JPH0447961B2 - - Google Patents
Info
- Publication number
- JPH0447961B2 JPH0447961B2 JP58027758A JP2775883A JPH0447961B2 JP H0447961 B2 JPH0447961 B2 JP H0447961B2 JP 58027758 A JP58027758 A JP 58027758A JP 2775883 A JP2775883 A JP 2775883A JP H0447961 B2 JPH0447961 B2 JP H0447961B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- resistor
- green sheet
- silver
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、プリント基板上に用いるチツプ抵抗
器の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a chip resistor used on a printed circuit board.
（従来例の構成とその問題点）
従来の角型のチツプ抵抗器は、プリント基板に
フエースボンデングで半田付けするため、抵抗体
に接続した銀電極を、アルミナ磁気の側面を通し
て裏面に引きまわしている。このような構造を得
るため、アルミナ表面に印刷された電極は、アル
ミナを個片にしてから、銅ペーストにデイツプす
る繁雑な工程をとつていた。(Conventional structure and its problems) Conventional square chip resistors are soldered to a printed circuit board by face bonding, so the silver electrode connected to the resistor is routed to the back side through the alumina magnetic side. ing. To obtain such a structure, the electrodes printed on the alumina surface required a complicated process in which the alumina was cut into pieces and then dipped in copper paste.
（発明の目的）
本発明の目的は、上記従来例のような繁雑な工
程を経ることなく、チツプ抵抗器を製造できる方
法を提供するものである。(Object of the Invention) An object of the present invention is to provide a method for manufacturing a chip resistor without going through the complicated steps as in the conventional example.
（発明の構成）
本発明によるチツプ抵抗器の製造方法は、アル
ミナグリーンシートに、グリーンシートの厚みと
同一寸法の長さのタングステン線を所定の間隔を
介して複数埋込み焼成し、焼成後のアルミナ基板
の両表面に露出しているタングステン線端部に銀
ペーストを塗布、焼付けて銀電極を形成し、隣接
する銀電極間にまたがつて抵抗体を印刷、焼成し
た後、アルミナ基板を所定の寸法に切断する工程
からなるものである。(Structure of the Invention) A method for manufacturing a chip resistor according to the present invention involves embedding a plurality of tungsten wires having the same length as the thickness of the green sheet in an alumina green sheet at a predetermined interval and firing the alumina green sheet. Silver paste is applied to the ends of the tungsten wires exposed on both surfaces of the substrate and baked to form silver electrodes. After printing and baking a resistor across the adjacent silver electrodes, the alumina substrate is placed in a predetermined position. This process consists of cutting to size.
（実施例の説明）
本発明の一実施例を第１図ないし第６図に基づ
いて説明する。(Description of Embodiment) An embodiment of the present invention will be described based on FIGS. 1 to 6.
第１図に示すように、厚さ0.5mmのアルミナグ
リーンシート１に直径0.1mmで長さ0.5mmのタング
ステン線２を、１mmピツチのマトリクス状に埋込
む。 As shown in FIG. 1, tungsten wires 2 with a diameter of 0.1 mm and a length of 0.5 mm are embedded in a 0.5 mm thick alumina green sheet 1 in a 1 mm pitch matrix.
次に第２図で示すように、グリーンシートを
1600℃の還元雰囲気中で燃焼する。 Next, as shown in Figure 2, the green sheet is
Burns in a reducing atmosphere at 1600℃.
次に第３図に示すように、アルミナは焼成によ
り約15％程度収縮するが、タングステン線２は収
縮しないため、アルミナ基板３の両面にタングス
テン線２が突出する。この突出部の上に銀ペース
トを印刷し、焼成して電極４，５を形成する。 Next, as shown in FIG. 3, alumina shrinks by about 15% by firing, but the tungsten wire 2 does not shrink, so the tungsten wire 2 protrudes from both sides of the alumina substrate 3. Silver paste is printed on the protrusions and fired to form the electrodes 4 and 5.
次に第４図に示すようにアルミナ基板３の一方
の面の一対の銀電極４上に酸化ルテニウムのグレ
ーズ抵抗ペーストを印刷し、焼成して抵抗体６を
形成する。 Next, as shown in FIG. 4, a ruthenium oxide glaze resistor paste is printed on a pair of silver electrodes 4 on one side of the alumina substrate 3 and fired to form a resistor 6.
最後に第５図に示すように、あらかじめグリー
ンシート１につけておいたハーフカツトの溝に沿
つてグリーンシート１を切断して、チツプ抵抗器
を得るのである。 Finally, as shown in FIG. 5, the green sheet 1 is cut along the half-cut grooves previously made in the green sheet 1 to obtain chip resistors.
なお、このチツプ抵抗器の取付け方法は第６図
に示すように、プリント基板７の銅箔８，９とチ
ツプ抵抗器の裏面の電極５が半田１０によりフエ
ースボンデングされる。 As shown in FIG. 6, this chip resistor is attached by face-bonding the copper foils 8 and 9 of the printed circuit board 7 and the electrode 5 on the back side of the chip resistor with solder 10.
（発明の効果）
本発明によれば、アルミナ基板がタングステン
線によりスルーホールされて、抵抗体の電極が裏
面に設置される。したがつてチツプ抵抗器の寸法
が小型になつても、電極と抵抗体の印刷だけで精
度良くチツプ抵抗器を製造することができる。(Effects of the Invention) According to the present invention, a through hole is formed in the alumina substrate using a tungsten wire, and the electrode of the resistor is installed on the back surface. Therefore, even if the size of the chip resistor becomes smaller, it is possible to manufacture the chip resistor with high precision just by printing the electrodes and the resistor.
第１図は本発明の一実施例の製造方法による第
１工程を示す断面図、第２図は同第２工程を示す
断面図、第３図は同第３工程を示す断面図、第４
図は同第４工程を示す断面図、第５図はチツプ抵
抗器の平面図、第６図は本発明の実施例により得
られたチツプ抵抗器をプリント基板にフエースボ
ンデンクした断面図である。
１……アルミナグリーンシート、２……タング
ステン線、３……アルミナ基板、４，５……銀電
極、６……抵抗体、７……プリント基板、８，９
……銅箔、１０……半田。
FIG. 1 is a sectional view showing the first step in a manufacturing method according to an embodiment of the present invention, FIG. 2 is a sectional view showing the second step, FIG. 3 is a sectional view showing the third step, and FIG.
The figure is a sectional view showing the fourth step, FIG. 5 is a plan view of the chip resistor, and FIG. 6 is a sectional view of the chip resistor obtained by the embodiment of the present invention face-bonded onto a printed circuit board. . 1... Alumina green sheet, 2... Tungsten wire, 3... Alumina substrate, 4, 5... Silver electrode, 6... Resistor, 7... Printed circuit board, 8, 9
...Copper foil, 10...Solder.
Claims (1)
トの厚みと同一寸法の長さのタングステン線を所
定の間隔を介して複数埋込み燃焼し、焼成後のア
ルミナ基板の両表面に露出しているタングステン
線端部に銀ペーストを塗布、焼付けて銀電極を形
成し、隣接する前記銀電極間にまたがつて抵抗体
を印刷、焼成した後、アルミナ基板を所定の寸法
に切断することを特徴とするチツプ抵抗器の製造
方法。1. A plurality of tungsten wires having the same length as the thickness of the green sheet are embedded in an alumina green sheet at predetermined intervals and burned, and the ends of the tungsten wires exposed on both surfaces of the fired alumina substrate are A chip resistor characterized in that a silver electrode is formed by coating and baking a silver paste, a resistor is printed and baked between the adjacent silver electrodes, and then an alumina substrate is cut into predetermined dimensions. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58027758A JPS59154002A (en) | 1983-02-23 | 1983-02-23 | How to manufacture chip resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58027758A JPS59154002A (en) | 1983-02-23 | 1983-02-23 | How to manufacture chip resistors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59154002A JPS59154002A (en) | 1984-09-03 |
| JPH0447961B2 true JPH0447961B2 (en) | 1992-08-05 |
Family
ID=12229908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58027758A Granted JPS59154002A (en) | 1983-02-23 | 1983-02-23 | How to manufacture chip resistors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154002A (en) |
-
1983
- 1983-02-23 JP JP58027758A patent/JPS59154002A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59154002A (en) | 1984-09-03 |
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