JPH0424293B2 - - Google Patents
Info
- Publication number
- JPH0424293B2 JPH0424293B2 JP27090287A JP27090287A JPH0424293B2 JP H0424293 B2 JPH0424293 B2 JP H0424293B2 JP 27090287 A JP27090287 A JP 27090287A JP 27090287 A JP27090287 A JP 27090287A JP H0424293 B2 JPH0424293 B2 JP H0424293B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- surface layer
- glass
- carbide
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002344 surface layer Substances 0.000 claims description 36
- 239000011521 glass Substances 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 239000010410 layer Substances 0.000 claims description 25
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 20
- 238000000465 moulding Methods 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical group C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 13
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 150000001247 metal acetylides Chemical class 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 5
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000306 component Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000005304 optical glass Substances 0.000 description 4
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000007733 ion plating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PCLURTMBFDTLSK-UHFFFAOYSA-N nickel platinum Chemical compound [Ni].[Pt] PCLURTMBFDTLSK-UHFFFAOYSA-N 0.000 description 3
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical compound [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- -1 By dispersing B 4 C Chemical compound 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000005308 flint glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B11/00—Pressing molten glass or performed glass reheated to equivalent low viscosity without blowing
- C03B11/06—Construction of plunger or mould
- C03B11/08—Construction of plunger or mould for making solid articles, e.g. lenses
- C03B11/084—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor
- C03B11/086—Construction of plunger or mould for making solid articles, e.g. lenses material composition or material properties of press dies therefor of coated dies
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2215/00—Press-moulding glass
- C03B2215/02—Press-mould materials
- C03B2215/08—Coated press-mould dies
- C03B2215/14—Die top coat materials, e.g. materials for the glass-contacting layers
- C03B2215/26—Mixtures of materials covered by more than one of the groups C03B2215/16 - C03B2215/24, e.g. C-SiC, Cr-Cr2O3, SIALON
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
(産業上の利用分野)
本発明は、ガラスをプレス成形するための成形
型に関し、特に、プレス成形後に研磨を必要とし
ない高精度のガラス成形体に成形するための成形
型に関する。
(従来の技術)
一般に、プレス成形によるガラスの成形では、
所定の表面形状(例えば球面または非球面)に仕
上げた表面層を有する成形型内に、予め軟化させ
た被成形ガラスを入れ(また被成形ガラスを成形
型に入れてから加熱・軟化させ)、この成形型に
所定の圧力を加えることによつて、成形型の表面
層が被成形ガラスに転写される。したがつて、成
形型は、その表面層の形状がガラス成形体の表面
形状としてそのまま転写されることから、その表
面層に気孔等の欠陥がなく、緻密で鏡面状に精密
加工することができ、かつ高温において十分な硬
度および強度を保てる等の要件を満たすことが求
められる。
