JPH0428457B2 - - Google Patents
Info
- Publication number
- JPH0428457B2 JPH0428457B2 JP12129983A JP12129983A JPH0428457B2 JP H0428457 B2 JPH0428457 B2 JP H0428457B2 JP 12129983 A JP12129983 A JP 12129983A JP 12129983 A JP12129983 A JP 12129983A JP H0428457 B2 JPH0428457 B2 JP H0428457B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone
- sio
- mold release
- varnish
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C1/00—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds
- B22C1/02—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by additives for special purposes, e.g. indicators, breakdown additives
- B22C1/14—Compositions of refractory mould or core materials; Grain structures thereof; Chemical or physical features in the formation or manufacture of moulds characterised by additives for special purposes, e.g. indicators, breakdown additives for separating the pattern from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22C—FOUNDRY MOULDING
- B22C3/00—Selection of compositions for coating the surfaces of moulds, cores, or patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mold Materials And Core Materials (AREA)
Description
本発明は鋳型製造時に鋳物砂と木型等の鋳枠の
離型が容易な鋳型用離型剤組成物に関するもので
ある。
更に本発明は塗膜乾燥後のベタツキのない離型
持続性に優れた鋳型用離型剤を提供するものであ
る。
従来より鋳型用離型剤として油脂類、パラフイ
ンワツクス、シリコーン等の撥水性物質をベース
とした組成物が使用されている。特にシリコーン
系離型剤はその優れた離型効果の為に広く使用さ
れている。しかし一般にシリコーン系離型剤とし
てはシリコーンオイルが多く、離型性は優れてい
るが、塗布後鋳枠運搬時等に指に付着して剥離し
たり、塗布一回当りの使用回数が小さい等の耐久
性に難点があつた。
かかる問題点に対して特開昭52−17323、17324
号公報により硬化性シリコーンを用いて離型持続
性の優れた離型剤が提供されているが、組成物中
のシリコーン分が多く高価であり、また枠表面上
のシリコーン分が多い為有機金属塩や酸を添加し
て架橋させてやらないとベタツキが残る等使用サ
イクルの極めて大きい枠でないと不経済である。
本発明者はかかるシリコーン系鋳型用離型剤の
欠点を改良すべく種々検討した結果、シリコーン
樹脂としてシリコーンオイルとシリコーン樹脂ワ
ニスの混合物を用い、更にこれに無機粉末を適量
同時に添加させることで離型効果に優れ、且つ剥
離しにくく離型持続性の大きな鋳型用離型剤を見
い出し本発明に到達した。
即ち、本発明は無機粉末５〜30重量部、有機系
溶剤50〜94重量部およびシリコーンオイルとシリ
コーン樹脂ワニスの重量比が９：１〜１：９であ
るシリコーン樹脂１〜20重量部からなり、ベタツ
キがなく離型持続性の大きな鋳型用離型剤を提供
するものである。
本発明におけるシリコーン樹脂ワニスとしては
式〔〕の如き構造をもつSiO2，CH3SiO3/2，
（CH3）2SiO，（CH3）3SiO1/2の構造単位からなる
共重合体であるメチルシリコーンワニス或いは
CH3SiO3/2，（CH3）2SiO，C6H5SiO3/2，（C6H5）
（CH3）SiO，（C6H5）2SiOの構造単位からなる共
重合体であるフエニルメチルシリコーンワニスが
好ましい。
式〔〕
TECHNICAL FIELD The present invention relates to a mold release agent composition for molds, which facilitates the release of mold sand from a mold such as a wooden mold during mold production. Furthermore, the present invention provides a mold release agent for molds that is free from stickiness after the coating film dries and has excellent mold release durability. Conventionally, compositions based on water-repellent substances such as oils and fats, paraffin waxes, and silicones have been used as mold release agents for molds. In particular, silicone mold release agents are widely used because of their excellent mold release effects. However, silicone oil is generally used as a silicone-based mold release agent, and although it has excellent mold release properties, it sometimes sticks to fingers and peels off when transporting the mold after application, and the number of times it can be used per application is small. There was a problem with its durability. To solve this problem, Japanese Patent Application Laid-open No. 52-17323 and 17324
