JPH043119B2 - - Google Patents
Info
- Publication number
- JPH043119B2 JPH043119B2 JP22760583A JP22760583A JPH043119B2 JP H043119 B2 JPH043119 B2 JP H043119B2 JP 22760583 A JP22760583 A JP 22760583A JP 22760583 A JP22760583 A JP 22760583A JP H043119 B2 JPH043119 B2 JP H043119B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- continuously
- laminate
- printed wiring
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 41
- 239000011888 foil Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 239000013067 intermediate product Substances 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 238000011437 continuous method Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 for example Chemical compound 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、電子機器等に用いられる多層プリ
ント配線板の製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a multilayer printed wiring board used in electronic devices and the like.
多層プリント配線板は、一般につぎのようにし
てつくられている。まず、内層用積層板（以下、
「内層材」と記す）、樹脂含浸基材および金属箔を
積層して積層体をつくる。内層材は内層用回路を
備えており、普通は、500×600mm程度あるいはこ
れ以下の大きさである。得られた積層体を成形用
プレスにより熱圧して多層プリント配線板中間品
をつくり、この中間品の金属箔に回路を形成して
多層プリント配線板を得る。
Multilayer printed wiring boards are generally manufactured in the following manner. First, the inner layer laminate (hereinafter referred to as
(hereinafter referred to as "inner layer material"), a resin-impregnated base material, and metal foil are laminated to form a laminate. The inner layer material includes inner layer circuitry and is typically about 500 x 600 mm or smaller in size. The obtained laminate is hot-pressed using a molding press to produce a multilayer printed wiring board intermediate product, and a circuit is formed on the metal foil of this intermediate product to obtain a multilayer printed wiring board.
前記従来の製法はバツチ式であつて、積層体を
いちいちプレス機に掛けて熱圧するようにしてい
るので生産性が悪かつた。そのため、生産性の高
い多層プリント配線板の製法が望まれていた。 The conventional manufacturing method is a batch method in which the laminate is placed in a press one by one and hot-pressed, resulting in poor productivity. Therefore, a highly productive method for manufacturing multilayer printed wiring boards has been desired.
この発明は、このような事情に鑑みてなされた
もので、連続的に製造を行うことができて生産性
の高い多層プリント配線板の製法を提供すること
を目的としている。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that can be manufactured continuously and has high productivity.
前記のような目的を達成するため、この発明
は、内層用回路を備えた内層用積層板を連続的に
供給しつつ内層用積層板の少なくとも片面に所定
枚の帯状の樹脂含浸基材、その外側に帯状の金属
箔を配置するようにしてこれらを連続的に積層
し、連続的に移行させつつ加熱する工程を含む多
層プリント配線板の製法をその要旨としている。
以下に、この発明を詳しく説明する。
In order to achieve the above object, the present invention continuously supplies an inner layer laminate having an inner layer circuit, and at least one side of the inner layer laminate is provided with a predetermined strip-shaped resin-impregnated base material; The gist of this method is a method for manufacturing a multilayer printed wiring board, which includes the steps of continuously laminating strip-shaped metal foils on the outside and heating them while continuously transferring them.
This invention will be explained in detail below.
