JPH038268B2 - - Google Patents
Info
- Publication number
- JPH038268B2 JPH038268B2 JP10970183A JP10970183A JPH038268B2 JP H038268 B2 JPH038268 B2 JP H038268B2 JP 10970183 A JP10970183 A JP 10970183A JP 10970183 A JP10970183 A JP 10970183A JP H038268 B2 JPH038268 B2 JP H038268B2
- Authority
- JP
- Japan
- Prior art keywords
- leaf spring
- armature
- wire
- weight
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 12
- 239000010949 copper Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 238000005219 brazing Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 7
- 230000032683 aging Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000004881 precipitation hardening Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 3
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 229910000734 martensite Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
- B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
- B41J2/27—Actuators for print wires
- B41J2/28—Actuators for print wires of spring charge type, i.e. with mechanical power under electro-magnetic control
Landscapes
- Impact Printers (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、板バネのバネ力によりドツトワイ
ヤを駆動させて印字を行なうワイヤドツトヘツド
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a wire dot head that performs printing by driving a dot wire using the spring force of a leaf spring.
従来、この種のワイヤドツトヘツドにおける印
字素子1は、第1図乃至第3図に示すように、基
端部がヨーク2に固定され、自由端部にドツトワ
イヤ3が固着されたオーステナイト系ステンレス
鋼(SUS301−H)製の板バネ4に、そのドツト
ワイヤ3が延出する側にレーザ点△にて補強リブ
5がレーザ溶接され、その反対側にレーザ点×に
て低炭素鋼製のアーマチユア6が溶接されること
により構成されていたが、レーザ溶接による溶融
に伴う結晶構造変化によつて体積変化等が起こ
り、それによつて、溶着部に微細クラツクが発生
したり、レーザ熱により第4図に示すように溶着
部及びその周辺の硬度が低下したりするため、溶
着部の強度が弱いため、ドツトワイヤ3が駆動さ
れ、印字を行うごとに溶着部に作用する曲げモー
メントに対する溶着部の疲労寿命が著しく短くな
つて、板バネの折損を招き、ワイヤドツトヘツド
の故障を生ずる欠点があつた。
Conventionally, the printing element 1 in this type of wire dot head is made of austenitic stainless steel, with its base end fixed to a yoke 2 and a dot wire 3 fixed to its free end, as shown in FIGS. 1 to 3. A reinforcing rib 5 is laser welded to the leaf spring 4 made of (SUS301-H) at the laser point △ on the side where the dot wire 3 extends, and an armature 6 made of low carbon steel is attached to the opposite side at the laser point ×. However, volume changes occur due to changes in the crystal structure due to melting by laser welding, which can cause microcracks to occur in the welded area, and laser heat can cause As shown in the figure, the strength of the weld is weak because the hardness of the weld and its surroundings decreases, so the fatigue life of the weld is limited by the bending moment that acts on the weld every time the dot wire 3 is driven and prints. This has the disadvantage that the length becomes extremely short, leading to breakage of the leaf spring and failure of the wire dot head.
尚、第4図における数値はビツカース硬度を示
している。 Note that the numerical values in FIG. 4 indicate the Vickers hardness.
この発明は、このような従来の事情に対処する
ためになされたものであり、板バネとアーマチユ
アとの溶着に伴う空孔及び微細クラツクが全く発
生せず、且つ硬度も低下しない、溶着部の強度の
強いワイヤドツトヘツドを製造し、故障の少ない
ワイヤドツトヘツドを提供するものである。
This invention was made in order to deal with such conventional circumstances, and it is possible to create a welded part that does not generate any holes or microcracks caused by welding the leaf spring and armature, and does not reduce the hardness. The purpose of the present invention is to manufacture a wire dot head with high strength and provide a wire dot head with fewer failures.
