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JPH0429500B2 - - Google Patents
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JPH0429500B2 - - Google Patents

Info

Publication number
JPH0429500B2
JPH0429500B2 JP60004688A JP468885A JPH0429500B2 JP H0429500 B2 JPH0429500 B2 JP H0429500B2 JP 60004688 A JP60004688 A JP 60004688A JP 468885 A JP468885 A JP 468885A JP H0429500 B2 JPH0429500 B2 JP H0429500B2
Authority
JP
Japan
Prior art keywords
tool
laser
laser processing
head
spindle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60004688A
Other languages
Japanese (ja)
Other versions
JPS61164738A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60004688A priority Critical patent/JPS61164738A/en
Publication of JPS61164738A publication Critical patent/JPS61164738A/en
Publication of JPH0429500B2 publication Critical patent/JPH0429500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • B23K26/1482Detachable nozzles, e.g. exchangeable or provided with breakaway lines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/15513Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling the tool being taken from a storage device and transferred to a tool holder by means of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、工具マガジンに切削加工用工具の他
にレーザ加工ヘツドを用意し、このレーザ加工ヘ
ツドを主軸に装着してレーザ加工を可能にした工
作機械に関する。
[Detailed Description of the Invention] <Industrial Application Field> The present invention provides a tool magazine with a laser processing head in addition to cutting tools, and attaches this laser processing head to the spindle to enable laser processing. Regarding machine tools.

〈従来の技術〉 従来、レーザ光線を用いたレーザ加工を行うレ
ーザ加工機はすでに知られている。
<Prior Art> Conventionally, laser processing machines that perform laser processing using laser beams are already known.

〈発明が解決しようとする問題点〉 かかる従来のレーザ加工機は、レーザ加工ヘツ
ドを工作物に対して相対移動させるために、専用
のベツド、テーブルさらには送り装置等を設けて
おり、加工機のコストが高くなり、また工作物に
対するレーザ光線の投光方向を変更しようとする
とレーザ加工ヘツドを手作業で交換しなければな
らず、段取替えに手間ならびに時間がかかる欠点
があつた。
<Problems to be Solved by the Invention> Such conventional laser processing machines are equipped with a dedicated bed, table, and feed device in order to move the laser processing head relative to the workpiece. The cost is high, and if the direction of the laser beam projected onto the workpiece is to be changed, the laser processing head must be replaced manually, resulting in a disadvantage that setup changes are laborious and time consuming.

〈発明の構成〉 本発明は、かかる従来の問題を解決するために
なされたもので、マシニングセンタのごとき種々
の加工を連続的に行う工作機械を利用してレーザ
加工を行うために、前記工具マガジンにレーザ加
工ヘツドを収容し、このレーザ加工ヘツドを工具
交換装置によつて主軸に装着するとともに、レー
ザ発振器から発振されたレーザ光線をこのレーザ
加工ヘツドに設けられたレーザ光線投光手段を介
して工作物に投光するようにしたことを構成上の
特徴とするものである。
<Structure of the Invention> The present invention has been made in order to solve such conventional problems, and in order to perform laser processing using a machine tool such as a machining center that continuously performs various processing, the tool magazine is A laser processing head is housed in the machine, and this laser processing head is attached to the spindle by a tool changer, and the laser beam emitted from the laser oscillator is transmitted through a laser beam projection means provided in this laser processing head. The structural feature is that the light is projected onto the workpiece.

〈作用〉 本発明は、上記構成を備えているため、レーザ
加工を行う場合には、工具マガジン内に予め収容
しておいたレーザ加工ヘツドを工具交換装置を利
用して主軸に装着する。
<Function> Since the present invention has the above configuration, when performing laser processing, the laser processing head previously housed in the tool magazine is attached to the main spindle using the tool changer.

この状態においてレーザ発振器から発振される
レーザ光線を前記レーザ加工ヘツド内のレーザ光
線投光手段を介して工作物に照射し、同時にこの
レーザ加工ヘツドを工作物に対して相対移動させ
てレーザ加工を行う。
In this state, the laser beam emitted from the laser oscillator is irradiated onto the workpiece through the laser beam projection means in the laser processing head, and at the same time, the laser processing head is moved relative to the workpiece to perform laser processing. conduct.

