JPH0453119B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a composite component, and more particularly to a capacitor-embedded composite laminated ceramic component in which a large-capacity capacitor is built into a substrate.

(Prior Art) Conventionally, electronic circuits using large capacity capacitors have been highly integrated by mounting chip capacitors on substrates such as alumina. In other words, a hybrid IC is created by forming a wiring pattern using low-intensity antibodies, electrodes, and conductors on an insulating substrate such as ceramic using a printing method, and then mounting chip capacitors, semiconductor ICs, etc. on the same surface. It had been made. Recently, composite ceramic parts in which a dielectric material is sandwiched between insulators have been developed, and are being applied to hybrid ICs and the like.

(Problem to be solved by the invention) In recent years, with the rapid technological advancement of electronics, various electronic parts are becoming smaller and smaller, and it is essential to make parts lighter, thinner, and smaller in order to reduce costs. It has become a condition.

However, in conventional composite parts such as hybrid ICs, it is necessary to print resistors, electrodes, and wiring patterns at a higher density on a limited ceramic substrate, and to mount chip capacitors, semiconductor ICs, etc. in a higher density. has certain limits.

For example, forming a higher-density pattern may result in a decrease in quality or a rise in cost, and in a more highly integrated design, mounting space issues and shape problems may arise, especially as the number of mounted components increases. Restrictions on this matter became a problem.

Therefore, in order to achieve higher density and higher integration, new composite ceramic components with a structure in which resistors and capacitors are housed in the substrate are being developed. However, the dielectric layer 1 as shown in FIG.
Composite ceramic parts with a sandwiched structure are a composite of materials with very different properties, such as an insulator material and a dielectric material. Due to subtle differences in shrinkage rates and mutual diffusion between different materials, phenomena such as peeling and cracking tend to occur at the interface between the insulator and dielectric, making it difficult to obtain composite parts with stable quality and high reliability. Ta.

(Means for Solving the Problem) The present invention provides a composite ceramic component having a structure in which a dielectric material is sandwiched between insulators, in which an element is constructed without connecting any other conductor between the dielectric layer and the insulator layer. The present invention provides a structure in which a metal layer is formed.

(Function) The material forming this metal layer undergoes sintering at a relatively low temperature, so when the sintering reaction between dielectric and insulating ceramics occurs at high temperatures, these interfaces are completely separated and different materials This prevents mutual diffusion between ceramics and prevents reactions between ceramics. This makes it possible to prevent microcracks from peeling off, which conventionally occur. In addition, by selecting metal materials that provide bonding properties with various ceramics (dielectrics, insulators), it has become possible to create composite laminated ceramic parts that do not peel.

Composite laminated ceramic parts with metal layers are
It can be constructed in a structure in which a dielectric material is sandwiched between insulators with a metal layer in between, so-called a sandwich structure between insulator substrates. In other words, a capacitor can be obtained by forming a capacitor pattern on a dielectric layer and extracting it onto an insulating substrate using a through-hole conductor.
This eliminates the need for mounted chip capacitors, which were conventionally mounted on the board, increasing the space on the board, making it possible to achieve high density and high integration. Furthermore, if a high dielectric material is used as a dielectric layer, a composite laminated ceramic component containing a large capacitance capacitor can be obtained, and a compact and highly integrated composite component that can be used in a wider range of applications than ever before can be provided.

(Example) Generally, to obtain a ceramic green sheet, oxide powder raw materials are weighed and mixed or pulverized using a ball mill or the like. Next, the mixed powder raw material is calcined using an electric furnace or the like to produce a prefired powder material. The precalcined powder material obtained by calcining is mixed with an organic solvent and an organic binder to obtain a slurry. The slurry is formed into a green sheet on a polyethylene film using a casting device such as a doctor blade method to obtain a ceramic green sheet.

