JPH0416842B2 - - Google Patents
Info
- Publication number
- JPH0416842B2 JPH0416842B2 JP57001649A JP164982A JPH0416842B2 JP H0416842 B2 JPH0416842 B2 JP H0416842B2 JP 57001649 A JP57001649 A JP 57001649A JP 164982 A JP164982 A JP 164982A JP H0416842 B2 JPH0416842 B2 JP H0416842B2
- Authority
- JP
- Japan
- Prior art keywords
- gap forming
- core
- magnetic head
- forming surface
- ion beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/23—Gap features
- G11B5/232—Manufacture of gap
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
本発明は再生効率の良い磁気ヘツドの製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a magnetic head with high reproduction efficiency.
通常、磁気ヘツドコアは1組のコア半体を衝き
合わせて構成するようにしており、各コア半体は
両者間に非磁性体を配して対向配置されるように
なつている。例えば、第1図の如く、コア半体1
と2の各対向面を所定距離(ギヤツプ長3に相当
する距離)だけ空けて実質的に平行配置するよう
にしている。これは、各コア半体1,2のバツク
ギヤツプ構成面間にもフロントギヤツプ構成面間
の距離すなわちギヤツプ長3に相当する磁気空隙
を持つことになるから、再生時、この磁気空隙に
よる磁気抵抗で再生効率を低下させることが知ら
れている。この再生効率の低下を防止するため、
第2図に示す如く、少くとも一方のコア半体(例
えば2の作動ギヤツプ構成面とバツクギヤツプ構
成面との間に、上記ギヤツプ長3に相当する段差
4を設け、バツクギヤツプ側のコア半体を実質的
に面一となるように衝き合わせるものが提案され
ている。しかし、この段差を機械加工により成形
することは、段差を管理すること及び加工面の平
面度を出すことなどが難しく、困難であるとされ
ている。そこで、この段差を得るための加工面
を、ケミカルエツチング法で製出する方法が試行
されている。磁気ヘツドコア材がフエライトであ
る場合、エツチヤントして濃リン酸がよく利用さ
れるが、エツチング速度の不安定性によりエツチ
ング量の不同を招くという欠点があり、作動ギヤ
ツプの精度として要求される±5%以内を実現さ
せることが難しい。 Usually, a magnetic head core is constructed by a pair of core halves abutted against each other, and each core half is arranged to face each other with a non-magnetic material interposed therebetween. For example, as shown in FIG.
and 2 are arranged substantially parallel to each other with a predetermined distance (distance corresponding to gap length 3) between them. This means that there is also a magnetic gap between the back gap forming surfaces of each core half 1 and 2, which corresponds to the distance between the front gap forming surfaces, that is, the gap length 3. During playback, the magnetic resistance created by this magnetic gap causes playback. known to reduce efficiency. In order to prevent this reduction in regeneration efficiency,
As shown in FIG. 2, a step 4 corresponding to the above-mentioned gap length 3 is provided between at least one of the core halves (e.g. 2) between the operating gap forming surface and the back gap forming surface, and the core half on the back gap side is It has been proposed to meet the surfaces so that they are substantially flush. However, forming this step by machining is difficult because it is difficult to control the step and to ensure the flatness of the machined surface. Therefore, a method of producing the machined surface to obtain this step using a chemical etching method has been tried.If the magnetic head core material is ferrite, it is often etched with concentrated phosphoric acid. However, it has the disadvantage that the etching rate is unstable, leading to variations in the etching amount, and it is difficult to achieve the required accuracy of the working gap within ±5%.
本発明はかかる欠点に鑑みなされたものにし
て、磁気ヘツドコアのバツクギヤツプ構成面に対
して段差を持つべく形成される作動ギヤツプ構成
面を、該バツクギヤツプ構成面と実質的に面一な
る表面を有するコア素材の前記作動ギヤツプ構成
面を形成すべき部分にメカノケミカル研摩を施し
た後、イオンビームを付与することにより得る磁
気ヘツドの製造方法を提供しようとするものであ
る。 The present invention has been made in view of such drawbacks, and the working gap forming surface formed to have a step with respect to the back gap forming surface of the magnetic head core is replaced by a core having a surface substantially flush with the back gap forming surface. The object of the present invention is to provide a method for manufacturing a magnetic head, which is obtained by mechanochemically polishing the portion of the material where the working gap forming surface is to be formed, and then applying an ion beam.
