JPH041560B2 - - Google Patents
Info
- Publication number
- JPH041560B2 JPH041560B2 JP61293897A JP29389786A JPH041560B2 JP H041560 B2 JPH041560 B2 JP H041560B2 JP 61293897 A JP61293897 A JP 61293897A JP 29389786 A JP29389786 A JP 29389786A JP H041560 B2 JPH041560 B2 JP H041560B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric plate
- backing material
- conductor
- dimensional array
- dicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000011295 pitch Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は角柱状エレメントが碁盤目状に配列さ
れる２次元アレイトランスデユーサの製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a two-dimensional array transducer in which prismatic elements are arranged in a grid pattern.
（従来の技術）
従来から、角柱状エレメントが碁盤目状に配列
される２次元アレイトランスデユーサの製造する
方法が種々知られている。例えば、IEEE
TRANSACTIONS ON SONICS AND
ULTRASONICS、VOL.SU−19、No.４、
OCTOBER1972にその一例が開示されている。
上記開示によれば、２次元アレイトランスデユー
サは第２図ａ乃至ｅに示す工程で作られる。即
ち、
(1) 薄い圧電板１の一方の面を碁盤目状にダイシ
ングする（切込みは厚さ方向の約93％）。これ
により碁盤目状に配列された角柱状エレメント
２が構成される（第２図ａ）。(Prior Art) Various methods of manufacturing a two-dimensional array transducer in which prismatic elements are arranged in a grid pattern have been known. For example, IEEE
TRANSACTIONS ON SONICS AND
ULTRASONICS, VOL.SU−19, No.4,
An example is disclosed in OCTOBER1972.
According to the above disclosure, a two-dimensional array transducer is manufactured by the steps shown in FIGS. 2a to 2e. That is, (1) one side of the thin piezoelectric plate 1 is diced in a checkerboard pattern (cutting depth is about 93% in the thickness direction). As a result, prismatic elements 2 arranged in a grid pattern are formed (FIG. 2a).
(2) ダイシングしない側から角柱状エレメント２
のコーナに貫通穴３を設ける（第２図ｂ）。(2) Prismatic element 2 from the non-dicing side
A through hole 3 is provided at the corner of the hole (Fig. 2b).
(3) バツキング材４（圧電板１に対向する面が導
体膜で被覆されている）に支持される絶縁被覆
された導線５を貫通穴３に挿通し、バツキング
材４を圧電板３に接合して一体化する（第２図
ｃ）。(3) The insulated conductor 5 supported by the bucking material 4 (the surface facing the piezoelectric plate 1 is covered with a conductive film) is inserted into the through hole 3, and the bucking material 4 is bonded to the piezoelectric plate 3. (Fig. 2c).
(4) 角柱状エレメント２側に導かれた導線５を各
エレメント２の頭に半田付けする（第２図ｄ）
及びｅ。ｄ図では10×10個の角柱状エレメント
が半田付けされており、ｅ図はその半田付け部
の拡大図である）。半田付けされるエレメント
の頭が個別電極となり、ダイシングされない圧
電体１の面に接合される導体膜が共通電極とな
る。(4) Solder the conductive wire 5 led to the prismatic element 2 side to the head of each element 2 (Fig. 2 d)
and e. In figure d, 10 x 10 prismatic elements are soldered, and figure e is an enlarged view of the soldered part). The heads of the soldered elements serve as individual electrodes, and the conductor film bonded to the surface of the piezoelectric body 1 that is not diced serves as a common electrode.
ところで、上記の方法による２次元アレイトラ
ンスデユーサにおいて、各エレメントは完全に切
離されていないので、各エレメント間に音響的結
合が存在する。このような結合があると音響特性
が低下する。従つて、音響特性上から言えば２次
元アレイトランスデユーサの各エレメントは完全
に切離されていた方が望ましい。 By the way, in the two-dimensional array transducer according to the above method, since each element is not completely separated, acoustic coupling exists between each element. Such coupling degrades acoustic properties. Therefore, from the standpoint of acoustic characteristics, it is desirable that each element of the two-dimensional array transducer be completely separated.