このような成形型の材料としては、従来、シリ
コンカーバイド(SiC)やシリコンナイトライド
(Si3N4)(特開昭52−45613号公報)、タングステ
ンカーバイド(特開昭56−59641号公報)、ジルコ
ニウムオキサイド(ZrO2)を基盤材料とし、そ
の上に白金−ロジウム(Pt−Rh)合金または白
金−イリジウム(Pt−Ir)合金のコーテイング膜
を形成したもの(特開昭60−176930号公報)が提
案されている。
(発明が解決しようとする問題点)
しかし、シリコンカーバイドやシリコンナイト
ライドを表面層とする成形型は、緻密で、かつ硬
度および強度の点ですぐれているものの、被成形
ガラスに鉛を多量に含有する重フリント系光学ガ
ラスを使用した場合、鉛との化学反応性が高く、
高精度のガラス成形体に成形することが困難とな
る。
次に、タングステンカーバイドの成形型は、加
工性にすぐれるが、高温下で酸化しやすく、型表
面が肌荒れを起こし、光学表面を保持することが
できない。また、被成形ガラスと反応しやすい問
題もあつた。
また、白金−ロジウムまたは白金−イリジウム
の合金のコーテイング膜を形成したものは、被成
形ガラスとの化学作用を起こさないことが利点と
して挙げられているが、本発明者らの実験によれ
ば、ガラス成形体との離型性がプレス成形開始当
初から悪いという問題があつた。
(問題点を解決するための手段)
本発明によるガラス成形体の成形型は、成形型
の表面層を白金(Pt)とニツケル(Ni)の少な
くとも2成分からなる物質に炭化物が分散されて
形成されているものである。
なお、好ましくは白金(Pt)とニツケル(Ni)
の少なくとも2成分から成る前記物質がニツケル
(Ni)を5〜45wt%含み、前記炭化物がTiC、
TaC、B4C、SiC、HfC、ZrC、VCから選ばれた
少なくとも一つからなり、その分散量が0.02〜
30vol%であり、さらに前記表面層と下地の基盤
との間に、ニツケル(Ni)、チタン(Ti)、クロ
ム(Cr)、モリブデン(Mo)、コバルト(Co)、
チタンナイトライド(TiN)、チタンカーバイド
(TiC)、シリコンカーバイド(SiC)およびこれ
らの混合物のうちから選択された少なくとも一つ
を含む中間層を介在させたものである。
これらの表面層や中間層は、所定形状に加工さ
れた基盤上にスパツタリング法、イオンプレーテ
イング法などにより形成される。膜厚は0.05〜
10μm程度が好ましい。薄すぎると均一な膜が得
にくく、厚すぎると成膜時間を長くするのみなら
ず、膜の表面状態が荒れてくる。
なお、表面層材料として、ニツケルの他に、イ
リジウム(Ir)、ロジウム(Rh)、および金
(Au)などを加えた白金合金に炭化物を分散させ
れば、一層高温のプレスでの使用に耐えるように
なる。
成形型の基盤材料については、基盤として一般
に要求される硬度、強度および耐熱性等を満足す
るものであれば特に限定されず、ステンレス鋼、
タングステンカーバイド(WC)、ジルコニウム
オキサイド(ZrO2)、サーメツト、シリコンカー
バイド(SiC)およびシリコンナイトライド
(Si3N4)などが使用可能である。また、プレス
成形時の圧力が基盤の変形に問題にならない程度
であれば、この基盤材料は、上述した表面層や中
間層の各物質と同一の合金等を用いてもよい。
(作用)
本発明の成形型の表面層は、緻密性、硬度、強
度、加工性および耐化学反応性のそれぞれにおい
て良好であるばかりでなく、プレス成形されたガ
ラス成形体との離型性も良好になり、さらに結晶
成長を抑え膜の荒れを抑える。すなわち、白金−
ニツケル合金(白金50wt%以上、ニツケル5〜
45wt%)中に炭化物、具体的にはTiC、TaC、
B4C、SiC、HfC、ZrC、VCなどを分散させるこ
とにより、特にガラス成形体との離型性を向上さ
せるとともに、面精度を保持することができる。
その分散量を0.02〜30vol%としたのは、炭化物
が0.02vol%未満では硬度が低くなり傷が発生し
やすく、また分散効果により結晶成長を抑え、膜
の荒れを抑える効果が十分に得られにくく、一
方、30vol%を越えると、ガラス成形体との離型
性が悪くなるためである。
また、中間層は基盤と表面層との親和性を高
め、型寿命を長くする作用を有する。
(実施例)
第1図は本発明の一実施例を示す成形型の断面
図である。成形型は、上型1と下型2とから構成
される。上型1と下型2とは、それぞれの外周面
が案内型3の内周面上を滑動するように、案内型
3の内部に配置されている。これらの上型1およ
び下型2は、それぞれ基盤1aと表面層1bおよ
び基盤2aと表面層2bからなり、表面層1b,
2bを相互に対向させて配置してある。
基盤1a,2aは、焼結時にHIP処理を施して
緻密にしたタングステンカーバイドを用い、これ
を円柱状(直径18mm、高さ28mm)に加工し、その
一端面を凹球面状に研削し、最終仕上げとしてダ
イヤモンド砥石により高精度の光学鏡面に研摩
し、それぞれ所定の曲率半径(32mm)の凹球面に
加工した。この凹球面の面粗さは100Å以下であ
つた。
この基盤1a,2bの凹球面に対し、スパツタ
リング装置を用い、表に示した実施例1〜21の物
質組成のターゲツトを使用し、所定の成膜条件で
所定の厚さの表面層1b,2bを形成した。な
お、その際、基盤1a,2aと表面層1b,2b
との密着性を一層強固にするために、表面層1
b,2bの成膜に先立つて、逆スパツタリングに
より基盤1a,2aの各表面を洗浄化することは
有効である。
例えば、実施例1ではアルゴンガス圧1×
10-3Torr、ターゲツトとして白金−ニツケル5wt
%、DClkw、成膜速度500Å/min、さらにター
ゲツトとしてチタンカーバイド、RF400W、成膜
速度5Å/min(分散量1vol%)、電極間距離100
mm、回転数20rpmで行い、膜厚は0.5μmであつ
た。
また、本実施例では白金−ニツケル、チタンカ
ーバイド別々のターゲツトを同時にスパツタを行
う二元スパツタリングについて述べたが2種のタ
ーゲツトをモザイク状に配置してその面積比で分
散を調整する複合ターゲツトを使用しても良いも
のである。またターゲツトそのものが分散型にな
つているものでもかまわない。いずれにしても
各々のスパツタ率を考慮して組合わせる。
なお、案内型3は本実施例では上型・下型の基
盤1a,2aと同様のタングステンカーバイドで
構成されている。
第2図は、本発明の他の実施例を示す成形型の
断面図である。本実施例の上型1′および下型
2′は、それぞれ基盤1aと表面層1bとの間お
よび基盤2aと表面層2bとの間に、第1中間層
1cと第2中間層1dおよび第1中間層2cと第
2中間層2dが介在させてある点で、第1図の上
型1および下型2と相違するが、その他は構造上
