JPH0449511B2 - - Google Patents
Info
- Publication number
- JPH0449511B2 JPH0449511B2 JP307486A JP307486A JPH0449511B2 JP H0449511 B2 JPH0449511 B2 JP H0449511B2 JP 307486 A JP307486 A JP 307486A JP 307486 A JP307486 A JP 307486A JP H0449511 B2 JPH0449511 B2 JP H0449511B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ceramic
- plating layer
- plating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 6
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 239000000463 material Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000005219 brazing Methods 0.000 description 9
- 150000002739 metals Chemical class 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229910000833 kovar Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 1
- 229910018536 Ni—P Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- -1 sputtering Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はセラミツク接合用の金属部材に係わる
ものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Field of Application> The present invention relates to a metal member for joining ceramics.
〈従来の技術〉
金属部材とセラミツク部材の間にペースト状あ
るいはシート状のロー材を挟んで加熱溶融して両
者を接合することは既に行われている。<Prior Art> It has already been practiced to sandwich a paste-like or sheet-like brazing material between a metal member and a ceramic member and heat and melt them to join them together.
しかしながら、この方法ではペーストの厚さに
ムラが有つたり、あるいはシートの位置がずれて
必要な部分のみを正確にロー付けすることが極め
てむつかしく、回路基板の様な微細模様のものに
至つては不可能に近い。 However, with this method, the thickness of the paste may be uneven, or the position of the sheet may be misaligned, making it extremely difficult to accurately braze only the necessary areas. is nearly impossible.
したがつて、従来の方法では、接合部分のロー
材の余分なバリによる絶縁不良や短絡の問題はさ
けがたい。 Therefore, in the conventional method, problems such as poor insulation and short circuits due to excess burrs in the brazing material at the joining portion are unavoidable.
〈発明が解決しようとする問題点〉
本発明はかかる問題に鑑みてなされたもので、
ロー材の厚さの制御、金属板とロー材の位置の固
定が極めて正確に実施できるセラミツク接合用の
金属部材の新規な構造を提供せんとするものであ
る。<Problems to be solved by the invention> The present invention has been made in view of these problems.
It is an object of the present invention to provide a novel structure of a metal member for joining ceramics, in which the thickness of the brazing material can be controlled and the position of the metal plate and the brazing material can be extremely precisely fixed.
〈問題点を解決するための手段〉
本発明者は上記問題にかんして鋭意研究をおこ
なつた結果、次のようなあたらしい知見をうるに
至つた。即ち、
１ 活性金属の粉末あるいは活性金属の化合物の
粉末を共析させた複合メツキ層を金属部材の接
合部分に形成させて、この部分をセラミツクに
密着させ、メツキ層を加熱、溶融、合金化する
と、この融液はセラミツクに融着すること。<Means for Solving the Problems> As a result of intensive research into the above problems, the inventors have come to the following new knowledge. That is, 1. A composite plating layer in which active metal powder or active metal compound powder is eutectoid is formed on the joining part of the metal members, this part is brought into close contact with the ceramic, and the plating layer is heated, melted, and alloyed. This melt then fuses to the ceramic.
２ 本発明では複合メツキ層は一種のロー材と見
なされるが、この複合メツキ層は金属部材と一
体的に接合されているために、この部材を微細
なパターンに加工してもメツキ層もこの模様の
通りに一緒に加工される。つまり微細パターン
の接合面にロー材が極めて正確に被覆あるいは
塗付できることになるために、従来の様な、ペ
ーストの厚さの不同やロー材のズレが起こらな
い。また、
３ このロー材の合金組成はメツキ層の厚さ、共
析粒子の量を変えることによつて、あるいは更
にこの複合メツキ層に更に第３、第４、……の
元素の薄膜の層（たとえば単独のメツキ層）を
組合わせることによつて、合金元素の種類、量
を変えることができることを見出した。2 In the present invention, the composite plating layer is regarded as a type of brazing material, but since this composite plating layer is integrally joined to the metal member, even if this member is processed into a fine pattern, the plating layer will not change. They are processed together according to the pattern. In other words, since the soldering material can be coated or applied extremely accurately to the bonding surface of the fine pattern, there is no difference in the thickness of the paste or misalignment of the soldering material, which occurs in the conventional method. 3 The alloy composition of this brazing material can be changed by changing the thickness of the plating layer and the amount of eutectoid particles, or by adding thin film layers of third, fourth, etc. elements to this composite plating layer. It has been found that the types and amounts of alloying elements can be changed by combining (for example, individual plating layers).
〈作用〉
１ 活性金属あるいはこの化合物は複合メツキ層
の中ではくるまれた状態で存在する。<Function> 1. The active metal or its compound exists in a wrapped state in the composite plating layer.
このくるまれた粒子は、加熱によつて、メツ
キ金属に拡散し、低融点の合金を形成し、セラ
ミツクに融着る。 Upon heating, the wrapped particles diffuse into the plating metal, forming a low melting point alloy and fusing to the ceramic.
２ ロー材は金属部材と一体的になつているため
に、部材を微細に加工してもロー材も一緒に加
工され、部材への極めて正確なロー材層の形成
が達成されることになる。2 Since the brazing material is integrated with the metal component, even if the component is finely machined, the brazing material will also be processed together, achieving extremely accurate formation of the brazing material layer on the component. .
３ 活性金属あるいは化合物は、おしなべて非常
に酸化されやすい金属であるが、この粒子はメ
ツキ層にくるまれているので、セラミツクの上
に単独で塗付して処理する場合に較べて雰囲気
による酸化等の影響は極めて少ない。3. All active metals or compounds are metals that are highly susceptible to oxidation, but since these particles are wrapped in a plating layer, they are less likely to be oxidized by the atmosphere than when they are applied alone onto ceramics. The impact is extremely small.
４ 活性金属の薄膜を形成する方法として他にス
パツタリング等の方法もあるが、これは、設備
的に高価で、生産性もわるい欠点があるが、複
合メツキはこれらに比較して非常に経済的であ
る。4 There are other methods for forming thin films of active metals, such as sputtering, but these have the drawbacks of being expensive in terms of equipment and having poor productivity, but composite plating is very economical compared to these methods. It is.
なお、本発明の活性金属あるいは化合物とは、
例えば、次の様なものである。 The active metal or compound of the present invention is
For example, the following.
金属：
Ti、Zr、Ｖ、Nb、Ta、……等の活性金属あ
るいはこれらを含む合金。Metals: Active metals such as Ti, Zr, V, Nb, Ta, etc. or alloys containing these.
化合物： 上記活性金属の水素化物等。Compound: Hydride of the above active metal, etc.
またメツキ金属は、例えば、Ni、Co、Cu、
Ag、Au、Sn……、Ni−Ｐ、Ni−Ｂ、……ある
いはこれらの合金メツキを指し、電解、無電解メ
ツキいずれでもよい。 Also, plating metals include, for example, Ni, Co, Cu,
Refers to Ag, Au, Sn..., Ni-P, Ni-B,... or alloy plating thereof, and may be either electrolytic or electroless plating.
〈実施例〉
実施例 １
金属部材 100ミクロンの銅箔
セラミツク：アルミナ
メツキ金属：ニツケル
拡散性粒子：Tiの粉末
メツキ操作
銅板の表面に、Ti粒子を懸濁した電気メツキ
浴によつて、約20ミクロン、Tiとニツケルの複
合メツキ層を形成させた。<Example> Example 1 Metal member 100 micron copper foil Ceramic: Alumina Plating metal: Nickel Diffusive particles: Ti powder Plating operation Approximately 2 A composite plating layer of micron, Ti, and nickel was formed.
パターンの形成
上記メツキ処理した銅板を回路基板用に打抜き
加工した。 Formation of Pattern The plated copper plate described above was punched into a circuit board.
〈接合操作〉
アルミナセラミツクの板の面に打抜き銅板のメ
ツキ面を密着させて、下記の条件で接合を行なつ
た。<Joining operation> The plated surface of the punched copper plate was brought into close contact with the surface of the alumina ceramic plate, and bonding was performed under the following conditions.
加熱雰囲気：５×10-4Torrの減圧下
加熱温度 950℃×10分
打ち抜きパターンはセラミツク板に強固に接合
されバリも出ていなかつた。 Heating atmosphere: Under reduced pressure of 5 x 10 -4 Torr Heating temperature: 950°C x 10 minutes The punched pattern was firmly bonded to the ceramic plate and no burrs appeared.
実施例 ２
金属部材：100ミクロンの銅の板
セラミツク：窒化アルミの板
メツキ金属：銅、銀
拡散性粒子：Tiの水素化物
メツキ操作
銅板の表面に電気メツキによつて、TiH2と銅
の複合メツキ層（10ミクロン）を形成した。Example 2 Metal member: 100 micron copper plate Ceramic: Aluminum nitride plate Plating metal: Copper, silver Diffusible particles: Ti hydride Plating operation A composite of TiH 2 and copper was deposited on the surface of the copper plate by electroplating. A plating layer (10 microns) was formed.
更に、この複合メツキ層の上に銀を10ミクロ
ン、メツキした。 Furthermore, 10 microns of silver was plated on top of this composite plating layer.
銅板の加工
上記メツキした板を微細回路模様に打抜き加工
した。 Processing of copper plate The plated plate described above was punched into a fine circuit pattern.
接合操作
温度：900℃
時間：５分
雰囲気：アルゴン雰囲気
微細回路はバリを出すことなくセラミツクに強
固に接合されていた。 Bonding operation Temperature: 900°C Time: 5 minutes Atmosphere: Argon atmosphere The microcircuit was firmly bonded to the ceramic without any burrs.
実施例 ３
金属部材 300ミクロンのコバールの板
セラミツク アルミナの板
メツキ金属 銅、銀
拡散性粒子 Tiの粉末
メツキ操作 コバール板の表面に銅を10ミクロ
ン、更にTi粉末と銀の複合メツキ層（20ミクロ
ン）を電気メツキで形成した。Example 3 Metal member Kovar plate of 300 microns Ceramic Alumina plate Plating metal Copper, silver Diffusible particles Ti powder Plating operation Copper is applied to the surface of the Kovar plate to a thickness of 10 microns, followed by a composite plating layer of Ti powder and silver (20 microns) ) was formed by electroplating.
コバール板の加工
上記メツキしたコバールの板を微細模様に打抜
き加工した。 Processing of Kovar Board The plated Kovar board described above was punched into a fine pattern.
接合操作
温度 850℃
時間 ５分
雰囲気 減圧（５×10-4Torr）
微細パターンはバリをだすことなくセラミツク
に接合されていた。 Bonding operation Temperature: 850°C Time: 5 minutes Atmosphere: Reduced pressure (5×10 -4 Torr) The fine pattern was bonded to the ceramic without any burrs.
〈発明の効果〉
１ 微細模様でもバリをだすことなくセラミツク
に正確に接合できる。<Effects of the invention> 1. Even fine patterns can be accurately bonded to ceramic without producing burrs.
２ 接合部にロール材を貼つたり、塗つたりする
手間が不要である。2. There is no need to affix or paint roll material on the joints.
３ 安価に施工できる。3. Can be constructed at low cost.
Claims (1)
活性金属あるいは活性金属の化合物の粉末を共析
した複合メツキ層が被覆されてなることを特徴と
するセラミツク接合用金属部材。1. On the joint surface of the metal member to be joined to the ceramic,
A metal member for joining ceramics, characterized in that it is coated with a composite plating layer in which active metal or active metal compound powder is eutectoid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP307486A JPS62161466A (en) | 1986-01-09 | 1986-01-09 | Metallic member for joining ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP307486A JPS62161466A (en) | 1986-01-09 | 1986-01-09 | Metallic member for joining ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62161466A JPS62161466A (en) | 1987-07-17 |
| JPH0449511B2 true JPH0449511B2 (en) | 1992-08-11 |
Family
ID=11547191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP307486A Granted JPS62161466A (en) | 1986-01-09 | 1986-01-09 | Metallic member for joining ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62161466A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260952A (en) * | 1988-08-27 | 1990-03-01 | Japan Synthetic Rubber Co Ltd | Rubber composition for rubber member of refrigerator |
| US5340658A (en) * | 1991-08-21 | 1994-08-23 | Ishihara Chemical Co., Ltd. | Composites made of carbon-based and metallic materials |
-
1986
- 1986-01-09 JP JP307486A patent/JPS62161466A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62161466A (en) | 1987-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0643903B1 (en) | Tin-bismuth solder connection having improved high temperature properties, and process for forming same | |
| CA1284898C (en) | Titanium-copper-nickel braze filler metal | |
| US6848610B2 (en) | Approaches for fluxless soldering | |
| JPH0217509B2 (en) | ||
| US5021300A (en) | Solder back contact | |
| EP1333958A1 (en) | Method of joining surfaces | |
| JPH0449511B2 (en) | ||
| JPH05105563A (en) | Metal-ceramic joint | |
| US3683488A (en) | Methods of bonding metals together | |
| JP3629578B2 (en) | Ti-based material and Cu-based bonding method | |
| JP2002292474A (en) | Titanium or titanium alloy joining method | |
| JPS6132752A (en) | Manufacture of ceramics circuit board | |
| EP0084161B1 (en) | Lead frames for electronic and electric devices | |
| JPH0338943B2 (en) | ||
| JPH06302952A (en) | Manufacture of circuit board with through hole | |
| JPS61269998A (en) | Sn alloy solder having excellent thermal fatigue characteristic | |
| JPS6334963A (en) | Method for manufacturing ceramic substrates for semiconductor devices and cladding materials used in the method | |
| JPH05259632A (en) | Printed wiring board and manufacture thereof | |
| JPS5812117B2 (en) | metal wax | |
| JPH0140711B2 (en) | ||
| JPH11300471A (en) | Solder coating material and its manufacture | |
| JPS6117394A (en) | Production of joined material | |
| JP2001105131A (en) | Solder coating material, solder joint of electronic component, and method of manufacturing solder coating material | |
| JPS6333175A (en) | Joining method for metallic member | |
| JPH0217952B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |