JPH0426786B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a full-wave rectifier to be mounted on a vehicle such as a motorcycle.

[Conventional technology]

As shown in Fig. 16, a conventional three-phase full-wave rectifier mounted on a motorcycle includes a heat dissipation board 1 made of die-cast Al, an insulating layer 2 made of epoxy resin, and a strip-shaped metal piece 3 made of Ni-coated Cu material. ,
It consists of a rectifying element 4 and a sealing material 5 made of epoxy resin. The rectifying element 4 has a silicon diode chip 6 fixed to the band-shaped metal piece 3 with solder (not shown), and a lead wire 7 made of a Ni-coated Cu material fixed to the silicon diode chip 6 with solder (not shown). It is constructed by covering a portion of the silicon diode chip 6 with a protective resin 8 made of silicon rubber. Two rectifier elements 4 with different polarities are fixed to one strip-shaped metal piece 3 to form a rectifier 9, which is not shown in the figure.
Three rectifiers 9 are arranged in parallel. 10 is
A connecting piece made of Ni-coated Cu material connects the lead wires 7 so as to bridge the parallel flow regulators 9. As a result, a three-phase full-wave rectifier circuit is constructed.

When assembling this three-phase full-wave rectifier, the 17th
As shown in the figure, after creating the flow regulator 9 separately,
The uncured slimy epoxy resin 2a is coated on the heat dissipation board 1, and the strip metal piece 3 is lightly pressed onto the epoxy resin 2a and heated.
harden. The insulating layer 2 formed by curing the epoxy resin 2a not only adheres the rectifier 9 to the heat dissipating substrate 1, but also electrically insulates them.

[Problem that the invention seeks to solve]

By the way, if the insulating layer 2 formed by the method described above is made too thin, the insulation properties will be reduced due to the effects of air bubbles remaining in the insulating layer 2. For this reason, the insulating layer 2 is actually formed to a thickness of about 300 μm, and it is difficult to make it thinner than this because the insulation properties will be impaired.

As a result, the thermal resistance of the insulating layer 2 becomes considerably large in the path through which the heat generated by the silicon diode chip 6 is transmitted to the heat dissipation substrate 1. The heat dissipation efficiency from the heat dissipation board 1 to the atmosphere is reduced due to the large thermal resistance of the insulating layer 2.
This is compensated for by using a large heat dissipation board 1 to provide the desired heat dissipation ability. Therefore, it is not possible to satisfactorily meet the demands for smaller and lighter full-wave rectifiers.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a method for easily manufacturing a full-wave rectifier with good heat dissipation.

[Means for Solving the Problems] The present invention for achieving the above object will be described with reference to the reference numerals in the drawings showing the embodiments.
A heat dissipation substrate 11 having a metal thin film 14 that is easy to solder formed on one main surface of the heat dissipation substrate 11 through an insulating layer 13 is prepared, and by partially removing the metal thin film 14 of the heat dissipation substrate 11, electrical connection between A plurality of island-shaped metal thin films 14b separated from each other are formed, and a plurality of metal pieces 17 that are thicker than the metal thin film 14 and easier to solder are prepared separately from the heat dissipation substrate 11, and the plurality of metal pieces 17 are prepared separately from the heat dissipation substrate 11. One electrode of the first rectifying element 18 of positive polarity and one electrode of the second rectifying element 19 of opposite polarity are each soldered onto one main surface of the plurality of metal pieces 17. The surfaces of the plurality of metal thin films 14b are soldered to each other, and the other electrodes of the first rectifying elements 18 of the plurality of metal pieces 17 are connected to each other to form one DC output terminal, and the plurality of metal A full-wave rectifier for vehicle mounting, characterized in that the other electrodes of the second rectifier elements 19 of the pieces 17 are connected to each other to provide the other DC output terminal, and the plurality of metal pieces 17 are used as AC input terminals. This relates to the method of manufacturing the device.

