JPH0438160B2 - - Google Patents
Info
- Publication number
- JPH0438160B2 JPH0438160B2 JP60083515A JP8351585A JPH0438160B2 JP H0438160 B2 JPH0438160 B2 JP H0438160B2 JP 60083515 A JP60083515 A JP 60083515A JP 8351585 A JP8351585 A JP 8351585A JP H0438160 B2 JPH0438160 B2 JP H0438160B2
- Authority
- JP
- Japan
- Prior art keywords
- metal core
- board
- printed wiring
- metal
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、熱伝導率の良い金属板を有する多
層金属芯入り印刷配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a multilayer metal core printed wiring board having a metal plate with good thermal conductivity.
第２図は、例えば電気通信学会CPM78−32、
図−１４に開示されたものと類似の構造をする従
来の多層金属芯入り印刷配線板を示す断面図であ
る。図において、１，２は電気部品、３は金属芯
（金属板）、４，５，６，７は多層基板構成用の樹
脂基板、８は金属芯３を露出するために設けた削
除部分、９はスルーホールめつき穴、１０は導体
部品、１１はプリプレグである。
Figure 2 shows, for example, IEICE CPM78-32,
15 is a cross-sectional view showing a conventional multilayer metal core printed wiring board having a structure similar to that disclosed in FIG. 14. FIG. In the figure, 1 and 2 are electrical components, 3 is a metal core (metal plate), 4, 5, 6, and 7 are resin substrates for multilayer board configuration, 8 is a removed portion provided to expose the metal core 3, 9 is a through-hole plating hole, 10 is a conductor component, and 11 is a prepreg.
次に、上記第２図に示す従来の多層金属芯入り
印刷配線板の構造とその作用について説明する。
電気部品１のリード１ａはスルーホールめつき穴
９にはんだ付けされており、電気部品２は削除部
分８に取り付けられている。多層金属芯入り印刷
配線板（多層金属芯基板）は、導体部分１０と多
層基板構成用の各樹脂基板４〜７により６層配線
構造に構成されている。各電気部品１，２にて生
じた熱は、主として各樹脂基板４及び５、プリプ
レグ１１を通過して金属芯３に伝導し、さらに、
金属芯３を熱経路として冷却部へ伝わり放熱す
る。また、各電気部品１，２から発生した熱は拡
散することにより、各基板全表面から放熱するも
のである。 Next, the structure and operation of the conventional multilayer metal core printed wiring board shown in FIG. 2 will be explained.
The lead 1a of the electrical component 1 is soldered to the through-hole plating hole 9, and the electrical component 2 is attached to the removed portion 8. The multilayer metal core printed wiring board (multilayer metal core board) has a six-layer wiring structure including a conductor portion 10 and resin substrates 4 to 7 for forming the multilayer board. The heat generated in each electrical component 1 and 2 mainly passes through each resin substrate 4 and 5 and prepreg 11 and is conducted to the metal core 3.
The heat is transmitted to the cooling part using the metal core 3 as a heat path and is radiated. Furthermore, the heat generated from each of the electrical components 1 and 2 is radiated from the entire surface of each board by being diffused.
上記のような従来の多層金属芯入り印刷配線板
では、電気部品１と金属芯３間には熱伝導率の低
い各樹脂基板４，５の２層（例えば、厚さ約0.7
〜0.9mmで構成される）が存在しており、熱抵抗
が比較的に高い。そして、このような熱抵抗を下
げるためには、第２図に示すごとく各樹脂基板
４，５に削除部分８を形成するように樹脂の削除
加工を必要とし、この結果、この削除部分８には
印刷配線を設けることができず、配線部が減少す
るという問題点があつた。また、各電気部品１，
２と金属芯３間の熱抵抗を下げるために、例えば
部品面Ａと金属芯３間は導体層２層と樹脂基板１
層とし、金属芯３とはんだ付け面Ｂは導体層４層
と樹脂基板２層として多層基板を構成すれば、こ
の場合には、各構成体の厚みが異なつて、これら
の構成体を形成する各基板に反りが生じる等の問
題点があつた。
In the conventional printed wiring board with a multilayer metal core as described above, two layers of resin substrates 4 and 5 with low thermal conductivity (for example, a thickness of about 0.7
~0.9mm) and has a relatively high thermal resistance. In order to lower such thermal resistance, it is necessary to remove the resin so as to form a removed portion 8 on each resin substrate 4, 5 as shown in FIG. However, there was a problem in that printed wiring could not be provided, and the number of wiring sections was reduced. In addition, each electrical component 1,
2 and the metal core 3, for example, between the component surface A and the metal core 3, there are two conductor layers and the resin substrate 1.
