JPH0422327B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip-type electrolytic capacitor that can be mounted on a printed circuit board by reflow soldering or the like, and in particular, the capacitor can be mounted vertically or horizontally.

Conventional technology In recent years, electronic devices have become smaller, lighter, denser,
As the trend towards higher reliability progresses, thinner and more flexible printed circuit boards, as well as those using metal plates with good thermal conductivity, are being developed and used.

Chip components have also been developed in electronic components, and chip-type multilayer ceramic capacitors and tantalum capacitors are increasing in the capacitors mounted on the above-mentioned printed circuit boards.
In the case of electrolytic capacitors, since the capacitor element is impregnated with electrolyte, double-cladding such as encasing the capacitor in an aluminum case or a resin case and then covering it with a molded resin has been devised (Japanese Patent Laid-Open No. 1983-1999-1). 134923, etc.).

Further, as shown in FIGS. 4 and 5, an electrolytic capacitor housed in a cylindrical metal case 5 has been devised. 7 is an insulating stand. (Utility Model Application Publication No. 50-98233, etc.).

Problems to be Solved by the Invention The above-mentioned double-sheathed electrolytic capacitor has the problem of being large in external size and expensive.
In addition, in vertical electrolytic capacitors as shown in Figures 4 and 5, the capacitor body is cylindrical, and when mounted on a printed circuit board using an automatic mounting machine, the capacitor rotates and the device position may shift or fall off. There were problems such as.

Means for Solving the Problems The present invention solves the above-mentioned problems. Two lead-out leads led out from the capacitor element in the same direction are inserted into an elastic sealing body, housed in a metal case, and then Tighten and seal the opening of the case, and then
The lead of the book is led out through a heat-resistant insulating molded body having at least two surfaces perpendicular to each other, and folded in the same direction along the outer surface of the corner portion where the two surfaces of the insulating molded body intersect so as to be parallel to each other. This is a chip electrolytic capacitor characterized by the following arrangement.

Function The metal case that houses the capacitor element is placed on the printed circuit board via a pre-formed heat-resistant insulating molded body, and the lead-out leads led out from the capacitor element are placed along the corners of the insulating molded body. Since the capacitors are bent in the same direction and arranged parallel to each other, the heat is isolated by the insulating molded body, improving soldering heat resistance, and the capacitor can be mounted in any direction vertically or horizontally with respect to the surface of the printed circuit board. This also improves soldering strength.

Embodiments The present invention will be explained below with reference to embodiments shown in FIGS. 1 and 2.

Fig. 1 shows a chip-type electrolytic capacitor of the present invention, in which A is a perspective view as seen from the lead-out lead side and B is a cross-sectional view. 4, and housed in a metal case 5, and the opening of the case is tightened and sealed. next
The above two pull-out leads are inserted into the lead hole 7 formed in the L-shaped heat-resistant insulating molded body 6, which is formed by molding thermoplastic resin such as PBT, PET, ABS, or PPS and has two mutually perpendicular surfaces 6A and 6B. 2 and 3 are inserted, bent along the outer surface of the corner portion 6C of the heat-resistant insulating molded body 6, and arranged in parallel. 6D is a convex portion provided on the heat-resistant insulating molded body 6 to prevent the lead-out leads 2 and 3 from being short-circuited by molten solder. 8 is an insulating sleeve that displays the rating, lot number, etc., and covers the metal case 5 and the heat-resistant insulator 6.

Next, when mounting the above-mentioned electrolytic capacitor on a printed circuit board, as shown in FIG.
The lead leads 2, 3 and the wiring conductor 9a may be connected by heating and melting the capacitor, or the capacitor may be mounted horizontally as shown in FIG. 2B.

FIG. 3 shows another embodiment, which is constructed in the same manner as described above using a U-shaped heat-resistant insulating molded body 11. It goes without saying that the heat-resistant insulating molded body may be formed into a rectangular container with a bottom.

In addition, in the above-mentioned embodiment, two surfaces 6A, 6B or 11 of the heat-resistant insulating molded body 6 or 11
By setting the relationship between the width W of A and 11B and the diameter H of the metal case 5 such that W≧H, capacitors packaged by taping or stacking can be automatically placed on a printed circuit board using an automatic mounting machine. When mounting the capacitor on the capacitor, even if the capacitor is pressed against the center from four directions, the capacitor will not rotate and the mounting position will shift or fall off, making it possible to hold the capacitor more stably.

Effects of the Invention Since the chip-type electrolytic capacitor of the present invention is configured as described above, the soldering heat resistance is improved.
It has extremely significant effects such as no sudden increase in leakage current, being extremely stable, allowing capacitors to be mounted both vertically and horizontally, standardizing parts and improving productivity in automatic mounting.

[Brief explanation of drawings]

Figure 1 shows an embodiment of the chip-type electrolytic capacitor of the present invention, A is a perspective view as seen from the lead-out side, B is a sectional view, and Figure 2 A and B are chip-type electrolytic capacitors of the present invention attached to a printed circuit board. An explanatory diagram of an electrolytic capacitor, FIG. 3 shows another embodiment of the chip-type electrolytic capacitor of the present invention, A is a cutaway front view of the main part, B is a bottom view, and FIG.
5 and 5 are cross-sectional views of different conventional chip-type electrolytic capacitors. 1: Capacitor element, 2, 3: Drawer lead,
4: Elastic sealing body, 5: Metal case, 6, 11: Heat-resistant insulating molded body, 6A, 6B, 11A, 11B:
Two surfaces perpendicular to each other, 6C, 11C: Corner portion, 8: Insulating sleeve.

Claims (1)

[Scope of Claims] 1. Two lead-out leads led out in the same direction from a capacitor element are inserted into an elastic sealing body, this is housed in a metal case, the opening of the case is tightened and sealed, and the above-mentioned two The lead-out leads are led out through a heat-resistant insulating molded body having at least two surfaces perpendicular to each other, and are bent in the same direction along the outer surface of the corner portion where the two surfaces of the insulating molded body intersect and arranged in parallel. A chip-type electrolytic capacitor characterized in that the insulating molded body and the metal case are covered with an insulating sleeve and integrated. 2. The chip-type electrolytic capacitor according to claim 1, wherein the heat-resistant insulating molded body is formed in an L-shape, and the metal case is disposed inside the heat-resistant insulating molded body.