イオンビームを使うエツチング(イオンビーム
ミリング)はエツチングガスの物理的な作用によ
つてエツチングされることや、イオンビーム室と
加工室が分離されているため加工室の真空度を高
くできるなどの特徴を有し、そのためエツチング
速度の再現性が極めて良い(±5%以内)とされ
ている。従い、このイオンビームミリングはこれ
を磁気ヘツドコアのバツクギヤツプ構成面と作動
ギヤツプ構成面との間の段差を形成するために利
用すれば、該段差の管理を比較的簡単にすること
ができて有利であるから、該作動ギヤツプ構成面
の形成に適しているといえる。しかし、このビー
ム加工前のコア素材の表面が仮に鏡面に研摩され
ていてもその表面状態は均質でない(例えば一見
フラツトな鏡面に見えても実際には目ずまりが生
じてそのように見えるなど)場合があり、この場
合上記イオンビーム加工を施してもエツチング速
度が部分的に異なるため、エツチング終了後の表
面状態が最初の状態より却つて悪くなることがあ
る。これを防止するには、このビーム加工を行な
う前に被加工面について鏡面研摩時に生じうる加
工変質層を除去したり、平面度及び面粗度を充分
なものにしておく必要がある。このため、本発明
では鏡面に研摩された被加工面(少なくともバツ
クギヤツプ構成面と実質的に面一なる表面を有す
るコア素材の作動ギヤツプ構成面に相当する部
分、すなわちイオンビーム加工を施こす部分、を
含む)に、工作物に機械的エネルギーを与えそこ
に誘起する化学的反応を積極的に研摩に利用する
メカノケミカル研摩を施こし研摩面の均質性を向
上させるようにし、その後上記イオンビームミリ
ングを行なうようにして上記段差を、作動ギヤツ
プ構成面の面精度を保障して歩留まり良く形成す
ることができる。 Etching using an ion beam (ion beam milling) is characterized by the fact that the etching is done by the physical action of the etching gas, and because the ion beam chamber and processing chamber are separated, the degree of vacuum in the processing chamber can be increased. Therefore, the reproducibility of the etching rate is said to be extremely good (within ±5%). Therefore, if this ion beam milling is used to form a step between the back gap forming surface and the working gap forming surface of the magnetic head core, it is advantageous because the control of the step can be made relatively simple. Therefore, it can be said that it is suitable for forming the working gap forming surface. However, even if the surface of the core material before beam processing is polished to a mirror surface, the surface condition is not homogeneous (for example, even if it looks like a flat mirror surface at first glance, it actually looks like a flat mirror surface). ), and in this case, even if the ion beam processing is performed, the etching speed will differ locally, so that the surface condition after etching may be even worse than the initial condition. In order to prevent this, it is necessary to remove the process-affected layer that may occur during mirror polishing from the surface to be processed, and to ensure that the surface has sufficient flatness and surface roughness before performing this beam processing. Therefore, in the present invention, the workpiece surface polished to a mirror surface (at least the portion corresponding to the working gap forming surface of the core material having a surface substantially flush with the back gap forming surface, that is, the portion to be subjected to ion beam processing), ), the workpiece is subjected to mechanochemical polishing, which applies mechanical energy to the workpiece and actively utilizes the induced chemical reaction for polishing, to improve the homogeneity of the polished surface, followed by the ion beam milling described above. By doing so, the step can be formed with a high yield while ensuring the surface accuracy of the working gap forming surface.
