JPH0420372B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an ultrasonic bonding device used to manufacture bags by applying ultrasonic waves to stacked packaging materials and bonding them.

<Conventional technology> When forming a bag from a packaging material such as a sheet made of synthetic resin threads knitted in a mesh pattern or a paper sheet, ultrasonic waves are irradiated to the stacked packaging materials to generate intramolecular vibrations. An ultrasonic bonding device is used that generates heat to melt and bond.

FIG. 5 is a plan view of a conventional example of such an ultrasonic bonding device. A guide rail 42 is provided in parallel to the machine frame 41, and an ultrasonic oscillator 43 is connected to the guide rail 42.
It is designed to move back and forth along the At the left end of the ultrasonic oscillator 43 is a horn 4 that emits ultrasonic waves.
4 is attached, and its tip is attached to the clamp plate 45.
It passes through the slide hole of the substrate 46 supporting the packaging material A and faces the packaging material A. Mounting seat 49 is on the opposite side of packaging material A.
A horizontally long pedestal 47 attached to the horn 44 is fixed, and the position of the pedestal 47 and the horn 44 is adjusted by a plurality of adjustment bolts 48 so as to maintain a constant distance (0.1 to 0.2 mm). It's summery.

In this ultrasonic bonding device, overlapping packaging materials A are supplied from above in the drawing, and the substrate 46 advances toward the pedestal 41 due to the supply of the packaging material A, and the clamp plate 45 attached to the pedestal 47 and the substrate 46 Then, the ultrasonic oscillator 43 slides along the guide rail 42, and the ultrasonic wave from the horn 44 causes the packaging material A to be bonded.

<Problems to be Solved by the Invention> However, in the conventional ultrasonic bonding apparatus, the pedestal 4 is
7 generates heat and expands. Due to this expansion, the distance between the horn 44 and the pedestal 47 becomes narrower, and the pedestal 47 comes into contact with the packaging material A, heating the packaging material A, and the adhesive portion is thermally melted and cut during adhesion. There's a problem.
In addition, the adhesive line formed by ultrasonic irradiation has a weak adhesive strength, so it is easy to peel off, and the contents filled in the bag may be fine powders such as green tea leaves, black tea leaves, coffee powder, etc. In some cases, the contents may get caught within the adhesive line of the packaging material A, resulting in a problem in which the appearance deteriorates.

The present invention has been made in consideration of the above circumstances, and provides an ultrasonic bonding device that can prevent the pedestal from generating heat, can form a bond line with strong adhesive force, and can prevent the contents from being caught. It is something.

<Means for Solving the Problems> The ultrasonic bonding device according to the present invention has the following features: forming a large number of narrow grooves on the outer surface of a pedestal provided corresponding to the horn to expand the area that receives ultrasonic waves; , the pedestal is attached in a freely rotatable state so that the ultrasonic irradiation surface can be changed as appropriate.

<Examples> The present invention will be specifically described below with reference to illustrative examples.

FIG. 1 is a perspective view of one embodiment of the present invention, and FIGS. 2 and 3 are a side view of the operating state and a plan view of essential parts. An ultrasonic oscillator 1 and a pedestal 2 are attached to each tip of a bifurcated connector 3. A vibrator (not shown) for performing ultrasonic vibration is installed inside the ultrasonic oscillator 1, and a horn 4 connected to the vibrator protrudes from the tip surface of the ultrasonic oscillator 1. The horn 4 is formed into a pointed shape, and the vibrations from the vibrator are magnified to generate ultrasonic waves. The pedestal 2 is attached to the connector 3 so as to be located on the opposite side of the packaging material A with respect to the horn 4. This pedestal 2 is supported by support brackets 5 and 6 that are attached to the connector 3 so as to be adjustable in the front-back and left-right directions.
and a rotating body 8 attached to the shaft center 7. The rotating body 8 is formed into a cylindrical shape, and receives ultrasonic waves from the horn 4 on its side surface. And, the entire side surface has a vertical narrow groove 8a.
is formed to prevent an increase in adhesive force, cooling of the rotating body 8, and prevention of the contents from being caught in, as will be described later. Further, this rotating body 8 is rotatably attached to the axis 7, and freely rotates around the axis 7 during adhesion operation, so that the surface receiving the ultrasonic waves changes as appropriate. As a result, the entire side surface receives ultrasonic waves, so that wear of the rotating body 8 is suppressed and the rotating body 8 is allowed to cool. In particular, even if the horn comes into contact with the rotating body 8 due to poor adjustment of the distance between the horn and the horn 4, the rotation of the rotating body 8 is assisted by the contact action, so wear of the rotating body 8 is suppressed, and Cooling is taking place. Incidentally, the distance between the pedestal 2 and the horn 4 is adjusted here by means of the support brackets 5 and 6. For this purpose, a long hole 9 extending in the direction of the horn 4 is formed in the lower support bracket 5 attached to the connector 3.
On the other hand, an upper support bracket 6 attached to the lower support bracket 5 is formed with a long hole 10 in a direction perpendicular to the horn 4. Adjustment screws 11 and 12 are attached to these elongated holes 9 and 10, and the support brackets 5 and 6 are adjusted by moving left and right and front and back with respect to the horn 4.
By tightening screws 1 and 12, the position of the pedestal 2 can be adjusted. A rod 14 of a driving means 13 consisting of a cylinder is connected to the pedestal 2 and the connector 3 that supports the ultrasonic oscillator 1. Therefore, when the cylinder 13 is driven, the rod 14 expands and contracts, and the ultrasonic oscillator 1 and the pedestal 2 supported by the connector 3 reciprocate in unison in synchronization. Thereby, the pedestal 2 moves together with the ultrasonic oscillator 1 while always receiving ultrasonic waves from the horn 4. In the figure, 15 is a substrate, and a slide hole 16 into which the horn 4 is slidably inserted is formed in the longitudinal direction. This board 15
A clamp plate 17 is provided on one side of the clamp plate 17 so as to be movable forward and backward. That is, the clamp plate 17 is attached to the tip of the rod of the cylinder 18, and when the cylinder 18 is operated, it is pressed against the substrate 15 from above and below the slide hole 16 of the substrate 15, and the packaging material A is clamped onto the substrate 15.
It is designed to prevent the packaging material A from shaking due to vibration during adhesion.

