JPH0431186B2 - - Google Patents

Abstract

PURPOSE:To mount two kinds or more of input/output terminals having different shapes and fitting types easily in response to application and a time without repeating the design and the like of a pattern of a wiring substrate by forming two kinds or more of conductor pads capable of connecting two kinds or more of the input/output terminals having different fitting types to the back of the wiring substrate. CONSTITUTION:Stepped sections 9 in which oppositely faced side edge sections along long sides are each lowered and a central section is heightened are shaped to the back of a wiring substrate 7. Flat package type conductor pads 10 for mounting input/output terminals are each formed at intervals of 1.27mm on lower surface in the stepped sections for the back, and pin grid array type conductor pads 11 for mounting input/output terminals are shaped at intervals of 2.54mm on the higher central section. These flat package type conductor pads 10 for mounting the input/output terminals and pin grid array type conductor pads 11 for mounting the input/output terminals are mutually connected electrically.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a hybrid integrated circuit to which input/output terminals of different types can be attached as required.

[Technical background of the invention and its problems] In recent years, various types of hybrid integrated circuits have been used in response to demands for smaller and lighter electronic devices, higher performance, higher reliability, etc.

For example, these hybrid integrated circuits are classified into two types, a flat package type and a pin grid array type, depending on the shape and mounting form of the input/output terminals, and each type is used for different purposes.

In other words, in a flat package type hybrid integrated circuit, as shown in FIG. 4, a plurality of flat package type input/output terminal mounting conductor pads 3 to which input/output signals are wired are arranged on the back surface of a wiring board 1. A plurality of active and passive circuit elements are mounted on this wiring board 1, and the whole is hermetically sealed with a metal cap, and conductive pads for mounting these are mounted on the wiring board 1. 3 has multiple flat package type input/output terminals 4
are fixed to each other with silver solder or the like so as to be lined up along the back surface of the wiring board 1.

On the other hand, in a pin grid array type hybrid integrated circuit, as shown in FIG. These mounting conductor pads 5 are arranged in a different arrangement method from the type input/output terminal mounting conductor pads 3.
A plurality of pin grid array type input/output terminals 6 are fixed perpendicularly to the back surface of the wiring board 1 using silver solder or the like.

However, in these flat package type and pin grid array type hybrid integrated circuits, the type of input/output terminal to be attached to the conductor pad for attaching the input/output terminal is determined at the time the conductor pad for attaching the input/output terminal is formed, so characteristic tests are not required. - It was not possible to select the most desirable shape and mounting form of the input/output terminals at the time of evaluation and at the time of implementation.

In addition, once one type of hybrid integrated circuit has been manufactured, if the shape and mounting form of the input/output terminals are changed, the positions should be changed according to the form of the input/output terminals to be changed. Conductor pads for attaching input/output terminals are provided at intervals according to the type, and the cost of changing the mask pattern is incurred to route input/output signals to these new conductor pads for attaching input/output terminals, which increases the cost and man-hours significantly. There was a problem.

[Purpose of the Invention] The present invention was made to solve these problems, and it is possible to select the shape and mounting form of the input/output terminals after manufacturing the wiring board, and furthermore, it is possible to select the shape and mounting form of the input/output terminals once installed. It is an object of the present invention to provide a hybrid integrated circuit whose shape and mounting form can be easily changed.

[Summary of the Invention] In other words, the hybrid integrated circuit of the present invention has a plurality of circuit elements mounted on the front surface of a wiring board, and two or more types of input/output terminals that can be connected to two or more types of input/output terminals with different mounting configurations on the back surface. By providing conductor pads and electrically connecting the corresponding ones of these different conductor pads, it is possible to create two or more types of conductor pads with different shapes and mounting forms depending on the application and situation without having to redo the pattern design of the wiring board. This allows input/output terminals to be easily attached.

In addition, when the hybrid integrated circuit of the present invention has a structure in which two types of input/output terminals, a flat package type and a pin grid array type, can be attached, the flat package type is attached to the back side of the wiring board. A step with a height equal to or greater than the thickness of the input/output terminals is provided, and conductor pads for attaching flat package type input/output terminals are placed on the lower side, and pingrids are placed on the higher side. It is desirable to provide conductor pads for attaching door array type input/output terminals.