この発明にかかる多層プリント配線板の製法の
実施例を第１図を用いて説明する。ロール１に巻
かれた帯状の基材２を含浸槽３に送り、ここで樹
脂ワニス４を含浸させて樹脂含浸基材２′をつく
る。基材としては、紙、ガラス布、ガラスマツ
ト、ガラス不織布等が用いられる。ガラス布等を
用いる場合は、あらかじめアクリルシラン等によ
り表面処理が施されているものを用いるようにす
るとよい。樹脂ワニスとしては、普通、不飽和ポ
リエステル樹脂、ジアリルフタレート樹脂、ビニ
ルエステル樹脂等の不飽和結合を有する不飽和樹
脂をビニルモノマー（架橋剤）などで希釈し、さ
らに重合開始剤を加えてつくつたものが用いられ
る。ここであげたような実質的に揮発分のない無
溶剤タイプのものを用いるようにすると、あとで
説明するように積層体を加熱炉（硬化炉）中で加
熱するとき、積層体にふくれが生じないからであ
る。このようにして得られた樹脂含浸基材２′は
上下一対のロール８，８間に連続的に送られる。
ロール８，８間には、ロール５に巻かれた帯状の
内層材６が連続的に供給されてくるので、上記樹
脂含浸基材２′はこの帯状内層材６の両面に所定
枚ずつ連続的に配置され、さらにその外側に帯状
の金属箔７が１枚ずつ配置され、ロール８，８に
より連続的に重ね合わせられて、積層体９とな
る。金属箔７は、ロール１０に巻かれており、こ
れから連続的に供給されるようになつている。必
要に応じ、遅くとも積層前に金属箔７に接着剤を
塗布しておく。金属箔としては、銅箔やアルミニ
ウム箔等が用いられ、必要に応じて、接着強度向
上の目的で表面粗化処理を施したものが用いられ
る。また、必要に応じ、遅くとも積層前に内層材
６の内層用回路に表面処理を行うようにする。表
面処理方法は、一般に多層プリント配線板用の内
層処理に用いられている方法と同じである。内層
用回路が銅箔より形成されている場合は、たとえ
ば、黒色酸化銅処理、塩化銅処理、Ｓ（イオウ）
処理等が行われる。しかし、両面を粗化した銅箔
（いわゆるDT箔）を備えた内層用銅張積層体か
らつくられた内層材を使用する場合には、内層用
回路の表面処理を全く行わなくてよい。表面処理
は、内層材をロールに巻き取る前にあらかじめ行
つておくようにしてもよいし、ロール対による積
層（一体化）の直前に連続的に行うようにしても
よい。 An embodiment of the method for manufacturing a multilayer printed wiring board according to the present invention will be described with reference to FIG. A strip-shaped base material 2 wound around a roll 1 is sent to an impregnation tank 3, where it is impregnated with a resin varnish 4 to produce a resin-impregnated base material 2'. As the base material, paper, glass cloth, glass mat, glass nonwoven fabric, etc. are used. When using glass cloth or the like, it is preferable to use one whose surface has been previously treated with acrylic silane or the like. Resin varnishes are usually made by diluting unsaturated resins with unsaturated bonds, such as unsaturated polyester resins, diallyl phthalate resins, and vinyl ester resins, with vinyl monomers (crosslinking agents) and adding polymerization initiators. things are used. If you use a solvent-free type that has virtually no volatile matter as mentioned above, the laminate will not blister when it is heated in a heating furnace (hardening furnace), as will be explained later. This is because it does not occur. The resin-impregnated base material 2' thus obtained is continuously fed between a pair of upper and lower rolls 8, 8.
Since the strip-shaped inner layer material 6 wound around the roll 5 is continuously supplied between the rolls 8 and 8, a predetermined number of sheets of the resin-impregnated base material 2' are continuously applied to both sides of the strip-shaped inner layer material 6. Further, strip-shaped metal foils 7 are placed one by one on the outside thereof, and are continuously overlapped by rolls 8, 8 to form a laminate 9. The metal foil 7 is wound around a roll 10 and is adapted to be continuously supplied from there. If necessary, an adhesive is applied to the metal foil 7 at the latest before lamination. As the metal foil, a copper foil, an aluminum foil, or the like is used, and if necessary, a surface roughening treatment is used for the purpose of improving adhesive strength. Further, if necessary, the inner layer circuit of the inner layer material 6 is subjected to surface treatment before lamination at the latest. The surface treatment method is the same as the method generally used for inner layer treatment of multilayer printed wiring boards. If the inner layer circuit is made of copper foil, for example, black copper oxide treatment, copper chloride treatment, S (sulfur) treatment, etc.
Processing etc. are performed. However, when using an inner layer material made from an inner layer copper-clad laminate with copper foil roughened on both sides (so-called DT foil), there is no need to perform any surface treatment of the inner layer circuit. The surface treatment may be performed in advance before the inner layer material is wound onto a roll, or may be performed continuously just before lamination (integration) by a pair of rolls.
