JPH0433261B2 - - Google Patents
Info
- Publication number
- JPH0433261B2 JPH0433261B2 JP10829182A JP10829182A JPH0433261B2 JP H0433261 B2 JPH0433261 B2 JP H0433261B2 JP 10829182 A JP10829182 A JP 10829182A JP 10829182 A JP10829182 A JP 10829182A JP H0433261 B2 JPH0433261 B2 JP H0433261B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- temperature
- disk
- annular
- temperature control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 230000035882 stress Effects 0.000 description 8
- 239000003507 refrigerant Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
- B29C2045/2644—Heating or cooling means therefor for the outer peripheral ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C2045/2648—Outer peripheral ring constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明はデイスク状成形品、特に光学式情報記
録デイスクを射出成形するための金型の温度調節
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a temperature control device for a mold for injection molding disc-shaped molded products, particularly optical information recording discs.
従来、この種の装置としては、第1図および第
2図(第1図のA−A矢視断面図)に示すような
ものがあつた。 Conventionally, there have been devices of this type as shown in FIGS. 1 and 2 (cross-sectional view taken along the line A--A in FIG. 1).
第1〜第2図において、20は第一金型、30
は第二金型であり、第一金型20と第二金型30
との間にキヤビテイ空間40が形成されている。 In FIGS. 1 and 2, 20 is the first mold, 30
is the second mold, and the first mold 20 and the second mold 30
A cavity space 40 is formed between the two.
また50b,60b,70bはそれぞれ冷却水
の環状流路であり、冷却水入口50a、環状流路
50bおよび冷却水出口50cによつて第一冷却
区域が形成され、同様にして冷却水入口60a,
70a、環状流路60b,70bおよび冷却水出
口60c,70cによつて第二(第三)冷却区域
が形成されている。 Further, 50b, 60b, and 70b are annular flow paths for cooling water, respectively, and a first cooling area is formed by the cooling water inlet 50a, the annular flow path 50b, and the cooling water outlet 50c, and similarly, the cooling water inlet 60a,
70a, annular channels 60b, 70b and cooling water outlets 60c, 70c form a second (third) cooling zone.
このような複数個の渦巻型冷却流路によつて、
キヤビテイ空間40全体にわたつて一様な温度に
保ち、成形品の熱による残留応力を低減するよう
に図つていた。 With such multiple spiral cooling channels,
An attempt was made to maintain a uniform temperature throughout the cavity space 40 to reduce residual stress due to heat in the molded product.
しかしながら、このような従来の温度調節装置
では、成形品のほぼ全体にわたつて残留応力を低
減させることができるものの、最外周端部につい
ては金型との接触面積が大きいため、溶融樹脂の
冷却速度の差から残留応力およびその内周部のひ
けが生じる等の欠点があつた。 However, although such conventional temperature control devices can reduce residual stress over almost the entire molded product, the outermost edge has a large contact area with the mold, so it is difficult to cool the molten resin. There were drawbacks such as residual stress and sink marks on the inner periphery due to the difference in speed.
特に、光学式情報記録デイスクのような薄肉成
形では、射出圧力が高いときには外周端部付近の
樹脂に密度勾配ができ、樹脂密度差から冷却時に
生じる残留応力も加わつて複屈折およびひけのた
めに外周部の信号読取りに悪影響を及ぼしてい
た。(光学式デイスクにあつては成形されたデイ
スクが読取ビームの光路の一部となる。)
また、ひけは信号面の保護膜コーテイングに支
障をきたし、残留応力は経時変化による最外周の
クラツクの原因となつた。 In particular, in thin-walled molding such as optical information recording disks, when the injection pressure is high, a density gradient is created in the resin near the outer peripheral edge, and residual stress generated during cooling is added to the resin density difference, resulting in birefringence and sink marks. This had a negative effect on signal reading on the outer periphery. (In the case of optical disks, the molded disk becomes part of the optical path of the reading beam.) In addition, sink marks can interfere with the protective film coating on the signal surface, and residual stress can cause cracks on the outermost periphery due to aging. It became the cause.