同一である。中間層は、2層図示したが、1層の
みまたは3層以上にしてもよい。表に、中間層を
1層のみとした例を実施例11〜13、16〜19および
21として示し、中間層を2層とした例を実施例
14、15および20として示した。
これらの中間層および表面層は、例えば実施例
11では、基盤1a,2aをイオンエツチングし
た後、イオンプレーテイング法により、所定の成
膜条件(真空度5×10-5Torr、成膜速度300Å/
min、基盤電圧−300V)でチタンからなる第1
中間層1c,2c(膜厚0.05μm)を成膜した後、
その上にスパツタリング法により白金(95wt%)
−ニツケル5wt%とチタンカーバイド(TiC)を
ターゲツトとし、所定の成膜条件(前記)で表面
層1b,2b(膜厚3.0μm)を成膜することによ
り形成した。
また、実施例20においては、基盤1a,2aを
イオンエツチングした後、その凹球面上にイオン
プレーテイング法により、所定の成膜条件(チツ
素ガス圧5×10-4Torr、成膜速度300Å/min、
基盤電圧−300V)でチタンナイトライドからな
る第2中間層1d,2d(膜圧0.3μm)を成膜し
た。次いで、スパツタリング法により所定の成膜
条件(アルゴンガス圧1×10-3Torr、成膜速度
400Å/min)でニツケルからなる第1中間層1
c,1c(膜圧0.05μm)を成膜し、引続き同様の
方法により、白金(80wt%)−ニツケル(10wt
%)−イリジウム(10wt%)を合金とチタンカー
バイド(TiC)をターゲツトとし、所定の成膜条
件(前記)で表面層1b,2b(膜圧1.0μm)を
成膜した。
その他の実施例もこれらとほぼ同様の方法によ
り中間層および表面層を形成した。
(Industrial Application Field) The present invention relates to a mold for press-molding glass, and particularly to a mold for molding into a high-precision glass molded body that does not require polishing after press-molding. (Prior art) Generally, when glass is formed by press molding,
A pre-softened glass to be formed is placed in a mold having a surface layer finished with a predetermined surface shape (for example, spherical or aspherical) (and the glass to be formed is heated and softened after being placed in the mold), By applying a predetermined pressure to this mold, the surface layer of the mold is transferred to the glass to be molded. Therefore, since the shape of the surface layer of the mold is directly transferred as the surface shape of the glass molded object, the surface layer has no defects such as pores and can be precisely processed into a dense and mirror-like surface. It is also required to satisfy requirements such as being able to maintain sufficient hardness and strength at high temperatures. Conventional materials for such molds include silicon carbide (SiC), silicon nitride (Si 3 N 4 ) (Japanese Patent Laid-Open No. 52-45613), and tungsten carbide (Japanese Patent Laid-Open No. 56-59641). , which uses zirconium oxide (ZrO 2 ) as a base material and on which a coating film of platinum-rhodium (Pt-Rh) alloy or platinum-iridium (Pt-Ir) alloy is formed (Japanese Unexamined Patent Publication No. 176930/1982) ) has been proposed. (Problem to be solved by the invention) However, although molds with a surface layer of silicon carbide or silicon nitride are dense and have excellent hardness and strength, they contain a large amount of lead in the glass to be molded. When using heavy flint-based optical glass containing lead, it has high chemical reactivity with lead.
