JPH0440437B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a nozzle device for spray plating for plating the inner surface of a plating object having an aperture such as a connector socket used in various electronic devices. .

<Prior art> Connectors used in electronic devices are generally made of copper or copper alloys, and when they require high reliability, they have excellent electrical conductivity as well as corrosion resistance, abrasion resistance, Since performance such as ease of soldering is required, plating is required, and the plating is mainly gold plating,
Depending on the purpose, various alloy platings other than gold such as rhodium or silver plating may be applied.

As a nozzle device for spray plating for plating the inner surface of an opening such as a pin insertion portion of a connector socket, for example, the ``Connector'' disclosed in Japanese Patent Application Laid-Open No. 58-37193 as shown in Fig. 6 is used. There is a device like the one used in "Method for Plating the Inner Surface of a Socket". According to this disclosed technology, a connector socket 1 as a "plated object" has a pin insertion part 2 as an "opening", and the opening of the pin insertion part 2 is fixed by a metal support 3 which also serves as a cathode. The connector socket 1 is held vertically with the connector socket 1 facing downward, and a plating tank 6 containing a plating liquid 5 is provided below the connector socket 1, and a nozzle is installed in the plating tank 6. 7 is attached to the pin insertion portion 2 so that it can move forward and backward.
The plating liquid 5 in the plating tank 6 is passed through a pipe 9 by a pump 8 to the injection port 10 of the nozzle 7 inserted into the pin insertion part 2 of the connector socket 1.
As a result, the injected plating liquid 5 is injected onto the inner surface of the aperture 11, performs plating while flowing down the inner surface of the aperture 11, is collected in the plating tank 6 provided below, and is passed through the pump 8 and pipe 9 again. The water is supplied to the nozzle 7 in circulation.

<Problem to be solved by the invention> However, in recent years, as the prices of precious metals such as gold and silver have soared, and as efforts are being made to conserve precious metal resources, plating of these precious metals is limited to the minimum necessary parts. The demand for plating is increasing.
When plating the inner surface 11 of the opening 1 of the connector socket 1, it is also necessary to plate the inner surface 11 of the opening 4, which is necessary for contact between the connector socket 1 and the pin (not shown).
It is sufficient to apply plating only to the area near the pin insertion part 2. With conventional equipment, plating is applied to the entire inner surface 11 of the hole 11 of the pin insertion portion 2, and unnecessary portions of the inner surface 11 of the hole 11 are also plated. There were disadvantages such as increased manufacturing costs.

The present invention has been made in view of the above-mentioned problems, and it is possible to partially plate the inner surface of the aperture and to make the insertion of the nozzle into the aperture and the center positioning operation within the aperture smoother and more reliable. It is an object of the present invention to provide a nozzle device for spray plating that can perform spray plating.

<Means for Solving the Problems> In order to achieve the above object, the present invention includes a nozzle insertion part that includes an insulating part for regulating the plating target area on the inner surface of the opening, and The structure includes a center positioning body made of an insulating material that also serves as a guide and has an outer diameter corresponding to the size and a shape that does not obstruct the flow of plating liquid at least in the area to be plated. Here, "regulating the area to be plated on the inner surface of the hole" means that originally the entire inner surface of the hole is the area to be plated, but due to the insulation part, the corresponding part becomes the area not to be plated, and the rest is the area to be plated. Since this is the target part, the plating target part is ultimately determined by the condition of the insulation part.

<Example> The details of the present invention will be explained below with reference to the drawings.

1 to 4 show an embodiment of the present invention. In the following description, parts common to those in the prior art are given the same reference numerals, and redundant description will be omitted.