このあと、得られた積層体９を加熱炉１１に送
り、ここで連続的に移行させつつ加熱硬化させ
る。硬化した積層体９′を切断場所に送り、カツ
タ等の切断装置１２により所望の大きさにこれを
切断して多層プリント配線板中間品１３を得る。 Thereafter, the obtained laminate 9 is sent to a heating furnace 11, where it is heated and cured while being continuously transferred. The cured laminate 9' is sent to a cutting site and cut into a desired size by a cutting device 12 such as a cutter to obtain an intermediate product 13 of the multilayer printed wiring board.
この発明の方法は、中間品１３を得る段階で終
了としてもよいが、普通は、つぎに、従来一般に
用いられている方法によりこの中間品１３の金属
箔に内層用回路を形成させて完成品の多層プリン
ト配線板とする。具体的には、たとえばつぎのよ
うにする。まず、スクリーン印刷法、オフセツト
印刷法、あるいは当業界で普遍的に用いられてい
るドラムフイルム（ドラムフイル）等の光感光性
のレジストを利用した写真法等により、中間品の
金属箔にエツチングレジストで所望の回路を印刷
する。つぎにエツチングを施して金属箔に回路を
形成させ、エツチングレジストを剥離させて多層
プリント配線板を得る。 The method of the present invention may be terminated at the stage of obtaining the intermediate product 13, but normally, an inner layer circuit is formed on the metal foil of the intermediate product 13 by a conventionally commonly used method to produce a finished product. Multilayer printed wiring board. Specifically, for example, do as follows. First, an etching resist is applied to the intermediate metal foil using a screen printing method, an offset printing method, or a photographic method using a photosensitive resist such as a drum film, which is commonly used in the industry. Print the desired circuit. Next, etching is performed to form a circuit on the metal foil, and the etching resist is peeled off to obtain a multilayer printed wiring board.
なお、硬化した積層体９′は、カツトしもしく
はカツトすることなく、その表面金属箔に所定の
回路を形成し、これを次の内層材として用いて前
記の方法を実施することも、この発明の範囲に含
まれる。 Note that the cured laminate 9' may be cut or not cut, a predetermined circuit may be formed on the surface metal foil, and this may be used as the next inner layer material to carry out the above method. included in the range.
ここで使用する帯状の内層材は、たとえば、つ
ぎに説明する連続法によりつくることができる。
まず、前述したのと同じ方法を用いる等して樹脂
含浸基材をつくる。つぎに、樹脂含浸基材所定枚
を連続して積層するとともに帯状の金属箔をその
少なくとも片面に連続して積層し、連続的に移行
させつつ加熱して内層材用積層板を連続的に得
る。この内層材用積層板の具体的な種類として
は、ガラス布基材ポリエステル樹脂銅張積層板、
あるいはポリエステル樹脂、ポリイミド樹脂をベ
ースとするフレキシブル銅張積層板等であつて、
片面金属箔張のものあるいは両面金属箔張のもの
があげられる。つぎに、前述したのと同様の方法
を用い、内層材用積層板の金属箔に内層用回路を
連続的に形成させて連続的に内層材を得る。 The strip-shaped inner layer material used here can be made, for example, by the continuous method described below.
First, a resin-impregnated base material is prepared, such as by using the same method as described above. Next, predetermined sheets of the resin-impregnated base material are continuously laminated, and a strip-shaped metal foil is continuously laminated on at least one side thereof, and heated while continuously transferring, to continuously obtain a laminate for the inner layer material. . Specific types of laminates for inner layer materials include glass cloth-based polyester resin copper-clad laminates,
Or flexible copper-clad laminates based on polyester resin or polyimide resin,
Examples include those with metal foil on one side or those with metal foil on both sides. Next, using the same method as described above, the inner layer circuit is continuously formed on the metal foil of the inner layer material laminate to continuously obtain the inner layer material.
この発明にかかる多層プリント配線板の製法で
は積層体をいちいちプレス機に掛けて熱圧すると
いうようなことはせず、加熱炉で連続的に移行さ
せつつ加熱硬化させるようにしているので生産性
が非常に高くなつている。 In the method for manufacturing a multilayer printed wiring board according to the present invention, the laminate is not heated and pressed one by one in a press machine, but is heated and cured while being continuously transferred in a heating furnace, which improves productivity. It's getting very expensive.
