JPH0388329U - - Google Patents
Info
- Publication number
- JPH0388329U JPH0388329U JP14981089U JP14981089U JPH0388329U JP H0388329 U JPH0388329 U JP H0388329U JP 14981089 U JP14981089 U JP 14981089U JP 14981089 U JP14981089 U JP 14981089U JP H0388329 U JPH0388329 U JP H0388329U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- wafer
- rinsing mechanism
- resist film
- edge rinsing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002904 solvent Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
Description
第１図はこの考案の一実施例のエツジリンス機
構を採用したレジスト塗布装置の要部断面図であ
る。第２図は従来のエツジリンス機構を採用たレ
ジスト塗布装置の要部断面図である。第３図は従
来のエツジリンス機構を採用した場合のレジスト
除去範囲を示す。
４……ウエーハ、５……ウエーハ端周縁部対応
用ノズル、７……オリエンテーシヨンフラツト部
専用ノズル。
FIG. 1 is a sectional view of a main part of a resist coating apparatus employing an edge rinsing mechanism according to an embodiment of this invention. FIG. 2 is a sectional view of a main part of a resist coating apparatus employing a conventional edge rinsing mechanism. FIG. 3 shows the range of resist removal when the conventional edge rinsing mechanism is employed. 4...Wafer, 5...Nozzle for supporting the wafer edge, 7...Nozzle exclusively for the orientation flat part.
補正 平２．３．３０
図面の簡単な説明を次のように補正する。
出願明細書第５頁第１８行目の「……除去範囲
を示す。」を「……除去範囲を示すウエーハの平
面図である。第４図は、この考案のエツジリンス
機構のレジスト除去タイミングを示すタイミング
チヤートである。」に訂正する。Amendment 1992.3.30 The brief description of the drawing is amended as follows. In the 18th line of page 5 of the application specification, "...indicates the removal range" is replaced with "... is a plan view of the wafer showing the removal range. FIG. 4 shows the resist removal timing of the edge rinse mechanism of this invention. This is a timing chart showing the correct timing.
Claims (1)
固定し、回転させるとともに、薬液ノズルから溶
剤を吐出し、ウエーハ周辺部のレジスト膜を除去
するエツジリンス機構において、 前記薬液ノズルを、ウエーハ円周部用ノズルと
オリエンテーシヨンフラツト部専用ノズルに分設
したことを特徴とするエツジリンス機構。[Scope of Claim for Utility Model Registration] In an edge rinsing mechanism that attaches and fixes a wafer with a resist film to a spin chuck, rotates it, and discharges a solvent from a chemical nozzle to remove the resist film around the wafer, An edge rinsing mechanism characterized by having a nozzle for the circumferential part and a nozzle dedicated to the orientation flat part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14981089U JPH0388329U (en) | 1989-12-25 | 1989-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14981089U JPH0388329U (en) | 1989-12-25 | 1989-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388329U true JPH0388329U (en) | 1991-09-10 |
Family
ID=31696185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14981089U Pending JPH0388329U (en) | 1989-12-25 | 1989-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388329U (en) |
-
1989
- 1989-12-25 JP JP14981089U patent/JPH0388329U/ja active Pending
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