It becomes difficult to form a glass molded body with high precision. Next, although tungsten carbide molds have excellent workability, they are susceptible to oxidation at high temperatures, causing roughness on the mold surface and making it impossible to maintain an optical surface. Another problem was that it easily reacted with the glass to be formed. In addition, it is said that the advantage of coatings formed with platinum-rhodium or platinum-iridium alloys is that they do not cause chemical reactions with the glass to be formed, but according to experiments conducted by the present inventors, There was a problem that the mold releasability from the glass molded body was poor from the beginning of press molding. (Means for Solving the Problems) In the mold for a glass molded article according to the present invention, the surface layer of the mold is formed by dispersing carbide in a substance consisting of at least two components, platinum (Pt) and nickel (Ni). This is what has been done. Note that platinum (Pt) and nickel (Ni) are preferably used.
The substance consisting of at least two components contains 5 to 45 wt% of nickel (Ni), and the carbide contains TiC,
Consists of at least one selected from TaC, B 4 C, SiC, HfC, ZrC, and VC, and the amount of dispersion is 0.02 ~
Furthermore, between the surface layer and the underlying base, nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), cobalt (Co),
An intermediate layer containing at least one selected from titanium nitride (TiN), titanium carbide (TiC), silicon carbide (SiC), and mixtures thereof is interposed. These surface layers and intermediate layers are formed on a substrate processed into a predetermined shape by a sputtering method, an ion plating method, or the like. Film thickness is 0.05~
The thickness is preferably about 10 μm. If it is too thin, it will be difficult to obtain a uniform film, and if it is too thick, not only will the film formation time become longer, but the surface condition of the film will become rough. In addition, if carbide is dispersed in a platinum alloy containing nickel, iridium (Ir), rhodium (Rh), and gold (Au) as a surface layer material, it can withstand even higher temperature presses. It becomes like this. The base material of the mold is not particularly limited as long as it satisfies the hardness, strength, heat resistance, etc. generally required for a base, and stainless steel,
Tungsten carbide (WC), zirconium oxide (ZrO 2 ), cermet, silicon carbide (SiC) and silicon nitride (Si 3 N 4 ) can be used. Further, as long as the pressure during press molding does not cause a problem in deformation of the base, the base material may be the same alloy as the materials of the above-mentioned surface layer and intermediate layer. (Function) The surface layer of the mold of the present invention not only has good density, hardness, strength, workability, and chemical reaction resistance, but also has good releasability from a press-molded glass molded body. In addition, crystal growth is suppressed and film roughness is suppressed. That is, platinum-
Nickel alloy (platinum 50wt% or more, Nickel 5~
45wt%) contains carbides, specifically TiC, TaC,
By dispersing B 4 C, SiC, HfC, ZrC, VC, etc., it is possible to particularly improve the mold releasability from the glass molded product and maintain surface precision.