If the metal core 3 and the soldering surface B constitute a multilayer board with four conductor layers and two resin substrate layers, in this case, the thickness of each component will be different to form these components. There were problems such as warping of each board.
この発明は、かかる問題点を解決するためにな
されたもので、電気部品と金属芯間の熱抵抗を低
くでき、さらに、配線部に削除部分を設けること
がないので、配線領域を損なうことがない多層金
属芯入り印刷配線板を得ることを目的とする。 This invention was made to solve these problems, and it is possible to lower the thermal resistance between the electrical component and the metal core.Furthermore, since there is no need to cut out parts in the wiring section, the wiring area can be prevented from being damaged. The objective is to obtain a printed wiring board with a multilayer metal core.
この発明に係る多層金属芯入り印刷配線板は、
部品面側とはんだ付け面側とにそれぞれ設けた熱
伝導の良い２枚の金属板の両外側及び両金属板間
に、印刷配線回路を形成することにより多層構成
で、かつ部品面側の金属板と配線回路基板を含む
構成体と、はんだ付け面側の金属板と配線回路基
板を含む構成体とをそれぞれ上下対称の構造とし
たものである。
The printed wiring board with a multilayer metal core according to the present invention includes:
A printed wiring circuit is formed between the two metal plates with good thermal conductivity on the component side and the soldering side, respectively, on both sides, and between the two metal plates. A structure including a board and a printed circuit board, and a structure including a metal plate on the soldering surface side and a printed circuit board are vertically symmetrical.
この発明の多層金属芯入り印刷配線板において
は、熱伝導の良い２枚の金属板を部品面側とはん
だ付け面側とにそれぞれ設けて対称構造に構成し
たので、両構成体を形成する各基板の反りが生じ
なくなり、また、電気部品と金属板間の距離を短
くして熱抵抗を低くできるので、配線部に削除部
分を設けることがなくなり、このため、配線領域
をより一層多く確保できる。
In the printed wiring board with a multilayer metal core according to the present invention, two metal plates with good thermal conductivity are provided on the component side and the soldering side, respectively, to form a symmetrical structure. Since the board does not warp, and the distance between the electrical components and the metal plate can be shortened to lower thermal resistance, there is no need to cut out parts in the wiring area, which allows more wiring area to be secured. .
第１図はこの発明の一実施例である多層金属芯
入り印刷配線板を示す断面図である。図におい
て、１は電気部品、１ａはリード、３ａは部品面
Ａ側の金属芯（金属板）、３ｂははんだ付け面Ｂ
側の金属芯（金属板）、４は部品面Ａ側の外層基
板用の樹脂基板、５，６は各金属芯３ａ，３ｂ間
に設けた内層基板用の樹脂基板、７ははんだ付け
面Ｂ側の外層基板用の樹脂基板、９はスルーホー
ルめつき穴、１０は導体部分、１１はプリプレ
グ、１２内層基板用の各樹脂基板５，６間を接続
するスルーホール（インナーバイアホール又は多
重スルーホールと呼ばれているが、ここでは、多
重スルーホールと呼称する）、１３は部品面Ａ側
の外層基板用の樹脂基板４と部品面Ａ側の金属芯
３ａ及び内層基板用の樹脂基板５を含む部品面Ａ
側の構成体、１４ははんだ付け面Ｂ側の外層基板
用の樹脂基板７とはんだ付け面Ｂ側の金属芯３ｂ
及び内層基板用の樹脂基板６を含むはんだ付け面
Ｂ側の構成体である。
FIG. 1 is a sectional view showing a printed wiring board with a multilayer metal core, which is an embodiment of the present invention. In the figure, 1 is an electrical component, 1a is a lead, 3a is a metal core (metal plate) on the component surface A side, and 3b is a soldering surface B
4 is a resin board for the outer layer board on the component side A side, 5 and 6 are resin boards for the inner layer board provided between each metal core 3a and 3b, 7 is the soldering surface B 9 is a through-hole plating hole, 10 is a conductor part, 11 is a prepreg, 12 is a through hole (inner via hole or multiple through hole) connecting each resin board 5 and 6 for the inner layer board. 13 is a resin board 4 for the outer layer board on the component side A side, a metal core 3a on the component side A side, and a resin board 5 for the inner layer board. Part side A containing
The side structure 14 is a resin substrate 7 for the outer layer board on the soldering surface B side and a metal core 3b on the soldering surface B side.
