according to an embodiment of the present invention, FIG. 2 is a block diagram showing the circuit configuration of the multiplex calculation device in FIG. 1, and FIG. 4 are detailed circuit diagrams of each part of FIG. 2, and FIG. 5 is a schematic block diagram of FIG. 2.

第1図において01は多重周波数渦電流探傷器
本体、02は多重演算装置、03は複数の異なる
周波数f1〜fnを発振する発振器、04はミキサ、
05は探傷ブローブコイル、06はバランス回
路、07は周波数f1〜fnの信号処理部である。第
1図において各発振器03から発振された複数の
異なる渦電流探傷励磁周波数f1〜fnの励磁電流が
ミキサ04を介して探傷ブローブコイル05に同
時に通電されると、被分析体である例えば細管肉
質部(図示せず)にこれらの周波数f1〜fnに対応
した渦電流が流れる。この場合細管肉質部の欠陥
等により生ずる探傷ブローブコイル05のインピ
ーダンス変化が上記各周波数により決定され、細
管肉質部に欠陥が存在すれば、探傷ブローブコイ
ル05のインピーダンスの各周波数に対応した変
化をバランス回路06を介して各信号処理部07
により検出し、それらの出力信号を多重演算装置
02の入力端子に入力するようになされている。
In FIG. 1, 01 is the main body of the multi-frequency eddy current flaw detector, 02 is the multiplex calculation device, 03 is the oscillator that oscillates a plurality of different frequencies f 1 to fn, 04 is the mixer,
05 is a flaw detection probe coil, 06 is a balance circuit, and 07 is a signal processing section for frequencies f 1 to fn. In FIG. 1, when excitation currents of a plurality of different eddy current excitation frequencies f 1 to fn oscillated from each oscillator 03 are simultaneously applied to a flaw detection probe coil 05 via a mixer 04, Eddy currents corresponding to these frequencies f 1 to fn flow in the fleshy part (not shown). In this case, impedance changes of the flaw detection probe coil 05 caused by defects in the thin tube fleshy portion are determined by the above-mentioned frequencies, and if a defect exists in the thin tube fleshy portion, changes in the impedance of the flaw detection probe coil 05 corresponding to each frequency are balanced. Each signal processing unit 07 via the circuit 06
, and their output signals are input to the input terminal of the multiplex arithmetic unit 02.

多重演算装置02の回路構成は第2図にブロツ
ク線図で示されている。第2図において、1は渦
電流探傷励磁周波数f3信号水平成分の入力端子、
2はf3信号垂直成分の入力端子、3はf3信号の感
度調整及び無調整切替スイツチ、4はf3信号感度
調整(−10dB)回路、5はf3信号の位相調整及
び無調整切替スイツチ、6はf3信号位相調整回
路、7および8はそれぞれf3信号のモニター端
子、9はf3信号感度調整(+10dB)回路、10
はf3信号の位相調整及び無調整切替スイツチ、1
1はf3信号位相調整回路、12および13はそれ
ぞれf3信号のモニター端子、14および15それ
ぞれf1信号水平垂直成分の入力端子、16はf1
号におけるデント信号成分及び内径変化(寸法変
化)信号成分を消去する演算回路、17はf1信号
の感度調整及び無調整切替スイツチ、18はf1
号感度調整回路、19および20はそれぞれf2
号水平垂直成分の入力端子、21はf2信号におけ
るデント信号成分及び内径変化(寸法変化)信号
成分を消去する演算回路、22はf1信号の位相調
整及び無調整切替スイツチ、23はf1信号位相調
整回路、24および25はそれぞれf1信号のモニ
ター端子、26は細管外面付着物及び支持板消去
演算回路、27は同信号の位相調整及び無調整切
替スイツチ、28は同信号の位相調整回路、29
および30はそれぞれ多重演算出力信号端子であ
る。
The circuit configuration of the multiplex arithmetic unit 02 is shown in a block diagram in FIG. In Fig. 2, 1 is the input terminal for the horizontal component of the eddy current flaw detection excitation frequency f3 signal;
2 is an input terminal for the vertical component of the f 3 signal, 3 is a switch for adjusting the sensitivity of the f 3 signal and not adjusting it, 4 is a circuit for adjusting the sensitivity of the f 3 signal (-10 dB), and 5 is a switch for adjusting the phase of the f 3 signal and not adjusting it. switch, 6 is an f 3 signal phase adjustment circuit, 7 and 8 are each an f 3 signal monitor terminal, 9 is an f 3 signal sensitivity adjustment (+10dB) circuit, 10
is f3 signal phase adjustment and non-adjustment switch, 1
1 is an f 3 signal phase adjustment circuit, 12 and 13 are monitor terminals for the f 3 signal, 14 and 15 are input terminals for the horizontal and vertical components of the f 1 signal, and 16 is an input terminal for the dent signal component and inner diameter change (dimensional change) in the f 1 signal. ) an arithmetic circuit for erasing signal components; 17 is a switch for adjusting and not adjusting the sensitivity of the f 1 signal; 18 is a sensitivity adjustment circuit for the f 1 signal; 19 and 20 are input terminals for the horizontal and vertical components of the f 2 signal; 21 is an f 1 signal sensitivity adjustment switch; 2 is an arithmetic circuit that eliminates the dent signal component and the inner diameter change (dimensional change) signal component in the signal, 22 is a phase adjustment/non-adjustment switch for the f 1 signal, 23 is an f 1 signal phase adjustment circuit, and 24 and 25 are f 1 signal phase adjustment circuits, respectively. 1 signal monitor terminal, 26 is a thin tube outer surface deposit and support plate elimination calculation circuit, 27 is a phase adjustment/non-adjustment switch for the same signal, 28 is a phase adjustment circuit for the same signal, 29
and 30 are multiplex calculation output signal terminals, respectively.

