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JPH0458197B2 - - Google Patents
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JPH0458197B2 - - Google Patents

Info

Publication number
JPH0458197B2
JPH0458197B2 JP63051517A JP5151788A JPH0458197B2 JP H0458197 B2 JPH0458197 B2 JP H0458197B2 JP 63051517 A JP63051517 A JP 63051517A JP 5151788 A JP5151788 A JP 5151788A JP H0458197 B2 JPH0458197 B2 JP H0458197B2
Authority
JP
Japan
Prior art keywords
mark
marks
lower layer
upper layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63051517A
Other languages
Japanese (ja)
Other versions
JPH01226194A (en
Inventor
Tadashi Takagaki
Isao Kinumegawa
Tomoaki Umeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP63051517A priority Critical patent/JPH01226194A/en
Publication of JPH01226194A publication Critical patent/JPH01226194A/en
Publication of JPH0458197B2 publication Critical patent/JPH0458197B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、重なり合うマークの相対位置を検出
する装置に係り、特に多層の印刷を行う場合に、
各層ごとの印刷のずれを検出するのに好適な装置
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for detecting the relative position of overlapping marks, particularly when performing multilayer printing.
The present invention relates to a device suitable for detecting printing misalignment for each layer.

〔従来の技術〕 従来、多層印刷配線板の印刷時に、各層ごとの
相対的な印刷ずれを検出する方法としては、基準
となるパターンと印刷配線板のマークとを画像入
力装置で読み取り、画像処理装置で画素数を計数
して位置ずれを把握しており、それに基づいて、
必要な場合は位置ずれの元となつた印刷マスクの
位置を手動で修正していた。
[Prior Art] Conventionally, when printing a multilayer printed wiring board, a method for detecting relative printing misalignment for each layer is to read a reference pattern and marks on the printed wiring board with an image input device, and perform image processing. The device counts the number of pixels to understand the positional deviation, and based on that,
If necessary, the position of the print mask that caused the misalignment was manually corrected.

基準となるパターンとしては、画素数の計数が
可能な面積を有する点を用い、画像処理装置に事
前に基準データとして入力しておくか、または検
体となる印刷配線板のマークを同時に入力して比
較することが行われていた。なお、この種の装置
として関連するものは例えば特開昭61−5385号公
報等が挙げられる。
As the reference pattern, use points with an area that allows the number of pixels to be counted, and either input them into the image processing device in advance as reference data, or simultaneously input marks on the printed wiring board that will be the specimen. A comparison was being made. Incidentally, related devices of this type include, for example, Japanese Patent Application Laid-Open No. 61-5385.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上記従来技術では、基準となるパターンが必要
であり、また基準パターンと検体となる印刷配線
板との比較には時間がかかり、印刷機のタクトタ
イムに合わないことから印刷ライン上で印刷配線
板全数を調べることはできない。しかし実際には
印刷層ごとの印刷の相対的ずれがわかればよいこ
とから目視で調べることが行われているが、それ
でも処理時間の短縮には限度があり、印刷機のタ
クトタイムには合わない。
In the above conventional technology, a reference pattern is required, and it takes time to compare the reference pattern with the printed wiring board to be tested, which does not match the takt time of the printing machine, so the printed wiring board is not printed on the printing line. It is not possible to check the total number. However, in reality, visual inspection is performed because it is only necessary to know the relative misalignment of printing for each printing layer, but even so, there is a limit to the reduction of processing time, and it does not match the takt time of the printing machine. .

本発明の目的は、二層以上の印刷を行う印刷配
線板において、各印刷層ごとに下層と上層との相
対的な位置のずれを、印刷機のタクトタイムに合
つた処置タイムで、自動的に調べて印刷時の相対
的ずれ量を把握する装置を提供することにある。
An object of the present invention is to automatically correct the relative positional deviation between the lower layer and the upper layer for each printed layer in a printed wiring board that prints two or more layers in a processing time that matches the takt time of the printing machine. An object of the present invention is to provide a device for checking the relative deviation amount during printing.