この発明は、前記目的を達成するために、アー
マチユアにろう付接合された板バネを偏倚させ
て、それによりドツトワイヤを駆動するワイヤド
ツトヘツドにおいて、Cr13.50〜15.50重量%、
Ni6.50〜7.75重量%、Si1.00〜2.00重量%、
Cu0.40〜1.00重量%、Mn1.00重量%以下、Ti0.20
〜0.65重量%、C0.09重量%以下、P0.040重量%
以下、S0.030重量%以下、残量をFeとした材料
により、前記板バネを構成したことを特徴とする
ものである。
In order to achieve the above object, the present invention provides a wire dot head that biases a leaf spring brazed to an armature and thereby drives a dot wire, which contains 13.50 to 15.50% by weight of Cr.
Ni6.50~7.75wt%, Si1.00~2.00wt%,
Cu0.40~1.00wt%, Mn1.00wt% or less, Ti0.20
~0.65 wt%, C0.09 wt% or less, P0.040 wt%
Hereinafter, the leaf spring is characterized in that it is made of a material in which S is 0.030% by weight or less and the remaining amount is Fe.
以下、この発明を具体化した実施例について第
5図乃至第8図を参照して説明する。
Hereinafter, embodiments embodying the present invention will be described with reference to FIGS. 5 to 8.
第5図はワイヤドツトヘツド7の側断面図を示
し、8はフレームであり、偏平な円形容器状をな
す後部ヨーク9と円板状をなす前部ヨーク10に
よつて構成され、後部ヨーク9と前部ヨーク10
との間には、永久磁石11およびスペーサ部材1
2が介装されている。 FIG. 5 shows a side sectional view of the wire dot head 7, and 8 is a frame, which is composed of a rear yoke 9 in the shape of a flat circular container and a front yoke 10 in the shape of a disk. and front yoke 10
A permanent magnet 11 and a spacer member 1 are provided between the
2 is interposed.
13は複数枚例えば16枚の板バネであり、
Cr13.50〜15.50重量%、Ni6.50〜7.75重量%、
Si1.00〜2.00重量%、Cu0.40〜1.00重量%、
Mn1.00重量%以下、Ti0.20〜0.65重量%、C0.09
重量%以下、P0.040重量%以下、S0.030重量%以
下、残量をFeとした材料すなわち溶体化処理状
態でマルテンサイト組織を有し、析出硬化元素と
して、Si、Cu、Tiを有効利用した析出硬化型マ
ルテンサイト系ステンレス鋼で形成され、円環状
の基板14から内方に向けて放射状に突出してい
る。その基端部たる基板14は前記スペーサ部材
12と前部ヨーク10との間に挾持固定されてい
る。各板バネ13の自由端部15には、ドツトワ
イヤ16の基端部がろう付によつて固着されてい
る。 13 is a plurality of leaf springs, for example 16,
Cr13.50~15.50wt%, Ni6.50~7.75wt%,
Si1.00~2.00wt%, Cu0.40~1.00wt%,
Mn1.00wt% or less, Ti0.20~0.65wt%, C0.09
Material with weight% or less, P0.040 weight% or less, S0.030 weight% or less, and the remaining amount is Fe, i.e., it has a martensitic structure in the solution treatment state, and Si, Cu, and Ti are effective as precipitation hardening elements. It is made of precipitation-hardened martensitic stainless steel, and protrudes radially inward from the annular substrate 14. A substrate 14, which is the base end thereof, is clamped and fixed between the spacer member 12 and the front yoke 10. A base end portion of a dot wire 16 is fixed to the free end portion 15 of each leaf spring 13 by brazing.
また、基板14と板バネ13の自由端部15と
の間の中間部17に、低炭素鋼である2、5%Si
鋼(SUYP−S2.5)製のアーマチユア18が固着
されており、その反対側の面には、板バネ13と
同じ材質の補強リブ19がろう付されている。 In addition, 2.5% Si, which is low carbon steel, is added to the intermediate portion 17 between the substrate 14 and the free end 15 of the leaf spring 13.
An armature 18 made of steel (SUYP-S2.5) is fixed, and a reinforcing rib 19 made of the same material as the leaf spring 13 is brazed to the opposite surface.
