JPH0445987B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a carrier for an integrated circuit, and more particularly to a carrier for an integrated circuit having a proper lead arrangement.

BACKGROUND OF THE INVENTION Integrated circuit carriers have an enclosure in which an integrated circuit can be placed and sealed.
This carrier starts near the integrated circuit and
It has multiple leads that pass through the side of the carrier and exit. Each lead is connected to one input/output pad of the integrated circuit by standard bonding techniques. In other words, it serves to connect the integrated circuit within the lead enclosure to the outside world. The integrated circuit is operated by connecting the lead integrated circuit to a power source and making the necessary input/output connections.

Ordinary dual-in-package (hereinafter referred to as DIP)
The package (referred to as a package) is rectangular, and the leads extend outward from the long sides of the rectangle, are bent at right angles, and extend toward the bottom surface. When a large number of such carriers for integrated circuits are packaged together and transported, if adjacent carriers move in the direction of contact with each other, the leads of one carrier may become engaged with the leads of the other carrier. , getting caught or tangled between the leads of adjacent carriers.

<Problems to be Solved by the Invention> An object of the present invention is to prevent the leads of adjacent carriers from interlocking, catching, or
An object of the present invention is to provide a carrier for an integrated circuit having a structure that does not cause entanglement or the like.

<Means for Solving the Problems> According to the accumulation carrier according to the present invention, an enclosure having a top surface, a bottom surface, and at least one side surface between the top surface and the bottom surface; A plurality of leads pulled out from inside the side surface, extending from the side surface toward the bottom surface, and having tips located near the bottom surface, the leads each having a width smaller than the width of the lead. It has multiple leads, which are spaced apart at a distance.

<Operations and Effects of the Invention> According to the present invention, the leads of the carrier for integrated circuits are arranged with a distance smaller than the width of each lead, so that the leads of one carrier are connected to the other carrier. It does not get between the leads and therefore does not cause interlocking between the leads of adjacent carriers.

In addition, since the leads are pulled out from the sides and extend from the sides to the bottom, and the tips of the leads are positioned near the bottom, there is no risk of the leads getting caught or entangled between adjacent carriers. Not at all.

<Example> As shown in FIG. 1, the basic shape of the carrier 20 is a square. The carrier 20 has an enclosure 22 and a plurality of leads 24. The leads can be made of a conductive material, such as a copper alloy. Enclosure 22 may be made of plastic, such as epoxy. Carrier 20 may be of any suitable shape, but as shown in FIGS. 1, 2, and 3, it has a top surface 26, a bottom surface 28, and four sides 32-35, with The bottom surface 28 is square, and the side surfaces 32 to 35 are rectangular, so that the overall shape is a flat box. FIG. 1 is a partial cutaway view of top surface 26 showing integrated circuit 29 connected to leads 24 by a plurality of thin bonding wires 40. FIG.

Since all leads 24 have the same configuration, it will suffice to consider a particular lead 43. One end of lead 43 is located adjacent to integrated circuit 29 and is connected to the integrated circuit by one bonding wire 40 . As shown in FIG. 3, the lead 43 passes through the side surface of the enclosure 22 at approximately the center of the distance between the top surface 26 and the bottom surface 28. Lead 43 has flat sides 47 (FIGS. 3 and 5).

The corners connecting the sides 32-35 may be of any suitable shape, such as rounded, pointed or chamfered. Side surfaces 32 and 34 constitute a pair of side surfaces;
These sides are parallel and have approximately the same size. The same applies to side surfaces 33 and 35.

The lead 43 extends from one end 45 within the enclosure 22 to the outside of the side surface 34 (see FIG. 3), and further extends along the side surface 34 toward the bottom surface 28 with a flat surface 47. There is. All leads 24 exit the enclosure approximately centrally between the top surface 26 and the bottom surface 28. All leads have a flat surface 47. The bottom surface 28 has a plurality of recesses 5
0 (Figure 2). These recesses 50 are separated from each other by a bottom part that is at the same level as the rest of the bottom 28. The bottom portion between the recesses may be slightly above or below the remaining bottom portion. The ridge may also be level with the bottom surface if the recess is deep. As shown in FIG.
The end of is in the recess 50.

As shown in FIGS. 3 and 4, the individual leads 24 extend beyond the plurality of ridges 53. As shown in FIGS. These plurality of raised portions 53 are arranged on each side surface 3.
2-35 may be formed by a protrusion beyond the bottom surface 28. The ridge has a slope that is coplanar with the sides 32-35. Each lead passes into one recess 50 over the associated ridge. Accordingly, each recess 50 is provided with a respective associated ridge, and each ridge is associated with one lead. If these ridges are formed by one protrusion, it is only necessary to associate one recess with one lead.