A mold release agent with excellent mold release durability using curable silicone is provided in the publication, but it is expensive due to the high silicone content in the composition, and since the silicone content on the frame surface is large, organometallic It is uneconomical unless it has a very long usage cycle, as it will remain sticky unless it is cross-linked by adding salt or acid. As a result of various studies in order to improve the drawbacks of silicone-based mold release agents for molds, the inventors of the present invention found that a mixture of silicone oil and silicone resin varnish was used as the silicone resin, and an appropriate amount of inorganic powder was added to this at the same time. We have discovered a mold release agent for molds that has excellent mold effect, is difficult to peel off, and has long mold release durability, and has arrived at the present invention. That is, the present invention comprises 5 to 30 parts by weight of an inorganic powder, 50 to 94 parts by weight of an organic solvent, and 1 to 20 parts by weight of a silicone resin in which the weight ratio of silicone oil to silicone resin varnish is 9:1 to 1:9. The present invention provides a mold release agent for molds that is non-sticky and has long mold release properties. The silicone resin varnish in the present invention includes SiO 2 , CH 3 SiO 3/2 , and
Methyl silicone varnish or _
CH 3 SiO 3/2 , (CH 3 ) 2 SiO, C 6 H 5 SiO 3/2 , (C 6 H 5 )
Phenylmethyl silicone varnish, which is a copolymer consisting of structural units of (CH 3 )SiO and (C 6 H 5 ) 2 SiO, is preferred. formula〔〕
【式】
（式中ＲはCH3又はC6H5）
本発明におけるシリコーンオイルとしては、例
えばジメチルシリコーンオイル、メチルフエニル
シリコーンオイル、ジエチルシリコーンオイル、
メチルハイドロジエンポリシロキサンやα−メチ
ルスチレン変性シリコーンオイル等の変性シリコ
ーンオイルが挙げられる。
本発明におけるシリコーン樹脂としてのシリコ
ーンオイルとシリコーン樹脂ワニスの含有重量比
は９：１〜１：９である。この比率よりシリコー
ンオイルが多い場合は、ベタツキの改良効果が小
さく、少ない場合は、離型効果が不足する。また
本発明組成物中のシリコーン樹脂の配合量は実用
上は１〜20重量部であり、好ましくは２〜10重量
部である。これより少ない場合は、離型持続性に
乏しく、多い場合は鋳枠から鋳型を抜いた後鋳型
へシリコーンが付着し鋳型表面を汚染する。
本発明における無機粉末は、シリコーン樹脂の
離型効果を更に高める働きをもつ。即ち、無機粉
末を含有しないシリコーン系鋳型用粘結剤では、
塗膜のベタツキ、耐久性および離型性を同時に満
足させることは出来ないが、無機粉末を含有させ
ることによりそれが可能となる。更に、有色無機
粉末を用いることにより塗布ムラを防止すること
も可能である。無機粉末としては、鋳枠から鋳型
を離型する時に鋳型に多少付着しても鋳物に特に
悪影響を与えない化学的に不活性なものが好まし
く、例えば、黒鉛、アルミ粉、石花粉、シリカ
粉、アルミナ粉、タルク粉、ジルコンフラワーや
ベンガラ等の無機顔料などが挙げられる。本発明
組成物中の無機粉末の配合量は５〜30重量部であ
り、組成物中のシリコーン樹脂に対して２〜10倍
重量部用いられる。これより配合量が少ない場合
は、離型効果が小さく、多い場合は、塗膜が著し
く脆くなる。
本発明に用いられる有機系溶剤は、シリコーン
樹脂を溶解するものであれば、環境条件、使用条
件（乾燥速度等）に応じて任意に選択することが
出来る。例えば、ガソリン、石油ベンジン、ミネ
ラルスピリツト、トルエン、キシレン、トリクロ
ロエチレン、四塩化炭素、塩化メチレン、アセト
ン等が挙げられる。
また本発明組成物は上記必須成分以外に場合に
よりアエロジル等のチクソトロピツク剤、消泡
剤、パラフインワツクスやポリスチレン等の熱可
塑性ポリマー等を含有しても差支えない。
以下実施例をもつて更に本発明を詳細に説明す
る。
実施例 １〜４
シリコーン樹脂ワニスとしてメチルシリコーン
ワニスを用いた本発明の鋳型用離型剤組成物の引
抜き荷重、ベタツキ性を測定した。結果を表−１
に示す。またシリコーン樹脂としてシリコーンオ
イル又はシリコーンワニスのみ使用した場合と無
機粉末を含まない場合を参考例１〜３として示し
た。[Formula] (In the formula, R is CH 3 or C 6 H 5 ) Examples of the silicone oil in the present invention include dimethyl silicone oil, methylphenyl silicone oil, diethyl silicone oil,
Examples include modified silicone oils such as methylhydrodiene polysiloxane and α-methylstyrene modified silicone oil. In the present invention, the weight ratio of silicone oil as the silicone resin to silicone resin varnish is 9:1 to 1:9. If the silicone oil is more than this ratio, the stickiness improvement effect will be small, and if it is less, the mold release effect will be insufficient. Further, the amount of silicone resin blended in the composition of the present invention is practically 1 to 20 parts by weight, preferably 2 to 10 parts by weight. If the amount is less than this, the mold release durability will be poor, and if it is more than this, silicone will adhere to the mold after the mold is removed from the flask and contaminate the surface of the mold. The inorganic powder in the present invention has the function of further enhancing the mold release effect of the silicone resin. In other words, silicone-based mold binders that do not contain inorganic powder,