20は板バネ13の夫々に対応する16個の電磁
石装置であり、これら電磁石装置20は後部ヨー
ク9に突設されてその先端が板バネ13上のアー
マチユア18の表面18aに対向するコア21
と、そのコア21に巻回された電磁巻線22とか
ら構成されている。また、23は前部ヨーク10
に取付けられたガイド枠であり、その中央部には
ドツトワイヤ16の先端部を挿通させる16個の挿
通孔が形成されている。 Reference numeral 20 denotes 16 electromagnet devices corresponding to each of the leaf springs 13, and these electromagnet devices 20 are provided with a core 21 that projects from the rear yoke 9 and whose tip faces the surface 18a of the armature 18 on the leaf spring 13.
and an electromagnetic winding 22 wound around the core 21. In addition, 23 is the front yoke 10
This is a guide frame attached to the guide frame, and 16 insertion holes are formed in the center thereof, through which the tips of the dot wires 16 are inserted.
次に上記板バネ13(本発明品、摂氏480度に
おいて1時間の時効処理を行なつたもの)と他の
材料(SUS631、SUS301、それぞれ時効処理条
件は図中に示す)による板バネについて、その硬
さ特性、引張特性、ばね限界値、ヤング率、疲労
特性を第10図乃至第14図に示す。このように
例えば冷間圧延率30パーセントにおいて上記板バ
ネ13は非常に優れた特性を有する。またワイヤ
ドツトヘツドに用いられる板バネとして非常に重
要な疲労特性においてはSUS631と同等の特性を
有する。また他の特性においては、他の材料を上
回る特性が得られる。これは、溶体化処理後に生
成されたマルテンサイト相に、時効処理により微
細な金属間化合物が析出されて硬化するためと思
われる。 Next, regarding the above leaf spring 13 (product of the present invention, aged for 1 hour at 480 degrees Celsius) and leaf springs made of other materials (SUS631, SUS301, aging treatment conditions are shown in the figure), Its hardness characteristics, tensile characteristics, spring limit value, Young's modulus, and fatigue characteristics are shown in FIGS. 10 to 14. As described above, the leaf spring 13 has very excellent characteristics at a cold rolling rate of 30%, for example. Furthermore, it has properties equivalent to SUS631 in terms of fatigue properties, which are very important for leaf springs used in wire dot heads. Furthermore, in other properties, properties superior to those of other materials can be obtained. This seems to be because fine intermetallic compounds are precipitated and hardened by aging treatment in the martensite phase generated after solution treatment.
このように構成されたワイヤドツトヘツドの動
作について説明する。 The operation of the wire dot head constructed in this way will be explained.
このワイヤドツトヘツドにおいては、常には第
5図に破線で示すように、永久磁石11→スペー
サ部材12→基板14→前部ヨーク10→板バネ
13→アーマチユア18→コア21→後部ヨーク
9の磁路が形成されており、アーマチユア18は
永久磁石11の磁力によりコア21に吸着されて
いるので、板バネ13は第5図に示す矢印方向に
偏倚して偏倚エネルギーを蓄勢している。そし
て、電磁石装置20を電磁巻線22が通電される
と、その電磁石装置20は永久磁石11による磁
力を打ち消すような磁力を発生するようになり、
この電磁石装置20に対応する板バネ13の自由
端部15が、偏倚エネルギーによつて前方側たる
第5図における反矢印方向に移動してその自由端
部15のドツトワイヤ16を反矢印方向に移行さ
せるようになり、以つて、印字用紙(図示せず)
に印字が行なわれる。次いで、前記電磁石装置2
0の電磁巻線22が断電されると、板バネ13の
自由端部15は再び永久磁石11の磁力によつて
コア21に吸着復帰されるようになり、このよう
な動作が繰り返されることにより所望の印字を行
なうことができる。 In this wire dot head, the permanent magnet 11 → spacer member 12 → substrate 14 → front yoke 10 → leaf spring 13 → armature 18 → core 21 → rear yoke 9 magnet Since the armature 18 is attracted to the core 21 by the magnetic force of the permanent magnet 11, the leaf spring 13 is biased in the direction of the arrow shown in FIG. 5 and stores bias energy. When the electromagnetic winding 22 of the electromagnet device 20 is energized, the electromagnet device 20 generates a magnetic force that cancels the magnetic force of the permanent magnet 11.