〈実施例〉 以下本発明の実施例を図面に基づいて説明す
る。第1図は本発明の工作機械の全体構成を示す
もので、ヘツド10と、このベツド10上に固定
された固定台11と、この固定台11上において
送りモータ12によりX方向に移動されかつ工作
物Wを支持するテーブル13と、前記ベツド10
上に固定された工具マガジン14と、前記ベツド
10上において送りモータ15によりY方向に移
動されるコラム16と、このコラム16の前部に
おいて送りモータ17によりZ方向に移動される
スピンドルヘツド18と、このスピンドルヘツド
に回転可能に軸承された主軸26と、前記工具マ
ガジン14との間で工具交換を行う工具交換装置
19とよりなる。
<Example> Hereinafter, an example of the present invention will be described based on the drawings. FIG. 1 shows the overall configuration of the machine tool of the present invention, which includes a head 10, a fixed base 11 fixed on this bed 10, and a machine tool that is moved in the X direction by a feed motor 12 on this fixed base 11. A table 13 that supports the workpiece W, and the bed 10
A tool magazine 14 fixed above, a column 16 that is moved in the Y direction by a feed motor 15 on the bed 10, and a spindle head 18 that is moved in the Z direction by a feed motor 17 at the front of this column 16. , a main shaft 26 rotatably supported by the spindle head, and a tool changer 19 for changing tools between the tool magazine 14 and the tool magazine 14.

前記工具マガジン14は周知のごとくエンドレ
スチエーン20上の工具ソケツト21に種々の工
具22を収容保持するとともにこの工具ソケツト
21を工具取出し位置P1に割出し、するもの
で、この工具ソケツト21は工具取出し位置P1
からさらに水平面内で平行移動され、その後垂直
面内で旋回して工具交換位置P2へ移送されるよ
うになつている。
As is well known, the tool magazine 14 accommodates and holds various tools 22 in a tool socket 21 on the endless chain 20, and indexes the tool socket 21 to the tool take-out position P1. Position P1
The tool is then further translated in a horizontal plane, then turned in a vertical plane and transferred to the tool exchange position P2.

前記工具交換位置19は周知のごとく旋回軸2
5の軸線方向に軸動したり、また旋回軸25を中
心として旋回運動を行つて前記工具交換位置P2
に位置する工具22と、前記主軸26に装着され
た工具22との工具交換を行うようになつてい
る。
As is well known, the tool changing position 19 is located at the pivot axis 2.
The tool exchange position P2 is moved by pivoting in the axial direction of
The tool 22 located at the main shaft 26 is exchanged with the tool 22 mounted on the main shaft 26.

前記スピンドルヘツド18に回転可能に軸承さ
れた主軸26には第2図に示すように装着穴30
が形成され、この装着穴30の内方に周知の工具
クランプ装置31が設けられている。この装着穴
30には第3図に示す切削加工工具22が装着さ
れたり、また第2図に示すようにこの切削加工用
工具22に代えてレーザ加工ヘツド40が装着さ
れたりする。このレーザ加工ヘツド40は切削加
工用工具22と同様前記装着穴30に嵌合するテ
ーパ部41ならびに工具交換装置19によつて把
持される把持部42を有する。さらにこのレーザ
加工ヘツド40にはレーザ光線投光手段43が設
けられている。このレーザ光線投光手段43はレ
ーザ光線を通過させる通路44と、この通路44
の屈曲部に設けられたミラー45,46とからな
り、スピンドルヘツド18上取付られたレーザ発
振器50からのレーザ光線を所定の方向へ投光す
るようになつている。
The main shaft 26 rotatably supported by the spindle head 18 has a mounting hole 30 as shown in FIG.
is formed, and a well-known tool clamping device 31 is provided inside this mounting hole 30. A cutting tool 22 shown in FIG. 3 is mounted in this mounting hole 30, or a laser processing head 40 is mounted in place of this cutting tool 22 as shown in FIG. Like the cutting tool 22, this laser processing head 40 has a tapered portion 41 that fits into the mounting hole 30 and a grip portion 42 that is gripped by the tool changer 19. Further, this laser processing head 40 is provided with a laser beam projecting means 43. This laser beam projecting means 43 includes a passage 44 through which the laser beam passes, and a passage 44 through which the laser beam passes.
The mirrors 45 and 46 are provided at the bent portions of the spindle head 18, and the laser beam from the laser oscillator 50 mounted on the spindle head 18 is projected in a predetermined direction.

なお、51は軸受押えであり、この軸受押え5
1には前記レーザ発振器50からレーザ加工ヘツ
ド40側へレーザ光線を中継するための通路52
ならびにミラー53,54が設けられている。
In addition, 51 is a bearing holder, and this bearing holder 5
1 includes a passage 52 for relaying a laser beam from the laser oscillator 50 to the laser processing head 40 side.
Also provided are mirrors 53 and 54.

上記構成における本発明装置の作動を説明す
る。
The operation of the device of the present invention with the above configuration will be explained.

先ず通常の加工状態においては、主軸26に対
して切削加工工具22が装着され、この状態にお
いてテーブル13、コラム16、スピンドルヘツ
ド26を相対移動させて前記テーブル13上の工
作物Wの切削加工が行なわれる。
First, in a normal machining state, the cutting tool 22 is attached to the main spindle 26, and in this state, the table 13, column 16, and spindle head 26 are moved relative to each other to perform cutting on the workpiece W on the table 13. It is done.