As shown in FIG. 4, each lead 24 extends beyond the protrusion 53 and into the recess 50.
Each recess is separated by a bottom surface portion that is at the same (or slightly higher) level as the bottom surface forming the rib 56. In this way,
The ends of the leads 24 extend along the sides, but lateral movement parallel to the sides is substantially restrained by the ribs 56. Therefore, the ribs 56 hold the leads 24 and prevent adjacent leads 24 from coming into contact with each other.

Because the ribs prevent lateral movement, the leads can be made of thin or thin material.

As shown in FIG. 5, the lead 43 has a flat surface 47 opposite the associated ridge 58 and extends beyond the ridge 58. Raised portion 5
8 is identical to the other ridges 53, so it will be sufficient to describe one ridge in detail. Raised portion 5
The slope 60 of 8 is in a common plane with the side surface 34. side 3
4, the section from the center to the same level as the bottom surface 28 can be sloped with a small inclination angle (for example, about 3 degrees). The surface of the ridge 58 extends from the sloped surface 60 through the rounded apex 62 .
2 into a corresponding recess 66 . The angle of the second slope 64 with respect to the side surface is approximately 25°. The slope 64 moves away from the side surface 34 and reaches the bottom surface 2.
8 and generally toward the opposite side 32 (FIG. 2).

In FIG. 5, two positions of lead 43 are shown. The lead 43 is first bent at the rounded top 62, as shown in dotted lines, and then a punch 68 (shown in dotted lines) contacts the portion of the lead beyond this bent portion. Punch 68 deforms the lead (in its second position shown in solid line) and is angularly displaced to a second position adjacent ramp 64 as shown in solid line. In this manner, the end 70 of the lead 43 is placed within the recess 66. The end 70 is the rib 5
Ribs 73 and 74 (FIG. 2) of 6 prevent lateral movement. ribs, e.g.
Corner 7 of bottom surface 28 to obtain rib 74 of FIG.
6 will also be raised.

Even if a force is applied to pull the lead 43 away from the slope 60 and the side surface 34 of the enclosure 22, the end 70 of the lead 43 and a portion near it will contact the slope 64 to prevent such movement. After the deformation by the punch 68, the lead end 70 contacts the slope 64, so that the flat side surface 47 does not separate from the slope 60 due to the spring back action after deformation. Since the end 70 is within the recess 66, it is protected from contact with other objects. The ends of the other leads 24 are also within their respective recesses 50 and are protected from contact with other objects.

As shown in FIG. 5, the punch 68 moves from a first position shown in dotted lines on the right toward a second position (shown in solid lines in FIG. 5). This causes the lead 43 to bend along the rounded top 62 and contact or be close to the beveled surface 64. When the lead 43 is deformed, the punch 6
Even after 8 is removed and no longer in contact with lead 43, end 70 remains close to ramp 64.

The enclosure 22 has chamfered edges 79 and 8.
0 (Fig. 1), and these edges are
It is useful for aligning the carrier in order to properly connect the leads to, for example, a printed circuit board.

In FIG. 6, two adjacent leads 100 and 102 of leads 24 are shown extending out of enclosure 22. In FIG. Leads 100 and 102 have openings or holes 106 and 108, respectively, near where they exit enclosure 22. The holes shown are rectangular, but may be any suitable shape. This hole increases the flexibility of the lead. Leads 100 and 102 extend downwardly into narrow portions 120 and 122, respectively. Leads 100 and 102 have tapered edges 110, 112 and 114, 116 between narrow portions 120 and 122, respectively. The narrow portions 120 and 122 extend beyond the ridges 130 and 132 into the two recesses 50.
(not shown in FIG. 6).
Leads 100 and 102 can be soldered to printed circuit board 200 at the lower portions 136 and 138 of the top of their respective ridges.

Connect leads 100 and 102 to printed circuit board 2
When soldering to the 00 contact pads 202 and 204, the lower portions 136 and 138 are in contact with the contact pads 202 and 204, and the solder 206 is deposited on the narrow portions 120 and 122 (only a portion of the solder adhered to the lead 102). (Illustrated). Solder at the bottom part 1 of the thin part of the lead.
36 and 138 on one or both sides to connect the leads to printed circuit board 200.
Soldering can be performed by reflow, ripping, waving or other suitable methods.

when connected to a printed circuit board or when coming into contact with other objects (e.g. when coming into contact with other carriers during transport) or when being inserted into a socket.
The raised portions 130, 132 serve to hold the leads 100, 102. When the enclosure 22 is inserted into the socket, the leads extending along the sides of the enclosure 22 between the tapered portion 60 and the socket entrance contact the conductors within the socket. Raised portion 13
0,132 also limits the amount of solder that can accumulate between leads 100, 102 and enclosure 22 as a result of wicking effects and prevents bridging of solder 206 between adjacent leads 100 and 102. What is possible is prevented.

Leads 100, 102 through holes 106, 108
is flexible and can compensate for changes in the dimensions of the printed circuit board due to thermal effects. Leads 100 and 102 are separated by region 140. The size of region 140 between lead 100 and lead 102 is approximately equal to the width of lead 100. Lead 102 has approximately the same width as lead 100. The width of the leads is the distance between them,
That is, it may be larger than the size of the area 140. If leads 100 and 102 are not perfectly parallel, the width of the leads may be made slightly less than the spacing between them. Thus, the width of region 140 may be slightly greater than, equal to, or slightly less than the width of lead 100. Spacing the leads by their relative widths prevents leads from other carriers (not shown) similar to carrier 20 from interlocking between leads 100 and 102. be done. Such engagement can cause damage to the leads, especially during automated handling operations.

Although the present invention has been described based on drawings,
It goes without saying that modifications other than those mentioned in the above description are possible within the scope of the invention.

The following matters are disclosed in connection with the above explanation.

(1) an enclosure having a top surface, a bottom surface parallel to the top surface, and two pairs of opposing parallel sides touching each other and extending from the top surface to the bottom surface; the bottom surface such that the side surface has a ridge extending beyond the bottom surface, the bottom surface has a recess disposed adjacent the ridge, and the ridge is directed away from the one side surface; A carrier for an integrated circuit having a rounded tip extending toward the end and a slope extending from the rounded tip into the recess.

(2) (a) an enclosure having one surface and another surface adjacent to the one surface and having a plurality of ridges extending from the one surface; a plurality of separated leads extending from one surface to an outer surface, each lead having one end disposed within the enclosure and adjacent the one surface to the other surface; a plurality of leads extending beyond the surface and having their other ends placed in recesses in said other surface.

(3) (a) an enclosure having four sides; and (b) a plurality of leads, with at least one lead extending from each of said sides, and at least two adjacent leads extending from said enclosure to one side; The leads extend substantially parallel along the sides, the leads have substantially the same width, and one lead extends from the other lead at a distance slightly greater than to slightly less than the width of the pair of leads. A carrier for an integrated circuit comprising a plurality of leads separated by a distance within a range to prevent the leads of other carriers from becoming wedged between the leads.

(4) an enclosure having (a) a top surface, a bottom surface, and four side surfaces extending between the top surface and the bottom surface; and (b)
a plurality of leads extending from said side surfaces along said sides and tapering towards said ends, at least one of said sides being flexible in a portion of said leads proximate said enclosure; A carrier for integrated circuits having a hole adjacent said enclosure for increased flexibility.

(5) (a) having first and second parallel surfaces of substantially the same dimensions and two pairs of parallel sides extending between the first and second surfaces at right angles thereto; a plastic enclosure, each side having a plurality of ridges, the second side having a plurality of recesses respectively adjacent the ridges, and each ridge having a plurality of recesses adjacent the second side; a first slope extending beyond and parallel to and coplanar with the side surface; a rounded tip extending from the first slope toward a side opposite the side surface; and a rounded tip extending from the first slope to a side opposite to the side surface. (b) each having an end within the enclosure; and (b) each having an end within the enclosure; a second surface extending outwardly from the surrounding seal through said side surface and parallel to said side surface toward said second surface, beyond said rounded tip of said ridge, and further within said recess adjacent said second sloped surface; A carrier for an integrated circuit comprising a plurality of metallic electrical leads extending to one end and preventing translation of the other end parallel to the side surface.

[Brief explanation of drawings]

FIG. 1 is a plan view of the integrated circuit carrier of the present invention, with a portion cut away to show internal details (not to scale). Second
The figure is a bottom view, Figure 3 is a side view, Figure 4 is a sectional view taken along line 4--4 in Figure 2, and Figure 5 is a cross-sectional view along line 5 in Figure 2.
6 is a partial view of the carrier showing the sides of two adjacent leads; FIG.

Claims (1)

[Scope of Claims] 1. An enclosure having a top surface, a bottom surface, and at least one side surface between the top surface and the bottom surface; a plurality of leads extending toward the bottom surface, the tips of which are located near the bottom surface, the leads being spaced apart from each other by a distance smaller than the width of the leads; Carrier for integrated circuits.