（発明が解決しようとする問題点）
しかし、従来の製造方法にあつては、圧電板を
完全にダイシング、即ち上記工程(1)における切込
みを100％にすると、各エレメントがばらばらに
なるため、共通電極の引出し線の接続処理が難し
くなる（アース電極の引出し方が難しくなる）。
又、従来の製造方法における個別電極の引出し方
法は、各電極位置に対応させて圧電板に設ける貫
通穴に引出し線を挿通して行うようになつている
ため、その作業は非常に煩わしいと言う問題があ
る。即ち、従来の製造方法は、音響特性の改善が
難しい上、量産に適していないと言える。(Problems to be Solved by the Invention) However, in the conventional manufacturing method, if the piezoelectric plate is completely diced, that is, if the cut in the above step (1) is made 100%, each element will be separated. It becomes difficult to connect the common electrode lead wire (it becomes difficult to draw out the ground electrode).
Furthermore, in conventional manufacturing methods, individual electrodes are drawn out by inserting lead wires into through holes provided in the piezoelectric plate corresponding to each electrode position, which is a very troublesome process. There's a problem. That is, it can be said that conventional manufacturing methods are difficult to improve acoustic characteristics and are not suitable for mass production.
本発明は、かかる点に鑑みてなされたものであ
り、その目的は、音響的結合が少ない２次元アレ
イトランスデユーサを量産する製造方法を実現す
るにある。 The present invention has been made in view of this point, and its purpose is to realize a manufacturing method for mass-producing two-dimensional array transducers with less acoustic coupling.
（問題点を解決するための手段）
上記目的を達成する本発明の２次元アレイトラ
ンスデユーサの製造方法は、ｚ方向に厚みを有
し、両面が導体化された圧電板をバツキング材に
接着し、最初にｘ方向に所定のピツで、少なくと
もバツキング材との間に導体部を残して圧電板を
ダイシングし、次にｙ方向に所定のピツチで完全
に圧電板をダイシングして碁盤目状に配列される
角柱状エレメントを作り、これら角柱状エレメン
トの各頭に信号用導線を接続し、隣合う角柱状エ
レメント間で形成される溝に設置して外部に引出
すと共に、バツキング材側の導体部を共通にして
グラウンド用引出し線に接続するようになつてい
る。(Means for Solving the Problems) A method for manufacturing a two-dimensional array transducer of the present invention that achieves the above object includes bonding a piezoelectric plate having a thickness in the z direction and conductive on both sides to a backing material. First, the piezoelectric plate is diced at predetermined pitches in the x direction, leaving at least a conductor part between it and the backing material, and then the piezoelectric plate is completely diced at predetermined pitches in the y direction to form a checkerboard pattern. A signal conductor is connected to each head of each of these prismatic elements, and the signal conductor is installed in the groove formed between adjacent prismatic elements to be pulled out to the outside, and the conductor on the backing material side is It is designed to have a common part and connect to the ground lead wire.
（実施例）
以下、本発明について図面を参照して詳細に説
明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例による製造方法の工
程の説明図である。以下、ａ図からｅ図に至る工
程を説明する。尚、以下の説明において、圧電板
の厚み方向がｚ方向に、又、圧電板の面がｘ−ｙ
面となつている。 FIG. 1 is an explanatory diagram of the steps of a manufacturing method according to an embodiment of the present invention. The steps from figure a to figure e will be explained below. In the following explanation, the thickness direction of the piezoelectric plate is in the z direction, and the surface of the piezoelectric plate is in the x-y direction.
It is a face.
(1) PZT等の圧電板１１をバツキング材１２上
に導電性接着剤等で接着する。圧電板１１の両
面は極めて薄い膜１１a及び１１bで被覆されて
いる（両面が導体化されている）（第１図ａ）。(1) A piezoelectric plate 11 such as PZT is bonded onto the backing material 12 using a conductive adhesive or the like. Both sides of the piezoelectric plate 11 are covered with extremely thin films 11a and 11b (both sides are made conductive) (FIG. 1a).
(2) 圧電板１１を非接着側から少なくともバツキ
ング材１２との間に膜（導体部）１１bを残し、
かつ、ｘ方向に所定のピツチをもつてダイシン
グする（第１図ｂ）。ダイシングの深さは膜１
１bのみを残すのが理想的であるが、圧電板を
僅かに残すようにしてもよい。(2) Leaving the film (conductor portion) 11b between the piezoelectric plate 11 and the backing material 12 from the non-adhesive side,
Then, it is diced with a predetermined pitch in the x direction (FIG. 1b). The depth of dicing is 1 membrane.
Ideally, only 1b should be left, but it is also possible to leave a small amount of the piezoelectric plate.
(3) 圧電板１１を非接着側からｙ方向に所定のピ
ツチをもつて完全にダイシングする（第１図
ｂ）。バツキング材１２上に碁盤目状に配列さ
れる角柱状エレメント１３が作られる。(3) Completely dice the piezoelectric plate 11 from the non-adhesive side at a predetermined pitch in the y direction (FIG. 1b). Prismatic elements 13 arranged in a grid pattern are formed on the backing material 12.
(4) 角柱状エレメント１３の各頭（導体部）１１
ａに信号用導線１４を接続し、隣合う角柱状エ
レメント間で形成される溝１５に設置して外部
に引出す（第１図ｄ及びｅ）。引出された信号
用導線１４をケーブル１６に接続する。(4) Each head (conductor part) 11 of the prismatic element 13
A signal conducting wire 14 is connected to a, placed in a groove 15 formed between adjacent prismatic elements, and drawn out to the outside (FIG. 1 d and e). Connect the drawn-out signal conductor 14 to the cable 16.
(5) ｙ方向に配列されるバツキング材側の導体部
１１bを共通にしてグラウンド用引出し線１７
（共通アース）に接続する（第１図ｄ及びｅ）。
グラウンド用引出し線１７はフレキシブルボー
ドで構成され、接続は導電性エポキシ等の導電
性接着剤によつて行われる。(5) Connect the grounding lead wire 17 using the conductor portion 11b on the backing material side arranged in the y direction as a common ground wire.
(common ground) (Figure 1 d and e).
The ground lead wire 17 is made of a flexible board, and the connection is made with a conductive adhesive such as conductive epoxy.
上記の各工程によつて作られる２次元アレイト
ランスデユーサにおいて、角柱状エレメント１３
は、ｘ方向ピツチが導体部のみを残すダイシング
により、又、ｙ方向ピツチが完全なダイシングに
よつて形成される碁盤目状をなしてバツキング材
１２上に構成される（ｘ方向ピツチはときには僅
かに圧電板を残していることもあるが）。この構
成により、角柱状エレメント１３間における音響
的結合が小さくなる。又、共通電極とグラウンド
との接続はバツキング材側の導体部列を共通にし
て行われる。更に、個別電極と引出し線との接続
は角柱状エレメント１３によつて形成される溝に
収納する引出し線を立ちあげて行われる。 In the two-dimensional array transducer produced by each of the above steps, the prismatic element 13
are formed on the backing material 12 in the form of a checkerboard in which the x-direction pitches are formed by dicing that leaves only the conductor part, and the y-direction pitches are formed by complete dicing (the x-direction pitches are sometimes slightly (Sometimes the piezoelectric plate is left in place.) This configuration reduces acoustic coupling between the prismatic elements 13. Further, the common electrode and the ground are connected using a common conductor row on the backing material side. Further, the connection between the individual electrodes and the lead wires is performed by raising the lead wires housed in the grooves formed by the prismatic elements 13.
（発明の効果）
以上説明の通り、本発明の２次元アレイトラン
スデユーサの製造方法によれば、バツキング材を
ベースにして碁盤目状に配列される角柱状エレメ
ント群の中で、碁盤の一方の方向を示す溝に沿つ
て配列される角柱状エレメント列は少なくとも導
体部を残すダイシングによつて構成され、他の方
向を示す溝に沿つて配列される角柱状エレメント
列はバツキング材に達するダイシングによつて構
成されるため、角柱状エレメント同士間の音響的
結合が小さくなる。又、共通電極（バツキング材
側の導体部）とグラウンドとの接続を簡単に行う
ことができる。又、個別電極の引出し線を角柱状
エレメント間で形成される溝に設置するため、個
別電極の配線処理は貫通穴を挿通する作業に比べ
て簡単になる。従つて、本発明の製造方法によれ
ば音響的結合を小さくした２次元アレイトランス
デユーサを量産することができる。(Effects of the Invention) As explained above, according to the method for manufacturing a two-dimensional array transducer of the present invention, among the group of prismatic elements arranged in a grid pattern based on the backing material, one side of the grid is The rows of prismatic elements arranged along grooves pointing in the direction are formed by dicing that leaves at least a conductor part, and the rows of prismatic elements arranged along grooves pointing in other directions are formed by dicing that reaches the backing material. , the acoustic coupling between the prismatic elements is reduced. Further, the common electrode (conductor portion on the backing material side) can be easily connected to the ground. Further, since the lead wires of the individual electrodes are installed in the grooves formed between the prismatic elements, the wiring process for the individual electrodes is simpler than the work of inserting the wires through through holes. Therefore, according to the manufacturing method of the present invention, two-dimensional array transducers with reduced acoustic coupling can be mass-produced.
第１図ａ乃至ｅは本発明の一実施例によるの製
造工程の説明図、第２図ａ乃至ｅは従来の２次元
アレイトランスデユーサの製造工程の説明図であ
る。
１１……圧電体、１１a及び１１b……導体部、
１２……バツキング材、１３……角柱状エレメン
ト、１４……引出し線（信号用導線）、１５……
溝、１６……ケーブル、１７……引出し線。
FIGS. 1A to 1E are explanatory diagrams of the manufacturing process according to an embodiment of the present invention, and FIGS. 2A to 2E are explanatory diagrams of the manufacturing process of a conventional two-dimensional array transducer. 11... piezoelectric body, 11 a and 11 b ... conductor part,
12... Buckling material, 13... Prismatic element, 14... Lead wire (signal conducting wire), 15...
Groove, 16...Cable, 17...Leader line.
Claims (1)
電板をバツキング材に接着する第１工程と、少な
くともバツキング材との間に導体部を残し、か
つ、ｘ方向に所定のピツチをもつて圧電板をダイ
シングする第２工程と、ｙ方向に所定のピツチを
もつて完全に圧電板をダイシングする第３工程
と、第２及び第３工程によつて形成される碁盤目
状の角柱状エレメントの各頭に信号用導線を接続
し、該信号用導線を隣合う角柱状エレメント間で
形成される溝に設置して外部に引出す第４工程
と、第３工程によつてｙ方向に所定のピツチで形
成されるバツキング材側の導体部列を共通にして
グラウンド用引出し線に接続する第５工程を備え
ることを特徴とする２次元アレイトランスデユー
サの製造方法。1. A first step of bonding a piezoelectric plate having a thickness in the z direction and conductive on both sides to the backing material, and leaving a conductor part at least between the backing material and having a predetermined pitch in the x direction. a second step of dicing the piezoelectric plate with a predetermined pitch in the y direction, a third step of dicing the piezoelectric plate completely with a predetermined pitch in the y direction, and a grid-like prismatic shape formed by the second and third steps. A fourth step in which a signal conductor is connected to each head of the element, and the signal conductor is installed in a groove formed between adjacent prismatic elements and pulled out to the outside; A method for manufacturing a two-dimensional array transducer, comprising a fifth step of connecting conductor rows on the backing material side formed by the pitches to a common ground lead line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293897A JPS63146698A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293897A JPS63146698A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63146698A JPS63146698A (en) | 1988-06-18 |
| JPH041560B2 true JPH041560B2 (en) | 1992-01-13 |
Family
ID=17800568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61293897A Granted JPS63146698A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146698A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011016994A1 (en) * | 2009-07-27 | 2011-02-10 | Cts Corporation | Encapsulated ceramic element and method of making the same |
-
1986
- 1986-12-10 JP JP61293897A patent/JPS63146698A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63146698A (en) | 1988-06-18 |
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