The reason for setting the dispersion amount to 0.02 to 30 vol% is because if the carbide content is less than 0.02 vol%, the hardness will be low and scratches will easily occur, and the dispersion effect will be sufficient to suppress crystal growth and prevent film roughness. On the other hand, if it exceeds 30 vol%, the mold releasability from the glass molded article will deteriorate. Further, the intermediate layer has the effect of increasing the affinity between the base and the surface layer and extending the life of the mold. (Example) FIG. 1 is a sectional view of a mold showing an example of the present invention. The mold is composed of an upper mold 1 and a lower mold 2. The upper mold 1 and the lower mold 2 are arranged inside the guide mold 3 so that their respective outer peripheral surfaces slide on the inner peripheral surface of the guide mold 3. These upper mold 1 and lower mold 2 each consist of a base 1a and a surface layer 1b, a base 2a and a surface layer 2b, and the surface layer 1b,
2b are arranged facing each other. The bases 1a and 2a are made of tungsten carbide made dense by HIP treatment during sintering, processed into a cylinder (diameter 18 mm, height 28 mm), one end surface of which is ground into a concave spherical shape, and the final As a finishing touch, they were polished to a high-precision optical mirror surface using a diamond grindstone, and each was processed into a concave spherical surface with a predetermined radius of curvature (32 mm). The surface roughness of this concave spherical surface was 100 Å or less. The concave spherical surfaces of the substrates 1a and 2b were coated with surface layers 1b and 2b of a predetermined thickness under predetermined film forming conditions using a sputtering device and using targets having the material compositions of Examples 1 to 21 shown in the table. was formed. In addition, in that case, the bases 1a, 2a and the surface layers 1b, 2b
In order to further strengthen the adhesion with the surface layer 1
It is effective to clean the surfaces of the substrates 1a and 2a by reverse sputtering prior to forming the films b and 2b. For example, in Example 1, the argon gas pressure is 1×
10 -3 Torr, platinum-nickel 5wt as target
%, DClkw, deposition rate 500 Å/min, titanium carbide as a target, RF 400 W, deposition rate 5 Å/min (dispersion amount 1 vol%), distance between electrodes 100
The film thickness was 0.5 μm. In addition, in this example, we have described binary sputtering in which separate targets of platinum-nickel and titanium carbide are sputtered at the same time, but a composite target is used in which two types of targets are arranged in a mosaic pattern and the dispersion is adjusted by the area ratio. It is okay to do so. Furthermore, the target itself may be decentralized. In any case, the sputtering rate of each is taken into account when combining them. In this embodiment, the guide mold 3 is made of tungsten carbide, similar to the bases 1a and 2a of the upper and lower molds. FIG. 2 is a sectional view of a mold showing another embodiment of the present invention. The upper mold 1' and the lower mold 2' of this example have a first intermediate layer 1c, a second intermediate layer 1d, and a This differs from the upper mold 1 and the lower mold 2 shown in FIG. 1 in that a first intermediate layer 2c and a second intermediate layer 2d are interposed therebetween, but the other structures are the same. Although two intermediate layers are illustrated, the intermediate layer may include only one layer or three or more layers. Examples 11-13, 16-19 and examples with only one intermediate layer are shown in the table.
21, and an example in which the middle layer is two layers is shown as an example.
Shown as 14, 15 and 20. For example, in Example 11, these intermediate layers and surface layers are formed by ion etching the substrates 1a and 2a and then by ion plating under predetermined film forming conditions (degree of vacuum 5×10 -5 Torr, film forming rate 300 Å). /
min, base voltage -300V) and the first one is made of titanium.
After forming the intermediate layers 1c and 2c (film thickness 0.05 μm),
On top of that, platinum (95wt%) is added by sputtering method.