The free end 15 of the leaf spring 13 corresponding to this electromagnet device 20 moves in the direction opposite to the arrow in FIG. Printing paper (not shown)
Printing is performed on the Next, the electromagnet device 2
When the electromagnetic winding 22 of No. 0 is de-energized, the free end 15 of the leaf spring 13 is again attracted to the core 21 by the magnetic force of the permanent magnet 11, and this operation is repeated. Desired printing can be performed by this.
このようにして板バネ13を第5図及び第6図
に示すように曲げたとき、アーマチユア18を溶
着した板バネ13の溶着部に大きな曲げモーメン
トが加わるが、この発明による前記の板バネ材料
を用いて、ろう付接合を行なえば、溶着部の溶融
に伴う微細クラツクの発生等がなく、又、硬度も
低下することもないので板バネ13が溶着部で折
損することが少なくなる。 When the leaf spring 13 is bent as shown in FIGS. 5 and 6 in this manner, a large bending moment is applied to the welded portion of the leaf spring 13 to which the armature 18 is welded. If the brazing joint is performed using the welded part, there will be no occurrence of minute cracks due to melting of the welded part, and the hardness will not decrease, so the leaf spring 13 is less likely to break at the welded part.
次に、板バネ13とアーマチユア18との溶着
について説明する。 Next, welding between the leaf spring 13 and the armature 18 will be explained.
まず、磁気特性等を考慮して、低炭素鋼である
2.5%Si鋼(SUYP−S2.5)から形成されたアー
マチユア18の表面に、ろう材として導電性に優
れた銅膜を適宜膜厚にて予めメツキ処理し、次
に、析出硬化元素として、Si、Cu、Tiを有効利
用した析出硬化型マルテンサイト系ステンレス鋼
により形成した板バネ13上に、メツキ処理した
アーマチユア18を載置する。そして、その板バ
ネ13とアーマチユア18とを高温炉中におい
て、銅を溶融し得る程度の温度(1130℃程度)で
加熱処理すると、アーマチユア18にメツキ処理
された銅膜が溶融され、溶融された銅は毛管現象
により板バネ13とアーマチユア18との間に充
填され、その冷却に従つて板バネ13とアーマチ
ユア18とが銅ろう付される。この時、溶着部に
は第7図及び第8図に示すように、クラツクが全
く発生せず、又、溶着部の硬度も低下することが
なく(溶着部も含めほぼHv450前後である)、印
字動作により溶着部に集中応力がかかつても、板
バネ13が溶着部で折損することが少なくなり、
ワイヤドツトヘツドの耐久性能が従来の板バネ材
料及び溶着方法に比べて2倍以上に向上する。 First, considering magnetic properties, etc., it is a low carbon steel.
On the surface of the armature 18 made of 2.5% Si steel (SUYP-S2.5), a copper film with excellent conductivity is pre-plated as a brazing material to an appropriate thickness, and then as a precipitation hardening element, A plated armature 18 is placed on a plate spring 13 made of precipitation hardening martensitic stainless steel that effectively utilizes Si, Cu, and Ti. Then, when the leaf spring 13 and the armature 18 are heat-treated in a high-temperature furnace at a temperature that can melt copper (about 1130° C.), the copper film plated on the armature 18 is melted. Copper is filled between the leaf spring 13 and the armature 18 by capillary action, and as the copper is cooled, the leaf spring 13 and the armature 18 are copper-brazed. At this time, as shown in Figures 7 and 8, no cracks were generated in the welded part, and the hardness of the welded part did not decrease (approximately Hv450 including the welded part). Even if concentrated stress is applied to the welded part due to the printing operation, the leaf spring 13 is less likely to break at the welded part,
The durability of the wire dot head is more than doubled compared to conventional leaf spring materials and welding methods.