続いてレーザ加工を行いたい場合には、工具マ
ガジン14を割出し、この工具マガジン14内に
予め用意されたレーザ加工ヘツド40を工具取出
し位置P1に割出しておく。そして切削加工工具
22による加工が終了すると同時にこのレーザ加
工ヘツド40を保持した工具ソケツト21を水平
面内で平行移動し、さらに垂直面内で旋回させて
レーザ加工ヘツドを工具交換位置P2に位置決め
する。
When it is desired to perform laser processing subsequently, the tool magazine 14 is indexed, and the laser processing head 40 prepared in advance in the tool magazine 14 is indexed to the tool take-out position P1. At the same time as the machining by the cutting tool 22 is completed, the tool socket 21 holding the laser machining head 40 is moved in parallel in a horizontal plane and further rotated in a vertical plane to position the laser machining head at a tool exchange position P2.

一方スピンドルヘツド18は工具交換のため、
原位置まで上昇し、原位置まで上昇すると同時に
工具交換装置19によつて主軸26に装着された
使用ずみの切削加工工具22と、レーザ加工ヘツ
ド40とが交換される。その後切削加工工具22
は工具マガジン14内に戻され、またレーザ加工
ヘツド40を装着したスピンドルヘツド18は下
降し、所定位置まで下降したところで、レーザ発
振器50からレーザ光線が出力される。このレー
ザ光線は通路52、ミラー53,54通路44な
らびにミラー45,46を介して偏向され、工作
物Wに向かつて投光され、同時にテーブル13な
らびにコラム16の相対移動により所定の経路に
沿つてレーザ光線が照射されてレーザ加工を行な
われる。
On the other hand, the spindle head 18 is due to tool replacement.
It rises to the original position, and at the same time as it rises to the original position, the used cutting tool 22 mounted on the main shaft 26 is replaced by the laser processing head 40 by the tool changing device 19. After that, the cutting tool 22
is returned to the tool magazine 14, and the spindle head 18 with the laser processing head 40 mounted thereon is lowered, and when it has been lowered to a predetermined position, a laser beam is output from the laser oscillator 50. This laser beam is deflected through the passage 52, the mirrors 53, 54, the passage 44, and the mirrors 45, 46, and is projected toward the workpiece W. At the same time, it is directed along a predetermined path by the relative movement of the table 13 and the column 16. A laser beam is irradiated to perform laser processing.

レーザ加工終了後、前記同様の要領をもつて使
用ずみのレーザ加工ヘツド40は工具マガジン1
4に戻され、同時に次に使用すべき切削加工工具
22が主軸26に装着され、次の加工が行なわれ
る。
After the laser processing is completed, the used laser processing head 40 is transferred to the tool magazine 1 in the same manner as described above.
At the same time, the cutting tool 22 to be used next is mounted on the main shaft 26, and the next machining is performed.

なお、レーザ加工ヘツド40としては第2図に
示すように垂直方向よりレーザ光線を投光するも
のに限定されるものではなく、第4図および第5
図に示すように水平方向ならびに斜め方向よりレ
ーザ光線を照射する各種レーザ加工ヘツド40を
工具マガジン14内に用意し、これらレーザ加工
ヘツド40を使い分けることでより複雑なレーザ
加工が可能となる。
Note that the laser processing head 40 is not limited to one that emits a laser beam from the vertical direction as shown in FIG. 2;
As shown in the figure, various laser machining heads 40 that emit laser beams from horizontal and oblique directions are provided in the tool magazine 14, and by using these laser machining heads 40 properly, more complex laser machining becomes possible.