残留応力やひけを低減する手段として、金型の
温度調節による以外に、金型の外周部に間隙を設
けて樹脂を逃がしたり、成形品外周部の肉厚を増
加させるなどの手段が考えられる。しかし、これ
らの手段では成形品の形状変更および後加工が必
要となるため、好ましくない。 In addition to controlling the temperature of the mold, possible ways to reduce residual stress and sink marks include creating a gap around the outside of the mold to allow the resin to escape, and increasing the wall thickness around the outside of the molded product. . However, these methods are not preferable because they require changing the shape of the molded product and post-processing.
参考のため、従来の温度調節装置において設定
温度100℃とした場合の金型のキヤビテイ空間4
0表面温度の測定結果を記す。 For reference, the cavity space 4 of the mold when the temperature is set at 100℃ using a conventional temperature control device.
The measurement results of the zero surface temperature are shown below.
デイスク内周部 83℃
デイスク中周部 84℃
デイスク外周部 85℃
デイスク最外周端部を形成する環状部材 81℃
最外周端部を形成する環状部材においては、溶
融樹脂と金型との接触面積が大きいこと等からキ
ヤビテイ表面温度が他部に比べて数℃低いことが
わかる。Inner circumference of the disk 83℃ Middle circumference of the disk 84℃ Outer circumference of the disk 85℃ Annular member forming the outermost edge of the disk 81℃ In the annular member forming the outermost edge, the contact area between the molten resin and the mold It can be seen that the cavity surface temperature is several degrees lower than that of other parts because of the large value.
本発明の目的は、上記従来の技術の欠点を克服
し、成形品の最外周端部付近の残留応力、ひけ、
および複屈折を低減することのできる温度調節装
置を提供することにある。 An object of the present invention is to overcome the drawbacks of the above-mentioned conventional techniques, and to reduce residual stress, sink marks, etc. near the outermost peripheral edge of a molded product.
Another object of the present invention is to provide a temperature control device that can reduce birefringence.
以下、図によつて本発明を具体的に説明する。 Hereinafter, the present invention will be specifically explained with reference to the drawings.
第3図は本発明の一実施例よりなる温度調節装
置の断面図、第4図は他の実施例よりなる同装置
の断面図である。 FIG. 3 is a sectional view of a temperature control device according to one embodiment of the present invention, and FIG. 4 is a sectional view of the same device according to another embodiment.
第3図において、1は第一金型、2は第二金
型、3は第一金型1および第二金型2によつて形
成されるキヤビテイ空間、4は第一金型1の温度
調節用冷媒流路、5は第二金型2の温度調節用冷
媒流路、6はスタンパー、7はデイスク最外周端
面と接触する環状金型部材、8はキヤビテイ外周
端部の金型面9はエア・ギヤツプおよび10は環
状金型部材7の温度調節用冷媒流路である。11
はブツシユであり溶融樹脂をキヤビテイ空間3に
流入するためのスピール12が形成されている。
環状金型部材7の外周端部は第一金型1と、密着
させることも可能であるが、必要に応じエア・ギ
ヤツプ13を設け、エア・ギヤツプ9と同様に環
状金型部材7を熱的に遮断してもよい。 In FIG. 3, 1 is the first mold, 2 is the second mold, 3 is the cavity space formed by the first mold 1 and the second mold 2, and 4 is the temperature of the first mold 1. Reference numeral 5 designates a temperature control refrigerant flow path of the second mold 2, 6 a stamper, 7 an annular mold member that contacts the outermost peripheral end surface of the disk, and 8 a mold surface 9 at the outer peripheral end of the cavity. 1 is an air gap, and 10 is a coolant flow path for controlling the temperature of the annular mold member 7. 11
is a bush, and a spill 12 for flowing molten resin into the cavity space 3 is formed.