なお第3図および第4図はそれぞれ上記第2図
の各部の詳細回路図であり、第5図は第2図の概
略ブロツク線図である。
3 and 4 are detailed circuit diagrams of the various parts shown in FIG. 2, respectively, and FIG. 5 is a schematic block diagram of FIG. 2.

次に上記本発明の一実施例の作用について説明
する。
Next, the operation of the above embodiment of the present invention will be explained.

第2図乃至第5図において始めにf1,f2の基準
信号から演算回路16(以下第1の演算回路とい
う)および21(以下第2の演算回路という)に
よりデント信号成分及び内径変化信号成分(以下
第1番目の要因の影響という)を除去するために
比較的デント信号成分が顕著に得られるf3信号を
第3図の感度調整回路4によりf1デント信号電圧
振幅に感度を相わせ、これを位相調整回路6によ
り位相を同一にしf1信号のデント信号成分のみを
消去するに等しい信号成分に波形整形(以下第1
の演算という)を行う。またf3信号を感度調整回
路9によりf2デント信号電圧振幅に感度を相わ
せ、これを位相調整回路11により位相を同一に
調整しf2信号のデント信号成分のみを消去するに
等しい信号成分に波形整形(以下第2の演算とい
う)を行う。これらの信号は第4図の多重演算回
路の演算回路16(第1の演算回路)によりf1
号のデント信号成分及び内径変化信号成分が消去
され、また演算回路21(第2の演算回路)によ
りf2信号のデント信号成分及び内径変化信号成分
が消去される。このようにしてデント及び内径変
化の各信号成分(第1番目の要因の影響)が消去
されたf1,f3の各信号には、欠陥信号(以下第3
番目の要因の影響という)の他に例えば管板、支
持板若しくは細管外面付着物等(以下第2番目の
要因の影響という)に基因する残余の妨害信号成
分が残るが、これらの妨害信号成分を消去するた
めに第4図図示のf1信号感度調整回路18により
f2信号をf1信号で減算するための最良の感度に調
整し、f1信号位相調整回路23によりf2信号の位
相と同一に相わせ、演算回路26(以下第3の演
算回路という)によりf1,f2信号を演算処理して
支持板及び外面付着物等に基因する残余の妨害信
号成分が除去される。これにより欠陥信号(第3
番目の要因の影響)のみが位相調整回路28を経
て多重演算出力信号端子29および30から出力
され、この欠陥信号が検出分析されることとな
る。この場合多重演算後の出力信号位相は比較的
高くなるために位相調整回路28で補正し減肉量
の推定を行うようにする。
In FIG. 2 to FIG. 5, a dent signal component and an inner diameter change signal are first generated from reference signals f 1 and f 2 by arithmetic circuits 16 (hereinafter referred to as the first arithmetic circuit) and 21 (hereinafter referred to as the second arithmetic circuit). (hereinafter referred to as the influence of the first factor), the sensitivity of the f 3 signal, which has a relatively noticeable dent signal component, is adjusted by the sensitivity adjustment circuit 4 shown in FIG. 3 to the f 1 dent signal voltage amplitude. Then, the phase adjustment circuit 6 performs waveform shaping (hereinafter referred to as the first
) is performed. In addition, the sensitivity of the f 3 signal is adjusted to match the f 2 dent signal voltage amplitude by the sensitivity adjustment circuit 9, and the phase is adjusted to be the same by the phase adjustment circuit 11, which is a signal component equivalent to erasing only the dent signal component of the f 2 signal. Then, waveform shaping (hereinafter referred to as second calculation) is performed. These signals are processed by the arithmetic circuit 16 (first arithmetic circuit) of the multiplex arithmetic circuit in FIG . As a result, the dent signal component and inner diameter change signal component of the f 2 signal are eliminated. In this way, the f 1 and f 3 signals, in which the signal components of the dent and inner diameter change (the influence of the first factor) have been eliminated, contain a defect signal (hereinafter referred to as the third factor).
In addition to the influence of the second factor (hereinafter referred to as the influence of the second factor), there remain residual interference signal components caused by, for example, the tube plate, support plate, or deposits on the outer surface of the capillary (hereinafter referred to as the influence of the second factor), but these interference signal components In order to eliminate the f1 signal sensitivity adjustment circuit 18 shown in FIG.
The f 2 signal is adjusted to the best sensitivity for subtracting the f 1 signal, and the f 1 signal phase adjustment circuit 23 matches the phase of the f 2 signal, and the arithmetic circuit 26 (hereinafter referred to as the third arithmetic circuit) By processing the f 1 and f 2 signals, residual interference signal components caused by the support plate, external surface deposits, etc. are removed. This causes the defect signal (third
Only the influence of the second factor) is outputted from the multiple calculation output signal terminals 29 and 30 via the phase adjustment circuit 28, and this defect signal is detected and analyzed. In this case, since the output signal phase after multiple calculations becomes relatively high, it is corrected by the phase adjustment circuit 28 to estimate the amount of thinning.

