JPH043673B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing an electronic circuit device in which electronic components are mounted on a circuit board.

[Prior Art] Since there has been a demand for miniaturization of electronic circuit devices used in automobiles, for example, electronic components have been mounted on very small circuit boards. . As an example of a method for manufacturing such an electronic circuit device, conventionally, a process of punching a plurality of circuit boards into predetermined shapes from a large-sized printed wiring board is carried out, and at the same time, once the circuit boards are stamped in this way, The cut out circuit boards are returned to their original positions before punching, and in this state, electronic components are mounted on each circuit board and soldered using an automatic mounting machine and an automatic soldering machine. After that, the circuit board is removed again to complete the electronic circuit device, thereby improving productivity by employing a so-called pushback board. However, with this configuration, distortion during the punching process of the circuit board remains in the printed wiring board and the sheared part of the circuit board, so when the once punched circuit board is returned to its original position on the printed wiring board (i.e., the so-called When performing a pushback), the circuit board may not be placed exactly in its original position, resulting in the two being at different levels. However,
In such a situation, during the process of mounting electronic components on a circuit board using an automatic mounting machine, the accuracy of the mounting position in the height direction is not achieved, resulting in misalignment of the mounting position of the electronic component, which may result in poor soldering, etc. There was a problem with circuit failure accidents occurring.

[Object of the Invention] The present invention has been made to solve the above-mentioned conventional problems, and its purpose is to reduce the number of steps and have excellent manufacturability, and also to prevent misalignment of the mounting position of electronic components. In addition to effectively preventing circuit failure accidents caused by poor soldering, it also reduces the impact when separating the circuit board from the printed wiring board, suppressing negative effects on electronic components. An object of the present invention is to provide an effective method for manufacturing an electronic circuit device.

[Summary of the Invention] In order to achieve the above object, the present invention is configured such that a plurality of circuit boards for mounting electronic components can be trimmed, and each circuit board is located at a different distance from the periphery. A printed wiring board having a shape integrated with a plurality of bridge parts is prepared, the bridge part of this printed wiring board is formed narrower than the circuit board, and a row of through holes is formed in this bridge part. forming and mounting electronic components corresponding to the circuit board on the printed wiring board; pressing a portion of each circuit board adjacent to the bridge portion from both the front and back surfaces thereof; and the through hole in the bridge portion. The step of separating the circuit board by cutting the row portions with punches corresponding to the respective through hole rows is performed sequentially.

[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, reference numeral 1 denotes an electronic circuit device for use in automobiles, for example, which is constructed by mounting a large number of electronic components 3 on a circuit board 2 having a special shape.The manufacturing method thereof will be described below. state

In FIG. 2, reference numeral 4 denotes a relatively large printed wiring board, on which a plurality of circuit boards 2 (three in the figure) are placed at different distances from the periphery of the printed wiring board 4. It is formed so that it can be trimmed via the plurality of bridge parts 5, 5, . . . A predetermined wiring pattern (not shown) is formed in advance on the back surface of each circuit board 2, and a plurality of perforation-like through-hole rows 6 are formed in advance in each bridge portion 5 as shown in the figure. has been done. Then, for such printed wiring board 4,
As shown in FIG. 3, the electronic components 3 corresponding to each circuit board 2 are mounted using an automatic mounting machine, and the electronic components 3 are soldered using an automatic soldering machine.

The electronic circuit device 2 described above is obtained by separating each circuit board 2 at the bridge portion 5 from the state shown in FIG. A press mold for separating the substrate 2 by cutting is shown. That is, FIG. 4 shows a lower mold 7, and this lower mold 7 has an escape hole having a shape that is slightly smaller than the circuit board 2 and into which the electronic component can fit. A recess 7a is formed, and each through hole row 6 in the printed wiring board 4
Punch holes 7b are formed in portions corresponding to the respective holes. Further, FIG. 5 shows the upper mold 8,
This upper die 8 has a punch 8a that can be slid up and down.
is provided in the lower die 7 at a position corresponding to the punch hole 7b. Therefore, in order to cut the bridge portion 5 of the printed wiring board 4 using the lower die 7 and the upper die 8, first place the printed wiring board 4 on the lower die 7 on its back side (the side with the printed wiring pattern). Place the electronic components in the escape hole 7.
Position it within a. In this state, the peripheral edge of each circuit board 2 on the printed wiring board 4 is
It is supported by the periphery of the relief hole 7a in the. After this,
The upper die 8 is lowered with the punch 8a retracted, and the printed wiring board 4 is sandwiched between it and the lower die 7. Then, the portion of each circuit board 2 adjacent to the bridge portion 5 is pressed from both the front and back surfaces and is firmly supported. Thereafter, the punch 8a is delivered to cut the through hole row 6 portion of the bridge portion 5, thereby completing the electronic circuit device 1.