Although it is possible to bring the outer peripheral end of the annular mold member 7 into close contact with the first mold 1, if necessary, an air gap 13 may be provided to heat the annular mold member 7 in the same manner as the air gap 9. It may be blocked.
このような構成よりなる金型の温度調節装置を
用いれば、まず温度調節用冷媒流路4,5を流れ
る冷媒によつて、キヤビテイ空間3の表面温度を
前面にわたつて一様な温度に保ことができる。こ
のことは本発明も第1図及び第2図に示すデイス
クの平面部を冷却する構成をそのまま包含してい
ることに基いている。しかしながら本発明はさら
に、環状冷媒流路10を流れは独立した冷媒によ
つて、デイスク最外周端面と接触する環状金型部
材7も温度調節される。したがつて、キヤビテイ
外周端部の金型面8を他のキヤビテイ表面と略同
一の温度に保つことができることは勿論、場合に
よつては異なつた温度に保つことができる。 If a mold temperature control device having such a configuration is used, first, the surface temperature of the cavity space 3 is maintained at a uniform temperature across the front surface by the refrigerant flowing through the temperature control refrigerant channels 4 and 5. be able to. This is based on the fact that the present invention also includes the structure for cooling the flat surface of the disk shown in FIGS. 1 and 2 as is. However, in the present invention, the temperature of the annular mold member 7 in contact with the outermost peripheral end surface of the disk is also controlled by the independent refrigerant flowing through the annular refrigerant flow path 10. Therefore, it goes without saying that the mold surface 8 at the outer peripheral end of the cavity can be kept at substantially the same temperature as the other cavity surfaces, but can also be kept at a different temperature depending on the case.
なお、上記実施例では環状金型部材7の温度調
節を環状流路10に冷媒を流すことによつて行な
つているが、第4図のようにバンドヒータ14に
よつて環状金型部材7のみを加熱するようにして
もよい。また、環状金型部材7と第二金型2との
接触部分に溶融樹脂が流出しない程度に数ミクロ
ンのギヤツプ15を設けて、熱絶縁効果をあげる
こともできる(このことは第3図における実施例
の場合も同様である。)。さらに、エア・ギヤツプ
9,13の代りに断熱材料によるパツキンを用い
てもよい。 In the above embodiment, the temperature of the annular mold member 7 is adjusted by flowing a coolant through the annular channel 10, but as shown in FIG. It is also possible to heat only the Furthermore, a gap 15 of several microns may be provided at the contact portion between the annular mold member 7 and the second mold 2 to the extent that the molten resin does not flow out, thereby increasing the thermal insulation effect (this is shown in FIG. 3). The same applies to the examples.) Furthermore, instead of the air gaps 9, 13, packings made of a heat insulating material may be used.
以上説明したように、本発明の温度調節装置は
上記構成からなるため、デイスク最外周端面と接
触する環状金型部材の温度を独立に調節すること
ができ、したがつて成形品最外周端部の残留応力
とそれに伴う複屈折および内周部に生じるひけを
低減することができる。 As explained above, since the temperature control device of the present invention has the above configuration, it is possible to independently adjust the temperature of the annular mold member that comes into contact with the outermost peripheral end surface of the disk, and therefore It is possible to reduce the residual stress, the accompanying birefringence, and the sink mark that occurs on the inner periphery.
第1図は従来の温度調節装置の断面図、第2図
は第1図のA−A矢視断面図、第3図は本発明の
一実施例よりなる温度調節装置の断面図および第
4図は他の実施例よりなる同装置の断面図であ
る。
1……第一金型、2……第二金型、3……キヤ
ビテイ空間、4,5……温度調節用冷媒流路、7
……環状金型部材、10……温度調節用冷媒流
路、14……バンドヒータ。
FIG. 1 is a sectional view of a conventional temperature control device, FIG. 2 is a sectional view taken along the line A-A in FIG. The figure is a sectional view of the same device according to another embodiment. DESCRIPTION OF SYMBOLS 1...First mold, 2...Second mold, 3...Cavity space, 4, 5...Refrigerant channel for temperature adjustment, 7
... Annular mold member, 10 ... Refrigerant channel for temperature adjustment, 14 ... Band heater.