[Actions and Effects of the Invention] The following effects can be obtained by the present invention.

(b) A plurality of metal foils cut into desired shapes are cut into metal plate 1.
2 with an insulating adhesive, a metal thin film is commonly formed on the metal plate 12 and then partially removed to form a plurality of island-shaped metal thin films 14b that are electrically isolated from each other. The plurality of island-shaped thin metal films 14b can be electrically separated from the metal plate 12 by the relatively thin insulating layer 13 that has little deterioration in heat dissipation. Therefore, it is possible to easily provide a rectifier with good heat dissipation.

(b) Since the metal piece 17 is not fixed to the metal plate 12 with an insulating adhesive but soldered to the island-like metal thin layer 14b, a decrease in heat dissipation due to the metal piece 17 being fixed can be prevented.

(c) A first rectifying element 18 of positive polarity and a second rectifying element 19 of opposite polarity are connected to the plurality of metal pieces 17, respectively, and these are used as AC input terminals, so that the first and second rectifying elements It becomes possible to have a plurality of metal pieces 17 with 18 and 19 in the same configuration,
Manufacturing becomes easier.

〔Example〕

Next, a method of manufacturing a three-phase full-wave rectifier to be mounted on a motorcycle according to an embodiment of the present invention will be described with reference to FIGS. 1 to 14.

First, a large-area heat dissipation substrate 11 shown in FIG. 2 is manufactured. As shown in FIG. 3, the cross-sectional structure of the heat dissipation board 11 has a three-layer structure including a metal plate 12 made of Al material, an insulating layer 13 made of epoxy resin, and a metal thin film 14 made of Cu material. To create this three-layer structure, as shown in FIG. 4, an epoxy resin film 13 is placed on a metal plate 12 in a reduced pressure atmosphere.
The Cu foil 14a is stacked on top of the Cu foil 14a via a, and the entire surface of the Cu foil 14a is heated while being lightly pressed. The epoxy resin film 13a is once melted and then thermally hardened to become the insulating layer 13, which adheres the metal plate 12 and the metal thin film 14 and electrically insulates them. At this time, unlike the conventional case shown in FIG. 16, the slimy epoxy resin 2a is not locally pressed and thinned by the band-shaped metal piece 3, so that the thickness of the epoxy resin film 13a is The epoxy resin directly forms the thickness of the insulating layer 13. The epoxy resin film 13a can be obtained with a thin, uniform thickness and good insulation properties. Therefore, these advantages of the epoxy resin film 13a are inherited by the insulating layer 13, and the insulating layer 13 is formed, for example, with a thickness of 80 μm and having no problems in both adhesion and insulation.

In addition, in order to produce the heat dissipation board 11, the metal plate 1
Form an epoxy resin layer on 2 by a printing method,
On top of that, Cu is etched using high-frequency ion brating method.
There are also methods of forming layers. In any case,
If the heat dissipation substrate 11 is produced as a three-layer structure of the metal plate 12 - the insulating layer 13 - the metal thin film 14, the insulating layer 13 can be made much thinner than the insulating layer 2 of the conventional example without impairing the insulation properties. can.

Next, as shown in FIG. 5, the thin metal layer 14 is partially etched away, leaving three separate strip-shaped thin metal layers 14b in parallel for one full-wave rectifier.

Next, as shown in FIGS. 6 and 7, this large-area heat dissipation board 11 is cut and the full-wave rectifier 1 is
A heat dissipating substrate 11a having the same size as the individual heat dissipating substrates 11a is produced. 15 is a mounting hole. Incidentally, the thin metal layer 14 may be partially etched after being disassembled into the heat dissipating substrate 11a.

