JPH0423609B2 - - Google Patents
Info
- Publication number
- JPH0423609B2 JPH0423609B2 JP17682984A JP17682984A JPH0423609B2 JP H0423609 B2 JPH0423609 B2 JP H0423609B2 JP 17682984 A JP17682984 A JP 17682984A JP 17682984 A JP17682984 A JP 17682984A JP H0423609 B2 JPH0423609 B2 JP H0423609B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- electrolytic
- ceramic
- fluid
- ceramics according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012545 processing Methods 0.000 claims description 47
- 239000000919 ceramic Substances 0.000 claims description 42
- 238000003754 machining Methods 0.000 claims description 31
- 239000012530 fluid Substances 0.000 claims description 26
- 239000002253 acid Substances 0.000 claims description 18
- 150000003839 salts Chemical class 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000003672 processing method Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 6
- 239000003792 electrolyte Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- -1 oxide Chemical class 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000003513 alkali Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 9
- 150000007513 acids Chemical class 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 150000001447 alkali salts Chemical class 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- ASZZHBXPMOVHCU-UHFFFAOYSA-N 3,9-diazaspiro[5.5]undecane-2,4-dione Chemical class C1C(=O)NC(=O)CC11CCNCC1 ASZZHBXPMOVHCU-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 150000008043 acidic salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004814 ceramic processing Methods 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- MQRJBSHKWOFOGF-UHFFFAOYSA-L disodium;carbonate;hydrate Chemical compound O.[Na+].[Na+].[O-]C([O-])=O MQRJBSHKWOFOGF-UHFFFAOYSA-L 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- RNDIHDKIZRODRW-UHFFFAOYSA-L magnesium;chloride;hydroxide Chemical compound [OH-].[Mg+2].[Cl-] RNDIHDKIZRODRW-UHFFFAOYSA-L 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミツクスの加工方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for processing ceramics.
一般にセラミツクスと呼ばれているものには、
酸化物、窒化物、炭化物、硼化物、珪化物、弗化
物、硫化物、セレン化物、テレル化物等の主に一
種類の化合物で構成されている単一相セラミツク
ス、上記セラミツクスの二種以上の化合物から成
る複合セラミツクス、更には上記セラミツクスに
金属を添加した酸化物、炭化物、若しくは硼化物
系のサーメツト等の天然若しくは人工の粉末状化
合物を成型、高温焼成により作られ、金属と非金
属元素による無機化合物から成る多結晶固体材料
等がある。
What is generally called ceramics includes
Single-phase ceramics mainly composed of one type of compound such as oxide, nitride, carbide, boride, silicide, fluoride, sulfide, selenide, terrellide, etc., and two or more types of the above ceramics. Composite ceramics consisting of compounds, as well as natural or artificial powdered compounds such as oxides, carbides, or boride-based cermets, which are made by adding metals to the above ceramics, are molded and fired at high temperatures, and are made from metals and nonmetallic elements. There are polycrystalline solid materials made of inorganic compounds.
而して、これらのセラミツクスの殆どは、一般
に金属より融点が高く、且つ、その生成自由エネ
ルギ(結合エネルギ)が高く、化学的にも極めて
安定であり、また硬度も高いため、これを機械的
に加工するためには、ダイヤモンドやCBN(立方
晶窒化硼素)等の切削チツプ又は砥粒を切刃とし
て有する切削工具やドリル、或いは研削砥石等の
超高硬質工具によるほかはなく、その場合の切削
又は研削加工能は金属、合金に比較して著しく低
くなり、また、脆く割れ易いので、機械的切削又
は研削による加工成形には適さない。 Most of these ceramics generally have a higher melting point than metals, have a higher free energy of formation (bonding energy), are extremely chemically stable, and have high hardness, so it is difficult to mechanically In order to process the material, the only way to process it is to use a cutting tool or drill that has cutting chips such as diamond or CBN (cubic boron nitride) or abrasive grains as a cutting edge, or an ultra-hard tool such as a grinding wheel. Its cutting or grinding performance is significantly lower than that of metals and alloys, and it is brittle and easily cracked, so it is not suitable for processing and forming by mechanical cutting or grinding.
