JPH0379879B2 - - Google Patents
Info
- Publication number
- JPH0379879B2 JPH0379879B2 JP61186950A JP18695086A JPH0379879B2 JP H0379879 B2 JPH0379879 B2 JP H0379879B2 JP 61186950 A JP61186950 A JP 61186950A JP 18695086 A JP18695086 A JP 18695086A JP H0379879 B2 JPH0379879 B2 JP H0379879B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- component
- hole
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔概要〕
半田ブリツジ防止法であつて、プリント板に形
成された部品半田付け用パツドが隣接し、その間
隔が狭小な場合、該部に孔を設けておき、部品を
噴流式半田付け装置により半田付けするとき、半
田が未だ溶融している間に前記孔に圧縮空気を吹
付けて隣接パツド間の半田を吹き飛ばすことによ
り半田ブリツジを防止可能とする。[Detailed Description of the Invention] [Summary] In the solder bridging prevention method, when component soldering pads formed on a printed circuit board are adjacent to each other and the interval between them is narrow, a hole is provided in the part and the component soldering pads are When soldering is performed using a jet soldering device, solder bridging can be prevented by blowing compressed air into the hole while the solder is still molten to blow away the solder between adjacent pads.
本発明は電子装置に用いられるプリント板に部
品を噴流式半田付装置にて半田付けするときの半
田ブリツジ防止法に関するものである。
The present invention relates to a method for preventing solder bridging when parts are soldered to a printed board used in an electronic device using a jet soldering device.
従来より通信装置、電子計算装置等の電子装置
には、部品の塔載と、それら部品間の配線を合理
化するためにプリント配線板（以下プリント板と
いう。）が用いられている。このプリント板は紙、
ガラス、布等に樹脂を含浸硬化させた絶縁基板に
銅箔又は銅めつきにより配線パターンを形成した
ものであり、最近はそのパターンが高密度化され
つつある。 BACKGROUND ART Printed wiring boards (hereinafter referred to as printed boards) have conventionally been used in electronic devices such as communication devices and electronic computing devices in order to rationalize the mounting of components and the wiring between these components. This printed board is paper,
A wiring pattern is formed by copper foil or copper plating on an insulating substrate made by impregnating and hardening resin into glass, cloth, etc., and recently, the density of the pattern has been increasing.
このようなプリント板において、部品の塔載は
第２図に示すように、リード１を有する部品２は
プリント板３に設けられたスルーホール４を挿通
して半田５にて半田付けされ、リードのないチツ
プ部品６はその端子７をプリント板３に設けられ
たパツド８に半田付けされている。
In such a printed board, components are mounted as shown in FIG. 2. A component 2 having a lead 1 is inserted through a through hole 4 provided in a printed board 3 and soldered with solder 5. The chip component 6 without a chip has its terminal 7 soldered to a pad 8 provided on the printed board 3.
上記従来のチツプ部品の半田付けにおいては、
第３図の如く部品実装密度が高くなり、隣接する
パツド８，８′間の間隔ｌが小さくなると、部品
半田付け時に半田ブリツジ９を生じ易くなり部品
間を短絡するという問題があつた。
In the conventional soldering of chip parts mentioned above,
As shown in FIG. 3, as the mounting density of components increases and the distance l between adjacent pads 8 and 8' decreases, solder bridges 9 are more likely to occur during soldering of components, causing short circuits between components.
本発明はこのような点に鑑みて創作されたもの
で、プリント板への部品半田付け時に半田ブリツ
ジが生じないようにした半田ブリツジ防止法を提
供することを目的としている。 The present invention was created in view of these points, and an object of the present invention is to provide a method for preventing solder bridging, which prevents solder bridging from occurring during soldering of components to a printed board.
このため本発明においては、電子部品を塔載す
るプリント板において、該プリント板３に形成さ
れた部品半田付け用パツド８，８′が隣接し、そ
の間隔が狭小な部分に孔１０を設け、該パツド
８，８′に部品６を噴流式半田付装置１１により
半田付けするとき、半田が未だ溶融している間に
前記孔１０に半田付け面の反対面から圧縮空気１
４を吹き付け隣接パツド８，８′間の半田を吹き
飛ばし半田ブリツジの形成を防止することを特徴
としている。
Therefore, in the present invention, holes 10 are provided in the printed board on which electronic components are mounted, where the component soldering pads 8, 8' formed on the printed board 3 are adjacent to each other and the distance between them is narrow. When soldering the component 6 to the pads 8, 8' using the jet soldering device 11, compressed air 1 is applied to the hole 10 from the opposite side of the soldering surface while the solder is still molten.
4 to blow off the solder between adjacent pads 8, 8' and prevent the formation of solder bridges.
隣接したパツド８，８′間に孔１０を設けてお
き、部品を半田付けするときに、未だ半田が溶融
している間に前記孔１０に圧縮空気を吹付けるこ
とにより、半田ブリツジとなる半田を吹飛ばし半
田ブリツジの形成も防止可能とする。
A hole 10 is provided between adjacent pads 8 and 8', and when soldering components, by blowing compressed air into the hole 10 while the solder is still melted, the solder becomes a solder bridge. It is also possible to prevent the formation of solder bridges by blowing away the solder.
