JPH0454551B2 - - Google Patents
Info
- Publication number
- JPH0454551B2 JPH0454551B2 JP1954985A JP1954985A JPH0454551B2 JP H0454551 B2 JPH0454551 B2 JP H0454551B2 JP 1954985 A JP1954985 A JP 1954985A JP 1954985 A JP1954985 A JP 1954985A JP H0454551 B2 JPH0454551 B2 JP H0454551B2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- accessory
- joining
- base
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 33
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 28
- 239000010931 gold Substances 0.000 claims description 28
- 229910052737 gold Inorganic materials 0.000 claims description 26
- 238000005304 joining Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000010935 stainless steel Substances 0.000 claims description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims description 13
- 229910001020 Au alloy Inorganic materials 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 9
- 239000003353 gold alloy Substances 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 229910001369 Brass Inorganic materials 0.000 description 5
- 239000010951 brass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229910000925 Cd alloy Inorganic materials 0.000 description 1
- 229910002535 CuZn Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OVKMDTVKFLNYRN-UHFFFAOYSA-N [Cd].[Cu].[Au] Chemical compound [Cd].[Cu].[Au] OVKMDTVKFLNYRN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本願発明は、時計側等の装飾用外装基体に、パ
イプ、〓、ピンなどの微小付属部品を接合する方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for joining minute accessories such as pipes, bolts, pins, etc. to a decorative exterior base for a watch side or the like.
従来、時計側などの装飾用外装基体に、リユー
ズ用パイプ、〓又はピンなどの微小付属部品を接
合する場合は、金鑞を用いていたが、この方法で
は、鑞の設位場所の問題あるいは鑞を加熱溶融さ
せるための鏝の問題などから、付属部品が微細で
ある場合はその接合作業が極めて困難であるとと
もに、鑞の流れが不均一になり強固な接合が困難
であつた。一方鑞による接合を均一強固にする手
段として、高温にして鑞の流度を高めることも考
えられるが、この場合は、熱変形の問題が生じる
不都合がある。
Conventionally, gold solder was used to join minute accessories such as reuse pipes, bolts, or pins to decorative exterior bases such as watch sides, but with this method, there were problems with the location of the solder, Due to problems with the trowel used to heat and melt the solder, joining work is extremely difficult when the attached parts are minute, and the flow of the solder becomes uneven, making it difficult to achieve a strong joint. On the other hand, as a means to uniformly strengthen the solder joint, it may be possible to raise the temperature to increase the flow rate of the solder, but in this case, there is a problem of thermal deformation.
また、他の従来例として、ステンレス製パイプ
などの付属部品に銀メツキした後外装基体に接合
した例があつたが、接合面での耐食が低く、現在
はこの方法は全く行われていない。 In addition, as another conventional example, an accessory part such as a stainless steel pipe was plated with silver and then bonded to an exterior base, but this method is not currently used at all because the corrosion resistance of the bonded surface is low.
本願発明は、時計側などの銅又は銅合金あるい
は亜鉛又は亜鉛合金からなる時計側などの装飾用
外装基体に、パイプ、〓又はピンなどの微小付属
部品を接合するに際し、従来の技術の項で記載し
たとおり、微細付属部品の接合に伴う作業困難
性、接合面の均一性、強度、接合部の耐食性およ
び接合時の熱変形の問題を、同時に解するもので
ある。
The present invention utilizes the conventional techniques when joining minute accessories such as pipes, bolts, or pins to a decorative exterior base of a watch side made of copper or copper alloy, or zinc or zinc alloy, such as a watch side. As described above, this method simultaneously solves the problems of work difficulty associated with joining minute accessories, uniformity of joint surfaces, strength, corrosion resistance of joints, and thermal deformation during joining.