According to the present embodiment described above, since the electronic component 3 is mounted before the circuit board 2 is separated from the printed wiring board 4, the electronic component 3 is mounted on the circuit board 2 by an automatic mounting machine. When mounting the electronic component 3, it is possible to achieve sufficient accuracy in the height direction, and there is no deviation in the mounting position of the electronic component 3 unlike in the conventional pushback board method. This also eliminates the possibility of soldering defects caused by. Of course, in this case, one printed wiring board 4 can be connected to a plurality of boards (three in this embodiment).
2) circuit boards 2 can be obtained, and since the conventional push-back process is not required, productivity can be sufficiently improved. Further, in this embodiment, when cutting the circuit board 2 at the bridge part 5, the portion of each circuit board 2 adjacent to the bridge part 5 is pressed from both the front and back sides, so that the impact during cutting is reduced. There is no possibility that the electronic components 3 will be adversely affected by the absorption, and therefore there is no practical problem. Moreover, since the circuit board 2 is cut by the perforation-like through-hole array 6, the impact during cutting can be reduced from this aspect as well, and the situation where the circuit board 2 is cracked during cutting can be reduced. can be effectively prevented. Of course, when the circuit board 2 is cut at the perforation-like through hole row 6 in the bridge portion 5, the force acting on the punch 8a can be reduced, thereby cutting the mold (upper mold). 8) The lifespan of the product will be improved.

[Effects of the Invention] According to the present invention, as is clear from the above description, in a method for manufacturing an electronic circuit device in which electronic components are mounted on a circuit board, the present invention has excellent manufacturability,
Furthermore, it is possible to reliably prevent the mounting position of electronic components from shifting, and it is also possible to effectively prevent the electronic components from being adversely affected or cracks from occurring on the circuit board when the circuit board is separated from the printed wiring board. Moreover, it is possible to achieve effects such as prolonging the life of the mold used in the above-mentioned cutting process.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention; FIG. 1 is a perspective view of an electronic circuit device, FIG. 2 is a plan view of a printed wiring board, and FIG. 3 is a printed wiring board with electronic components mounted thereon. Plan view, Figures 4 and 5
The figures are a plan view of a lower die and a bottom view of an upper die for cutting circuit boards, respectively. In the figure, 1 is an electronic circuit device, 2 is a circuit board, and 3
4 is an electronic component, 4 is a printed wiring board, 5 is a bridge portion, 6 is a row of through holes, 7 is a lower die, 7a is an escape recess (escape hole), 8 is an upper die, and 8a is a punch.

Claims (1)

[Claims] 1. A method for manufacturing an electronic circuit device in which electronic components are mounted on a circuit board, the circuit board being configured such that a plurality of the circuit boards can be trimmed, and each circuit board being positioned at a different distance from the periphery. In the manufacturing method of an electronic circuit device using a printed wiring board integrally formed with a plurality of bridge parts, the bridge part is formed to be narrower than the circuit board, and forming a row of through holes in the printed wiring board and mounting electronic components corresponding to the circuit board on the printed wiring board; placing the printed wiring board on a mold provided with relief holes, and placing the electronic components in the relief holes; a step of placing the components in a positioned state, a step of pressing the portions of each circuit board adjacent to the bridge portion from both the front and back surfaces thereof, and a step of pressing the through hole row portions of the bridge portions thereof. A method of manufacturing an electronic circuit device comprising the step of separating the circuit board by cutting with a punch corresponding to each row of through holes.