1 is a connector socket as a "plated item", and 12 is a rotating holder. A cathode plate 13 is provided on the outer peripheral surface of this rotary holder 12, and a plurality of fixing grooves 15 corresponding to approximately half the outer peripheral surface of the stem 14 of the connector socket 1 are provided at a constant pitch on this outer peripheral surface. ing. The stem 14 of the connector socket 1 is fitted into the fixing groove 15, and the rotation holder 1 is held under the tension of a presser belt 16 that covers the outer peripheral surface of the rotation holder 12.
It is fixed while being prevented from shifting from position 2. A plating liquid receiving tank 17 is provided below the rotary holder 12, and within this plating liquid receiving tank 17, a plurality of nozzles 7 which also serve as anodes are exchangeably placed on a spargeer 18 with their injection ports 10 facing upward. It is erected. The spacing between the nozzles 7 is the same as that of the connector sockets 1 held in the rotary holder 12, that is, each nozzle 7 is positioned directly below each connector socket 1. The spargeer 18 is fixed to an arm 19 of a pressure cylinder (not shown) and is vertically movable. The nozzle 7 communicates with the inside of the spargeer 18, and injects the plating liquid 5 supplied into the spargeer 18 at a constant pressure from the injection port 10. Pin insertion part 2 of nozzle 7
Nozzle insertion part 20, which is the part inserted into the inside
An insulating part 21 made of an insulator is formed on the injection port 10 side of the nozzle 7, and a portion of the nozzle 7 other than the insulating part 21 is a conductive part 22 made of a metal with good conductivity. The proportion (length) of this insulating part 21 in the nozzle insertion part 20 is set by the non-plating target part (X) in the inner surface 11 of the opening, and as a result, the plating target part (Y) I'll have to decide. A center positioning body 25 which also serves as a guide and has an outer diameter 24 corresponding to the aperture size is integrally provided in the insulating part 21 and made of the same material.

Next, the action will be explained.

The number of connector sockets 1 held by the rotary holder 12 corresponds to the number of nozzles 7 in the plating tank 6, that is, in groups of six in the illustrated example, as indicated by the arrow A.
move in the direction. In FIG. 3, B indicates the pre-processing zone, C indicates the plating process, and D indicates the post-processing zone. Also, the connector socket 1 is the rotating holder 1.
Since it is in contact with the cathode plate 13 of No. 2, it is always turned into a cathode. A certain group is in the Metsuki tank 6
When the spargeer 18 is raised by a pressure cylinder (not shown) when the spargeer 18 is positioned directly above the nozzle 7, the nozzle 7 is first inserted into the pin insertion portion 2 of the connector socket 1, and then positioned within the pin insertion portion 2. When the nozzle 7 is inserted into the pin insertion part 2, the nozzle 7
is smoothly inserted into the pin insertion portion 2 by the guide of the center positioning body 25. At the same time, the nozzle 7 inserted into the pin insertion part 2 is always positioned at the center of the pin insertion part 2 by the center positioning body 25 as shown in FIG.

When the nozzle 7 is positioned inside the pin insertion part 2, the plating liquid 5 is first supplied at a constant pressure into the spargeer 18, and then is injected into the pin insertion part 2 from the injection port 10 through the inside of the nozzle 7. be done. The center positioning body 25, which also serves as a guide, has an "arrowhead" shape that does not obstruct the flow of the plating liquid 5, so the plating liquid 5 is smoothly injected from the injection port 10, and the nozzle 7 is connected to the pin insertion part. Since the plating liquid 5 is located at the center of the hole 2, the injected plating liquid 5 flows down the inner surface 11 of the hole equally and is collected. Furthermore, since the distance between the nozzle 7 and the inner surface 11 of the aperture is the same everywhere, an equal potential is applied to the inner surface 11 of the aperture.

The plating liquid 5 injected in this way applies plating while flowing down the inner surface 11 of the opening in the pin insertion part 2, and it corresponds to the insulating part 21 in the nozzle insertion part 20 in the pin insertion part 2. Since a sufficient potential for plating is not applied to the non-plating target portion (X), plating is not performed. On the other hand, since a sufficient potential is applied to the plating target area (Y) facing the conductive part 22 of the nozzle insertion part 20, a precipitate 23 can be obtained on the plating target area (Y). Therefore, the area to be plated is adjusted by adjusting the ratio (length) of the insulating part 21 in the nozzle insertion part 20 and by adjusting the vertical movement stroke amount of the nozzle 7. The inner surface 11 can be partially plated.