and a structure on the soldering surface B side including a resin substrate 6 for an inner layer substrate.
次に、上記第１図に示すこの発明の一実施例で
ある多層金属芯入り印刷配線板の構造と作用につ
いて説明する。電気部品１のリード１ａはスルー
ホールめつき穴９にはんだ付けされている。各樹
脂基板４，７により部品面Ａ側、はんだ付け面Ｂ
側に各外層配線層を構成し、各樹脂基板５，６に
より内層配線層を構成している。また、必要によ
り内層配線層間を接続する多重スルーホール１２
を設ける。電気部品１から発生した熱は、主とし
て樹脂基板４、プリプレグ１１を経由して金属芯
３ａに伝導され、さらに、金属芯３ａからスルー
ホールめつき穴９、各樹脂基板５，６を通して金
属芯３ｂに伝導され、また、リード１ａ、スルー
ホールめつき穴９、導体部分１０を通して各金属
芯３ａ，３ｂへも伝導される。電気部品１から発
生した熱は金属芯３ａを主経路とし、金属芯３ｂ
を副経路としてそれぞれ冷却部へ伝わり放熱さ
れ、あるいは各金属芯３ａ，３ｂにより拡散さ
れ、各基板全表面から放熱される。 Next, the structure and operation of the printed wiring board with a multilayer metal core, which is an embodiment of the present invention shown in FIG. 1, will be explained. Leads 1a of electrical component 1 are soldered to through-hole plating holes 9. Each resin board 4, 7 has a component side A side and a soldering side B.
Each outer wiring layer is formed on the side, and each resin substrate 5, 6 forms an inner wiring layer. In addition, multiple through holes 12 for connecting inner wiring layers are provided as necessary.
will be established. Heat generated from the electrical component 1 is mainly conducted to the metal core 3a via the resin substrate 4 and the prepreg 11, and further from the metal core 3a through the through-hole plating hole 9 and each resin substrate 5, 6 to the metal core 3b. It is also conducted to each metal core 3a, 3b through the lead 1a, through-hole plating hole 9, and conductor portion 10. The heat generated from the electrical component 1 uses the metal core 3a as the main path, and the metal core 3b
The heat is transmitted to the respective cooling portions as sub-paths and is radiated, or is diffused by the metal cores 3a and 3b, and is radiated from the entire surface of each substrate.
