JPH0421354B2 - - Google Patents
Info
- Publication number
- JPH0421354B2 JPH0421354B2 JP59212698A JP21269884A JPH0421354B2 JP H0421354 B2 JPH0421354 B2 JP H0421354B2 JP 59212698 A JP59212698 A JP 59212698A JP 21269884 A JP21269884 A JP 21269884A JP H0421354 B2 JPH0421354 B2 JP H0421354B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- chips
- diode chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Adornments (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は発光ダイオードチツプを用いた全周囲
発光体に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an all-around light emitter using light emitting diode chips.
（従来の技術）
発光ダイオードチツプを用いた発光体として、
不透光性基板又は基台の一面に該チツプを配設し
たものが知られている。(Prior art) As a light emitter using a light emitting diode chip,
It is known that the chip is disposed on one surface of an opaque substrate or base.
（発明が解決しようとする問題点）
従来の前記発光体は全周囲に配光することがで
きない不都合があつた。(Problems to be Solved by the Invention) The conventional light emitting body has a disadvantage in that it cannot distribute light all around.
本発明はかかる不都合を簡単な構成で解消する
ことをその目的としたものである。 It is an object of the present invention to solve such inconveniences with a simple configuration.
（問題点を解決するための手段）
本発明は、絶縁基板の両面にそれぞれ発光ダイ
オードチツプを配設したことを特徴とする。(Means for Solving the Problems) The present invention is characterized in that light emitting diode chips are disposed on both sides of an insulating substrate.
（実施例）
第１図〜第３図は本発明の一実施例を示す。図
面において、１はセラミツクまたはガラス繊維入
りエポキシ樹脂等で作製された絶縁基板で、該基
板１の中心部及び端部にそれぞれ明けられた孔２
１，２2に嵌入され、該基板１の面から突出した部
分をかしめる等の手段で固着された銅又はアルミ
ニウム等の良導電性の金属線又は鋲３1，３2（以
下単に鋲３1，３2という。）を有する。(Example) FIGS. 1 to 3 show an example of the present invention. In the drawings, reference numeral 1 denotes an insulating substrate made of ceramic or glass fiber-containing epoxy resin, and holes 2 are formed in the center and edges of the substrate 1, respectively.
1 , 2 2 , and the protruding portions from the surface of the board 1 are fixed by caulking or other means such as conductive metal wires or rivets 3 1 , 3 2 (hereinafter simply referred to as rivets 3 ). 1 , 3 2 ).
この鋲３1，３2のかしめられた両端部は、互に
平行な平坦面に形成されると共に銀メツキが施さ
れており、鋲３1の両端部の平坦面にそれぞれ発
光ダイオードチツプ４1，４2が導電性接着剤によ
り固着させている。 Both caulked ends of the studs 3 1 and 3 2 are formed into parallel flat surfaces and are plated with silver, and light emitting diode chips 4 1 are mounted on the flat surfaces of both ends of the studs 3 1 , respectively. , 4 2 are fixed with conductive adhesive.
５1，５2は発光ダイオードチツプ４1，４2に電
圧を供給するためのリード線で、その１つ５1は
鋲３2の一端に、他の１つ５2は鋲３1の一端にそ
れぞれ半田付け、かしめ等の手段で固着されてい
る。このリード線５1と、発光ダイオードチツプ
４1，４2とは金、アルミニウム等の延展性に富ん
だ金属の微細な導電線６1，６2をそれぞれに超音
波圧接等の手段で圧着することにより接続されて
いる。 5 1 , 5 2 are lead wires for supplying voltage to the light emitting diode chips 4 1 , 4 2 , one of them 5 1 is connected to one end of the stud 3 2 , and the other one 5 2 is connected to one end of the stud 3 1 They are each fixed by means of soldering, caulking, etc. The lead wire 5 1 and the light emitting diode chips 4 1 , 4 2 are made by crimping fine conductive wires 6 1 , 6 2 made of highly malleable metal such as gold or aluminum by ultrasonic pressure welding or the like. connected by.
７は発光ダイオードチツプ４1，４2、導電線６
１，６2、鋲３1，３2及びリード線５1，５2の一部
を被覆し、これ等を保護する透光性樹脂で、加熱
等の手段により基板１に固着されている。 7 is a light emitting diode chip 4 1 , 4 2 and a conductive wire 6
1 , 6 2 , studs 3 1 , 3 2 , and lead wires 5 1 , 5 2 are partially coated and protected by a translucent resin, which is fixed to the substrate 1 by heating or other means.
このような構成によれば、リード線５1，５2に
直流電圧を印加すると、発光ダイオードチツプ４
１，４2は発光し、リード線５1，５2で遮光させる
以外は全周囲に配光される。 According to such a configuration, when a DC voltage is applied to the lead wires 5 1 and 5 2 , the light emitting diode chip 4
1 and 4 2 emit light, and the light is distributed all around except for the lead wires 5 1 and 5 2 that block the light.
尚、この実施例の外に、プリント基板に電極を
形成し、これにチツプをボンデイングしてもよ
く、また基板の両側のチツプを直列接続したり、
基板の各面に配設するチツプの数を複数個にして
もよい。 In addition to this embodiment, electrodes may be formed on a printed circuit board and chips may be bonded to this, or chips on both sides of the board may be connected in series.
A plurality of chips may be disposed on each surface of the substrate.
第４図はイヤリングに適用された本発明の他の
実施例である。 FIG. 4 shows another embodiment of the present invention applied to earrings.
