JPH0451415B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention Technical Field The present invention relates to an apparatus for automatically forming packaging containers by bonding materials for packaging containers such as cardboard and plastic sheets using a hot-melt spray gun method. The present invention relates to a hot melt adhesion inspection device for packaging containers that is attached to and used for inspecting hot melt adhesion defects.

BACKGROUND ART Conventionally, materials for packaging containers such as cardboard and plastic sheets are placed on a conveyor such as a belt conveyor, and a detection sensor that scans the movement of the material and a hot melt injection gun that operates in synchronization with the sensor are used. A packaging container for sequentially and continuously storing bottles, cans, etc. is formed by attaching hot melt to desired parts of the material.

In the above-described method of forming a packaging container by spraying and adhering hot melt to a desired part of the material using a hot melt spray gun, the required amount of hot melt may not be sprayed to the desired part, or the hot melt may not be sprayed continuously, that is, excess hot melt may be sprayed. This may cause accidents such as packaging containers peeling off during transportation, or hot melt adhering to areas of the container where adhesion is not required may adhere to stored bottles, cans, etc., reducing product value. Something happened.

However, the only countermeasure against this problem is to use a photoelectric switch to check for peeling of the container after it has been formed by a small amount of hot melt adhering to the container. The reality is that fundamental inspections to check for abnormalities such as hot melt adhesion to bottles and cans in advance, i.e., when hot melt adhesion occurs, and to devise countermeasures, are still not being carried out. be.

Problems to be Solved by the Invention Therefore, from the above-mentioned circumstances, accidents due to peeling during transportation due to insufficient adhesion of packaging containers, and hot melt adhesion to unnecessary parts of the containers, resulting in damage to stored bottles and cans. There still remains a technical problem in trying to solve the problem of staining, and this solution has been strongly desired.

Means for Solving the Constituent Problems of the Invention The present invention is designed to prevent hot melt adhesion failure (adhesion area is smaller than a predetermined area, or
Based on the knowledge that this is caused by adhesion (the amount of adhesion is less than the specified amount) or adhesion abnormality (adhesion extending beyond the specified area) (hereinafter referred to as adhesion failure collectively, adhesion failure and adhesion abnormality). As a result of various studies, it was discovered that by detecting the temperature of the adhered hotmelt using an infrared temperature sensor, it is possible to judge whether the adhesion of the hotmelt is good or not or abnormality using an electrical method.This is the summary of this work. However, it is a hot melt adhesion inspection device for packaging containers that is attached to a device that forms packaging containers from packaging container materials such as cardboard and plastic sheets by hot melt adhesion. A temperature sensor, a counter that counts signals from the temperature sensor, and a detection sensor that scans the packaging container material are provided, and when the scanning of the packaging container material is completed, the number of signals stored in the counter is provided. A hot melt adhesion inspection device for packaging containers is characterized by inspecting hot melt adhesion defects according to numerical values.

DESCRIPTION OF EMBODIMENTS The present invention will be described in detail below based on embodiments shown in the drawings.

FIG. 1 is a perspective view of a main part of a hot melt adhesion inspection device attached to a packaging container forming device according to the present invention. FIG. 2 is a perspective view similar to FIG. 1 showing another embodiment.

As shown in FIG. 1, an opened cardboard box 1 before container formation is conveyed by a belt conveyor 7.
At the station 6a, hot melt injection guns 4 are arranged in parallel adjacent to the side of the belt conveyor 7 at required positions 5a and 5a' in the lower half of the side of the cardboard 1.
Hot melt is sprayed and deposited by a and 4a'.

The cardboard box 1 with the hot melt adhering to it moves forward in the direction of the large arrow on the conveyor 7, the cardboard box 1 is detected by the synchronous sensor 3a for position detection, and then the adhering hot melt 5a is detected by the infrared temperature sensor 2a. The signals are counted by a counter (not shown). When the packaging container is further moved by the conveyor 7, the hot melt 5a' is detected by the infrared temperature sensor 2a, and the detection signal is counted as a second count by the counter.

In the case of this example, that is, the case of FIG. 1, if the counter counts 2 while the synchronization sensor 3a is detecting, it is determined to be a pass; if it only counts 0 or 1, or if it counts 3 or more, it is determined to be a fail.

Also, in Figure 1, the hot melt gun for the packaging container is attached only to the front side, but it goes without saying that if necessary, the rear side can be inspected in the same way as above using the same equipment as the front side. do not have.

The packaging container 1 that has been inspected is placed at the station 6b, and hot melted 5a,
The flap 1a is folded in the direction of the position 5a',
The cardboard pieces are glued together.

Similarly, at the position of the station 6c, the required position 5b in the upper half of the cardboard 1, as shown in the figure.
5b' is sprayed with hot melt by hot melt spray guns 4b, 4b' provided in the same manner as described above, and then the position and number of hot melts 5b, 5b' are inspected by the infrared temperature sensor 2b and the synchronization sensor 3b, and the hot melt is deposited on the station 6d. Then the upper half flap 1b is folded up and the cardboard pieces are glued together.