この銅ろう付作業の後に時効処理による硬化作
業を行なう。すると前記銅ろう付時に板バネ13
先端の硬度が損なわれるが、その後に硬化作業が
なされるため、充分な硬度を得ることができる。
前記板バネ13はその時効処理の硬化温度が摂氏
480度と比較的に低く、そのため時効処理では摂
氏480度程度に加熱するのみでよいので、ろう材
(銅)の再溶解等を起すことがなく、銅ろう付部
に悪影響を与えることがない。 After this copper brazing work, hardening work is performed by aging treatment. Then, during the copper brazing, the leaf spring 13
Although the hardness of the tip is impaired, sufficient hardness can be obtained since the hardening operation is performed afterwards.
The curing temperature of the aging treatment of the leaf spring 13 is Celsius.
It is relatively low at 480 degrees Celsius, so it only needs to be heated to about 480 degrees Celsius during aging treatment, so there is no remelting of the brazing filler metal (copper), and there is no adverse effect on the copper brazed parts. .
尚、前記実施例ではろう材として銅を使用した
が、ニツケル等の他のろう材を使用しても何ら支
障がない。 Although copper was used as the brazing material in the above embodiments, other brazing materials such as nickel may be used without any problem.
ところで、他の実験としてこの発明の析出硬化
型マルテンサイト系ステンレス鋼を使用して板バ
ネを形成すると共に、その板バネとアーマチユア
とをレーザー溶接したところ、溶融に伴なつて溶
着部に発生する微細クラツクは、従来の板バネ材
料(SUS301−H)のときに比べて多少減少する
が完全にはなくならない(第9図参照)ので、ワ
イヤドツトヘツドの耐久性能はあまり向上しなか
つた。 By the way, in another experiment, a plate spring was formed using the precipitation hardening martensitic stainless steel of the present invention, and the plate spring and armature were laser welded. Although the fine cracks were somewhat reduced compared to the conventional leaf spring material (SUS301-H), they were not completely eliminated (see Fig. 9), so the durability of the wire dot head was not significantly improved.
以上詳述したように、この発明は、アーマチユ
アにろう付接合された板バネを偏倚させて、それ
によりドツトワイヤを駆動するワイヤドツトヘツ
ドにおいて、Cr13.50〜15.50重量%、Ni6.50〜
7.75重量%、Si1.00〜2.00重量%、Cu0.40〜1.00重
量%、Mn1.00重量%以下、Ti0.20〜0.65重量%、
C0.09重量%以下、P0.040重量%以下、S0.030重
量%以下、残量をFeとした材料により、前記板
バネを構成したので、板バネとアーマチユアの溶
着部には、溶融に伴う微細クラツクが全く発生せ
ず、又、硬度低下を起こすこともなくなり、板バ
ネとアーマチユアとの溶着部の疲労寿命が増大
し、ワイヤドツトヘツドの故障が少なくなる。更
に、溶着方法としてろう付接合を採用したので、
板バネとアーマチユアとの溶着面積が大きくな
り、溶着部全体の絶対強度を増大できるなど、そ
の奏する効果は極めて大である。
As described in detail above, the present invention provides a wire dot head that biases a leaf spring brazed to an armature and thereby drives a dot wire, with Cr13.50 to 15.50% by weight and Ni6.50 to
7.75% by weight, Si 1.00-2.00% by weight, Cu 0.40-1.00% by weight, Mn 1.00% by weight or less, Ti 0.20-0.65% by weight,
Since the leaf spring was made of a material with C0.09% by weight or less, P0.040% by weight or less, S0.030% by weight or less, and the remaining amount of Fe, the welded part of the leaf spring and armature is not melted. This eliminates the occurrence of minute cracks and decreases in hardness, increasing the fatigue life of the welded portion between the leaf spring and the armature, and reducing the number of failures of the wire dot head. Furthermore, since we adopted brazing as the welding method,
The welded area between the leaf spring and the armature becomes larger, and the absolute strength of the entire welded part can be increased, so the effects are extremely large.