Claims (1)
の温度調節装置であつて、デイスク最外周端面と
接触する環状金型部材に、デイスク平面部の冷却
手段とは独立した温度調節手段を設けたことを特
徴とする射出成形用金型の温度調節装置。1. A temperature control device for a mold for injection molding a disk-shaped molded product, in which a temperature control means independent of the cooling means for the flat surface of the disk is provided in the annular mold member that comes into contact with the outermost peripheral end surface of the disk. A temperature control device for an injection mold, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10829182A JPS58224730A (en) | 1982-06-25 | 1982-06-25 | Temperature adjusting device of mold for injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10829182A JPS58224730A (en) | 1982-06-25 | 1982-06-25 | Temperature adjusting device of mold for injection molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58224730A JPS58224730A (en) | 1983-12-27 |
| JPH0433261B2 true JPH0433261B2 (en) | 1992-06-02 |
Family
ID=14480946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10829182A Granted JPS58224730A (en) | 1982-06-25 | 1982-06-25 | Temperature adjusting device of mold for injection molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58224730A (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60166433A (en) * | 1984-02-10 | 1985-08-29 | Shigeru Tsutsumi | Method and apparatus for injection-molding synthetic resin |
| JPS60187034U (en) * | 1984-05-23 | 1985-12-11 | 株式会社テクノプラス | Outer mounting structure of stamper for forming disc-shaped recording media |
| JPS6287812U (en) * | 1985-11-22 | 1987-06-04 | ||
| JPS62214914A (en) * | 1986-03-17 | 1987-09-21 | Mitsubishi Metal Corp | Transfer molding and mold therefor |
| FR2649640B1 (en) * | 1989-07-13 | 1991-09-20 | Sistac Sa B | LOCALIZED COOLING DEVICE FOR THERMOPLASTIC INJECTION MOLDS |
| JP2524885Y2 (en) * | 1991-02-25 | 1997-02-05 | ティーディーケイ株式会社 | Injection mold |
| JPH06285937A (en) * | 1993-03-31 | 1994-10-11 | Seikosha Co Ltd | Injection molding machine |
| EP0846542B1 (en) * | 1996-12-04 | 2003-03-19 | Sony DADC Austria AG | Method of and apparatus for injection moulding a plastic substrate using a plurality of separate temperature adjusting means |
| NL1005502C2 (en) * | 1997-03-12 | 1998-09-15 | Ict Axxicon Bv | Die for manufacturing disc-shaped objects. |
| NL1016726C2 (en) * | 2000-11-29 | 2002-05-31 | Otb Group Bv | Injection molding method, has temperature of ring around first mold section regulated in order to control distance of gap between ring and mold section |
| DE50310139D1 (en) * | 2002-03-25 | 2008-08-28 | Awm Mold Tech Ag | Injection molding tool for the production of disc-shaped information carriers |
| NL1027454C2 (en) * | 2004-11-09 | 2006-05-10 | F T Engineering B V | Injection molding die component useful in the manufacture of optical data carriers comprises a venting ring that surrounds a central part with a gap dependent on the axial position of the ring |
| CN108326144A (en) * | 2018-01-10 | 2018-07-27 | 东风商用车有限公司 | Drive axle end cover hot stamping forming die and manufacturing method thereof |
| JP7413968B2 (en) * | 2020-10-09 | 2024-01-16 | トヨタ自動車株式会社 | mold cooling structure |
-
1982
- 1982-06-25 JP JP10829182A patent/JPS58224730A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58224730A (en) | 1983-12-27 |
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