絶縁基板１の両面に配設された発光ダイオード
チツプ４1，４2及び導電線６1，６2を保護する透
光性樹脂７がイヤリング形状に形成されている。 Transparent resin 7 is formed into an earring shape to protect light emitting diode chips 4 1 , 4 2 and conductive wires 6 1 , 6 2 disposed on both sides of insulating substrate 1 .
同図において、８1，８2は、外部から電圧が加
えられるピンで、このピン８1，８2は通常のピン
ソケツトを介して微細絶縁電線に接続され、耳た
ぶに止める美装ケースに入れた電池からピンに電
線を介して電圧が加えられるようにする。 In the same figure, 8 1 and 8 2 are pins to which voltage is applied from the outside, and these pins 8 1 and 8 2 are connected to finely insulated wires through ordinary pin sockets and placed in a beautiful case that is attached to the earlobe. Allows voltage to be applied from the battery to the pin via the wire.
この発光体の両面のチツプとして、赤、緑等異
なる色を発光するチツプを使用すれば高度のアク
セサリー効果が得られる。 If chips that emit different colors such as red and green are used as chips on both sides of the light-emitting body, a sophisticated accessory effect can be obtained.
（発明の効果）
本発明は、絶縁基板の両面にそれぞれ発光ダイ
オードチツプを配設したので、発光体を全周囲に
配光させることができ、その構成が非常に簡単で
ある等の効果を有する。(Effects of the Invention) The present invention has the effect that since light emitting diode chips are disposed on both sides of the insulating substrate, the light can be distributed all around the light emitting body, and the structure is very simple. .
第１図は本発明の一実施例の正面図、第２図は
その裏面図、第３図は第１図のＡ−Ａ線截断面
図、第４図はイヤリングに適用された本発明の他
の実施例の正面図を示す。
１…絶縁基板、２1，２2…孔、３1，３2…金属
線又は鋲、４1，４2…発光ダイオードチツプ、５
１，５2…リード線、６1，６2…導電線、７…透光
性樹脂、８1，８2…ピン。
FIG. 1 is a front view of an embodiment of the present invention, FIG. 2 is a back view thereof, FIG. 3 is a cross-sectional view taken along line A-A in FIG. A front view of another embodiment is shown. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2 1 , 2 2 ... Hole, 3 1 , 3 2 ... Metal wire or stud, 4 1 , 4 2 ... Light emitting diode chip, 5
1 , 5 2 ... lead wire, 6 1 , 6 2 ... conductive wire, 7 ... translucent resin, 8 1 , 8 2 ... pin.
Claims (1)
ツプを配設したことを特徴とする発光ダイオード
チツプを用いた全周囲発光体。1. An all-around light-emitting body using light-emitting diode chips, characterized in that light-emitting diode chips are arranged on both sides of an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59212698A JPS6191976A (en) | 1984-10-12 | 1984-10-12 | Overall peripheral light emitting body with diode chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59212698A JPS6191976A (en) | 1984-10-12 | 1984-10-12 | Overall peripheral light emitting body with diode chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6191976A JPS6191976A (en) | 1986-05-10 |
| JPH0421354B2 true JPH0421354B2 (en) | 1992-04-09 |
Family
ID=16626942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59212698A Granted JPS6191976A (en) | 1984-10-12 | 1984-10-12 | Overall peripheral light emitting body with diode chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6191976A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6419991U (en) * | 1987-07-23 | 1989-01-31 | ||
| JPS6419989U (en) * | 1987-07-23 | 1989-01-31 | ||
| JPS6419990U (en) * | 1987-07-23 | 1989-01-31 | ||
| JPS6423090U (en) * | 1987-07-29 | 1989-02-07 | ||
| WO2002090825A1 (en) * | 2001-04-23 | 2002-11-14 | Lab. Sphere Corporation | Lighting device using light-emitting diode |
| DE10159544A1 (en) * | 2001-12-05 | 2003-06-26 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Method for producing an optoelectronic semiconductor component and component produced therewith |
-
1984
- 1984-10-12 JP JP59212698A patent/JPS6191976A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6191976A (en) | 1986-05-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5942770A (en) | Light-emitting diode chip component and a light-emitting device | |
| US6093940A (en) | Light-emitting diode chip component and a light-emitting device | |
| US6270236B1 (en) | L.E.D Lighting unit with transparent carrier panel | |
| JP2001326390A (en) | Back-side light emitting chip type light emitting element and insulating substrate used therefor | |
| JPH0421354B2 (en) | ||
| US4538143A (en) | Light-emitting diode displayer | |
| JPH01163352U (en) | ||
| JP2001352105A (en) | Surface mount type light emitting device | |
| JPH08186284A (en) | Surface mount type photocoupler and manufacturing method thereof | |
| JPS59226401A (en) | Light emitting display device | |
| JPH06310763A (en) | Led lamp | |
| JPS6113958U (en) | light emitting diode lamp | |
| JPS63174379A (en) | Luminous display device | |
| JPH0465465U (en) | ||
| JP2004063973A (en) | Vertical and horizontal mounted electronic components | |
| JPS62106488A (en) | Display unit using light emitting diode | |
| JPS5924186Y2 (en) | LED dial guide | |
| JPS6413166U (en) | ||
| JPH06310762A (en) | Led device | |
| JPH0328529Y2 (en) | ||
| JPH0414944Y2 (en) | ||
| JP2597985B2 (en) | Flat LED | |
| JPH0412695Y2 (en) | ||
| JPH0741121Y2 (en) | Variable resistor terminal lead-out structure | |
| JPS5939733Y2 (en) | display device |