JPH0453092B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heating device used for heat treatment of an object to be heated, such as a semiconductor wafer, housed in a reaction tube.

[Conventional technology]

Conventionally, heating devices used in semiconductor processing have a configuration that covers the circumferential surface of a cylindrical reaction tube that houses a semiconductor wafer, and a heating element is arranged to uniformly heat the circumferential surface of the reaction tube. It was established.

The heat treatment of the semiconductor wafer is performed by inserting the reaction tube containing the semiconductor wafer through the end opening of the heating device, and the semiconductor wafer that has undergone the heat treatment is pulled out together with the reaction tube from the end opening of the heating device. ing.

[Problem that the invention seeks to solve]

By the way, moving the reaction tube in and out of the heating device in the longitudinal direction requires a space larger than the length of the reaction tube on the end face side of the heating device, and also takes a long time to move the reaction tube in and out. In particular, when the reaction tube is pulled out from the heating device for cooling, residual heat from the heating device acts on the semiconductor wafer inside the reaction tube, putting a limit on the cooling rate.

Regarding the cooling of semiconductor wafers, the effect of rapid cooling may directly affect the characteristics of some semiconductor devices, and the demand for rapid cooling is increasing.

In response to these demands, in order to achieve rapid heating and cooling of semiconductor wafers, the furnace body was configured to be divisible in the diametrical direction, and the reaction tubes were attached to and removed from the furnace body in the diametrical direction. A heating device has been proposed.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a heating device that prevents deformation such as hanging of the heating element wire installed on the inner wall surface of a furnace body.

[Means for solving problems]

As shown in FIG. 1, the heating device of this invention has the following features:
A cylindrical furnace body 2, a heating element wire 4 provided exposed on the inner wall surface of the furnace body, and an insulating band-shaped fixing member having an arcuate recess 6 formed therein to secure a plurality of the heating element wires. piece (fixing piece 8), a presser plate 10 that fixedly supports the fixing piece, and the presser plate fixes the heating element wire to the furnace body through the fixing piece on the outer wall surface of the furnace body. The furnace is equipped with a fixing mechanism (fixing bolt 18 and nut 26), and a heat insulating ring 24 interposed between the fixing mechanism and the outer wall surface of the furnace body.

[Effect]

In the heating device of this invention, since the heating element wire is firmly fixed to the inner wall surface of the furnace body, deformation of the heating element wire such as hanging from the inner wall surface of the furnace body during heat generation can be prevented, and the heating temperature is uniform. and stabilization.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the heating device of the present invention.

As shown in FIG. 1, a plurality of heating element wires 4 are arranged as heating elements on the inner wall surface of the furnace body 2, and each heating element wire 4 has an arc shape that covers a part of its circumferential surface. A band-shaped fixing piece 8 made of an insulating material is applied to the recess 6, for example, at two locations. That is, the heating element wire 4 is held by the furnace body 2 and the fixed piece 8. A presser plate 10 for fixedly supporting the fixing piece 8 is placed on the outer surface of the fixing piece 8, and the presser plate 10 and the fixing piece 8 have through holes 12 and 1, respectively.
4 is formed, and a through hole 16 is also formed in the furnace body 2. Fixing bolts 18 as a fixing mechanism are passed through these through holes 12, 14, and 16, and a wire 22 and a heat insulating ring 24 are attached to the fixing bolts 18 that protrude from the outer surface of the reinforcing plate 20 that forms the outer wall surface of the furnace body 2. At the same time as installing, fixing bolt 1
A nut 26, which forms a fixing mechanism together with the fixing bolt 18, is attached to the threaded portion of the bolt 8.

Therefore, the heating element wire 4 can be firmly fixed to the inner wall surface of the furnace body 2, and a strong fixed state can be obtained without distinction between the lower inner wall surface and the upper inner wall surface of the furnace body 2. Deformation such as hanging of the wire 4 when it generates heat can be prevented.