本願発明は、前述の問題点を解決するために、
装飾用外装基体を金と相互拡散しやすい銅又は銅
合金あるいは亜鉛又は亜鉛合金で構成するととも
に、接合すべき付属部品に予め金又は金合金メツ
キあるいは金又は金合金メツキ層を含む多層メツ
キ層を施し、このメツキを施された付属部品を前
記基体に組込んだ後、該基体と付属部品のいずれ
の融点よりも低い温度に加熱し、接合面でメツキ
層を介して基体および付属部品を構成する金属原
子の拡散を生じせしめることにより基体と付属部
品を接合するものである。
The present invention, in order to solve the above-mentioned problems,
The decorative exterior base is made of copper or copper alloy, zinc or zinc alloy that easily interdiffuses with gold, and the attached parts to be joined are pre-plated with gold or gold alloy plating or a multilayer plating layer containing gold or gold alloy plating layer. After the plated accessory parts are assembled into the base body, they are heated to a temperature lower than the melting point of both the base body and the accessory parts, and the base body and the accessory parts are assembled through the plating layer at the joint surface. The base body and attached parts are bonded by causing the diffusion of metal atoms.
本願発明においては、装飾用外装基体を銅又
は銅合金あるいは亜鉛又は亜鉛合金で構成したた
め、後の加熱処理により、付属部品に施した金又
は金合金メツキ層と相互拡散しやすくしたがつて
金メツキ層を介して付属部品との接合が強固にな
る作用効果があり、付属部品に予め金又は金合
金メツキあるいは金又は金合金メツキ層で含む多
層メツキ層を施し、該付属部品を基体に組込んだ
後、加熱し、メツキ層を介しての拡散により両者
を接合させるようにしたため、従来の金鑞を用い
る場合に問題となつていた鑞の設置、鏝の問題等
が全くなく、極めて微小な付属部品でも均一に且
つ強固に基体に接合できる。また比較的低い温度
に全体を加熱処理するため、鑞付けのような局部
的な高温加熱による熱歪の問題が生じない。更に
メツキ層を金又は金合金あるいは金又は金合金メ
ツキ層を含む多層メツキ層としているため、拡散
接合後に接合面に形成される拡散合金層は金を含
む合金層となり耐食性が極めて高いものとなる。
In the present invention, since the decorative exterior base is made of copper or a copper alloy, or zinc or a zinc alloy, it is easy to interdiffuse with the gold or gold alloy plating layer applied to the accessory parts by subsequent heat treatment, and therefore the gold plating It has the effect of strengthening the bond with the accessory parts through the layer, and the accessory parts are pre-applied with gold or gold alloy plating or a multilayer plating layer containing a gold or gold alloy plating layer, and the accessory parts are assembled into the base body. After that, the two are bonded by heating and diffusion through the plating layer, so there are no problems with setting the solder or using a trowel, which were problems when using conventional gold solder, and the extremely small Even accessory parts can be bonded uniformly and firmly to the base. Furthermore, since the entire product is heat-treated to a relatively low temperature, there is no problem of thermal distortion caused by local high-temperature heating, such as in brazing. Furthermore, since the plating layer is a multilayer plating layer containing gold or gold alloy or a gold or gold alloy plating layer, the diffusion alloy layer formed on the joint surface after diffusion bonding becomes an alloy layer containing gold and has extremely high corrosion resistance. .
本願発明を、時計側を基体とし、これにリユー
ズ用パイプを接合する場合の実施例を挙げて更に
詳しく説明する。
The present invention will be described in more detail with reference to an embodiment in which the watch side is used as a base and a reuse pipe is joined to the base.
実施例 １
黄銅（60％Cu、Zn40％）製の図３に示す形状
の時計側に、図１に示す形状のステンレス鋼製の
パイプを接合するに際し、パイプに下記のメツキ
条件で、10〜1000Åの酸性金ストライクメツキを
施す。Example 1 When joining a stainless steel pipe with the shape shown in Figure 1 to the brass (60% Cu, 40% Zn) watch side with the shape shown in Figure 3, the pipe was plated under the following plating conditions. Apply 1000Å acid gold strike plating.
メツキ浴組成
金…0.5〜5g／ 電流密度１〜20A／ｄm2
リン酸…10〜20ml／ PH１〜４
シアン化カリ…１〜10g／ 浴温30〜60℃
次に、下記のメツキ条件で厚さ１〜5μの22K金
ニツケル合金メツキを施した。Plating bath composition Gold...0.5~5g/Current density 1~20A/dm Phosphoric acid...10~20ml/PH1~4 Potassium cyanide...1~10g/Bath temperature 30~60℃ Next, the thickness was 22K gold-nickel alloy plating with a thickness of 1 to 5μ is applied.