Although it is not possible to satisfy the stickiness, durability, and mold release properties of the coating film at the same time, it is possible to achieve this by incorporating an inorganic powder. Furthermore, it is also possible to prevent uneven coating by using colored inorganic powder. Preferably, the inorganic powder is a chemically inert powder that does not have a particularly negative effect on the casting even if it adheres to the mold when the mold is released from the flask, such as graphite, aluminum powder, stone pollen, and silica powder. , alumina powder, talcum powder, and inorganic pigments such as zircon flour and red iron. The amount of inorganic powder blended in the composition of the present invention is 5 to 30 parts by weight, which is 2 to 10 times the weight of the silicone resin in the composition. When the amount is less than this, the mold release effect is small, and when it is more than this, the coating film becomes extremely brittle. The organic solvent used in the present invention can be arbitrarily selected depending on the environmental conditions and usage conditions (drying rate, etc.) as long as it dissolves the silicone resin. Examples include gasoline, petroleum benzine, mineral spirits, toluene, xylene, trichloroethylene, carbon tetrachloride, methylene chloride, acetone, and the like. In addition to the above-mentioned essential components, the composition of the present invention may optionally contain a thixotropic agent such as Aerosil, an antifoaming agent, a thermoplastic polymer such as paraffin wax or polystyrene, and the like. The present invention will be further explained in detail with reference to Examples below. Examples 1 to 4 The pull-out load and stickiness of the mold release agent composition of the present invention using methyl silicone varnish as the silicone resin varnish were measured. Table 1 shows the results.
Shown below. Further, Reference Examples 1 to 3 are shown in which only silicone oil or silicone varnish is used as the silicone resin, and in which no inorganic powder is used.
【表】
実施例 ５〜８
シリコーン樹脂ワニスとしてフエニルメチルシ
リコーンワニスを用いた本発明の鋳型用離型剤組
成物における引抜き荷重、ベタツキ性を測定し
た。結果を表−２に示す。同時にシリコーン樹脂
としてシリコーンオイル又はシリコーンワニスの
み使用した場合と無機粉末を含まない場合を参考
例４〜６として示した。[Table] Examples 5 to 8 The pull-out load and stickiness of the mold release agent composition of the present invention using phenylmethyl silicone varnish as the silicone resin varnish were measured. The results are shown in Table-2. At the same time, cases in which only silicone oil or silicone varnish was used as the silicone resin and cases in which no inorganic powder was used were shown as Reference Examples 4 to 6.
【表】
実施例 ９〜11
シリコーン樹脂ワニスとしてメチルシリコーン
ワニスを用いた本発明の鋳型用離型剤組成物にお
ける離型効果持続性をみた。即ち、木型に離型剤
を塗布後所定回数木型の埋め込みと抜型を繰返し
た。この木型を用いて引抜き荷重を測定した。結
果を表−３に示す。尚、シリコーンワニスを配合
しないものを参考例７として示した。[Table] Examples 9 to 11 The durability of the mold release effect of the mold release agent composition for molds of the present invention using methyl silicone varnish as the silicone resin varnish was examined. That is, after applying a mold release agent to the wooden mold, embedding and removing the wooden mold were repeated a predetermined number of times. The pullout load was measured using this wooden pattern. The results are shown in Table-3. Note that reference example 7 is one in which no silicone varnish is blended.