- Surface layers 1b and 2b (thickness: 3.0 μm) were formed using 5 wt% nickel and titanium carbide (TiC) as targets under the predetermined film forming conditions (described above). In Example 20, after ion etching the substrates 1a and 2a, the ion plating method was applied to the concave spherical surfaces of the substrates under predetermined film forming conditions (nitrogen gas pressure of 5×10 -4 Torr, film forming rate of 300 Å). /min,
Second intermediate layers 1d and 2d (film thickness: 0.3 μm) made of titanium nitride were formed at a substrate voltage of −300 V). Next, a sputtering method was used to form a film under predetermined film forming conditions (argon gas pressure 1×10 -3 Torr, film forming speed
400 Å/min) and the first intermediate layer 1 made of nickel.
c, 1c (film thickness 0.05μm) was formed into a film, and then platinum (80wt%)-nickel (10wt%) was formed using the same method.
%)-iridium (10 wt%) as an alloy and titanium carbide (TiC) as targets, surface layers 1b and 2b (film thickness 1.0 μm) were formed under the predetermined film forming conditions (described above). In other Examples, the intermediate layer and surface layer were formed by substantially the same method as these.
【表】
次にこのような成形型の使用方法を、第1図の
成形型を例に説明する。
第3図は、プレス成形機の主要部を示す断面図
である。このプレス成形機は上述した上型1、下
型2および案内型3を備え、下型2の上に被成形
ガラス4が置かれる。これらの型1,2,3は、
断面H字状のステンレス鋼からなる保持具5を介
して、同じくステンレス鋼からなる支持台6で支
持されている。7はステンレス鋼からなる押し棒
で、これらを石英管8の内部に収容し、外周に配
置した誘導加熱コイル9により型1,2,3およ
び被成形ガラス4を加熱し、押し棒7を上型1の
頭部に下降させて、被成形ガラス4をプレス成形
する。温度制御は、下型2の内部に配設した熱電
対10により型温度を測定して行なう。次に、そ
の具体例を説明する。
被成形ガラス4として、ガラス組成がwt%で
SiO2:27.8、Al2O3:2.0、Na2O:1.8、K2O:
1.2、PbO:65.2、TiO2:2.0である重フリント系
光学ガラス(転移温度435℃)を直径10mmの球状
のガラス塊に加工したものを使用し、N2ガラス
雰囲気中、型温度500℃で圧力40Kg/cm2を30秒間
加えた。その後、圧力を解き、プレス成形された
ガラス成形体を、上型1および下型2と接触させ
た状態のまま上記転移温度まで徐冷し、次いで室
温まで急冷して、両凸球面レンズに成形されたガ
ラス成形体を成形型から取出す。
以上のプレス成形法は、第2図に示した成形型
でも同様に行なわれる。そして、第3図のプレス
成形機において、実施例1〜21の表面層ないし中
間層を有する上・下型を用いて、上述したと同様
の条件で上記重フリント系ガラスの成形をそれぞ
れ1000回ずつ繰り返して行なつた。その結果、い
ずれの実施例の型についても、ガラス成形体は型
との離型性が良好で、型との接触面において化学
反応した様子が認められず、ガラス成形体と上・
下型表面層の面精度および鏡面は当初の状態が維
持され、ガラス成形体の面精度は100Å以下であ
り、透明度も良好であつた。
比較のため、表面層として白金−ロジウムおよ
び白金−イリジウムの各合金のコーテイング膜を
それぞれ形成した成形型を使用し、上述した実施
例と同様にプレス成形を行なつたところ、最初の
プレス成形時からガラス成形体と成形型との離型
性が悪く、相互の接触面において化学反応した様
子が認められた。
以上、成形型の表面層形状が凹球面のものにつ
いて示したが、本発明はこのような形状に制限を
加えるものではなく、凸球面、非球面、平面等、
何でもよい。
また、中間層は、上述した各実施例において用
いた物質を主成分とするものであれば、その効果
を奏し、他の物質として例えば白金、イリジウ
ム、ロジウム、金、モリブデンもしくはニツケル
等を含有したものであつてもよい。
さらに、被成形ガラスとしては、比較的化学反
応を起こしやすい重フリント系光学ガラスを使用
して良好な結果が得られたことから、他の光学ガ
ラスについても、本発明の型を用いた成形が行な
えることはいうまでもない。
なお、本発明の型の表面層は成膜およびプレス
成形時において酸化されることがあるが、酸化さ
れても使用に支承はない。
また、表面層上にさらに何らかの被覆層を形成
し、表面層と被成形ガラスとの間に被覆層を介在
させるようにしてもよい。
(発明の効果)
本発明によれば、成形型の表面層を、白金とニ
ツケルの少なくとも2成分からなる物質に炭化物
が分散されて形成されていることにより、緻密
性、硬度および強度、耐化学反応性ならびに、結
晶成長を抑える事による面精度の保持性のそれぞ
れにおいて良好な結果が得られるとともに、ガラ
ス成形体との離型性も向上する。[Table] Next, how to use such a mold will be explained using the mold shown in FIG. 1 as an example. FIG. 3 is a sectional view showing the main parts of the press molding machine. This press molding machine includes the above-mentioned upper die 1, lower die 2, and guide die 3, and a glass to be formed 4 is placed on the lower die 2. These types 1, 2, and 3 are
It is supported by a support base 6 also made of stainless steel via a holder 5 made of stainless steel and having an H-shaped cross section. Reference numeral 7 denotes a push rod made of stainless steel. These are housed inside a quartz tube 8, and the molds 1, 2, 3 and the glass to be formed 4 are heated by an induction heating coil 9 arranged on the outer periphery. It is lowered to the head of the mold 1, and the glass to be formed 4 is press-molded. Temperature control is performed by measuring the mold temperature with a thermocouple 10 disposed inside the lower mold 2. Next, a specific example will be explained. As the glass to be formed 4, the glass composition is wt%.