第1図乃至第3図は従来のワイヤドツトヘツド
のレーザ溶接箇所を示す図、第4図は従来の板バ
ネとアーマチユアとをレーザ溶接し、そのレーザ
点付近の硬度を測定した後の板バネ表面を示す写
真、第5図はこの発明に係るチヤージ式ワイヤド
ツトヘツドの概略を示す断面図、第6図は第5図
の要部拡大断面図、第7図は板バネとアーマチユ
アとのろう付状態を示す電子顕微鏡写真、第8図
は第7図の拡大電子顕微鏡写真、第9図は板バネ
とアーマチユアとをレーザ溶接した状態を示す電
子顕微鏡写真、第10図は板バネの硬さ特性を示
す図、第11図は板バネの引張特性を示す図、第
12図は板バネのばね限界値を示す図、第13図
は板バネのヤング率を示す図、第14図は板バネ
の疲労特性を示す図である。
7はワイヤドツトヘツド、13は板バネ、14
は基板、16はドツトワイヤ、18はアーマチユ
ア、19は補強リブ。
Figures 1 to 3 show the laser welding points of a conventional wire dot head, and Figure 4 shows the plate spring after laser welding the conventional plate spring and armature and measuring the hardness near the laser point. A photograph showing the surface, FIG. 5 is a sectional view showing the outline of the charge type wire dot head according to the present invention, FIG. 6 is an enlarged sectional view of the main part of FIG. 5, and FIG. Fig. 8 is an enlarged electron micrograph of Fig. 7, Fig. 9 is an electron micrograph showing the state in which the leaf spring and armature are laser welded, and Fig. 10 is the hardness of the leaf spring. Figure 11 is a diagram showing the tensile characteristics of the leaf spring, Figure 12 is a diagram showing the spring limit value of the leaf spring, Figure 13 is a diagram showing the Young's modulus of the leaf spring, and Figure 14 is a diagram showing the leaf spring's spring modulus. FIG. 3 is a diagram showing fatigue characteristics of a spring. 7 is a wire dot head, 13 is a leaf spring, 14
16 is a dot wire, 18 is an armature, and 19 is a reinforcing rib.
Claims (1)
倚させて、それによりドツトワイヤを駆動するワ
イヤドツトヘツドにおいて、 Cr13.50〜15.50重量%、Ni6.50〜7.75重量%、
Si1.00〜2.00重量%、Cu0.40〜1.00重量%、
Mn1.00重量%以下、Ti0.20〜0.65重量%、C0.09
重量%以下、P0.040重量%以下、S0.030重量%以
下、残量をFeとした材料により、前記板バネを
構成したことを特徴とするワイヤドツトヘツド。[Claims] 1. A wire dot head that biases a leaf spring brazed to the armature and thereby drives a dot wire, comprising: 13.50 to 15.50% by weight of Cr, 6.50 to 7.75% by weight of Ni,
Si1.00~2.00wt%, Cu0.40~1.00wt%,
Mn 1.00% by weight or less, Ti 0.20-0.65% by weight, C 0.09
A wire dot head characterized in that the leaf spring is made of a material in which the balance is Fe, P0.040 wt% or less, S0.030 wt% or less, and the remaining amount is Fe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10970183A JPS60970A (en) | 1983-06-17 | 1983-06-17 | Wire dot head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10970183A JPS60970A (en) | 1983-06-17 | 1983-06-17 | Wire dot head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60970A JPS60970A (en) | 1985-01-07 |
| JPH038268B2 true JPH038268B2 (en) | 1991-02-05 |
Family
ID=14517016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10970183A Granted JPS60970A (en) | 1983-06-17 | 1983-06-17 | Wire dot head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60970A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3017151B2 (en) | 1997-11-26 | 2000-03-06 | 静岡日本電気株式会社 | Hand strap of portable device and mounting structure of this hand strap |
-
1983
- 1983-06-17 JP JP10970183A patent/JPS60970A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60970A (en) | 1985-01-07 |
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