Next, the operation of the above ultrasonic bonding device will be explained with reference to FIGS. 2 and 3. Before operation,
Adjust the distance between the pedestal 2 and the horn 4 to about 0.1 to 0.2 mm using adjustment screws 11 and 12. After completing the adjustment, turn on the switch to turn on the ultrasonic oscillator 1.
is activated, and the packaging material A is lowered between the clamp plate 17 and the substrate 15 in an overlapping state.
In this case, the packaging material A is passed through another similarly configured ultrasonic bonding device to be supplied with both side edge portions bonded in advance. When the packaging material A is supplied for a predetermined length, the cylinder 18 is activated to clamp the packaging material A between the clamp plate 17 and the substrate 15. In this state, the driving means 13 is activated, the ultrasonic oscillator 1 and the pedestal 2 move together, and the packaging material A is bonded by the ultrasonic waves from the horn 4. In this bonding operation, the ultrasonic waves from the horn 4 are received by the side surface of the rotating body 8 of the pedestal 2, but the narrow grooves 8a are formed in the rotating body 8, increasing the area that receives the ultrasonic waves and increasing the heat dissipation area. It is increasing. In addition, during adhesion, as shown in FIG. A certain gap is formed between the two. Therefore, since ventilation is generated in the narrow grooves 8a, the rotary body 8 is efficiently cooled, and together with the aforementioned expansion of the heat dissipation area, heat generation of the rotary body is prevented, and cutting of the packaging material A, etc. No thermal effect. Furthermore, even if the contents are present in the area to be bonded, they will fall through the gaps in the narrow grooves 8a due to ultrasonic vibration, and will not get caught in the bonded area. In order to achieve these various effects, it is preferable to form the narrow grooves so that at least two protrusions 8b are located with respect to the width d of the tip of the horn 4. FIG. 4 is a front view of a bag 20 manufactured using such a cradle 2. An adhesive line 21 is formed on the upper part of the bag body 20 by ultrasonic irradiation.
The part where is located will not be glued. Since the strength of the packaging material A is maintained as it is due to the presence of the non-adhesive portion in the adhesive line 21 in this way, the strength is high and it will not peel off. Furthermore,
During the bonding operation, the rotating body 8 of the pedestal 2 rotates freely, and the surface receiving the ultrasonic waves changes in a direction perpendicular to the direction of ultrasonic irradiation, so that wear of the pedestal 2 is suppressed. In addition, in the bonding operation, an adhesive seal line and a cutting line are simultaneously formed by ultrasonic irradiation, and the stacked packaging materials A are bonded to each other to form a bag, and each bag is separated from the cutting line as a boundary. separated into When the ultrasonic oscillator 1 and the pedestal 2 reach the end of their movement, the cylinder 18 is activated and the clamp on the packaging material A is released. As a result, the bag falls downward, and then the next stage packaging material A is supplied for a predetermined length, and the clamp plate 17
and the substrate 15, and the ultrasonic oscillator 1 and the pedestal 2 move in the opposite direction as one. Then, during the reverse movement, adhesion and cutting are performed at the same time, and thereafter, the same repeated operations are performed to continuously manufacture bags.

In the present invention, the narrow groove of the pedestal may be a knurled groove, or it may be a narrow groove with a rectangular cross section instead of a gear-shaped groove. Furthermore, the ultrasonic oscillator and the pedestal may be attached to separate drive means and moved synchronously by controlling the drive means.
Alternatively, a motor may be used as the driving means. Furthermore, this ultrasonic bonding device can be applied not only to the production of bags but also to the production of other molded bodies.

<Effects of the Invention> As described above, according to the present invention, since a thin groove is formed in the pedestal provided corresponding to the horn and the pedestal is placed in a free rotation state, heat generation of the pedestal is prevented and reliable joining is possible. At the same time, the contents will no longer get stuck. Therefore, the packaging material is effective in that the strength of the bond is increased and the appearance of the manufactured bag can be improved.

[Brief explanation of drawings]

Fig. 1 is a perspective view of an embodiment of the ultrasonic bonding device according to the present invention, Figs. 2 and 3 are a side view of the operation and a plan view of the main parts, and Fig. 4 is a front view of an example of the bag body. , FIG. 5 is a plan view of the conventional device. 1... Ultrasonic oscillator, 4... Horn, 2... pedestal, 8... Rotating body, 8a... Thin groove.

Claims (1)

[Claims] 1. An ultrasonic oscillator that reciprocates against the stacked packaging materials while emitting ultrasonic waves from the tip of the horn, and a large number of thin grooves formed on the outer surface that receives the ultrasonic waves from the horn, and that is free to rotate. An ultrasonic bonding device comprising: a pedestal that moves back and forth in synchronization with the back and forth movement of an ultrasonic oscillator.