JPH0426544B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a semiconductor device, and particularly to a semiconductor device constructed by wire bonding a semiconductor element die-bonded onto a substrate and a post.

(Prior Art) In a semiconductor device consisting of a semiconductor element such as a semiconductor chip or an integrated circuit, the semiconductor element is die-bonded onto a substrate, and the post on the substrate and the bonding pad of the semiconductor element are connected with a wire such as a gold wire. It is well known that wires are connected to each other by wire bonding.

On the other hand, in this type of semiconductor device, in order to increase the density of the semiconductor element, the pitch of the bonding pads is small, and in some cases, they are arranged in a staggered manner.
The posts on the board are arranged in a staggered manner (see Japanese Utility Model Application Publication No. 107844/1983). However, when the posts are arranged in a staggered manner as described above, there is a risk that the wires and the leads may come into contact with each other when a positional shift occurs during die bonding of a semiconductor element.

To explain this with reference to the drawings, in FIG. 4, 1 is a substrate, 2 is a semiconductor element, and a plurality of bonding pads 3 are installed on this semiconductor element. Bonding part 3 shown
are arranged in a staggered manner. 4 is a first row of posts; 5 is a second row of posts; the first row of posts are arranged to face the semiconductor element 2;
The columns are arranged further away from the semiconductor element 2 than the first column. Note that each post is installed on the substrate 1.

The posts in each row are arranged in a staggered manner by alternating each other. 6 is a lead connected to each post 4 in the first row, 7 is a lead connected to each post 5 in the second row, and 8 is a lead connected to each post 4 in the first row and each bonding pad 3 in one row. wire, 9
are wires connecting the posts 5 in the second row and each bonding pad in the other rows, all of which are wire-bonded.

If the semiconductor element 2 is die-bonded to a specified location on the substrate 1, there will be no problem. In other words, in this case, each bonding pad 3 and the posts 4 and 5 connected thereto face each other correctly as shown in FIG. There is no way to cross that lead of 6.

However, if the semiconductor element 2 is die-bonded at a position shifted from the specified position, the wire 9 connected to the post 5 in the second row will straddle the post or its lead 6 in the first row, as shown in FIG. It becomes like this. Usually, this type of wire is stretched so as to hang down between the bonding pad and the post, as shown in FIG. 2, which will be described later. Therefore, the wire 9 connected to the second row of posts 5 hangs down, and the wire 9 straddles the first row of posts 4 or the lead 6 connected thereto.
may come into contact with.

(Problems to be Solved by the Invention) It is an object of the present invention to reliably avoid accidents caused by contact between wires connecting a semiconductor element and a post using a simple configuration.

(Means for Solving the Problems) This invention provides an insulating layer between a first row of posts and a second row of posts on a substrate so as to cover the leads connected to the posts of the first row. It is characterized by what it did.

This invention will be explained using figures. Note that parts given the same reference numerals as in FIG. 4 indicate the same or corresponding parts. As can be understood from the configuration of FIG.
An insulating layer 10 is installed between the rows of. This insulating layer 10 is placed so as to cover the leads 6 connected to the posts 4 in the first row.

(Operation) FIG. 1 shows a state in which the semiconductor element 2 is die-bonded at a prescribed position on the substrate 1, and at this time, the wires 8 and 9 are parallel to each other. Therefore, each wire never passes over the posts 4, 5 and the leads 6, 7 connected thereto.

However, if the semiconductor element 2 is die-bonded at a position shifted from the specified position as shown in FIG. Therefore, the wire 9 is supported by the surface of the insulating layer 10 and does not hang down beyond the surface. Since this insulating layer 10 covers the leads 6 connected to the posts 4, the wires 9 do not come into contact with the posts 4 or even the leads 6. Furthermore, even if the die bonding position of the semiconductor element shifts, contact of the wire can be prevented, so that the accuracy of the die bonding position can be made looser.

(Effects of the Invention) As described in detail above, according to the present invention, an insulating layer is provided between the posts of the first row and the posts of the second row, thereby making it possible to separate the bonding pads of the semiconductor element. It is possible to easily prevent the wires heading toward the posts from coming into contact with the posts in the second row or the leads connected thereto, and there is also no need to make the die bonding position of the semiconductor element highly accurate. In terms of process control, the acceptance criteria can be certified more leniently, which has the effect of improving the yield of the process and increasing productivity.

[Brief explanation of drawings]

Figure 1 is a plan view showing an embodiment of the invention, Figure 2 is a plan view showing an embodiment of the invention.
The figure is a sectional view of the same, and Figure 3 is a plan view showing the operating state.
FIG. 4 is a plan view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Semiconductor element, 3... Bonding pad, 4... First column post, 5...
Second row posts, 6, 7... Leads, 8, 9...
...Wire.

Claims (1)

[Claims] 1. In a semiconductor device in which bonding pads of a semiconductor element and posts on a substrate are connected by wires, the posts are arranged in a first row along the semiconductor element side, and the posts are connected from the semiconductor element in the first row. and a second row arranged at a distance from each other and arranged in a staggered manner with respect to the first row of posts, and between the first and second row of posts. and an insulating layer covering the leads connected to the posts in the first row.