又、この種のセラミツクスは、一般的には絶縁
体とも云うべく、その電気伝導率は金属、合金に
比べ著しく低く、又、その熱伝導率も同様に極め
て低いので、ダイヤモンド等のチツプ又は砥粒を
有する工具による切削又は研削加工に要したエネ
ルギは、金属、合金等のい材料を加工する場合よ
りも多く前記工具側に伝達され、従つて、工具側
の摩耗、損傷が金属、合金の加工の場合に比べて
著しく大きくなることが少なくない。 In addition, this type of ceramic is generally referred to as an insulator, and its electrical conductivity is significantly lower than that of metals and alloys, and its thermal conductivity is also extremely low, so it cannot be used with diamond chips or abrasives. The energy required for cutting or grinding with a tool having grains is transmitted to the tool side more than when machining thin materials such as metals and alloys, and therefore the wear and damage on the tool side is less than when processing thin materials such as metals and alloys. It is often much larger than in the case of machining.
このように、セラミツクスは融点が高く、高硬
度であるが割れ易く、電気伝導率が低く、又、化
学的にも安定であるところから、従来通常の加工
手段に対しては、相当な難加工材であることが知
られている。 As described above, ceramics have a high melting point, high hardness, but break easily, low electrical conductivity, and are chemically stable, making them extremely difficult to process using conventional processing methods. It is known to be a material.
而して、セラミツクスに用いられている金属酸
化物の如き化学的に安定な化合物は、通常の金
属、合金に比べて、一般的に耐酸及び耐アルカリ
性に優れているが、これは、例えば室温程度の比
較的低温領域のことであつて、高温域では、金
属、合金等に或いは劣らない程度に反応性が高
い。即ち、一般的に知られているように通常の金
属酸化物は高温域(例えば、約100℃前後よりも
高い約100〜400℃前後)の酸(例えば硫酸等の強
酸)、アルカリ(例えば、水酸化ナトリウム等の
強アルカリ)に溶解する。
Chemically stable compounds such as metal oxides used in ceramics generally have superior acid and alkali resistance compared to ordinary metals and alloys; In the high temperature range, the reactivity is as high as that of metals, alloys, etc. That is, as is generally known, ordinary metal oxides are difficult to react with acids (e.g., strong acids such as sulfuric acid), alkalis (e.g., Dissolves in strong alkalis (such as sodium hydroxide).
然しながら、上記の如き高温の酸やアルカリ等
による化学反応作用をセラミツクスに対して行な
うにしても、そのような高温の酸やアルカリ等に
耐え得る容器や供給、回収等を行なう等の信頼性
をおける物及び手段がなく、又、この化学反応作
用を被加工体セラミツクスの所望局部部分のみに
作用させることも従来技術では難しかつた。 However, even if a chemical reaction using high-temperature acids, alkalis, etc. as described above is applied to ceramics, reliability must be ensured, such as containers that can withstand such high-temperature acids, alkalis, etc., and supply/recovery methods. In addition, with the prior art, it was difficult to cause this chemical reaction to act only on a desired local portion of the ceramic workpiece.
このような高温の酸やアルカリ或いは塩による
反応作用を、セラミツクスの所望加工部分に限定
して局部的に与えて周囲の他の部分から切り離
し、そしてその加工部分を何等かの手段で除去す
ることができれば、セラミツクスの加工が可能と
なる。
The reaction action of such high-temperature acids, alkalis, or salts is applied locally to the desired processed part of the ceramics, separated from other surrounding parts, and then the processed part is removed by some means. If this is possible, it will be possible to process ceramics.
かかる加工の態様は高温の酸、アルカリに限ら
ず、例えば、電解により正極に酸、そして負極に
アルカリを生ずるNaCl等の中性塩の電解液、化
学的に活性なイオン、例えば、ハロゲンイオン
Cl-等を所定の高温条件下でセラミツクスに作用
させて、当該部分の酸化物を分解させる態様のも
のであつてもよい。又、所望加工部分に置いたイ
オン結晶の固体である塩を融点以上に加熱し、こ
れを溶融して溶融塩となし、所定の高温条件を保
つて加工可能な状態にした。その溶融塩には塩の
組成中に結晶水を含む含水塩、水素イオンを含む
酸性塩、水素イオンを含む塩基性塩とがあつて、
加工すべきセラミツクによつて選定される。 Such processing is not limited to high-temperature acids and alkalis; for example, electrolytes of neutral salts such as NaCl, which produce acid at the positive electrode and alkali at the negative electrode, and chemically active ions, such as halogen ions, are used.
