JPH0449782B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a heat-evacuation fixing device for electrical components, in particular control elements, fixed on metallic parts, in particular metal space plates. .

BACKGROUND OF THE INVENTION On page 107 of the magazine "Electronics", issue 11, 1977, a cooling means for maintaining a sufficiently low temperature of semiconductor components is described. A cooling effect is necessary in particular in high-power semiconductor components and is conventionally produced via heat-conducting parts, such as cooling profiled surfaces of the housing part and/or fastening devices. For this purpose, good thermal and mechanical contact with the part or molding surface to be cooled is important. In this case, if heat is discharged using a heat conductive paste, the cooling becomes extremely good.

OBJECT OF THE INVENTION It is an object of the present invention to improve the conventional fixing device and to provide one which is simpler in structure and easier to assemble, and which also has good and uniform heat dissipation.

Means for Solving the Problems The gist of the present invention, which has solved the above problems, is a heat dissipating fixing device for a member, especially an electronic component, especially an electronic control element, fixed to a metal base plate, comprising: It has a casing made of electrically insulating elastic plastic, and
In a type in which the member is inserted into the housing, and a space between the housing and the member is filled with a heat conductive paste,
The casing is provided with at least one, in particular serrated, profiled edge on the upper edge of the housing, by means of which the element can be snapped into the housing.

Embodiments Advantageous embodiments of the invention are set out in the dependent claims. It is particularly advantageous if the space between the housing and the component to be cooled is filled with a thermally conductive paste. It is also advantageous if the housing is made of an insulating material, since this creates an electrically advantageous surrounding for the electrical control element and, in particular, short circuits with the housing potential do not occur. Furthermore, if the casing is made of elastic plastic and the upper edge of the housing is formed with a molded edge, the component to be cooled can be pushed over the molded edge into the housing; Advantageously, this allows reliable fixation that prevents movement of the component from the housing without complicating the assembly process.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A housing 2 is formed in a housing 1 made of elastic material, the upper edge of which has a tooth-shaped profiled edge 6 . A metal base plate 4 is fitted into the housing 2, and a space between the metal base plate 4 and the wall of the housing 2 is filled with a heat conductive paste 3. A metal base plate 4 holds an electrical control element 5.

The electrical control element 5 is the final output stage in thin film technology and is glued onto the metal base plate. Before assembly, the casing 1 is preformed with a cap 2 and a molded edge 6 and filled with a heat-conductive paste 3, and a metal base plate 4 is fitted into the cap 2 as a holder for the electrical control element 5. The tooth-shaped profiled edges 6 thereby prevent the metal base plate 4 from shifting.
Although not shown, a plurality of connection points are arranged around the enclosure 2, thereby connecting the control element 5.
is connected to this connection point by the Bonderite method after installation.

Naturally, the invention is not limited to the exemplary embodiment shown; in particular, the fixing device according to the invention is also suitable for example for output resistors, final stage transistors, voltage regulators, etc.

Effects of the Invention In the heat dissipating fixing device according to the present invention,
The fixing method is extremely simple as the member holding the electrical control element is simply inserted into the housing. Particularly in mass production, this makes possible a simple assembly process, which is advantageous. In the docked state, the component to be cooled is surrounded by the enclosure, so that a particularly effective and uniform heat removal can take place.

[Brief explanation of the drawing]

The drawing is a sectional view of a heat dissipating fixing device according to the invention. DESCRIPTION OF SYMBOLS 1...Casing, 2...Housing part, 3...Heat conductive paste, 4...Metal base plate, 6...
. . . molded edge, 5 . . . electrical control element.

Claims (1)

[Claims] 1 a heat-dissipating fastening device for an electronic component 5, in particular an electronic control element, which is fastened to a component 4, in particular a metal base plate, with a casing made of electrically insulating elastic plastic; 2, the member 4 is inserted into the casing 2, and the space between the casing 2 and the member 4 is filled with a heat conductive paste 3. In the casing 1
is provided with at least one, in particular serrated, profiled edge 6 on the upper edge of the housing 2, so that
Heat dissipating fixing device, characterized in that said member 4 is snap-fittable into said housing 2.