Claims (1)
量部およびシリコーンオイルとシリコーン樹脂ワ
ニスの重量比が９：１〜１：９であるシリコーン
樹脂１〜20重量部からなることを特徴とする鋳型
用離型剤組成物。 ２ シリコーン樹脂ワニスがSiO2，CH3SiO3/2，
（CH3）2SiO，（CH3）3SiO1/2の構造単位からなる
共重合体であるメチルシリコーンワニス或いは
CH3SiO3/2，（CH3）2SiO，C6H5SiO3/2，（C6H5）
（CH3）SiO，（C6H5）2SiOの構造単位からなる共
重合体であるフエニルメチルシリコーンワニスで
あることを特徴とする特許請求の範囲第１項記載
の鋳型用離型剤組成物。[Scope of Claims] 1. 5 to 30 parts by weight of an inorganic powder, 50 to 94 parts by weight of an organic solvent, and 1 to 20 parts by weight of a silicone resin in which the weight ratio of silicone oil to silicone resin varnish is 9:1 to 1:9. A mold release agent composition for molds, comprising: 2 Silicone resin varnish contains SiO 2 , CH 3 SiO 3/2 ,
Methyl silicone varnish or _
CH 3 SiO 3/2 , (CH 3 ) 2 SiO, C 6 H 5 SiO 3/2 , (C 6 H 5 )
The mold release agent for molds according to claim 1, which is a phenylmethyl silicone varnish which is a copolymer consisting of structural units of (CH 3 )SiO and (C 6 H 5 ) 2 SiO. Composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12129983A JPS6012248A (en) | 1983-07-04 | 1983-07-04 | Mold release agent composition for casting mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12129983A JPS6012248A (en) | 1983-07-04 | 1983-07-04 | Mold release agent composition for casting mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6012248A JPS6012248A (en) | 1985-01-22 |
| JPH0428457B2 true JPH0428457B2 (en) | 1992-05-14 |
Family
ID=14807815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12129983A Granted JPS6012248A (en) | 1983-07-04 | 1983-07-04 | Mold release agent composition for casting mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6012248A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0352171Y2 (en) * | 1986-12-12 | 1991-11-12 | ||
| JP5054308B2 (en) * | 2006-01-12 | 2012-10-24 | アイシン精機株式会社 | Casting method and water-soluble mold release agent for casting mold |
| JP4452310B2 (en) * | 2008-06-13 | 2010-04-21 | 新日本製鐵株式会社 | Casting method and casting mold of iron-based alloy in semi-molten or semi-solid state |
| CN105149498B (en) * | 2015-08-21 | 2017-11-10 | 重庆益新阳工贸有限公司 | A kind of releasing agent used for casting |
| CN105344928A (en) * | 2015-10-26 | 2016-02-24 | 无锡市永亿精密铸造有限公司 | Mold releasing agent for precisely-casted universal ball |
-
1983
- 1983-07-04 JP JP12129983A patent/JPS6012248A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6012248A (en) | 1985-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4529028A (en) | Coating for molds and expendable cores | |
| JPH08509665A (en) | Method for producing molded body using organometallic ceramic precursor binder | |
| EP0207864B1 (en) | Binders for manufacture of precision casting molds | |
| JPH0428457B2 (en) | ||
| US4096293A (en) | Mold and core wash | |
| US4248825A (en) | Sulfur processing release agents | |
| US3717485A (en) | Pattern wax compositions | |
| JPS6218571A (en) | Manufacture of 1-component toner powder | |
| US3922245A (en) | Wash coating for sand cores and sand molds containing a rubber polymer | |
| JP4316259B2 (en) | Release agent composition | |
| EP0591545A1 (en) | Use of a composition as a mold release agent | |
| JP3278090B2 (en) | Foundry sand adhesion inhibitor composition | |
| JPS5821491A (en) | Mold release agent composition | |
| US4191578A (en) | Release agents | |
| CA2220359C (en) | Heat cured foundry binder systems and their uses | |
| EP0215783B1 (en) | Coating for molds and expendable cores | |
| JP3128604B2 (en) | Release agent for green molding | |
| JPS6317958A (en) | Mold-releasing composition | |
| JPH0663688A (en) | Release agent of wax pattern for precision casting and method for molding wax pattern | |
| SU676377A1 (en) | Method of activating sand under room temperature | |
| EP1706363B1 (en) | Filling material | |
| JPS62224444A (en) | Mold coating material | |
| SU534288A1 (en) | Separating coating for model equipment | |
| CA1051608A (en) | Preparation of high temperature shell molds | |
| JP3115398B2 (en) | Mold release agent composition for curable mold for vibration molding and mold molded using the same |