Using the above method, a ceramic green sheet as an insulator, a ceramic green sheet as a dielectric material, a metal body (a metal body having a composition containing one or more of Au/Pd, Ag/Pd, Pt, Cu, Ni, etc.) Each green sheet was produced and cut into an appropriate shape to produce each ceramic green sheet piece and metal green sheet piece.

The insulators used here include alumina borosilicate lead composite materials, cordierite ceramics, mullite ceramics,
anorthite ceramics, calcilite ceramics, forsterite ceramics,
Materials such as spodumene and eucryptite can be used. The dielectric constant of these insulators is about 5 to 10.

On the other hand, the dielectric material is a compound with a perogskite structure containing lead, and the sintering temperature is the same as that of the insulating material. The dielectric constant of this dielectric material varies depending on the composition of the constituent elements, but it is approximately 500~
It is controlled in the range of 20000. Therefore, it is extremely advantageous for forming a large capacity capacitor.

Next, electrode patterns are printed on the dielectric sheet pieces using Ag/Pd internal electrode paste, and each ceramic green sheet piece that requires through holes is
A through hole is opened and then filled with electrode paste to form a via conductor. In addition, necessary through holes are formed in the metal sheet piece.

Next, they are put into a press mold in the order that they are overlapped as shown in FIG. 3, and then subjected to thermocompression pressing. After cutting the press-bonded raw laminated ceramic body into a predetermined shape with a knife blade, etc., the binder is removed at around 500℃, and the laminated ceramic body after the binder is removed is heated to about 900℃ to 1000℃ using an electric furnace. By sintering at high temperatures, composite laminated ceramic parts with built-in capacitors are obtained.

FIG. 1 is an exploded cross-sectional view of a composite laminated ceramic component with a built-in capacitor manufactured based on an example.
Metal layers 2 and 3 are formed on the upper and lower surfaces of a dielectric layer 1 having an internal electrode pattern that becomes a capacitor layer. Further, it has a composite laminated structure in which insulators 4 and 5 are formed on one side of each metal layer 2 and 3, and an internal electrode pattern 6 formed on the dielectric layer 1 is used as a capacitor part to connect the insulator layer 4 with a conductor electrode 7. It is guided to the upper surface and formed as a patch electrode 8 on the upper surface of the substrate.

(Effects of the Invention) As described above, by forming a metal layer at the interface between a dielectric and an insulator, an interfacial reaction between the dielectric and the insulator can be prevented, and a highly reliable capacitor with a good bonding property can be built-in. We were able to provide composite laminated ceramic parts.

In this example, the metal layer was formed by a green sheet method, but the metal layer can also be formed by a method of printing a metal paste such as screen printing.

If composite parts such as hybrid ICs are manufactured using this composite laminated ceramic part with a built-in capacitor, there is no need for mounted parts (chip capacitors, etc.) that were conventionally mounted on the board, so it can be used even with conventional hybrid method technology. , higher integration becomes possible, and even in terms of high-density patterning, high-density composite parts can be provided without degrading quality, and more compact composite parts can be realized. Furthermore, by utilizing both sides of a composite laminated ceramic component, it is possible to create a composite component with a larger integration.

[Brief explanation of drawings]

FIG. 1 is an exploded sectional view of an embodiment of a composite laminated ceramic component with a built-in capacitor according to the present invention. Figure 2 is a configuration diagram of a conventional composite laminated ceramic part. FIG. 3 is a perspective view showing a stacked state. In the figure, 1... dielectric layer, 2, 3... metal layer, 4, 5... insulator layer, 6... capacitor forming electrode pattern, 7... conductor, 8... electrode pad, 9... Dielectric layer, 10, 11...Insulator layer.

Claims (1)

[Claims] 1. In a composite laminated ceramic component having a structure in which a dielectric layer, an insulator layer, and a conductor are laminated,
A composite laminated ceramic component characterized by having a structure in which a metal layer that is not connected to other conductors and does not constitute an element is formed between a dielectric layer and an insulator layer.