In a hybrid integrated circuit with such a structure, especially when a flat package type input/output terminal is attached to a conductor pad for attaching a flat package type input/output terminal, it is mounted on another circuit.
Most of the back surface is in contact with the surface on which the circuit is mounted, which has the advantage of increasing the heat dissipation effect and virtually eliminating any deterioration in characteristics due to heat during operation.

[Embodiments of the Invention] Examples of the present invention shown in the drawings will be described below.

FIG. 1 is a perspective view showing the back side of an embodiment of the hybrid integrated circuit of the present invention.

In this figure, reference numeral 7 indicates a wiring board on which a conductive circuit is formed, and a plurality of memories, resistors,
Active and passive circuit elements (not shown) such as capacitors are mounted, and these circuit elements are hermetically covered in their entirety by a metal cap 8.

Further, on the back surface of the wiring board 7, there is provided a step 9 in which opposing edges along the long sides are low and the center is high.

Furthermore, conductor pads 10 for attaching flat package type input/output terminals are provided at intervals of 1.27 mm on the lower side of the back surface, and a pin grid array is provided on the higher central part. The conductor pad 11 for mounting the input/output terminal of the type is 2.54 mm.
are provided at intervals of

Further, the flat package type input/output terminal mounting conductor pad 10 and the pin grid array type input/output terminal mounting conductor pad 11 are electrically connected to each other.

In the hybrid integrated circuit configured in this manner, depending on the form of the circuit in which it is to be mounted, as shown in FIG. It can be used as a flat package type hybrid integrated circuit by fixing the input/output terminals 12 of the pin grid array type, or as shown in FIG. It can also be used as a pin grid array type hybrid integrated circuit by fixing the array type input/output terminals 13.

Furthermore, even if a flat package type hybrid integrated circuit is manufactured and mounted on it as shown in Figure 2, it is difficult to obtain sockets for the flat package type input/output terminals 12 with a pitch of 1.27 mm. Moreover, since it is difficult to insert and remove from this socket, we replaced the input and output terminals during characteristic testing and evaluation to construct a pin grid array type hybrid integrated circuit as shown in Figure 3.
This can be subjected to characteristic tests and evaluation tests.

[Effects of the Invention] As explained above, in the hybrid integrated circuit of the present invention, conductor pads for attaching input/output terminals with different shapes and mounting forms are provided on the back surface of the wiring board, so that it is possible to The mounting form can be selected after manufacturing the wiring board.

Furthermore, since the shape and mounting form of the input/output terminals to be attached can be easily changed between installation and characteristic testing/evaluation, development costs associated with these changes can be significantly reduced.

[Brief explanation of drawings]

FIG. 1 is a rear perspective view of an embodiment of a hybrid integrated circuit according to the present invention, and FIGS. 2 and 3 are a flat package type and pin grid array type hybrid integrated circuit constructed according to an embodiment of the present invention, respectively. FIG. 4 is a perspective view showing a conventional flat package type hybrid integrated circuit, and FIG. 5 is a perspective view showing a conventional pin grid array type hybrid integrated circuit. 1, 7... Wiring board, 2, 8... Metal cap,
3, 10...Conductor pads for attaching flat package type input/output terminals, 4,12...Flat package type input/output terminals, 5,11...Conductor pads for attaching pin grid array type input/output terminals,
6, 13... Pin grid array type input/output terminal, 9... Step.

Claims (1)

[Claims] 1. A plurality of circuit elements are mounted on the front surface of a wiring board, and two or more types of conductor pads are provided on the back surface to which two or more types of input/output terminals with different mounting configurations can be connected, and these different types of conductor pads are provided. A hybrid integrated circuit characterized by electrically connecting corresponding conductor pads. 2. A step of an appropriate height is provided on the back surface of the wiring board, and conductor pads for attaching input/output terminals with different mounting configurations are provided separately on the higher and lower surfaces of the step. A hybrid integrated circuit according to claim 1, characterized in that: