JPH0446453B2 - - Google Patents
Info
- Publication number
- JPH0446453B2 JPH0446453B2 JP60173020A JP17302085A JPH0446453B2 JP H0446453 B2 JPH0446453 B2 JP H0446453B2 JP 60173020 A JP60173020 A JP 60173020A JP 17302085 A JP17302085 A JP 17302085A JP H0446453 B2 JPH0446453 B2 JP H0446453B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- presser
- chip
- frame
- heat block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7622—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、IC製造工程においてICチツプとリ
ードフレームとを金属細線で結線する場合に使用
するリードフレーム押圧器に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame presser used for connecting an IC chip and a lead frame with a thin metal wire in an IC manufacturing process.
従来、この種リードフレーム押圧器は、第３図
に示すように構成されている。これを同図〜第５
図に基づいて説明すると、１はその隅部に４個の
取付孔２を有する押圧器本体で、中央部には矩形
状の窓３が設けられており、この窓３の裏側周縁
にはボンデイング時にリードフレーム４をヒート
ブロツク５に押圧する枠状の押圧部６が設けられ
ている。なお、前記リードフレーム４上にはIC
チツプ７がろう付けされており、このICチツプ
７上には電極（パツド）８が配設されている。ま
た、９はこの電極８と金属線（図示せず）によつ
て接続されるリードである。
Conventionally, this type of lead frame presser has been constructed as shown in FIG. This is shown in Figure 5.
To explain based on the figure, 1 is a presser main body having four mounting holes 2 at its corners, a rectangular window 3 is provided in the center, and bonding A frame-shaped pressing portion 6 is provided for pressing the lead frame 4 against the heat block 5 at times. Note that there is an IC on the lead frame 4.
A chip 7 is soldered to the IC chip 7, and an electrode (pad) 8 is provided on the IC chip 7. Further, 9 is a lead connected to this electrode 8 by a metal wire (not shown).
このように構成されたリードフレーム押圧器に
おいては、ボンデイング時、すなわちリードフレ
ーム４とこのフレーム４上のICチツプ７とを結
線する時に、第５図に矢印Ａで示す方向にリード
フレーム４がピツチ送りされるが、このときリー
ドフレーム４の移動がスムーズに行われるように
押圧器本体１は同図に矢印Ｂで示す方向に、また
ヒートブロツク５は同図に矢印Ｃで示す方向に後
退している。そして、リードフレーム４上のIC
チツプ７が押圧器本体１の窓３の下方に位置する
と、押圧器本体１およびヒートブロツク５は前進
してリードフレーム４を把持する。しかる後、ワ
イヤボンデイングがICチツプ７の電極８とリー
ドフレーム４のリード９との間で行われる。 In the lead frame presser constructed in this way, the lead frame 4 is pitched in the direction shown by arrow A in FIG. 5 during bonding, that is, when connecting the lead frame 4 and the IC chip 7 on the frame 4. At this time, the presser body 1 is moved back in the direction shown by arrow B in the same figure, and the heat block 5 is moved back in the direction shown by arrow C in the same figure, so that the lead frame 4 can move smoothly. ing. Then, the IC on lead frame 4
When the chip 7 is positioned below the window 3 of the presser body 1, the presser body 1 and the heat block 5 move forward to grip the lead frame 4. Thereafter, wire bonding is performed between the electrodes 8 of the IC chip 7 and the leads 9 of the lead frame 4.
なお、第４図に示す鎖線で囲む部分はフレーム
把持状態において押圧器本体１の押圧部６がリー
ドフレーム４に当接する部分である。 Note that the portion surrounded by the chain line shown in FIG. 4 is the portion where the pressing portion 6 of the presser main body 1 comes into contact with the lead frame 4 when the frame is gripped.
この場合、リードフレーム４の把持の良否がワ
イヤボンデイングの良否に直接影響を及ぼすた
め、ヒートブロツク５のフレーム載置部５ａおよ
び押圧器本体１の押圧部６が部品レベルで平面度
が要求され、組立段階では両部材１，５の互いの
平行度が要求される。 In this case, since the quality of gripping the lead frame 4 directly affects the quality of wire bonding, the flatness of the frame mounting portion 5a of the heat block 5 and the pressing portion 6 of the presser body 1 is required at the component level. In the assembly stage, mutual parallelism of both members 1 and 5 is required.
ところが、この種のリードフレーム押圧器にお
いては、押圧器本体１の押圧部６およびヒートブ
ロツク５の載置部５ａを高精度に加工しなげれば
ならず、コストが嵩むという不都合があつた。
However, in this type of lead frame presser, the pressing part 6 of the presser main body 1 and the mounting part 5a of the heat block 5 must be machined with high precision, resulting in an increase in cost.
すなわち、その加工精度が悪い押圧部６をもつ
押圧器本体１においては、ヒートブロツク５との
間でリードフレーム４を把持した場合、往々にし
て第６図に示すようにその一部がリードフレーム
４に当接するだけで両部材１，４間に間隙ｇが生
じてしまうからである。 That is, in the presser main body 1 having the pressing part 6 with poor machining accuracy, when the lead frame 4 is held between the heat block 5 and the lead frame 4, a part of the lead frame is often damaged as shown in FIG. This is because a gap g is created between the two members 1 and 4 simply by contacting the members 1 and 4.
本発明はこのような事情に鑑みなされたもの
で、ボンデイング時にヒートブロツクとの間でリ
ードフレームを確実に把持することができるリー
ドフレーム押圧器を提供するものである。 The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a lead frame presser that can reliably hold a lead frame between it and a heat block during bonding.
本発明に係るリードフレーム押圧器は、複数の
リードに対向して設けられ、複数のリードを一括
して押圧する押圧子を、この押圧子の押圧方向と
ねじれ方向に弾性変形可能な接続部で押圧器本体
に連結したものである。
The lead frame presser according to the present invention includes a presser that is provided facing a plurality of leads and presses the plurality of leads at once, and a connecting portion that is elastically deformable in the pressing direction and torsional direction of the presser. It is connected to the presser body.
本発明においては、フレーム把持状態において
接続部が弾性変形して押圧子が対向する複数のリ
ードを一括して押圧することになる。
In the present invention, when the frame is gripped, the connecting portion is elastically deformed, and the presser presses a plurality of opposing leads all at once.
第１図は本発明に係るリードフレーム押圧器を
示す下面図、第２図はその要部を示す斜視図で、
同図において第３図〜第６図と同一の部材につい
ては同一の符号を付し、詳細な説明は省略する。
同図において、符号１１で示すリードフレーム押
圧器は、前記押圧器本体１、この押圧器本体１を
切り抜き形成することにより複数個に分断形成さ
れ前記ICチツプ７の周囲外側を保持する押圧子
１２およびこれら押圧子１２を各押圧子１２の長
さ方向中央部において前記押圧器本体１に連結す
る弾性変形可能な接続部１３からなり、前記ヒー
トブロツク５上に載置したリードフレーム４を押
圧保持するように構成されている。
FIG. 1 is a bottom view showing a lead frame presser according to the present invention, and FIG. 2 is a perspective view showing the main parts thereof.
In this figure, the same members as in FIGS. 3 to 6 are designated by the same reference numerals, and detailed explanations will be omitted.
In the figure, the lead frame presser indicated by reference numeral 11 includes the presser main body 1, a presser 12 which is divided into a plurality of pieces by cutting out the presser main body 1, and holds the outside of the periphery of the IC chip 7. and an elastically deformable connection part 13 that connects these pressers 12 to the presser main body 1 at the central part in the length direction of each presser 12, and presses and holds the lead frame 4 placed on the heat block 5. is configured to do so.
このように構成されたリードフレーム押圧器に
おいては、リードフレーム４とこのフレーム４上
のICチツプ７とを結線するに、リードフレーム
４を把持することにより行われる。 In the lead frame presser constructed in this way, the lead frame 4 and the IC chip 7 on the frame 4 are connected by gripping the lead frame 4.
すなわち、第２図に示すフレーム把持状態にお
いて、押圧子１２の一端に同図に矢印で示す方向
にP1なる力が作用すると、接続部１３が弾性変
形して同図に矢印ｅで示す方向にねじれ、また押
圧子１２の両端に同図に矢印で示す方向にP1，
P2なる力が作用した場合は、接続部１３が弾性
変形して同図に矢印ｆで示す方向に撓み、各々の
場合全押圧子１２が均等にICチツプ７の周囲外
側のリードフレーム４に当接する。なお、実際に
は押圧子１２に複雑な力が作用するが、前記同様
に安定したフレーム把持が可能となる。 That is, when the frame is gripped as shown in FIG. 2, when a force P1 is applied to one end of the presser 12 in the direction indicated by the arrow in the figure, the connecting portion 13 is elastically deformed and moves in the direction indicated by the arrow e in the figure. P 1 and P 1 are twisted at both ends of the presser 12 in the direction shown by the arrow in the figure
When a force P2 is applied, the connecting portion 13 is elastically deformed and bent in the direction indicated by the arrow f in the figure, and in each case, all the pressers 12 are evenly pressed against the lead frame 4 on the outside of the periphery of the IC chip 7. come into contact with Although a complicated force actually acts on the presser 12, stable frame gripping is possible in the same manner as described above.
以上説明したように本発明によれば、押圧子が
対向するリードから受ける力の作用により、接続
部が押圧方向およびねじれ方向に弾性変形するこ
とになるため、押圧子が複数のリードを一括して
押圧することが可能となり、ボンデイング時にリ
ードフレームをヒートブロツクとの間で確実に把
持することができる。
As explained above, according to the present invention, the connection portion is elastically deformed in the pressing direction and the torsional direction due to the action of the force that the presser receives from the opposing leads. This makes it possible to press the lead frame securely between the heat block and the heat block during bonding.
第１図は本発明に係るリードフレーム押圧器を
示す下面図、第２図はその要部を示す斜視図、第
３図は従来のリードフレーム押圧器を示す下面
図、第４図はリードフレームを示す斜視図、第５
図および第６図はリードフレームの把持状態を示
す断面図である。
１……押圧器本体、４……リードフレーム、５
……ヒートブロツク、７……ICチツプ、１１…
…リードフレーム押圧器、１２……押圧子、１３
……接続部。
Fig. 1 is a bottom view showing a lead frame presser according to the present invention, Fig. 2 is a perspective view showing the main parts thereof, Fig. 3 is a bottom view showing a conventional lead frame presser, and Fig. 4 is a lead frame 5th perspective view showing
This figure and FIG. 6 are cross-sectional views showing how the lead frame is held. 1...Press device body, 4...Lead frame, 5
...Heat block, 7...IC chip, 11...
...Lead frame presser, 12...Press element, 13
...connection section.
Claims (1)
けられ、前記複数のリードを一括して押圧する押
圧子と、この押圧子を支持する押圧器本体と、こ
の押圧器本体と前記押圧子とを連結し、前記押圧
子の押圧方向とねじれ方向に弾性変形可能な接続
部とを備えたことを特徴とするリードフレーム押
圧器。1. A pusher that is provided facing the plurality of leads of a lead frame and presses the plurality of leads all at once, a pusher body that supports this pusher, and a connection between this pusher body and the pusher. A lead frame presser comprising: a connecting portion that can be elastically deformed in a pressing direction and a torsional direction of the presser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60173020A JPS6233432A (en) | 1985-08-06 | 1985-08-06 | Lead frame pusher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60173020A JPS6233432A (en) | 1985-08-06 | 1985-08-06 | Lead frame pusher |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6233432A JPS6233432A (en) | 1987-02-13 |
| JPH0446453B2 true JPH0446453B2 (en) | 1992-07-30 |
Family
ID=15952717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60173020A Granted JPS6233432A (en) | 1985-08-06 | 1985-08-06 | Lead frame pusher |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6233432A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03233947A (en) * | 1990-02-09 | 1991-10-17 | Fujitsu Ltd | Lead-frame inner-lead holding-down jig |
| KR20020069885A (en) * | 2001-02-28 | 2002-09-05 | 앰코 테크놀로지 코리아 주식회사 | Clamp for semiconductor package |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS595976Y2 (en) * | 1975-12-26 | 1984-02-23 | 株式会社新川製作所 | Lead frame Osae Souchi |
| JPS60113438A (en) * | 1983-11-24 | 1985-06-19 | Nec Corp | Base ribbon holding mechanism |
-
1985
- 1985-08-06 JP JP60173020A patent/JPS6233432A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6233432A (en) | 1987-02-13 |
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