Further, the shape of the center positioning body 25 which also serves as a guide is not limited to the shape shown in FIG. For example, those shown in FIG. 5 a, b, and c are also fully applicable. FIG. 5a shows a center positioning body 2 having four rod-like shapes on the outer peripheral surface of the insulating part 21.
5 is provided. The outer diameter 24 of the center positioning body 25 corresponds to the size of the opening, and the plating liquid 5 is sprayed from the injection port 10 at the tip. In FIG. 5b, the tip is formed of a tapered insulating part 21, and this tapered insulating part 21 also serves as a center positioning body 25. Four injection ports 10 are provided in a constricted portion below the center positioning body 25. Center positioning body 25
Although the flow of the plating liquid 5 is obstructed in the non-plating target area corresponding to the conductive part 22 due to the existence of the center positioning body 25 itself, the plating liquid 5 exhibits a smooth flow in the plating target area corresponding to the conductive part 22.
Furthermore, in the case of Fig. 5c, unlike the other cases, the nozzle 7
A conductive part 22 is provided at the tip of the , and an insulating part 2 is provided below.
1, and a center positioning body 25 which also serves as a guide is provided on the outer peripheral surface thereof. Jet nozzle 1
0 is provided at an inclined angle on the outer peripheral surface of the insulating section 21 so that the plating liquid 5 hits the circular bottom surface of the pin insertion section 2. Therefore, when plating is performed using this nozzle 7, the conductive part 2 in the pin insertion part 2
Plating will be applied only to the area near the bottom facing 2.

Also, in the above explanation, the connector socket 1 side is fixed and the nozzle 7 side is movable, but of course it is also possible to conversely make the plating object 1 side movable and the nozzle 7 side fixed. Furthermore, if both of them can be made movable, and if the nozzle 7 can be inserted into the opening 2 of the plating object 1, then it is possible to control the arrangement of the plating object 1 and the nozzle 7. All of these are also covered by the present invention. It goes without saying that the inner surface of the hole 11 of the plated object 1 is not limited to a cylindrical inner surface like the pin insertion portion 2 of the connector socket 1.

<Effects of the Invention> The nozzle device for spray plating according to the present invention has the following effects:
Since the contents are as explained above, plating is not applied to the inner surface of the opening facing the insulating part of the nozzle insertion part, that is, the non-plating target area. Therefore, by adjusting the ratio (length) occupied by the insulating part of the nozzle insertion part or adjusting the nozzle vertical movement stroke, the area to be plated can be adjusted, and the inner surface of the opening of the plated object can be adjusted. When plating gold or other precious metals, it has the effect of saving precious metals.

Furthermore, in addition to the above effects, the nozzle can be inserted into the opening reliably and smoothly by the center positioning body that also serves as a guide provided in the nozzle insertion part.
Similarly, the nozzle inserted into the inner surface of the aperture is always positioned at the center of the aperture of the object to be plated by the center positioning member. Therefore, there is less risk of short circuits caused by contact between the conductive part of the nozzle, which also serves as an anode, and the inner surface of the hole in the plating material, which is a cathode, and the distance between the nozzle and the inner surface of the hole is Since all parts are equal, a uniform potential can be applied to the part to be plated on the inner surface of the hole.At the same time, the injected plating liquid flows down in an equal amount to all parts on the inner surface of the hole, so it is possible to apply a uniform potential to the part to be plated on the inner surface of the hole. This has the effect that plating can be applied with a uniform thickness.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing a nozzle device according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the arrow line in Fig. 1, and Fig. 3 is a plating device to which the nozzle device of the present invention is applied. 4 is a cross-sectional view along the arrow line in FIG. 3, FIGS. 5 a, b, and c are perspective views showing modified examples of the center positioning body that also serves as a guide, and FIG. 6 is a conventional It is an explanatory view showing a nozzle device. 1...Plated item (connector socket), 2...
...Opening hole (pin insertion part), 5...Plating liquid, 7...
Nozzle, 10... Injection port, 11... Opening inner surface, 2
0... Nozzle insertion part, 21... Insulation part, 24...
Outer diameter, 25... Center positioning body, X... Non-plating target part, Y... Plating target part.

Claims (1)

[Scope of Claims] 1. Injection plating, in which plating liquid is injected from the injection port of a nozzle insertion part that also serves as an anode inserted into the opening of the object to be plated, thereby plating the inner surface of the opening of the object to be plated, which has been turned into a cathode. In the nozzle device for use, the nozzle insertion part includes an insulating part for regulating the plating target part on the inner surface of the aperture, and an outer diameter corresponding to the aperture size and a plating target part at least in the plating target part. A nozzle device for spray plating, characterized in that it is provided with a center positioning body made of an insulating material that also serves as a guide and has a shape that does not obstruct the flow of liquid.