浴組成
金…0.5〜5g／ 電流密度１〜20A／ｄm2
ニツケル…３〜15g／ PH３〜７
クエン酸カリ…50〜200g／ 浴温30〜60℃
クエン酸…10〜100g／
次に、図２に示す前記工程で金ニツケル合金メ
ツキを施されたパイプを、時計側の所定位置に組
込み、全体を720〜780℃で10分間加熱処理を施
し、時計側基体とパイプの拡散接合を行つた結
果、25Kgの押圧力でも抜け落ちることのないリユ
ーズ用ステンレス鋼製パイプ付時計側が得られ
た。Bath composition Gold...0.5~5g/ Current density 1~20A/dm 2 Nickel...3~15g/PH3~7 Potassium citrate...50~200g/Bath temperature 30~60℃ Citric acid...10~100g/ Next, the figure The pipe that had been plated with gold-nickel alloy in the step shown in step 2 above was assembled into a predetermined position on the watch side, and the whole was heat-treated at 720 to 780°C for 10 minutes to perform diffusion bonding between the watch side base and the pipe. As a result, we were able to obtain a watch side with a reuse stainless steel pipe that would not fall off even under a pressing force of 25 kg.
実施例 ２
実施例１と同様の条件下でステンレス鋼製パイ
プに酸性金ストライクメツキ処理を施した後、下
記の条件で１〜5μの金−銅−カドミニウム合金
メツキ（22K）を施した。Example 2 A stainless steel pipe was subjected to acidic gold strike plating under the same conditions as in Example 1, and then gold-copper-cadmium alloy plating (22K) of 1 to 5 μm was applied under the following conditions.
メツキ浴組成
金…１〜10g／ 電流密度0.1〜1A／ｄm2
カドミニウム…0.1〜5g／ PH４〜８
銅…50〜200g／ 浴温30〜60℃
リン酸塩…50〜200g／
以下実施例と同様の工程で該パイプを黄銅（60
％Cu40％Zn）の時計側に拡散接合処理した結果、
27Kgの押圧力でも抜け落ちることのないパイプ付
時計側が得られた。Plating bath composition Gold...1~10g/Current density 0.1~1A/dm 2Cadmium...0.1~5g/PH4~ 8 Copper...50~200g/Bath temperature 30~60℃ Phosphate...50~200g/The following examples In the same process, the pipe was made of brass (60
%Cu40%Zn) on the clock side,
A watch side with a pipe that does not fall off even under a pressing force of 27 kg was obtained.
実施例 ３
実施例１と同様の条件下でステンレス鋼製パイ
プに金ストライクメツキを施した後、下記の条件
下で金銀合金メツキ（16K）を施した。Example 3 A stainless steel pipe was plated with gold strike under the same conditions as in Example 1, and then plated with gold and silver alloy (16K) under the following conditions.
メツキ浴組成
金…５〜20g／ 電流密度01〜1A／ｄm2
銀…５〜20g／ PH10〜12
シアン化カリウム…50〜200g／
浴温30〜60℃
以下実施例１と同様の工程で該パイプを黄銅
（60％CuZn40％）の時計側に拡散接合処理した結
果、29Kgの押圧力でも抜け落ちることのないパイ
プ付時計側が得られた。Plating bath composition Gold...5~20g/ Current density 01~1A/dm 2 Silver...5~20g/PH10~12 Potassium cyanide...50~200g/
As a result of diffusion bonding the pipe to the brass (60% CuZn 40%) watch side using the same process as in Example 1 at a bath temperature of 30 to 60°C, a watch side with a pipe that would not fall off even with a pressing force of 29 kg was obtained. Ta.
実施例 ４
実施例１と同様に金ストライクメツキした後、
下記の条件下で金銀合金メツキ（18K）を施し
た。Example 4 After gold strike plating in the same manner as in Example 1,
Gold and silver alloy plating (18K) was applied under the following conditions.