次に、本発明方法の実施例を簡単に説明する。
第3図は本発明方法の加工工程の概要を示すもの
であり、5は磁性材例えば単結晶フエライト材よ
りなるウエハで該ウエハの衝合面となる表面は従
来通りの方法で鏡面に研摩されている。この加工
面は微視的には上述の如く加工変質層6が形成さ
れている(第3図イ)。このウエハ5について、
該加工変質層6を除去するためメカノケミカル研
摩を施こし、加工変質層の浅い良好な仕上面5a
を得る(第3図ロ)。次いで、通常の方法と同様、
巻線溝7を成形しまた該巻線溝と直交する方向に
延在するトラツク巾規定溝(図示省略))を成形
する(第3図ハ)。次いで、イオンビームミリン
グを実行する面を除き通常のホトリソグラフイー
によるパターニングを行ない保護膜8を形成する
(第3図ニ)。次いで、この試料を10″マイクロエ
ツチシステムに入れ下記条件で加工をすれば、被
加工面5bを0.37μmエツチングすることができ、
バツクギヤツプ構成面に対して段差4を有する作
動ギヤツプ構成面5cを成形することができる。
エネルギー(v/mA)500/440電流密度
(μA/cm2)600、角度(θ)30、時間(分)20、
アルゴン圧力(Torr)2.0×10-4、アーク(V/
A)60/60、カソード(V/A)11/39、コイル
(V/A)19/0.45、サプレツサ(V/mA)
300/40、ニユートラ(V/A)50/10.5。尚、
このイオンビームミリングは第3図ハの溝加工前
に実行するようにしても良い。第3図ホは保護膜
8を除去した状態を示している。次いで、このイ
オンビームミリングを行なつたウエハ5Aと、第
3図ロのウエハ5Bとを相互の衝合面が対面する
ように衝き合わせ、両者の各バツクギヤツプ構成
面を直接当接させかつ各作動ギヤツプ構成面が上
記段差4に相当するスペースをあけて対向させ
る。その後、該スペース内にガラス9を充填さ
せ、また図示省略した結合材で各ウエハを一体化
する(第3図ヘ)。この一体化はトラツク巾規定
溝内にまたバツクギヤツプ構成面の下端部に結合
材を充てんすることにより実現することができ
る。次いで、一体化したブロツクについて従来通
りテープ当接面の成形、スライシング、コアの厚
み加工を施こし、ヘツドチツプを得る。そして、
このヘツドチツプをヘツドベースに取付け、コイ
ルを巻回して磁気ヘツドを製出する。上記スペー
ス内へのガラス浸透に代え、適当なスペーサ材を
該段差を解消するように付着させても良い。ま
た、各ウエハを衝き合わせたとき所定のギヤツプ
長を形成するように、巻線溝を有するウエハとは
別のウエハに或いは衝合すべき各ウエハにイオン
ビーム加工を施こすようにしても良い。 Next, examples of the method of the present invention will be briefly described.
FIG. 3 shows an outline of the processing steps of the method of the present invention, in which 5 is a wafer made of a magnetic material, such as a single crystal ferrite material, and the surface of the wafer, which will become the abutting surface, is polished to a mirror finish by the conventional method. ing. Microscopically, the process-affected layer 6 is formed on this processed surface as described above (FIG. 3A). Regarding this wafer 5,
Mechanochemical polishing is performed to remove the process-affected layer 6, resulting in a good finished surface 5a with a shallow process-affected layer.
(Figure 3 B). Then, as usual,
The winding groove 7 is formed, and a track width defining groove (not shown) extending in a direction perpendicular to the winding groove is formed (FIG. 3C). Next, patterning is performed by ordinary photolithography except for the surface to be subjected to ion beam milling to form a protective film 8 (FIG. 3D). Next, if this sample is placed in a 10'' micro-etch system and processed under the following conditions, the processed surface 5b can be etched by 0.37 μm.
An operating gap forming surface 5c having a step 4 relative to the back gap forming surface can be formed.
Energy (v/mA) 500/440 Current density (μA/cm 2 ) 600, Angle (θ) 30, Time (min) 20,
Argon pressure (Torr) 2.0×10 -4 , arc (V/
A) 60/60, cathode (V/A) 11/39, coil (V/A) 19/0.45, suppressor (V/mA)
300/40, Neutra (V/A) 50/10.5. still,
This ion beam milling may be performed before the groove machining shown in FIG. 3C. FIG. 3E shows a state in which the protective film 8 has been removed. Next, the wafer 5A that has been subjected to ion beam milling and the wafer 5B shown in FIG. The gap forming surfaces are opposed to each other with a space corresponding to the step 4 above. Thereafter, the space is filled with glass 9, and each wafer is integrated with a bonding material (not shown) (FIG. 3). This integration can be achieved by filling the track width defining groove and the lower end of the back gap forming surface with a bonding material. Next, the integrated block is subjected to molding of the tape contacting surface, slicing, and thickness processing of the core in the conventional manner to obtain a head chip. and,
This head chip is attached to a head base and a coil is wound to produce a magnetic head. Instead of glass infiltration into the space, a suitable spacer material may be attached to eliminate the level difference. Further, in order to form a predetermined gap length when each wafer is butted, ion beam processing may be performed on a wafer other than the wafer having the winding groove, or on each wafer to be butted. .