第１図は本発明の実施例を説明するための図で
あり、ａはプリント板の平面図、ｂは部品半田付
け中を示す図である。
FIG. 1 is a diagram for explaining an embodiment of the present invention, in which a is a plan view of a printed board and b is a diagram showing parts being soldered.
本実施例は先ず第１図ａに示すように、プリン
ト板３上に形成されたパツド８，８′が隣接して
形成され、その間隔が狹い場合に、そのパツド
８，８′の間に貫通孔１０を設けておく。次に第
１図ｂの如くこのプリント板３に接着剤を用いて
仮止めした部品６を噴流式半田付装置１１を用い
て半田付けするとき、二次半田噴流１２を通過し
た直後で、未だ半田が溶融している間に前記孔１
０にノズル１３から圧縮空気１４を吹付けるので
ある。 In this embodiment, first, as shown in FIG. A through hole 10 is provided in the. Next, as shown in FIG. 1b, when the component 6 temporarily attached to the printed board 3 using adhesive is soldered using the jet soldering device 11, immediately after passing through the secondary solder jet 12, the component 6 is still attached. While the solder is melting, the hole 1
Compressed air 14 is blown from a nozzle 13 to the 0.
このようにして半田付けを行なうと、隣接した
パツド８，８′にそれぞれ半田付けされた部品間
に溜まつた半田は孔１０に吹付けられた圧縮空気
１２により吹飛ばされ、半田ブリツジを作ること
ができない。従つて半田ブリツジの形成は防止さ
れる。 When soldering is performed in this manner, the solder that has accumulated between the parts soldered to the adjacent pads 8 and 8' is blown away by the compressed air 12 blown into the holes 10, creating solder bridges. I can't. The formation of solder bridges is thus prevented.
以上述べてきたように、本発明によれば、極め
て簡易な方法で、隣接したパツド間の半田ブリツ
ジを防止することができ、実用的には極めて有用
である。
As described above, according to the present invention, solder bridging between adjacent pads can be prevented by an extremely simple method, and is extremely useful in practice.
第１図は本発明の実施例を説明するための図、
第２図は従来の部品半田付け法を示す図、第３図
は従来の部品半田付け法の不具合を説明するため
の図である。
第１図において、３はプリント板、６は部品、
８，８′はパツド、１０は孔、１１は噴流式半田
付け装置、１２は二次半田噴流、１３はノズル、
１４は圧縮空気である。
FIG. 1 is a diagram for explaining an embodiment of the present invention,
FIG. 2 is a diagram showing a conventional component soldering method, and FIG. 3 is a diagram illustrating problems with the conventional component soldering method. In Figure 1, 3 is a printed board, 6 is a component,
8, 8' are pads, 10 is a hole, 11 is a jet soldering device, 12 is a secondary soldering jet, 13 is a nozzle,
14 is compressed air.
Claims (1)
て、該プリント板３に形成された部品半田付け用
パツド８，８′が隣接し、その間隔が狭小な部分
に孔１０を設け、該パツド８，８′に部品６を噴
流式半田付装置１１により半田付けするとき、半
田が未だ溶融している間に前記孔１０に半田付け
面の反対面側から圧縮空気１４を吹付けて隣接パ
ツド８，８′間の半田を吹き飛ばし半田ブリツジ
の形成を防止することを特徴とした半田ブリツジ
防止法。1. In a printed wiring board on which electronic components are mounted, a hole 10 is provided in a portion where component soldering pads 8, 8' formed on the printed board 3 are adjacent to each other and the interval between them is narrow; When soldering the component 6 to the soldering device 11 using the jet soldering device 11, while the solder is still melting, compressed air 14 is blown into the hole 10 from the side opposite to the soldering surface to solder the adjacent pads 8, 8. A solder bridging prevention method characterized by blowing away the solder between the holes and preventing the formation of solder bridging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18695086A JPS6343394A (en) | 1986-08-11 | 1986-08-11 | Method of avoiding solder bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18695086A JPS6343394A (en) | 1986-08-11 | 1986-08-11 | Method of avoiding solder bridge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343394A JPS6343394A (en) | 1988-02-24 |
| JPH0379879B2 true JPH0379879B2 (en) | 1991-12-20 |
Family
ID=16197561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18695086A Granted JPS6343394A (en) | 1986-08-11 | 1986-08-11 | Method of avoiding solder bridge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343394A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030254U (en) * | 1973-07-12 | 1975-04-04 | ||
| JPS543215A (en) * | 1977-06-08 | 1979-01-11 | Niles Parts Co Ltd | Step motor and method of manufacture thereof |
-
1986
- 1986-08-11 JP JP18695086A patent/JPS6343394A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6343394A (en) | 1988-02-24 |
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