メツキ浴組成
金…５〜20g／ 電流密度0.1〜1A／ｄm2
銀…５〜20g／ PH10〜12
シアン化カリウム…50〜200g／
浴温30〜60℃
以下実施例と同様に該パイプを黄銅製時計側に
拡散接合した結果、30Kgの押圧力でも抜け落ちる
ことのないパイプ付時計側が得られた。Plating bath composition Gold...5~20g/ Current density 0.1~1A/dm 2 Silver...5~20g/PH10~12 Potassium cyanide...50~200g/
As a result of diffusion bonding the pipe to the brass watch side at a bath temperature of 30 to 60°C in the same manner as in the example, a watch side with a pipe that did not fall off even with a pressing force of 30 kg was obtained.
実施例 ５
実施例１と同様にステンレス鋼製パイプに金ス
トライクメツキを施した後、下記の条件下で厚さ
１〜5μの金ニツケルメツキ（22K）を施した。Example 5 A stainless steel pipe was plated with gold strike in the same manner as in Example 1, and then plated with gold nickel (22K) to a thickness of 1 to 5 μm under the following conditions.
次に、図３に示すように該メツキされたパイプ
を亜鉛製時計側に組込み、全体を380〜400℃に加
熱し両者を拡散接合した結果、押圧力20Kgでも抜
け落ちることのないパイプ付時計側が得られた。 Next, as shown in Figure 3, the plated pipe was assembled into the zinc watch side, the whole was heated to 380-400°C, and both were diffusion bonded. As a result, the watch side with the pipe did not fall off even with a pressing force of 20 kg. Obtained.
本願発明に係る実施例１〜５で得られたステン
レス鋼製パイプ付時計側の全体に通常の金メツキ
処理を施したものと、従来の銀メツキによる接合
法によりステンレス鋼製パイプを黄銅製時計側に
接合したものを人工汗テスト（40℃、24Hr）、ア
ンモニアバツキテスト（空温、4Hr）および硝酸
バツキテストの耐食性テストを行つたところ、従
来の銀メツキ法による接合のものは前記耐食テス
トのいずれにおいても接合部分に多数の孔食腐食
がみられたのに対し、本願発明にかかる実施例１
〜５によつて得られたものはいずれの耐食テスト
においても腐食が全くみられなかつた。 The entire watch side with stainless steel pipe obtained in Examples 1 to 5 according to the present invention was subjected to ordinary gold plating treatment, and the stainless steel pipe was attached to a brass watch by conventional silver plating joining method. When we conducted the corrosion resistance test of the artificial sweat test (40℃, 24 hours), ammonia dust test (air temperature, 4 hours), and nitric acid dust test, we found that the one joined by the conventional silver plating method did not pass the above corrosion resistance test. In all cases, a large number of pitting corrosions were observed in the joint parts, whereas in Example 1 according to the present invention,
No corrosion was observed in any of the corrosion resistance tests for the samples obtained in Examples 1 to 5.
本実施例として、ステンレス鋼製パイプを時計
側に接合する例を挙げたが、ステンレス鋼以外の
金属材料例えば銀、洋白の如く銅又は銅合金ある
いは亜鉛又は亜鉛合金と相互拡散しやすい金属材
料を素材としたパイプを接合した場合でも同様の
結果が確認された。 In this example, a stainless steel pipe is joined to the watch side, but metal materials other than stainless steel, such as silver and nickel silver, are easily interdiffused with copper or copper alloys, zinc or zinc alloys. Similar results were confirmed when joining pipes made of .
本願発明にかれば、従来の金鑞を用いて微小付
属部品を装飾用外装品に接合するに際し問題とな
つていた鑞設置および鏝操作などの作業上の困難
性が全くなく、かつ局部加熱による熱歪の問題も
なく、装飾用外装基体にそれと同種又は異種の金
属材料を素材とした微小付属部品でも効率よく強
固に接合できる。また従来の銀メツキ法による場
合の耐食性の問題も実施例に示すように厳しい耐
食性テストにおいても全く腐食が発生しない程度
まで解決しており、装飾用外装部品の製造におけ
る本願発明の効果は極めて大きいものと言える。
According to the present invention, there are no operational difficulties such as installing a solder and operating a trowel, which were problems when joining minute accessories to decorative exterior products using conventional gold solder, and the problem is that it is possible to use local heating. There is no problem of thermal distortion, and even minute accessories made of the same or different metal material can be efficiently and firmly bonded to the decorative exterior base. In addition, as shown in the examples, the problem of corrosion resistance caused by the conventional silver plating method has been resolved to the extent that no corrosion occurs even in severe corrosion resistance tests, and the effect of the present invention in the production of decorative exterior parts is extremely large. It can be said to be a thing.