It may also be an embodiment in which Cl - or the like is applied to the ceramic under predetermined high temperature conditions to decompose the oxide in the relevant portion. Further, the salt, which is a solid ionic crystal placed in the desired processing area, was heated above its melting point to melt it into a molten salt, and maintain a predetermined high temperature condition to make it ready for processing. The molten salt has a hydrated salt containing water of crystallization, an acidic salt containing hydrogen ions, and a basic salt containing hydrogen ions in its salt composition.
It is selected depending on the ceramic to be processed.
そして又、この溶融塩の溶液に酸或いはアルカ
リを添加したものを電解性加工液として使用する
ものである。 Furthermore, a solution of this molten salt to which an acid or alkali is added is used as an electrolytic processing fluid.
本発明は叙上の観点に立つてなされたものであ
り、被加工体セラミツクスの所望加工部分の表面
領域の単位局部に酸、アルカリ等の電解質を通常
溶媒である水に溶解した電解性加工液を所望単位
量だけ噴射、流下、滴加等により供給介在せしめ
た状態或いは溶融塩を置いた状態で、当該局部に
電気エネルギを供給し、放電を生ぜしめて高温状
態とし、更には電解作用を生ぜしめ、当該局部に
於て酸又はアルカリ等の電解性加工液の高温状態
に於けるセラミツクスとの反応を好ましくは供給
した電解性加工液中の酸、アルカリ又は塩等の全
部乃至大部分が行なうようにし、この反応による
変質生成物又は残留物、或いは前記反応により脆
弱化等した反応部分を超音波振動エネルギが付与
される超音波振動加工用工具によつて前記局部か
ら機械的に除去することにより加工が行なわれる
ようにしたもので、前記加工局部を被加工体セラ
ミツクス上の水平面内の所定の位置又は厚さ方向
に順次に制御移動させて所望の目的加工が行なわ
れるものである。 The present invention has been made based on the above-mentioned viewpoint, and uses an electrolytic processing liquid in which an electrolyte such as an acid or alkali is dissolved in water, which is usually a solvent, to a unit local area of the surface area of a desired processing part of a ceramic workpiece. A desired unit amount of molten salt is supplied by spraying, flowing down, dropping, etc., or electrical energy is supplied to the local area to generate electric discharge and a high temperature state, and furthermore, to generate an electrolytic action. Preferably, all or most of the acid, alkali, salt, etc. in the supplied electrolytic machining fluid reacts with the ceramics at high temperature in the local area. and mechanically remove the altered products or residues resulting from this reaction, or the reaction parts weakened by the reaction, from the local area using an ultrasonic vibration machining tool to which ultrasonic vibration energy is applied. The processing is carried out by sequentially controlling and moving the processing local part to a predetermined position in the horizontal plane or in the thickness direction of the ceramic object to perform the desired target processing.
また、本発明は、従来からある電気加工、超音
波加工、化学加工等の各加工方法を個別に適用す
る単純加工ではなく、上記の加工方法を各加工方
法の特質、特性だけでなく、加工を施すタイミン
グ、即ち、例えば被加工体の同一箇所に対して略
同時又は一方の加工方法の適用後時間を置かずに
直後に引き続いて他の加工方法を適用するとか、
或いは、二つ以上の加工方法を交互に適用する
等、一方の加工方法による加工作用又は効果が残
存している状態に於て他の加工方法を適用するよ
うにした複合加工方法によりセラミツクス加工の
難点を克服したものである。 In addition, the present invention is not a simple processing in which conventional processing methods such as electrical processing, ultrasonic processing, and chemical processing are individually applied, but the processing methods described above are applied not only to the characteristics and characteristics of each processing method, but also to In other words, for example, applying one processing method to the same part of the workpiece at approximately the same time or immediately after applying another processing method,
Alternatively, ceramic processing can be carried out by a composite processing method, such as applying two or more processing methods alternately, in which the processing effect or effect of one processing method remains, while the other processing method is applied. This overcomes the difficulties.
上記のような構成により、高温の酸、アルカリ
又は塩等の加工液の加工部からの回収除去は、た
とえ或る程度の回収量があるにしても、超音波加
工に冷却液を必要としない場合には、その量は極
めて少なくすることができ、又、回収する電解性
加工液が高温状態である可能性がほとんどないか
ら、本発明の目的を達成する加工装置を構成する
ことが可能となる。
With the above configuration, ultrasonic machining does not require a cooling liquid to collect and remove high-temperature acids, alkalis, salts, etc. from the processing section, even if there is a certain amount of recovery. In some cases, the amount can be extremely small, and there is almost no possibility that the electrolytic machining fluid to be recovered is in a high temperature state, so it is possible to construct a machining device that achieves the object of the present invention. Become.