Next, FIG. 2 shows the overall configuration of one embodiment of this heating device.

As shown in Fig. 2, this heating device is constructed by vertically dividing a cylindrical furnace body into two furnace bodies 2.
A, 2B, and each furnace body 2A, 2B has a support stand 28.
They are individually rotatably supported via support shafts 32 on columns 30 attached at regular intervals on the top surface, and are opened and closed and held at a desired opening degree via an opening/closing mechanism 34. ing.

Inside each of the furnace bodies 2A and 2B, a housing section 36 is formed to house a cylindrical reaction tube containing a semiconductor wafer as an object to be heated.

The housing portion 36 of each furnace body 2A, 2B is formed of a heat insulating material such as ceramic.
As shown in FIG. 3, heating element wires 4 as heating elements are arranged along the curved inner wall surface of the housing portion 36 with their ends bent in a staggered manner. In this case, the heating element wire 4 has a diameter of 6.5 mm.
Relatively thick strands of about 100 mL are used.

The heating element wires 4 are arranged at regular intervals by spacers 38 made of a heat insulating material, and are attached to the furnace bodies 2A, 2B, as shown in FIG. It is fixed by the fixing device shown in the figure.

Note that a DC power source as a driving source is connected between the terminals of the heating element wire 4, and by controlling the current,
It can generate heat at a specific temperature.

Therefore, the heating element wires 4 are incorporated along the inner wall surface of the accommodating part 36 that accommodates the objects to be heated in the furnace bodies 2A and 2B, and are arranged at regular intervals, so that the heating element wires 4 are installed along the inner wall surface of the accommodating part 36 that accommodates the objects to be heated in the furnace bodies 2A and 2B, and are arranged at regular intervals. It is possible to uniformly heat pipes and perform predetermined treatments.

In addition, since the heating element wire 4 can be of a thick shape of about 6.5 mm, it can be firmly fixed inside the furnace bodies 2A, 2B by the fixing means.
Since deformation due to the temperature inside the furnace can be prevented, a uniform temperature distribution can be maintained, a stable heating state can be maintained, and the heating life can be extended.

In the embodiments, a furnace body for heating a semiconductor wafer as an object to be heated has been described as an example, but the heating apparatus of the present invention can also be used for heat treatment of objects to be heated other than semiconductor wafers.

〔Effect of the invention〕

As explained above, according to the present invention, the heating element wire can be easily fixed to the wall surface of the furnace body, and the heating element wire can be firmly fixed, so that the heating element wire can be prevented from sagging when generating heat. Deformation can be prevented, the heat generation temperature can be made uniform, and the heat generation temperature can be stabilized.

[Brief explanation of drawings]

Fig. 1 is an exploded perspective view showing an embodiment of the heating device of the present invention, Fig. 2 is a perspective view showing the heating device of the invention, and Fig. 3 is a perspective view showing the internal configuration of the furnace body in the heating device of the invention. 4 are cross-sectional views showing the fixing structure of the heating element wire in the heating device shown in FIG. 3. 2, 2A, 2B...Furnace body, 4...Heating element wire, 6
... recess, 8 ... fixed piece, 10 ... presser plate, 18
... Fixing bolt (fixing mechanism), 24... Heat insulation ring, 26... Nut (fixing mechanism).

Claims (1)

[Scope of Claims] 1. A cylindrical furnace body, a heating element wire provided exposed on the inner wall surface of the furnace body, and an arcuate recess formed to fix a plurality of the heating element wires. an insulating strip-shaped fixing piece; a holding plate that fixes and supports the fixing piece; and a fixing device that fixes the heat-generating wire on the outer wall surface of the furnace body using the holding plate so as to fix the heating element wire to the furnace body via the fixing piece. A heating device comprising: a mechanism; and a heat insulating ring interposed between the fixing mechanism and the outer wall surface of the furnace body.