第１図は時計側に接合すべきステンレス鋼製パ
イプ、第２図はメツキ後のパイプの断面図第３図
はパイプを時計側に組み込み状態で示す図であ
る。
１…ステンレス鋼製パイプ、２…メツキ層、３
…時計側。
FIG. 1 is a stainless steel pipe to be joined to the watch side, FIG. 2 is a cross-sectional view of the pipe after plating, and FIG. 3 is a view showing the pipe assembled into the watch side. 1... Stainless steel pipe, 2... Plating layer, 3
...Watch side.
Claims (1)
なる装飾用外装基体に、該基体と同種又は異種の
金属材料よりなる付属部品を接合する方法におい
て、該付属部品に予め金又は金合金メツキあるい
は金又は金合金メツキ層を含む多層メツキを施
し、該メツキを施された付属部品を装飾用外装基
体の所定の位置に組込んだ後に、該基体および付
属部品のいずれの融点よりも低い温度に加熱し、
接合面における原子拡散を生じせしめることによ
り、基体と付属部品を接合することを特徴とする
装飾用外装基体への付属部品の接合方法。 ２ 前記装飾用外部品が時計側であり、前記付属
部品がパイプ、〓又はピンであることを特徴とす
る特許請求の範囲第１項記載の装飾用外装基体へ
の付属部品の接合方法。 ３ 前記付属部品がステンレス鋼からなることを
特徴とする特許請求の範囲第１項又は第２項記載
の装飾用外装基体への付属部品の接合方法。[Scope of Claims] 1. A method of joining an accessory made of the same or different metal material as the base to a decorative exterior base made of copper or copper alloy, zinc or zinc alloy, in which the accessory is pre-coated with gold or After applying gold alloy plating or multi-layer plating including a gold or gold alloy plating layer and assembling the plated accessory parts in a predetermined position on a decorative exterior base, the melting point of the base and the accessory parts can be lowered. also heated to a low temperature,
A method for joining an accessory part to a decorative exterior base, characterized by joining the base and the accessory part by causing atomic diffusion at the joint surface. 2. The method for joining an accessory part to a decorative exterior base according to claim 1, wherein the decorative external part is a watch side, and the accessory part is a pipe, a bolt, or a pin. 3. The method of joining an accessory part to a decorative exterior base according to claim 1 or 2, wherein the accessory part is made of stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1954985A JPS61180685A (en) | 1985-02-04 | 1985-02-04 | Method of joining accessory parts to base body of facing for decoration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1954985A JPS61180685A (en) | 1985-02-04 | 1985-02-04 | Method of joining accessory parts to base body of facing for decoration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61180685A JPS61180685A (en) | 1986-08-13 |
| JPH0454551B2 true JPH0454551B2 (en) | 1992-08-31 |
Family
ID=12002394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1954985A Granted JPS61180685A (en) | 1985-02-04 | 1985-02-04 | Method of joining accessory parts to base body of facing for decoration |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61180685A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2762690B2 (en) * | 1990-05-18 | 1998-06-04 | ブラザー工業株式会社 | Sewing machine lower thread amount detector |
| JPH06273A (en) * | 1992-06-22 | 1994-01-11 | Brother Ind Ltd | Lower thread remaining amount detector for sewing machine |
| JPH0631079A (en) * | 1992-07-15 | 1994-02-08 | Brother Ind Ltd | Bobbin thread remaining amount detecting device for sewing machine |
| JP4588292B2 (en) * | 2000-09-13 | 2010-11-24 | シチズンホールディングス株式会社 | Watch case |
| CN100407078C (en) * | 2001-09-21 | 2008-07-30 | 西铁城控股株式会社 | Exterior member for wristwatch and method of manufacturing the same |
| JP6194594B2 (en) * | 2013-02-26 | 2017-09-13 | 大日本印刷株式会社 | Metal substrate bonding method and metal laminate |
-
1985
- 1985-02-04 JP JP1954985A patent/JPS61180685A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61180685A (en) | 1986-08-13 |
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