本発明では、前記の所望加工部分に供給するエ
ネルギとして電解放電エネルギ(電解による電気
化学的作用、電気の通電に伴う通電加熱作用や放
電による熱及び衝撃作用等の複合作用を伴う)を
用い、これを、例えば数10μm〜1μmの所定の局
部範囲に作用させ、それ以外の領域には熱等を全
く作用させないので、局部加工が可能となる。 In the present invention, electrolytic discharge energy (accompanied by combined effects such as electrochemical action due to electrolysis, energization heating action due to electricity supply, and heat and impact action due to discharge) is used as the energy supplied to the desired machining part, This is applied to a predetermined local range of, for example, several 10 μm to 1 μm, and no heat or the like is applied to other areas, making it possible to perform local processing.
また、被加工体セラミツクスが熱伝導が悪く、
加工局部から熱拡散が比較的少ないことから、本
発明に於ける高温に加熱された酸、アルカリ又は
塩等による反応は局部的に行なわれるのである。 In addition, the ceramic material to be processed has poor thermal conductivity.
Since there is relatively little thermal diffusion from the local part of the process, the reaction with the acid, alkali, salt, etc. heated to high temperature in the present invention is carried out locally.
以下、図面を参照しつゝ本発明の実施例につい
て説明する。
Embodiments of the present invention will be described below with reference to the drawings.
図面は本発明方法を実施する際に用いる加工装
置の一実施例を示す説明図である。 The drawing is an explanatory diagram showing one embodiment of a processing device used when carrying out the method of the present invention.
図中、1は加工液供給ノズル、2は加工液供給
ノズル1の先端部に設けた一方の電極、3はアー
ム、4はアーム3に取り付けられた他方の電極、
5は超音波振動子、6は超音波振動子5の一端に
取り付けられたホーン、7はホーン6の先端に取
り付けられた超音波加工用工具、8は被加工体で
ある。 In the figure, 1 is a machining fluid supply nozzle, 2 is one electrode provided at the tip of the machining fluid supply nozzle 1, 3 is an arm, 4 is the other electrode attached to the arm 3,
5 is an ultrasonic vibrator, 6 is a horn attached to one end of the ultrasonic vibrator 5, 7 is an ultrasonic machining tool attached to the tip of the horn 6, and 8 is a workpiece.
加工液供給ノズル1はその先端噴出口が幅広の
偏平となつており、ここには一方の電極2(+
極)が設けられており、他方の電極4(−極)は
ノズル1から前方に延びたアーム3の先端部に、
ノズル1から噴出した電解性加工液と接するよう
に設けられている。 The machining fluid supply nozzle 1 has a wide and flat end spout, and one electrode 2 (+
The other electrode 4 (-pole) is provided at the tip of the arm 3 extending forward from the nozzle 1.
It is provided so as to be in contact with the electrolytic machining fluid spouted from the nozzle 1.
超音波振動子5は超音波加工機のアーム(図示
せず)に取り付けられ、高周波電流を機械的な振
動に変換し、超音波振動子5の一端に設けたホー
ン6はこの振動の振幅を拡大し、先端部に取り付
けた工具7に伝達する。 The ultrasonic vibrator 5 is attached to the arm (not shown) of the ultrasonic processing machine and converts high frequency current into mechanical vibration, and the horn 6 provided at one end of the ultrasonic vibrator 5 converts the amplitude of this vibration. It is enlarged and transmitted to the tool 7 attached to the tip.
被加工体8は、図示しないクロススライドテー
ブルに取り付けられ、水平面上で任意の位置にサ
ーボ制御移動されるよう構成されている。 The workpiece 8 is attached to a cross slide table (not shown) and is configured to be moved to any position on a horizontal plane under servo control.