On the other hand, apart from the fabrication of the heat dissipation substrate 11a, three rectifiers 16 shown in FIGS. 8 and 9 are fabricated for each full-wave rectifier, 17 is a band-shaped metal piece made of Ni-coated Cu material, 18, 19 is a rectifying element, 20 is a thyristor, and their polarities are as shown in FIG. The rectifying elements 18 and 19 are made by fixing silicon diode chips 21 and 22 to the strip metal piece 17 with solder (not shown), and connecting lead wires 2 made of Ni-coated Cu material to the silicon diode chips 21 and 22.
3 and 24 are fixed with solder (not shown), and the silicon diode chips 21 and 22 are further covered with protective resin 25 and 26 made of silicone rubber. The thyristor 20 is similarly constructed by fixing a thyristor chip 27, fixing a lead wire 28, and covering it with a protective resin 29. The thyristor 20 has a thin Ag wire 30 fixed to the thyristor chip 27 to serve as a gate electrode lead.

FIG. 1 shows how the heat dissipation substrate 11a and three rectifiers 16, which were prepared separately as described above, are integrated. Each of the three flow regulators 16 is fixed to each of the three band-shaped thin metal layers 14b by solder (not shown), as shown in FIG. 10. Note that the solder for fixing the flow regulator 16 is preferably a soft solder having a melting point of 400° C. or less.

Next, as shown in FIG. 11, wiring and the like are performed to configure a three-phase full-wave rectifier circuit. 31 is a hybrid in which a control circuit for the thyristor 20 is configured.
Since it is an IC board, its details will be omitted. 32 is a connecting piece for commonly connecting three lead wires 23 of the rectifying element 18. Reference numeral 33 denotes a connection piece for commonly connecting three lead wires 24 of the rectifying element 19 and three lead wires 28 of the thyristor 20, six in total. Each connecting piece 32, 33 is made of Ni-coated Cu material. Reference numerals 34, 35, and 36 are connection wires made of insulator-coated Cu wires connected to the band-shaped metal piece 17, respectively. Reference numerals 37 and 38 are connection wires connected to the connection pieces 32 and 33, respectively. Reference numerals 39 and 40 are connection lines that connect the connection pieces 32 and 33 to the hybrid IC board 31, respectively. Thyristor 20
A thin wire 30, which is a gate electrode lead, is connected to a hybrid IC substrate 31. These connections are
All are fixed by solder (not shown).

Finally, a case 41 made of epoxy resin is fixed to the heat dissipation board 11a with an epoxy adhesive (not shown), and a sealing resin 42 made of epoxy resin is filled inside the case 41, as shown in FIGS. 12 and 13. Complete the full-wave rectifier shown in .

FIG. 14 is a circuit diagram of this full-wave rectifier. Connection wires 34, 35, 36 are AC input terminals,
Three-phase alternating current from an alternator is input to these. Connection lines 37 and 38 are DC output terminals and are connected to a battery. The circuit consisting of the thyristor 20 and the hybrid IC board 31 is added to prevent overcharging of the battery. In other words, when the battery becomes overcharged, the hybrid IC 31 detects this and switches the thyristor 20 to 3.
They are both electrically connected, and the DC output from the connection lines 37 and 38 is stopped.

Note that when adopting a method of stopping the power generation of the generator to prevent overcharging, the thyristor 20 is not necessary, so the number of the strip metal thin layer 14b and the flow regulator 16 is usually two. That is,
Three rectifying elements 18 in FIG. 14 are formed on a band-shaped metal piece 17 to produce one rectifier 16,
Another rectifier 16 is made by forming three rectifying elements 19 on another strip-shaped metal piece 17, and these two
Each of the rectifying fluids 16 is fixed to the strip metal thin layer 14b. In this case, the strip metal piece 17 is on the DC output terminal side, and the three sets of connection pieces connecting the lead wires 23 and 24 are on the AC input terminal side. However, with regard to the present invention, these differences in circuit layout are not essential differences.