上記したような構成においては、構成体１３及
び構成体１４が樹脂基板５と樹脂基板６の境界を
中心に上下対称構造になつているので、温度変化
に対しても、上下の各構成体を形成する各基板に
反りが生じにくい。例えば、各金属芯３ａ，３ｂ
の線膨張係数が23×10-6／℃、各樹脂基板４〜７
の線膨張係数が30×10-6／℃のように互いに異な
る値であつても、部品面Ａ側の金属芯３ａと各樹
脂基板５，６間で生じる熱応力と、はんだ付け面
Ｂ側の金属芯３ｂと各樹脂基板５，６間で生じる
熱応力とが打ち消し合うことにより、上記した各
構成体を形成する各基板に反りが生じにくくな
る。さらに、この発明の実施例におけるように、
各樹脂基板５，６から成る内層配線層を各金属芯
３ａと３ｂの間に配置し、多重スルーホール１２
を多く用いた場合には、各金属芯３ａ，３ｂへの
穴を設ける数が減少し、放熱効果がさらに増大す
る配線基板に構成できる。 In the configuration described above, the structure 13 and the structure 14 have a vertically symmetrical structure centering on the boundary between the resin substrate 5 and the resin substrate 6, so that each of the upper and lower structures remains stable even when the temperature changes. Each substrate to be formed is less likely to warp. For example, each metal core 3a, 3b
The linear expansion coefficient of 23×10 -6 /℃, each resin substrate 4 to 7
Even if the coefficients of linear expansion of By canceling out the thermal stress generated between the metal core 3b and each resin substrate 5, 6, each substrate forming each of the above-mentioned structures is less likely to warp. Furthermore, as in embodiments of this invention,
An inner wiring layer consisting of each resin substrate 5 and 6 is arranged between each metal core 3a and 3b, and multiple through holes 12
When a large number of holes are used, the number of holes provided in each metal core 3a, 3b is reduced, and a wiring board can be constructed in which the heat dissipation effect is further increased.
なお、上記実施例では、放熱を主体に説明した
が、各金属芯３ａ，３ｂがサンドイツチ構造とな
つているので、反りが生じにくく、機械的に強度
の強い構造物として成る印刷配線板を構成するこ
とができる。 In the above embodiments, heat dissipation was mainly explained, but since each of the metal cores 3a and 3b has a sandwich structure, the printed wiring board is not easily warped and has a mechanically strong structure. can do.
また、上記実施例では、２枚の金属芯３ａ，３
ｂの厚さを同一値とし、上下に対称構造とした場
合について説明したが、生じる反りが許容範囲内
であれば、厚さを異なる値とし、部品面Ａ側の金
属芯３ａをより厚くし、はんだ付け面Ｂ側の金属
芯３ｂを薄くすることにより、全体の厚さが同じ
で、より一層放熱効果の高い印刷配線板を構成す
ることができる。 Further, in the above embodiment, two metal cores 3a, 3
We have explained the case where the thickness of b is the same value and the structure is vertically symmetrical, but if the warpage that occurs is within the allowable range, the thickness can be set to a different value and the metal core 3a on the component side A side can be made thicker. By making the metal core 3b on the soldering surface B side thinner, it is possible to construct a printed wiring board with an even higher heat dissipation effect while having the same overall thickness.
この発明は以上説明したとおり、多層金属芯入
り印刷配線板において、熱伝導の良い２枚の金属
板を部品面側とはんだ付け面側とにそれぞれ設け
て対称構造に構成したので、両構成体を形成する
各基板の反りが生じなくなり、また、電気部品と
金属板間の距離を短くして熱抵抗を低くでき、か
つ放熱が良好に行われ、また、配線部に削除部分
を設ける必要がなくなるから、配線接続がより多
く可能になり、はんだ付け面にも放熱すべき電気
部品を実装可能な高密度度実装が実現できるなど
の優れた効果を奏するものである。
As explained above, this invention has a symmetrical structure in which two metal plates with good thermal conductivity are provided on the component side and the soldering side, respectively, in a printed wiring board with a multilayer metal core. This eliminates the possibility of warping of each board that forms the circuit board, reduces the distance between the electrical components and the metal plate, lowers the thermal resistance, and improves heat dissipation. This has excellent effects such as enabling more wiring connections and realizing high-density packaging in which electrical components to be heat-dissipated can also be mounted on the soldering surface.
第１図はこの発明の一実施例である多層金属芯
入り印刷配線板を示す断面図、第２図は従来の多
層金属芯入り印刷配線板を示す断面図である。
図において、１……電気部品、１ａ……リー
ド、３ａ，３ｂ……金属芯（金属板）、４〜７…
…樹脂基板、９……スルーホールめつき穴、１０
……導体部分、１１……プリプレグ、１２……多
重スルーホールである。なお、各図中、同一符号
は、同一又は相当部分を示す。
FIG. 1 is a sectional view showing a printed wiring board with a multilayer metal core according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional printed wiring board with a multilayer metal core. In the figure, 1...electrical component, 1a...lead, 3a, 3b...metal core (metal plate), 4-7...