而して、加工液供給ノズル1から、例えば、濃
度5〜40%の塩酸(HCl)を、速度約10m/s〜
100m/s、流量約1〜10c.c.で超音波加工用工具
7による加工領域に合わせてフイルム状に噴出さ
せ、この電解性加工液にノズル1に設けた一方の
電極2(+極)と、他方の電極4(−極)との間
に直流、交流、高周波、又は間歇的電圧パルスの
電圧を印加して、この電解性加工液を通電、電
解、及び放電により所定の高温状態に加熱した状
態で被加工体セラミツクス8の加工すべきセラミ
ツクス表面に供給し、セラミツクスの分解、反応
層、脆化層8aを生ぜしめ、同時に被加工体8を
図中矢印方向に順次に制御移動せしめてこの層8
aに超音波加工用工具7を軽く接触させて超音波
振動エネルギを与え、これにより超音波振動研削
加工除去する。 Then, for example, hydrochloric acid (HCl) with a concentration of 5 to 40% is supplied from the processing liquid supply nozzle 1 at a speed of about 10 m/s to
The electrolytic machining fluid is sprayed in a film shape according to the machining area by the ultrasonic machining tool 7 at a flow rate of approximately 1 to 10 c.c. A DC, AC, high frequency, or intermittent voltage pulse voltage is applied between the electrode 4 and the other electrode 4 (-pole), and the electrolytic working fluid is brought to a predetermined high temperature state by energization, electrolysis, and discharge. It is supplied in a heated state to the surface of the ceramic to be processed of the ceramic workpiece 8 to cause decomposition of the ceramic, a reaction layer, and an embrittlement layer 8a, and at the same time, the workpiece 8 is controlled to move sequentially in the direction of the arrow in the figure. Lever layer 8
A is brought into light contact with the ultrasonic machining tool 7 to apply ultrasonic vibration energy, thereby performing ultrasonic vibration grinding and removal.
尚、必要があれば、超音波加工用工具7と被加
工体8との間に砥粒を超音波加工の常套手段に応
じ、軽油等に混合、分散させたものを適宜の手段
により供給介在させてもよい。 If necessary, abrasive grains mixed and dispersed in light oil or the like may be supplied between the ultrasonic machining tool 7 and the workpiece 8 by an appropriate means according to the conventional means of ultrasonic machining. You may let them.
また、加工液供給ノズル1から供給する電解性
加工液中の電解質は必ずしも強酸及び強アルカリ
である必要はなく、例えば塩化ナトリウムとか塩
化カリウム等の中性塩であつてもよく、この場合
には電解により正極で酸、負極でアルカリが生成
し、同様な効果が得られるものである。 Further, the electrolyte in the electrolytic machining fluid supplied from the machining fluid supply nozzle 1 does not necessarily have to be a strong acid or a strong alkali, and may be a neutral salt such as sodium chloride or potassium chloride. Electrolysis produces acid at the positive electrode and alkali at the negative electrode, producing similar effects.
組成SiCに小量のSiO2、CaO、K2O、TiC、
TiNを含む導電性SiCセラミツクスにNa2CO3を
40%含む水溶液をノズルから流出して電極2と4
との間に通電して、Na2CO3が沸騰しない程度に
加熱すると、セラミツクスSiC中の粒界に存在す
るSiO2、CaO、K2Oなどがアルカリ性腐食液と
反応して珪酸塩をつくり、浸食を著しくして、加
工性が付与される。 Composition SiC with small amounts of SiO 2 , CaO, K 2 O, TiC,
Adding Na 2 CO 3 to conductive SiC ceramics containing TiN
The aqueous solution containing 40% flows out from the nozzle and connects to electrodes 2 and 4.
When electricity is applied between Na 2 CO 3 and heated to an extent that it does not boil, SiO 2 , CaO, K 2 O, etc. present at the grain boundaries in the ceramic SiC react with the alkaline corrosive liquid to form silicates. , the erosion becomes significant and workability is imparted.
同様に電解性加工液としての溶融NaOHをノ
ズルから流出して加熱した場合、セラツクス粒界
のSiO2などが高温のNaOH液と容易に反応し、
珪酸ソーダとなり溶融し浸食が進んで加工性が付
与される。この電解性加工液Na2CO3とK2CO3は
約70.0℃より急激に浸食が増し、電解性加工液
NaNO3の場合は450℃から浸食が始まるが、何れ
の場合でも850℃に於てその浸食は良好となる。 Similarly, when molten NaOH as an electrolytic processing fluid flows out of a nozzle and is heated, SiO 2 at the ceramic grain boundaries easily reacts with the high-temperature NaOH solution.
