JPH0411640B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for electroplating or electrolytically treating a plate-like workpiece.

When plating is performed by spouting plating liquid from a nozzle onto a vertical workpiece immersed in plating liquid, in conventional equipment, the nozzle is generally installed above or below the workpiece, and the plating liquid is ejected from the nozzle. Since the jet flow is designed to flow up and down along the surface of the workpiece, the cathode film formed on the surface of the workpiece cannot be sufficiently destroyed by the plating liquid jet, which causes the problem of slow processing speed. be.

In order to solve the above-mentioned conventional problems, the present invention has a plurality of slit-like or serially arranged plating liquid spouts that are arranged toward the surface of the workpiece. It is as follows.

In FIG. 1, which is a schematic vertical cross-section, tank 1
A plate-like workpiece 3 is immersed in the plating liquid 2 in a vertical position. The workpiece 3 is suspended by a hanger-type holding mechanism 4, for example, and the workpiece 3 is
A cathode power supply 5 is connected to. Reference numeral 6 denotes a pair of tank side walls facing the surface of the workpiece 3, and an anode power source 7
An anode 8 connected to the plating liquid 2 is immersed in the vicinity of both side walls 6. A vertical plating liquid spouting pipe 10 is provided between both anodes 8 and the workpiece 3. The upper end of the pipe 10 is located at approximately the same height as the upper edge of the workpiece 3, and the lower end is connected to the plating liquid supply pipe 12 on the tank bottom wall 11, and the outer circumference of the pipe 10 has a stop that protrudes toward the workpiece 3 side. A liquid jet nozzle 13 is provided over substantially the entire length of the pipe 10. The slit-like slit-shaped glazing liquid spout 15 provided in the nozzle 13 has a vertical length and extends over substantially the entire length of the nozzle 13. Note that the pipe 12 is connected to a plating liquid supply pump (not shown). A shielding plate 16 (skirt) is vertically provided between the anode 8 and the pipe 10 on both sides. The shielding plate 16 is for blocking a part of the current flowing from the anode 8 to the workpiece 3, thereby preventing plating metal from concentrating on the lower edge of the workpiece 3. By operating the wire 17 using a pulley 18 or the like above the tank 1, the vertical position of the shielding plate 16 can be adjusted. In addition, the shielding plate 16
can also be abolished.

As shown in FIG. 2, which is a schematic enlarged cross-sectional view of FIG. It is provided. In the illustrated embodiment, the pipe 1 on both sides of the workpiece 3
0 and 10 face each other from side to side in FIG. 2 with the workpiece 3 in between. By a mechanism not shown, the angular position of each pipe 10 can be adjusted as shown by arrow R around its center line O (or a vertical line parallel to center line O). The pipes 10 are all in a position with the nozzles 13 facing toward one of the tank end walls 20, and each nozzle 13 is inclined at an angle D of about 45° with respect to the surface of the workpiece 3. It has been confirmed through experiments and the like that the optimum inclination angle D of the nozzle 13 (the ejection angle of the plating liquid) with respect to the workpiece surface is 45°±10°.

Although not shown, the holding mechanism 4 in FIG. 1 is connected to, for example, a chain-type moving mechanism, and the moving mechanism moves the workpiece 3 horizontally and parallel to the surface of the workpiece, as indicated by the arrow F-F' in FIG. It is designed to swing (reciprocate) in the direction. Note that the workpiece 3 can also be moved continuously in one direction F.

According to the above configuration, since the film-like plating liquid is spouted from the slit-shaped spout 15, the plating liquid collides with the workpiece 3 almost uniformly over the entire height, and this causes the workpiece 3 to be swing (or move) in the direction
By doing so, the plating liquid impinges on the entire surface of the workpiece 3 approximately evenly. Therefore, the cathode film on the workpiece surface is reliably destroyed, and fresh plating solution (containing a large amount of plating metal ions) is constantly in contact with the entire workpiece surface, and a sufficient thickness of plating can be applied to the workpiece surface in a short time. Applied evenly throughout.

As explained above, according to the present invention, the workpiece holding mechanism 4 immerses the plate-like workpiece 3 in the plating liquid 2 in the plating tank 1 in a vertical or inclined position, and the moving mechanism holds the workpiece 3 horizontally and along its surface. A plurality of plated jetting pipes 10 extending vertically along the surface of the workpiece are arranged side by side along the workpiece moving direction, and a slit-shaped jetting port 15 extending in the longitudinal direction of the pipe 10 is provided. Since the film-like plating liquid jet is ejected from the outlet 15, a high-quality plating layer can be formed in a short time.

Furthermore, if the angular position of the pipe 10 is made adjustable so that the angle of the jet with respect to the workpiece surface can be changed, the plating liquid jet angle can always be set to the optimum value in response to various plating conditions.

When embodying the present invention, the direction of the pipe 10a on one side and the direction of the pipe 10b on the other side with respect to the workpiece 3 are reversed, as shown in FIG.
It is also possible to direct one pipe 10a toward the end wall 20 and the other pipe 10b toward the opposite end wall 21. Further, the plating liquid from the pipe 10a and the plating liquid from the pipe 10b can be made to collide with the workpiece 3 at positions shifted from each other in the direction of the arrow F.

Instead of the hanger-type holding mechanism 4, the workpiece 3 can be held by multiple rollers from both sides, and when such a roller-type holding mechanism is adopted, the workpiece 3 can be held and moved at an angle. You can also do it.

Instead of the slit-like jet nozzle 15, a plurality of hole-like jet nozzles arranged in series may be used.

[Brief explanation of drawings]

FIG. 1 is a schematic vertical sectional view of an embodiment of the present invention, FIG. 2 is a schematic enlarged cross-sectional view of FIG. 1, and FIG. 3 is a schematic plan view of another embodiment. 1...Plating tank, 2...Plating liquid, 3...
Workpiece, 4... Holding mechanism, 10... Plating liquid jetting pipe, 13... Plating liquid jetting nozzle, 15...
Plating liquid spout.

Claims (1)

[Claims] 1. A workpiece holding mechanism immerses a plate-like workpiece in a plating solution in a plating tank in a vertical or inclined position, and a moving mechanism moves or swings the workpiece horizontally and along its surface (reciprocating). A plurality of plating liquid spouting pipes extending vertically along the workpiece surface are arranged side by side along the workpiece movement direction, and a slit-shaped or hole-shaped plating liquid spouting port extending in the longitudinal direction of the pipe is provided. 1. A plating device for plate-like workpieces, characterized in that a jet of film-like plating liquid is spouted from a spout. 2. The apparatus for plating a plate-like workpiece according to claim 1, wherein the angular position of the pipe is adjustable so that the angle of the jet stream with respect to the workpiece surface can be changed.