〈発明の効果〉 以上述べたように本発明装置は、工具マガジン
に工具交換装置によつて主軸側の工具と交換して
使用されるレーザ加工ヘツドを前記切削加工工具
とともに収容し、このレーザ加工ヘツドにレーザ
発振器からのレーザ光線を一定の方向に向けて照
射するレーザ光線投光手段を設けた構成であるた
め、切削加工を行うマシニングセンタを利用して
レーザ加工を行うことができ、特別なレーザ加工
機を必要とすることなく、低コストでマシニング
センタにレーザ加工機能をもたせることができ、
また種々のレーザ加工ヘツドを用意し、これを交
換使用することで、複雑なレーザ加工を簡単かつ
迅速に行うことができる利点を有する。
<Effects of the Invention> As described above, the apparatus of the present invention stores a laser machining head, which is used by a tool exchanger to replace a tool on the spindle side, in a tool magazine together with the cutting tool, and performs this laser machining. Since the head is equipped with a laser beam projector that irradiates a laser beam from a laser oscillator in a fixed direction, laser processing can be performed using a machining center that performs cutting, and a special laser A machining center can be equipped with a laser processing function at low cost without the need for a processing machine.
Moreover, by preparing various laser processing heads and using them interchangeably, there is an advantage that complex laser processing can be easily and quickly performed.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明の実施例を示すもので、第1図は
本発明装置の正面図、第2図はレーザ加工ヘツド
を装着したスピンドルヘツドの部分断面図、第3
図は切削加工工具の正面図、第4図および第5図
はレーザ加工ヘツドの変形例を示す断面図であ
る。 13……テーブル、14……工具マガジン、1
8……スピンドル、19……工具交換装置、22
……切削加工用工具、40……レーザ加工ヘツ
ド、43……レーザ光線投光手段。
The drawings show embodiments of the present invention; FIG. 1 is a front view of the apparatus of the present invention, FIG. 2 is a partial sectional view of a spindle head equipped with a laser processing head, and FIG.
The figure is a front view of the cutting tool, and FIGS. 4 and 5 are sectional views showing modified examples of the laser processing head. 13...Table, 14...Tool magazine, 1
8...Spindle, 19...Tool change device, 22
. . . Cutting tool, 40 . . . Laser processing head, 43 . . . Laser beam projecting means.

Claims (1)

【特許請求の範囲】[Claims] 1 スピンドルヘツドに回転可能に軸承された主
軸と、多数の切削加工用工具を収容する工具マガ
ジンとの間で工具交換装置により工具交換を行う
とともに、前記スピンドルヘツドをテーブルに対
して相対移動させてこのテーブル上に載置された
工作物の加工を行う工作機械において、前記工具
マガジンには前記工具交換装置によつて主軸側の
工具と交換して使用されるレーザ加工ヘツドを前
記切削加工工具とともに収容し、このレーザ加工
ヘツドにレーザ発振器からのレーザ光線を一定の
方向に向けて照射するレーザ光線投光手段を設け
たことを特徴とするレーザ加工可能な工作機械。
1. A tool changing device exchanges tools between a main shaft rotatably supported by a spindle head and a tool magazine that accommodates a large number of cutting tools, and the spindle head is moved relative to the table. In a machine tool that processes a workpiece placed on the table, the tool magazine stores a laser machining head that is used to replace a tool on the spindle side by the tool changer, together with the cutting tool. 1. A machine tool capable of laser processing, characterized in that the laser processing head is provided with a laser beam projection means for directing a laser beam from a laser oscillator in a fixed direction onto the laser processing head.
JP60004688A 1985-01-14 1985-01-14 Machine tool capable of laser beam machining Granted JPS61164738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60004688A JPS61164738A (en) 1985-01-14 1985-01-14 Machine tool capable of laser beam machining

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60004688A JPS61164738A (en) 1985-01-14 1985-01-14 Machine tool capable of laser beam machining

Publications (2)

Publication Number Publication Date
JPS61164738A JPS61164738A (en) 1986-07-25
JPH0429500B2 true JPH0429500B2 (en) 1992-05-19

Family

ID=11590830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60004688A Granted JPS61164738A (en) 1985-01-14 1985-01-14 Machine tool capable of laser beam machining

Country Status (1)

Country Link
JP (1) JPS61164738A (en)

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* Cited by examiner, † Cited by third party
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* Cited by examiner, † Cited by third party
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JPH02145232A (en) * 1988-11-25 1990-06-04 Nissei Plastics Ind Co Composite work machine
JPH04289038A (en) * 1991-03-15 1992-10-14 Fanuc Ltd Composte machine tool capable of laser process
JPH05293730A (en) * 1992-04-20 1993-11-09 Fanuc Ltd Complex machine tool capable of laser machining
JPH07328879A (en) * 1994-06-02 1995-12-19 Yasuda Kogyo Kk Machining center with quenching function
JPH11114741A (en) * 1997-10-20 1999-04-27 Kitamura Mach Co Ltd Combined machining center
EP0958884A1 (en) * 1998-05-19 1999-11-24 Lastec Laserjob AG Process for machining workpieces and machine tool
JP4431420B2 (en) * 2004-02-24 2010-03-17 ヤマザキマザック株式会社 Machine Tools
JP4390627B2 (en) * 2004-05-28 2009-12-24 ヤマザキマザック株式会社 Laser hardening tool
JP2006281390A (en) 2005-04-01 2006-10-19 Jtekt Corp Combined processing machine and workpiece processing method using the same
DE102005055553A1 (en) * 2005-11-18 2007-05-24 Johnson Controls Interiors Gmbh & Co. Kg Method for producing a weakened zone, in particular a predetermined breaking line for an airbag outlet opening, component and device
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