The full-wave rectifier manufactured in this manner has thermal resistance between the rectifying elements 18, 19, the thyristor 20, and the heat dissipation substrate 11a because the insulating layer 13 is formed much thinner than the conventional insulating layer 2. is small, and the efficiency of heat dissipation from the metal plate 12 is high.
Therefore, even if this full-wave rectifier is used without being attached to an external heat radiator as in the conventional case, the heat capacity of the heat radiating board 11a needs to be considerably smaller than that of the conventional heat radiating board 1. Moreover, if this feature is utilized and some of the constituent members of the motorcycle are used as an external heat radiator, the heat radiating board 11a itself may be sufficient to maintain the strength of the full-wave rectifier.
For example, it is sufficient if the metal plate 12 is an Al plate with a thickness of 2 mm. If the metal plate 12 is thin, it is possible to press the heat dissipation board 11, so even if there is a request to change the planar shape of the heat dissipation board 11a, it can be easily accommodated compared to conventional die-cast products.

FIG. 15 shows an example in which a starter motor is selected as a component of a motorcycle and a full-wave rectifier is attached to its side case cover. 43 is a starter motor, 44 is a fuselage case made of Al material,
45 and 46 are side case covers made of Fe material;
47 is the end of the shaft that transmits the rotational force of the motor, and 48 is the full-wave rectifier connected to the side case cover 45.
This is the mounting screw that is fixed to the

[Brief explanation of drawings]

1 is a sectional view showing the assembly of a full-wave rectifier according to an embodiment of the present invention, FIG. 2 is a perspective view of a heat dissipation board, FIG. 3 is a partial sectional view of the heat dissipation board of FIG. The figure is a cross-sectional view showing the method for manufacturing the heat sink, FIG. 5 is a perspective view showing the heat sink with a thin metal layer etched, FIG. 6 is a perspective view showing the heat sink after cutting, and FIG. 7 is the same as the one shown in FIG. FIG. 8 is a perspective view showing the flow regulator; FIG. 9 is a perspective view showing the - line sectional view of FIG. 8; FIG. The figure is a perspective view showing the full-wave rectifier before exterior packaging, Figure 12 is a perspective view showing the full-wave rectifier after exterior packaging, and Figure 13 is the same as in Figure 12.
Line sectional view, Figure 14 is a circuit diagram of a full wave rectifier,
Fig. 15 is a side view showing a state in which a full-wave rectifier is attached to a starting motor of a motorcycle, Fig. 16 is a sectional view showing a conventional full-wave rectifier, and Fig. 17 is a cross-sectional view of the full-wave rectifier shown in Fig. 16. It is a sectional view showing an assembly method. 11a... Heat dissipation board, 12... Metal plate, 13...
...Insulating layer, 14b... Metal thin layer, 16... Rectifier, 17... Metal piece, 18, 19... Rectifying element,
20...thyristor.

Claims (1)

[Scope of Claims] 1. Prepare a heat dissipation substrate 11 on which a metal thin film 14 that can be easily soldered is formed on one main surface of a metal plate 12 via an insulating layer 13, and partially remove the metal thin film 14 of the heat dissipation substrate 11. By removing the metal thin film 14b separately from the heat dissipation substrate 11, a plurality of island-shaped metal thin films 14b are formed which are electrically isolated from each other.
A plurality of metal pieces 17 that are thicker and easier to solder are prepared, and one electrode of the first rectifying element 18 of positive polarity and a second electrode of opposite polarity are placed on one main surface of the plurality of metal pieces 17. one electrode of the rectifying element 19 is soldered to each other, the other main surface of the plurality of metal pieces 17 is soldered to each of the plurality of island-shaped metal thin films 14b, and the first rectification of the plurality of metal pieces 17 is performed. Element 1
8 are connected to each other to provide one DC output terminal, and the second rectifying element 1 of the plurality of metal pieces 17
A method of manufacturing a full-wave rectifier for vehicle mounting, characterized in that the other electrodes of the two electrodes 9 are connected to each other to provide the other DC output terminal, and the plurality of metal pieces 17 are used as AC input terminals.