It becomes sodium silicate, melts, and progresses in erosion, giving it workability. The electrolytic machining fluid Na 2 CO 3 and K 2 CO 3 rapidly eroded from about 70.0℃, and the electrolytic machining fluid
In the case of NaNO 3 , erosion starts at 450°C, but in both cases, the erosion becomes good at 850°C.
又、加工液供給ノズル1の部分からは、液体で
ない炭酸水素ナトリウムNaHCO3、フツ化水素
カリウムKHF2の酸性塩や塩化水酸化マグネシウ
ムMgCl(OH)等の塩基性塩の結晶或いは炭酸ナ
トリウム水塩Na2CO3・H2Oや硫酸銅()五水
塩CuSO4・5H2O等の含水塩を供給して、一方の
電極2と他方の電極4との間に直流、交流、高周
波又は間歇的電圧パルスの電圧を印加して、この
結晶を溶融塩となし、その電解性加工液を所定の
高温状態に保つことによつて、被加工体セラミツ
クス8の表面にセラミツクスの分解、反応層、脆
化層8aを生ぜしめ、そこを前記同様、超音波加
工用工具で加工したり、図示していないが、砥石
で研削をする。 In addition, from the processing fluid supply nozzle 1, crystals of non-liquid sodium bicarbonate NaHCO 3 , acid salts of potassium hydrogen fluoride KHF 2 , basic salts such as magnesium chloride hydroxide MgCl(OH), or sodium carbonate hydrate are supplied. Direct current , alternating current, high frequency or By applying intermittent voltage pulses to turn the crystals into molten salt and keeping the electrolytic working fluid at a predetermined high temperature, the ceramic decomposes and a reaction layer is formed on the surface of the ceramic workpiece 8. , an embrittlement layer 8a is formed, which is then processed using an ultrasonic processing tool or ground using a grindstone (not shown), as described above.
本発明によれば、酸、アルカリ又は塩等の電解
性加工液を電気エネルギにより通電及び通電で高
温に加熱し、更には電解して、被加工体セラミツ
クス上に局部的に供給し、これにより被加工体セ
ラミツクスの少なくとも一部以上を分解、溶解等
反応させ、また部分的に脆弱化し、そしてその部
分を超音波振動エネルギが付与される超音波加工
用工具により機械的に除去加工するという特殊な
複合加工方法の適用により被加工体セラミツクス
への穿孔、型彫、切断、溝形成等の成形等の加工
や従来不可能とされていたダイヤのない砥石での
加工が可能となり、広い範囲への適用が予想され
るセラミツクス製品の容易且つ安価な提供を可能
とするものである。
According to the present invention, an electrolytic machining fluid such as an acid, alkali or salt is heated to a high temperature by energizing and energizing with electric energy, and further electrolyzed, and locally supplied onto the ceramic workpiece. This is a special process in which at least a portion of the ceramic workpiece is decomposed, melted, or otherwise reacted, partially weakened, and then that portion is mechanically removed using an ultrasonic processing tool that is applied with ultrasonic vibration energy. By applying a complex processing method, it is now possible to perform processing such as drilling, engraving, cutting, and forming grooves on ceramic workpieces, as well as processing using diamond-free grindstones, which was previously considered impossible, and can be applied to a wide range of areas. This makes it possible to easily and inexpensively provide ceramic products that are expected to be used in
尚、電解性加工液が或る程度以上の量供給され
る場合には、被加工体セラミツクスの載物台を一
方の電極とし、超音波加工用工具を他方の電極と
して通電すると、超音波加工用工具の主として被
加工体近接先端部周囲に於て微小放電が生起して
本発明の目的を達し得るから、電極2,4等は本
発明の必須構成要件ではない。 In addition, when the electrolytic machining fluid is supplied in a certain amount or more, if the stage for the ceramic workpiece is used as one electrode and the ultrasonic machining tool is used as the other electrode and electricity is applied, the ultrasonic machining will be performed. Since the object of the present invention can be achieved by generating a micro discharge mainly around the tip of the tool near the workpiece, the electrodes 2, 4, etc. are not essential components of the present invention.
図面は本発明方法を実施する際に用いる加工装
置の一実施例を示す説明図である。
1……加工液供給ノズル、2……一方の電極、
3……アーム、4……他方の電極、5……超音波
振動子、6……ホーン、7……超音波加工用工
具、8……被加工体。
The drawing is an explanatory diagram showing one embodiment of a processing device used when carrying out the method of the present invention. 1... Machining liquid supply nozzle, 2... One electrode,
3... Arm, 4... Other electrode, 5... Ultrasonic vibrator, 6... Horn, 7... Ultrasonic machining tool, 8... Workpiece.