...Resin board, 9...Through-hole plating hole, 10
. . . conductor portion, 11 . . . prepreg, 12 . . . multiple through holes. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
い２枚の金属板を部品面側とはんだ付け面側とに
それぞれ設け、前記各金属板の両外側及び両金属
板間に、印刷配線回路を形成した配線回路基板を
設け、前記部品面側の金属板と前記配線回路基板
を含む構成体と、前記はんだ付け面側の金属板と
前記配線回路基板を含む構成体とをそれぞれ上下
対称の構造に構成したことを特徴とする多層金属
芯入り印刷配線板。1. In a printed wiring board with a metal core, two metal plates with good thermal conductivity are provided on the component side and the soldering side, respectively, and a printed wiring circuit is installed on both outsides of each of the metal plates and between the two metal plates. The formed printed circuit board is provided, and a structure including the metal plate on the component side and the printed circuit board and a structure including the metal plate on the soldering side and the printed circuit board are vertically symmetrical, respectively. A printed wiring board with a multilayer metal core, characterized by having the following structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8351585A JPS61241999A (en) | 1985-04-18 | 1985-04-18 | Multilayer metal cored printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8351585A JPS61241999A (en) | 1985-04-18 | 1985-04-18 | Multilayer metal cored printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61241999A JPS61241999A (en) | 1986-10-28 |
| JPH0438160B2 true JPH0438160B2 (en) | 1992-06-23 |
Family
ID=13804619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8351585A Granted JPS61241999A (en) | 1985-04-18 | 1985-04-18 | Multilayer metal cored printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61241999A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636475B2 (en) * | 1988-05-16 | 1994-05-11 | 横浜ゴム株式会社 | Multilayer printed wiring board |
| JPH03239391A (en) * | 1990-02-16 | 1991-10-24 | Mitsubishi Electric Corp | Printed wiring board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552160U (en) * | 1978-06-22 | 1980-01-09 | ||
| JPS58124985A (en) * | 1982-01-20 | 1983-07-25 | 動力炉・核燃料開発事業団 | Double pellet built-in type nuclear fuel rod |
| JPS60158764U (en) * | 1984-03-31 | 1985-10-22 | 日本メクトロン株式会社 | Flexible metal-based circuit board |
-
1985
- 1985-04-18 JP JP8351585A patent/JPS61241999A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61241999A (en) | 1986-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4385202A (en) | Electronic circuit interconnection system | |
| JPH05243736A (en) | Manufacture of printed circuit board | |
| JP2799472B2 (en) | Substrate for mounting electronic components | |
| US4546406A (en) | Electronic circuit interconnection system | |
| JP2630293B2 (en) | Multilayer wiring board | |
| JPH0438160B2 (en) | ||
| JP2000165042A (en) | Thin film multilayer wiring board | |
| JPS63114299A (en) | Printed wiring board | |
| JPH08195566A (en) | Multilayer electronic board, manufacturing method thereof, and arithmetic processing board | |
| JPH0219982Y2 (en) | ||
| US5763060A (en) | Printed wiring board | |
| JP2000101237A (en) | Build-up board | |
| JPS5987896A (en) | Multilayer printed board | |
| JP2517315B2 (en) | Electronic circuit package | |
| JP2626785B2 (en) | Substrate for mounting electronic components | |
| JPH0548231A (en) | Packaging structure of printed-circuit board with different density | |
| JPH0249741Y2 (en) | ||
| JPH03219689A (en) | metal core printed wiring board | |
| JPH04291984A (en) | Printed board unit structure | |
| JPS62155525A (en) | Hybrid integrated circuit | |
| JPS60236278A (en) | Plate for circuit | |
| JP2539101B2 (en) | Printed circuit board | |
| JPH07249876A (en) | Multilayer printed board with metal core | |
| JPH04133394A (en) | multilayer printed wiring board | |
| KR100275376B1 (en) | Multylayer printed circuit board |