なお、前記実施例では、帯状の内層材を連続的
に供給するようにしているが、短い内層材を連続
的に供給するようにしてもよい。短い内層材を使
用するほかは第１図に示されているようにして多
層プリント配線板をつくるようにするときは、一
対のロール８，８の間に内層材をつぎつぎと供給
するようにする。短い内層材を使用する場合に
は、ガラスエポキシ金属箔張積層板、ガラスポリ
イミド金属箔張積層板等ほとんどの種類の銅張積
層板を内層材用積層板として使用することができ
るようになる。帯状のものをつくるのが困難な種
類の内層材用積層板でも用いることができるよう
になるからである。また、内層材をあらかじめ巻
き取つておく必要がないので自由に板厚を選ぶこ
ともできる。 In the above embodiment, the strip-shaped inner layer material is continuously supplied, but short inner layer materials may be continuously supplied. When manufacturing a multilayer printed wiring board as shown in FIG. 1 except for using short inner layer materials, the inner layer materials are fed one after another between the pair of rolls 8, 8. . When using a short inner layer material, most types of copper clad laminates such as glass epoxy metal foil clad laminates and glass polyimide metal foil clad laminates can be used as the inner layer laminate. This is because it becomes possible to use a type of laminate for inner layer material that is difficult to make into strips. Furthermore, since there is no need to pre-wind the inner layer material, the thickness can be freely selected.
前記実施例では、内層材の両面に樹脂含浸基材
を配置し、さらにその両外側に金属箔を配置する
ようにしているが、片面のみしか樹脂含浸基材を
配置せず、金属箔もその外側に１枚しか配置しな
い場合もあり、両面に樹脂含浸基材を配置した場
合でもその片側だけしか金属箔を配置しない場合
もある。 In the above example, the resin-impregnated base material is placed on both sides of the inner layer material, and the metal foil is placed on both outside sides, but the resin-impregnated base material is placed only on one side, and the metal foil is In some cases, only one sheet of metal foil is placed on the outside, and in some cases, even if resin-impregnated base materials are placed on both sides, metal foil is placed only on one side.
前記実施例では、硬化した積層体を所望の大き
さに切断したあと金属箔に回路を形成させるよう
にしているが、硬化した積層体の金属箔に回路を
形成させたあと所望の大きさに切断するようにす
る場合もありうる。 In the above embodiment, the circuit is formed on the metal foil after cutting the cured laminate into the desired size. In some cases, it may be necessary to disconnect it.
つぎに、より具体的な実施例について説明す
る。 Next, more specific examples will be described.
連続法により、連続的に製造されたガラス布基
材ポリエステル樹脂銅張積層板（0.2mm厚）に、
スクリーン印刷法によりエツチングレジストで回
路を連続的に印刷した。つぎに、積層板の金属箔
を連続的にエツチングして銅箔に内層用回路を形
成し、連続的にエツチングレジストの剥離を行つ
た。そして、内層用回路表面処理としての黒色酸
化銅処理を連続的に施し、さらに、水洗、乾燥を
行つて内層材をつくり、これをロールに巻き取つ
た。このあと、第１図に示されているようにして
多層プリント配線板をつくつた。すなわち、ロー
ルから内層材を連続して繰り出しつつ、この内層
材の上下に、不飽和ポリエステル樹脂を含浸させ
たガラス布を２枚ずつおよび接着強度向上の目的
で表面粗化処理が施された銅箔を１枚ずつ連続的
に供給し、一対のロールで連続的に積層一体化し
て積層体を得た。この積層体を加熱炉（硬化炉）
に導き、連続的に移行させつつ加熱を行つて不飽
和ポリエステル樹脂を硬化させた。つぎに、硬化
した積層体の所定の大きさに切断し、多層プリン
ト配線板中間品を得た。この中間品にドリルマシ
ンによつて穴をあけ、銅めつきを施し、写真法に
よりエツチングレジストを形成し、さらに、エツ
チングを施し、エツチングレジストの剥離を行つ
て多層プリント配線板を得た。 A glass cloth base polyester resin copper clad laminate (0.2 mm thick) manufactured continuously using a continuous method,
The circuit was printed continuously with etching resist by screen printing method. Next, the metal foil of the laminate was continuously etched to form an inner layer circuit on the copper foil, and the etching resist was continuously removed. Then, a black copper oxide treatment was continuously applied as a circuit surface treatment for the inner layer, followed by washing with water and drying to produce an inner layer material, which was wound into a roll. Thereafter, a multilayer printed wiring board was fabricated as shown in FIG. In other words, while the inner layer material is continuously fed out from a roll, two pieces of glass cloth impregnated with unsaturated polyester resin are placed on top and bottom of the inner layer material, and copper cloth that has been surface roughened to improve adhesive strength is placed on top and bottom of the inner layer material. The foils were continuously fed one by one and continuously laminated and integrated using a pair of rolls to obtain a laminate. This laminate is heated in a heating furnace (hardening furnace)
The unsaturated polyester resin was cured by heating with continuous transfer. Next, the cured laminate was cut into a predetermined size to obtain an intermediate product of a multilayer printed wiring board. Holes were drilled in this intermediate product using a drill machine, copper plating was applied, an etching resist was formed using a photographic method, etching was performed, and the etching resist was peeled off to obtain a multilayer printed wiring board.