以上により本発明によれば、欠陥識別の妨害と
なる複数の要因が同一場所に存在している場合で
も、これらの妨害となる要因を確実に消去して欠
陥信号のみを検出して分析することが可能とな
り、例えば管板および支持板直上、直下における
管外面の付着物とデントおよび欠陥の各信号が複
合している場合、従来はその信号評価が不明瞭で
あつたが、本発明によれば欠陥信号のみを明瞭に
判別できる。従つて分析評価枝術の同上が図れる
と共に分析評価が容易となる優れた効果が得られ
る。
As described above, according to the present invention, even if a plurality of factors that interfere with defect identification exist in the same place, these factors that interfere with defect identification can be surely eliminated and only the defect signal can be detected and analyzed. For example, when the signals of deposits, dents, and defects on the tube outer surface directly above and below the tube sheet and support plate are combined, the signal evaluation was unclear in the past, but with the present invention, it is possible to In this case, only defect signals can be clearly identified. Therefore, it is possible to achieve the same analysis and evaluation techniques as above, and to obtain an excellent effect that the analysis and evaluation are facilitated.

なお本発明による多重周波数渦電流探傷分析装
置を例えば大型電算機や小型コンピユータと運動
させて使用してもよく、この場合には例えば加圧
水型軽水炉(PWR)蒸気発生器伝熱管等の検査
システムが著るしく改善されるものである。
Note that the multifrequency eddy current flaw detection and analysis device according to the present invention may be used in conjunction with, for example, a large computer or a small computer, and in this case, the inspection system for, for example, pressurized water reactor (PWR) steam generator heat transfer tubes, This is a marked improvement.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の全体構成を示す概
略図、第2図は第1図における多重演算装置の回
路構成を示すブロツク線図、第3図および第4図
はそれぞれ第2図の各部の詳細回路図、第5図は
第2図の概略ブロツク線図である。 01……多重周波数渦電流探傷器本体、02…
…多重演算装置、03……発振器、04……ミキ
サ、05……探傷ブローブコイル、06……バラ
ンス回路、07……信号処理部、1,2……f3
号の入力端子、3……f3信号の感度調整および無
調整切替スイツチ、4……f3信号感度調整回路、
5……f3信号の位相調整および無調整切替スイツ
チ、6……f3信号位相調整回路、7,8……f3
号のモニター端子、9……f3信号感度調整回路、
10……f3信号の位相調整および無調整切替スイ
ツチ、11……f3信号位相調整回路、12,13
……f3信号のモニター端子、14,15……f1
号の入力端子、16……演算回路、17……f1
号の感度調整および無調整切替スイツチ、18…
…f1信号感度調整回路、19,20……f2信号の
入力端子、21……演算回路、22……f1信号の
位相調整および無調整切替スイツチ、23……f1
信号位相調整回路、24,25……f1信号のモニ
ター端子、26……演算回路、27……位相調整
および無調整切替スイツチ、28……位相調整回
路、29,30……多重演算出力信号端子。
FIG. 1 is a schematic diagram showing the overall configuration of an embodiment of the present invention, FIG. 2 is a block diagram showing the circuit configuration of the multiple arithmetic unit in FIG. 1, and FIGS. 3 and 4 are respectively shown in FIG. FIG. 5 is a schematic block diagram of FIG. 2. 01...Multi-frequency eddy current flaw detector body, 02...
...Multiple processing unit, 03...Oscillator, 04...Mixer, 05...Flaw detection probe coil, 06...Balance circuit, 07...Signal processing section, 1, 2... F3 signal input terminal, 3... f3 signal sensitivity adjustment and non-adjustment selector switch, 4... f3 signal sensitivity adjustment circuit,
5... f3 signal phase adjustment and non-adjustment changeover switch, 6... f3 signal phase adjustment circuit, 7, 8... f3 signal monitor terminal, 9... f3 signal sensitivity adjustment circuit,
10... F3 signal phase adjustment and non-adjustment changeover switch, 11... F3 signal phase adjustment circuit, 12, 13
... f3 signal monitor terminal, 14,15... f1 signal input terminal, 16...arithmetic circuit, 17... f1 signal sensitivity adjustment and non-adjustment changeover switch, 18...
... f 1 signal sensitivity adjustment circuit, 19, 20 ... f 2 signal input terminal, 21 ... arithmetic circuit, 22 ... f 1 signal phase adjustment and non-adjustment changeover switch, 23 ... f 1
Signal phase adjustment circuit, 24, 25...f 1 signal monitor terminal, 26... Arithmetic circuit, 27... Phase adjustment and non-adjustment changeover switch, 28... Phase adjustment circuit, 29, 30... Multiple calculation output signal terminal.

Claims (1)

【特許請求の範囲】[Claims] 1 複数の試験周波数による探傷出力が同時に得
られる多重周波数渦電流探傷器本体からの出力を
入力とする多重演算装置において、f1周波数によ
る水平成分及び垂直成分からなる探傷出力とf3
波数による水平成分及び垂直成分からなる探傷出
力とを組み合わせ、第1の演算回路に入力し、第
1番目の要因の影響を除去し、f3周波数による水
平成分及び垂直成分からなる探傷出力とf2周波数
による水平成分及び垂直成分からなる探傷出力と
を組み合わせ、第2の演算回路に入力し、第1番
目の要因の影響を除去し、第1の演算回路の水平
成分及び垂直成分からなる出力と第2の演算回路
の水平成分及び垂直成分からなる出力を組み合わ
せ第3の演算回路に入力し、第2番目の要因の影
響を除去し、これらにより、第1番目と、第2番
目の要因の影響とを除去し、第3番目の要因の影
響のみを出力させる機能を有することを特徴とす
る多重周波数渦電流探傷分析装置。
1. In a multi-processing device that receives as input the output from the main body of a multi-frequency eddy current flaw detector that can simultaneously obtain flaw detection outputs at multiple test frequencies, flaw detection outputs consisting of horizontal and vertical components at the f1 frequency and horizontal flaw detection outputs at the f3 frequency are used. The flaw detection output consisting of the horizontal component and the vertical component are combined and input into the first calculation circuit, and the influence of the first factor is removed . The flaw detection output consisting of the horizontal component and the vertical component is combined and input to the second calculation circuit, the influence of the first factor is removed, and the output consisting of the horizontal component and the vertical component of the first calculation circuit and the second calculation circuit are combined. The outputs consisting of the horizontal and vertical components of the arithmetic circuits are combined and input to the third arithmetic circuit to remove the influence of the second factor, thereby eliminating the influence of the first and second factors. A multi-frequency eddy current flaw detection and analysis device characterized by having a function of removing the influence of the third factor and outputting only the influence of the third factor.
JP5211183A 1983-03-28 1983-03-28 Flaw detector and analyzer using multifrequency eddy current Granted JPS59176664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5211183A JPS59176664A (en) 1983-03-28 1983-03-28 Flaw detector and analyzer using multifrequency eddy current

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5211183A JPS59176664A (en) 1983-03-28 1983-03-28 Flaw detector and analyzer using multifrequency eddy current

Publications (2)

Publication Number Publication Date
JPS59176664A JPS59176664A (en) 1984-10-06
JPH0376416B2 true JPH0376416B2 (en) 1991-12-05

Family

ID=12905748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5211183A Granted JPS59176664A (en) 1983-03-28 1983-03-28 Flaw detector and analyzer using multifrequency eddy current

Country Status (1)

Country Link
JP (1) JPS59176664A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6273158A (en) * 1985-09-27 1987-04-03 Daizaburo Iwasaki Signal processing method and apparatus in eddy current flaw detection test

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817353A (en) * 1981-06-12 1983-02-01 Kobe Steel Ltd Multifrequency eddy current flaw detection method and apparatus by multiple coil system

Also Published As

Publication number Publication date
JPS59176664A (en) 1984-10-06

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