SiO2 : 27.8, Al2O3 : 2.0, Na2O : 1.8, K2O :
1.2, PbO: 65.2, TiO 2 : 2.0 heavy flint optical glass (transition temperature 435°C) was processed into a spherical glass lump with a diameter of 10 mm, and mold temperature was 500°C in an N 2 glass atmosphere. A pressure of 40 Kg/cm 2 was applied for 30 seconds. After that, the pressure is released, and the press-molded glass molded body is slowly cooled to the above transition temperature while in contact with the upper mold 1 and the lower mold 2, and then rapidly cooled to room temperature and formed into a biconvex spherical lens. The glass molded body thus formed is taken out from the mold. The above press molding method is similarly performed using the mold shown in FIG. Then, in the press molding machine shown in FIG. 3, the heavy flint glass was molded 1000 times under the same conditions as described above using the upper and lower molds having the surface layer or intermediate layer of Examples 1 to 21. I did it over and over again. As a result, for all molds of Examples, the glass molded product had good releasability from the mold, and no chemical reaction was observed on the contact surface with the mold.
The surface precision and mirror surface of the lower mold surface layer were maintained in their original state, and the surface precision of the glass molded body was 100 Å or less, and the transparency was also good. For comparison, press forming was carried out in the same manner as in the above-mentioned example using molds in which coating films of platinum-rhodium and platinum-iridium alloys were formed as surface layers. The mold release properties between the glass molded body and the mold were poor, and it was observed that a chemical reaction occurred at the mutual contact surfaces. Although the shape of the surface layer of the mold is described above as a concave spherical shape, the present invention is not limited to such a shape, and may be formed with a convex spherical surface, an aspherical surface, a flat surface, etc.
Anything is fine. In addition, the intermediate layer has the same effect as long as it contains the substance used in each of the above-mentioned examples as a main component. It can be something. Furthermore, since good results were obtained using heavy flint optical glass, which is relatively easy to cause chemical reactions, other optical glasses can also be molded using the mold of the present invention. It goes without saying that it can be done. Note that the surface layer of the mold of the present invention may be oxidized during film formation and press molding, but even if it is oxidized, there is no support for use. Moreover, some kind of coating layer may be further formed on the surface layer, and the coating layer may be interposed between the surface layer and the glass to be formed. (Effects of the Invention) According to the present invention, the surface layer of the mold is formed by dispersing carbide in a substance consisting of at least two components, platinum and nickel, which improves density, hardness, strength, and chemical resistance. Good results can be obtained in both reactivity and retention of surface precision by suppressing crystal growth, and the mold releasability from the glass molded body is also improved.