この発明にかかる多層プリント配線板の製法で
は、内層用回路を備えた内層用積層板を連続的に
供給しつつ内層用積層板の少なくとも片面に所定
枚の帯状の樹脂含浸基材、その外側に帯状の金属
箔を配置するようにしてこれらを連続的に積層
し、連続的に移行させつつ加熱する工程を含むの
で、連続的に製造を行うことができて生産性が高
い。
In the method for manufacturing a multilayer printed wiring board according to the present invention, while continuously supplying an inner layer laminate having an inner layer circuit, a predetermined strip-shaped resin-impregnated base material is placed on at least one side of the inner layer laminate, and the outside thereof is Since the method includes a step of continuously stacking strip-shaped metal foils and heating them while continuously transferring them, manufacturing can be performed continuously and productivity is high.
第１図は、この発明にかかる多層プリント配線
板の製法の説明図である。
２′……樹脂含浸基材、６……内層用積層板
（内層材）、７……金属箔。
FIG. 1 is an explanatory diagram of a method for manufacturing a multilayer printed wiring board according to the present invention. 2'... Resin-impregnated base material, 6... Inner layer laminate (inner layer material), 7... Metal foil.
Claims (1)
供給しつつ内層用積層板の少なくとも片面に所定
枚の帯状の樹脂含浸基材、その外側に帯状の金属
箔を配置するようにしてこれらを連続的に積層
し、連続的に移行させつつ加熱する工程を含む多
層プリント配線板の製法。 ２ 内層用積層板が帯状体である特許請求の範囲
第１項記載の多層プリント配線板の製法。[Scope of Claims] 1. While continuously supplying an inner layer laminate having an inner layer circuit, a predetermined strip-shaped resin-impregnated base material is provided on at least one side of the inner layer laminate, and a strip-shaped metal foil is coated on the outer side of the inner layer laminate. A method for manufacturing a multilayer printed wiring board, which includes a step of successively laminating these layers in a manner such that they are arranged, and heating them while continuously transferring them. 2. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the inner layer laminate is a strip-shaped body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22760583A JPS60119796A (en) | 1983-11-30 | 1983-11-30 | Method of producing multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22760583A JPS60119796A (en) | 1983-11-30 | 1983-11-30 | Method of producing multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60119796A JPS60119796A (en) | 1985-06-27 |
| JPH043119B2 true JPH043119B2 (en) | 1992-01-22 |
Family
ID=16863557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22760583A Granted JPS60119796A (en) | 1983-11-30 | 1983-11-30 | Method of producing multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119796A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2544726B2 (en) * | 1986-06-14 | 1996-10-16 | 松下電工株式会社 | Manufacturing method of multilayer printed wiring board |
| JPS6310593A (en) * | 1986-07-02 | 1988-01-18 | 松下電工株式会社 | Manufacture of multilayer printed interconnection board |
| JPS63104806A (en) * | 1986-10-21 | 1988-05-10 | Shin Kobe Electric Mach Co Ltd | Manufacture of multi-layer board |
-
1983
- 1983-11-30 JP JP22760583A patent/JPS60119796A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60119796A (en) | 1985-06-27 |
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