In addition, as shown in Fig. 1, the infrared temperature sensor 2
The number of a, 2b is the number of hot melt injection guns 4a, 4.
Although half of the number of infrared temperature sensors a', 4b, and 4b' are provided, it goes without saying that the same number of infrared temperature sensors as the number of hot melt injection guns may be used.

If such an inspection device yields a failure value for hot melt adhesion, either an alarm is issued in the usual way and the conveyor 7 is stopped, or an inspection station 6c' is installed for rejected containers after the inspection, and the inspection device is removed from the inspection device. Rejected containers can also be automatically rejected by a signal.

The inspection device according to the present invention has the above-described structure and is formed to function, but as shown in another embodiment in FIG. When detecting the position of the hot melt 5a, a spot-type infrared temperature sensor 2a is used, and the detection range is made smaller than the adhering range of the hot melt 5a, as shown by the symbol 2a', thereby increasing the accuracy. was found to be preferable in terms of detection accuracy.

Also, hot melt, which is normally used to bond materials for packaging containers such as cardboard and plastic sheets, is used at temperatures of 175°C to 205°C, that is, around 190°C, so spot-type infrared rays with a sensitive temperature of about 100°C to 200°C are used. Highly accurate detection is possible by using a temperature sensor.

Using a temperature sensor as described above, when the ambient temperature is 10℃, the temperature of the adhered hot melt after 1 second is measured.
We have obtained test data of 170℃ and 163℃ after 2 seconds, and the response speed of the temperature sensor is 0.05 seconds, so the conveyor speed is sufficient over the range of 6m/min at low speed to 20m/min at high speed. Confirmed that it is detectable.

Next, the synchronous sensors 3a and 3 in this embodiment
The timing of the signals from the infrared temperature sensors 2a and 2b is as shown in Figure 3, and the infrared temperature sensor is activated only when the synchronized sensor detects the position of the box, that is, when the cardboard box 1 is present. I'm starting to do that.

An example of a circuit diagram of a synchronous sensor and an infrared temperature sensor for detecting a container is shown in FIG. 4. FIG. 4 is a circuit diagram for station 6a, and it goes without saying that the same is true for station 6c. . Incidentally, FIG. 5 shows the relationship between the output signals of each part and time in the circuit of FIG. 4 as a time chart.

In Fig. 4, the counter 10 (in this example, the count setting is set to 2) is the counter 10c when two signals from the infrared temperature sensor 2a are received.
is output and judged as passing, but when the signal of the infrared temperature sensor 2a is 0 or 1, the counter 10
does not count up, and the B signal remains output. In this case, as a result of integrating the signal B and the timing signal G after the container 1 passes, a rejection is determined.

If the signal from the infrared temperature sensor 2a is 3 or more, it should also be rejected, but the counter 11
Set the set to 3, and if it is 3 or more, output D
A determination of failure is made from the product of the timing signal G after the container 1 has passed. In the figure, numeral 12 is a timer;
13 is a one-shot timer, 14 is a memory, and 15 is an output relay. Also, in the figure, the (←) mark indicates the reset signal in each case.

Effects of the Invention As described above, according to the present invention, it has become possible to know the state of hot melt adhesion using an infrared temperature sensor, judge whether it is good or not, and take measures. It is now possible to prevent stains caused by excess hot melt adhering to the container when it is stored. Therefore, the present invention not only improves the reliability of container formation, but also greatly contributes to rational operation of the container formation process.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a main part of a hot melt adhesion inspection device attached to a packaging container forming device according to the present invention. FIG. 2 is a perspective view similar to FIG. 1 showing another embodiment. Figure 3 is a diagram showing the time chart of the signals of the synchronous sensor and infrared temperature sensor.
FIG. 4 is a diagram showing an example of a circuit diagram according to the present invention, and FIG. 5 is a diagram showing the relationship between output signals of each part and time in the circuit of FIG. 4 as a time chart. Explanation of symbols, 1...Cardboard box, 1a...Flap, 2a, 2b...Infrared temperature sensor, 3
a, 3b... synchronous sensor for position detection, 4a,
4a'... Hot melt injection gun, 5a, 5a'...
Adhered hot melt, 6a, 6b...station, 7...conveyor, 10, 11...counter, 12...timer, 13...one shot timer, 14...memory, 15...output relay.

Claims (1)

[Scope of Claims] 1. A hot melt adhesion inspection device for packaging containers attached to an apparatus for forming packaging containers from packaging container materials such as cardboard and plastic sheets by hot melt adhesion, which inspects hot melt adhesion on the packaging container materials. an infrared temperature sensor that scans the temperature sensor, a counter that counts signals from the temperature sensor, and a detection sensor that scans the packaging container material, and when scanning of the packaging container material is completed, 1. A hot melt adhesion inspection device for packaging containers, which tests for hot melt adhesion defects according to values stored in a counter. 2. The hot melt adhesion inspection device for packaging containers according to claim 1, wherein the infrared temperature sensor is a spot type sensor.