本発明方法になる磁気ヘツドは衝合せるコア半
体のバツクギヤツプ構成面が直接当接するからこ
の衝合部における磁気抵抗を著しく低下させるこ
とができ磁気ヘツドの再生効生効率の低滅を防ぐ
ことができる。また、このバツクギヤツプ構成面
に対して段差を有する作動ギヤツプ構成面はイオ
ンビームミリング法でエツチングされたものであ
りその表面精度を向上させることができ、製造歩
留まりの向上ひいては磁気ヘツドの低価格化に寄
与できる。 In the magnetic head according to the method of the present invention, the back gap forming surfaces of the abutting core halves are in direct contact with each other, so the magnetic resistance at this abutting portion can be significantly lowered, and a decline in the regenerative efficiency of the magnetic head can be prevented. can. In addition, the working gap forming surface, which has a step difference with respect to the back gap forming surface, is etched by the ion beam milling method, which improves the surface precision, which leads to improved manufacturing yield and lower cost of magnetic heads. I can contribute.
第1図は従来の磁気ヘツドの典型的な構成図、
第2図は再生効率の向上に資する従来の磁気ヘツ
ドの構成図、第3図イ〜ヘは本発明方法を含む磁
気ヘツドの製造工程図を示したものである。
主な図番の説明、5A,5B…1組のコア半体
となるウエハ、4…段差。
Figure 1 is a typical configuration diagram of a conventional magnetic head.
FIG. 2 is a block diagram of a conventional magnetic head that contributes to improving reproduction efficiency, and FIGS. 3A to 3F are diagrams showing the manufacturing process of the magnetic head including the method of the present invention. Explanation of main drawing numbers, 5A, 5B... wafers forming one set of core halves, 4... step.
Claims (1)
ドコアの少なくとも一方のコア半体の作動ギヤツ
プ構成面を、該一方のコア半体のバツクギヤツプ
構成面に対して段差を持つように構成してなる磁
気ヘツドの製造方法において、前記一方のコア半
体となるウエハの表面を鏡面に研摩した後、該研
摩により形成された加工変質層をメカノケミカル
研摩により除去し、その後、前記ウエハの表面の
うち作動ギヤツプ構成面を形成すべき部分にイオ
ンビームを付与することにより前記段差を形成す
ることを特徴とする磁気ヘツドの製造方法。1. A magnetic head core formed by a pair of core halves abutted against each other, wherein the working gap forming surface of at least one core half is configured to have a step with respect to the back gap forming surface of the one core half. In the method for manufacturing a magnetic head, the surface of the wafer serving as the one core half is polished to a mirror surface, and then the process-affected layer formed by the polishing is removed by mechanochemical polishing. A method of manufacturing a magnetic head, characterized in that the step is formed by applying an ion beam to a portion where a working gap forming surface is to be formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP164982A JPS58121124A (en) | 1982-01-07 | 1982-01-07 | Production of magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP164982A JPS58121124A (en) | 1982-01-07 | 1982-01-07 | Production of magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58121124A JPS58121124A (en) | 1983-07-19 |
| JPH0416842B2 true JPH0416842B2 (en) | 1992-03-25 |
Family
ID=11507359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP164982A Granted JPS58121124A (en) | 1982-01-07 | 1982-01-07 | Production of magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58121124A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60211608A (en) * | 1984-04-04 | 1985-10-24 | Seiko Epson Corp | Manufacture of magnetic head |
| US6771462B1 (en) | 1999-09-20 | 2004-08-03 | Seagate Technology Llc | Perpendicular recording head including concave tip |
| US6865056B1 (en) | 1999-10-05 | 2005-03-08 | Seagate Technology Llc | Longitudinal magnetic recording heads with variable-length gaps |
| JP2003511806A (en) * | 1999-10-05 | 2003-03-25 | シーゲイト テクノロジー エルエルシー | Longitudinal magnetic recording head with variable length gap |
| US6707642B1 (en) | 2000-02-04 | 2004-03-16 | Seagate Technology Llc | Longitudinal magnetic recording head with reduced side fringing |
| JP4130868B2 (en) * | 2001-03-19 | 2008-08-06 | 株式会社日立グローバルストレージテクノロジーズ | Magnetic head for perpendicular recording and magnetic disk drive equipped with the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51148412A (en) * | 1975-06-16 | 1976-12-20 | Mitsumi Electric Co Ltd | Head-core and its production method |
| JPS52153715A (en) * | 1976-06-16 | 1977-12-21 | Matsushita Electric Ind Co Ltd | Magnetic head manufacture |
| JPS5311012A (en) * | 1976-07-16 | 1978-02-01 | Matsushita Electric Ind Co Ltd | Production of magnetic head |
-
1982
- 1982-01-07 JP JP164982A patent/JPS58121124A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58121124A (en) | 1983-07-19 |
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