Claims (1)
領域に、電解性加工液を供給浸漬等により介在せ
しめた状態で上記加工部の表面領域に電気エネル
ギを付与して上記加工部を変質せしめ、次いで上
記変質加工部に超音波振動エネルギが付与される
超音波振動加工用工具により超音波加工すること
を特徴とするセラミツクスの加工方法。 2 上記電解性加工液が電解質を水に溶解させた
加工液である特許請求の範囲第1項記載のセラミ
ツクスの加工方法。 3 上記電解性加工液が加熱溶融せしめた溶解塩
である特許請求の範囲第1項記載のセラミツクス
の加工方法。 4 上記電解性加工液が酸である特許請求の範囲
第1項記載のセラミツクスの加工方法。 5 上記電解性加工液が塩基である特許請求の範
囲第1項記載のセラミツクスの加工方法。 6 上記電解性加工液が塩である特許請求の範囲
第1項記載のセラミツクスの加工方法。 7 上記加工部表面領域に付与される電気エネル
ギが、上記電解性加工液を介して通電される電流
である特許請求の範囲第1項乃至第6項記載のセ
ラミツクスの加工方法。 8 上記加工部表面領域に付与される電気エネル
ギが、加工部表面に近接して設けられた一対の電
極間の放電により与えられるエネルギである特許
請求の範囲第1項乃至第6項記載のセラミツクス
の加工方法。[Scope of Claims] 1. The above-mentioned processing is carried out by supplying an electrolytic processing liquid to the surface region of the desired processing portion of the ceramic workpiece and applying electrical energy to the surface region of the processing portion with the electrolytic processing fluid interposed therein by dipping or the like. 1. A method for processing ceramics, which comprises altering a portion of the ceramic, and then subjecting the altered portion to ultrasonic machining using an ultrasonic vibration machining tool that applies ultrasonic vibration energy to the altered portion. 2. The method of processing ceramics according to claim 1, wherein the electrolytic processing fluid is a processing fluid in which an electrolyte is dissolved in water. 3. The method of processing ceramics according to claim 1, wherein the electrolytic processing fluid is a dissolved salt heated and melted. 4. The method for processing ceramics according to claim 1, wherein the electrolytic processing fluid is an acid. 5. The method of processing ceramics according to claim 1, wherein the electrolytic processing fluid is a base. 6. The method of processing ceramics according to claim 1, wherein the electrolytic processing fluid is a salt. 7. The method of processing ceramics according to any one of claims 1 to 6, wherein the electrical energy applied to the surface area of the processed part is a current passed through the electrolytic processing fluid. 8. The ceramic according to any one of claims 1 to 6, wherein the electrical energy applied to the surface area of the processed part is energy provided by electric discharge between a pair of electrodes provided close to the surface of the processed part. processing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17682984A JPS6154908A (en) | 1984-08-27 | 1984-08-27 | Method of processing ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17682984A JPS6154908A (en) | 1984-08-27 | 1984-08-27 | Method of processing ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6154908A JPS6154908A (en) | 1986-03-19 |
| JPH0423609B2 true JPH0423609B2 (en) | 1992-04-22 |
Family
ID=16020564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17682984A Granted JPS6154908A (en) | 1984-08-27 | 1984-08-27 | Method of processing ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6154908A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02303724A (en) * | 1989-05-19 | 1990-12-17 | Akio Nakano | Ultrasonic machining method |
| JP4658578B2 (en) * | 2004-12-09 | 2011-03-23 | 独立行政法人理化学研究所 | Nozzle ELID grinding method and apparatus |
| CN102513622B (en) * | 2011-11-09 | 2014-03-12 | 扬州大学 | Micro and fine machining method for material difficult to machine |
| CN105619186A (en) * | 2016-02-29 | 2016-06-01 | 南京航空航天大学 | Machining method and device for silicon carbide mirror |
| CN112809111B (en) * | 2021-01-20 | 2022-05-20 | 南方科技大学 | Ultrasonic-plasma electrolytic combined machining method and machining device for workpiece |
-
1984
- 1984-08-27 JP JP17682984A patent/JPS6154908A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6154908A (en) | 1986-03-19 |
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