第1図は本発明の一実施例を示す成形型の断面
図、第2図は本発明の他の実施例を示す断面図、
第3図はプレス成形機の構成例を示す断面図であ
る。
1,1′……上型、1a,2a……基盤、1b,
2b……表面層、1c,1d,2c,2d……中
間層、2,2′……下型。
FIG. 1 is a sectional view of a mold showing one embodiment of the present invention, FIG. 2 is a sectional view showing another embodiment of the present invention,
FIG. 3 is a sectional view showing an example of the configuration of a press molding machine. 1, 1'...Upper mold, 1a, 2a...Base, 1b,
2b... surface layer, 1c, 1d, 2c, 2d... middle layer, 2, 2'... bottom mold.
Claims (1)
レス成形により被成形ガラスに転写されてガラス
成形体を成形する成形型において、表面層が、白
金(Pt)とニツケル(Ni)の少なくとも2成分
からなる物質に炭化物が分散されて形成されてい
ることを特徴とするガラス成形体の成形型。 2 表面層が白金(Pt)を主成分とし、ニツケ
ル(Ni)を5〜45wt%含有する少なくとも2成
分からなる物質に炭化物が分散されて形成されて
いることを特徴とする特許請求の範囲第1項に記
載の成形型。 3 炭化物がTiC、TaC、B4C、SiC、HfC、
ZrC、VCより選ばれた少なくとも一つからなる
もので、0.02〜30vol%分散されて形成されてい
ることを特徴とする特許請求の範囲第1項または
第2項に記載の成形型。 4 基盤と表面層との間に中間層を備え、その中
間層が、ニツケル(Ni)、チタン(Ti)、クロム
(Cr)、モリブデン(Mo)、コバルト(Co)、チタ
ンナイトライド(TiN)、チタンカーバイド
(TiC)、シリコンカーバイド(SiC)およびこれ
らの混合物から選ばれた少なくとも一つを含む物
質で形成されていることを特徴とする特許請求の
範囲第1項、第2項または第3項に記載の成形
型。[Scope of Claims] 1. A mold comprising a base and a surface layer, in which the shape of the surface layer is transferred to the glass to be molded by press molding to form a glass molded article, the surface layer comprising platinum (Pt) and nickel ( A mold for a glass molded article, characterized in that the mold is formed by dispersing carbide in a substance consisting of at least two components of Ni). 2. Claim No. 2, characterized in that the surface layer is formed by dispersing carbides in a substance consisting of at least two components, the main component of which is platinum (Pt) and 5 to 45 wt% of nickel (Ni). The mold according to item 1. 3 Carbide is TiC, TaC, B 4 C, SiC, HfC,
The mold according to claim 1 or 2, characterized in that the mold is made of at least one selected from ZrC and VC and is dispersed at 0.02 to 30 vol%. 4 An intermediate layer is provided between the base and the surface layer, and the intermediate layer is made of nickel (Ni), titanium (Ti), chromium (Cr), molybdenum (Mo), cobalt (Co), titanium nitride (TiN). , titanium carbide (TiC), silicon carbide (SiC), and a mixture thereof. The mold described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27090287A JPH01111734A (en) | 1987-10-27 | 1987-10-27 | Molding die for molded glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27090287A JPH01111734A (en) | 1987-10-27 | 1987-10-27 | Molding die for molded glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01111734A JPH01111734A (en) | 1989-04-28 |
| JPH0424293B2 true JPH0424293B2 (en) | 1992-04-24 |
Family
ID=17492575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27090287A Granted JPH01111734A (en) | 1987-10-27 | 1987-10-27 | Molding die for molded glass |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01111734A (en) |
-
1987
- 1987-10-27 JP JP27090287A patent/JPH01111734A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01111734A (en) | 1989-04-28 |
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