〔課題を解決するための手段〕[Means to solve the problem]

上記目的を達成するために、本発明に係る重な
り合うマークの相対位置を検出する装置の構成
は、2層以上の印刷を行う印刷配線板の各層の位
置ずれを検出する装置において、印刷配線板上に
重なつて印刷されている下層のマークと上層のマ
ークとを読み込む入力装置と、読み込んだ画像の
色の違いおよび色の濃淡のいずれかで下層のマー
クと上層のマークとを識別する装置と、識別され
た下層のマークと上層のマークとの相対的偏差を
演算する処理装置と、該処理装置の演算結果を表
示する出力装置と、上記各装置を関連的に制御す
る装置とからなるものである。
In order to achieve the above object, the configuration of a device for detecting the relative position of overlapping marks according to the present invention is a device for detecting misalignment of each layer of a printed wiring board that prints two or more layers. an input device that reads a lower layer mark and an upper layer mark that are printed on top of each other, and a device that identifies the lower layer mark and the upper layer mark based on either the difference in color or the shade of color of the read image. , consisting of a processing device that calculates the relative deviation between the identified lower layer mark and the upper layer mark, an output device that displays the calculation result of the processing device, and a device that controls each of the above devices in relation to each other. It is.

〔作用〕[Effect]

検体となる印刷配線板には、例えば各印刷層ご
とに直径が3〜4mmの円内に十文字を有する形状
(第2図a)を印刷配線板の縁部に2ケ以上設け
てマークとして使われている。このマークは、下
層では銅箔上に残されており、上層ではレジスト
インクの印刷時に同時に印刷する。下層のマーク
の色と上層のマークの色は相違しているかまたは
濃淡に差がでることから、このマークを入力装置
で読み込み、読み込んだ画像を公知の色抽出装置
などにより、初めに下層のマークのみ抽出して画
像の中心または図心の位置を画像処理装置で演算
処理し、次に、演算終了信号により上層のマーク
のみの抽出に切り換えて画像の中心または図心の
位置を処理装置で演算処理する。
On the printed wiring board to be tested, for example, two or more cross shapes (see Figure 2 a) in a circle with a diameter of 3 to 4 mm for each printed layer are placed on the edge of the printed wiring board and used as marks. It is being said. This mark is left on the copper foil in the lower layer, and is printed at the same time as the resist ink is printed in the upper layer. Since the color of the mark on the lower layer is different from the color of the mark on the upper layer, or there is a difference in shading, this mark is read in with an input device, and the read image is first extracted using a known color extraction device. The center or centroid position of the image is extracted and the position of the center or centroid of the image is processed by the image processing device, and then, upon receiving the calculation end signal, the processing is switched to extraction of only the upper layer marks and the position of the center or centroid of the image is calculated by the processing device. Process.

下層のマークの位置と上層のマークの位置と
は、処理装置内部でさらに比較演算され、相対的
な位置のずれの量が例えば画像出力装置のデイス
プレイ部に表示される。
The position of the mark on the lower layer and the position of the mark on the upper layer are further compared and calculated within the processing device, and the amount of relative positional deviation is displayed on, for example, a display unit of the image output device.

上下両層のマーク読み取り、相対的位置ずれの
検出は、比較的早く行えるから、印刷機のタクト
タイムに合わせた位置ずれ検出を行うことができ
る。
Since marks on both the upper and lower layers can be read and relative positional deviations can be detected relatively quickly, positional deviations can be detected in accordance with the takt time of the printing press.

〔実施例〕〔Example〕

以下、本発明の一実施例を第1図ないし第3図
を参照して説明する。
Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 to 3.

第1図は、本発明の一実施例に係る検査装置の
構成を示す一部斜視図を含むブロツク図、第2図
は、印刷物上のマークを示す平面図、第3図は、
マークの位置ずれの検査手順を示すフローチヤー
トである。
FIG. 1 is a block diagram including a partial perspective view showing the configuration of an inspection device according to an embodiment of the present invention, FIG. 2 is a plan view showing marks on printed matter, and FIG.
7 is a flowchart showing a procedure for inspecting mark positional deviation.

第1図に示すように、印刷配線板7は搬送装置
1により画像入力装置3の下部に配設され、かつ
印刷配線板7を所定の位置に所定の精度で固定す
る位置決め装置2に搬入され固定される。
As shown in FIG. 1, the printed wiring board 7 is carried by a conveyance device 1 to a positioning device 2 which is disposed below the image input device 3 and which fixes the printed wiring board 7 in a predetermined position with a predetermined precision. Fixed.

印刷配線板7の上面には、第2図aに示す少な
くとも2個の印刷物下層部のマーク(以下下層マ
ークという)9上に、印刷物上層部のマーク(以
下上層マークという)8が重なる位置に設けられ
ており、下層マーク9と上層マーク8とは色が相
違している。例えば下層マーク9の色は銅箔の色
であり、上層マーク8はレジストンクの色であ
る。
On the upper surface of the printed wiring board 7, marks 8 on the upper layer of printed matter (hereinafter referred to as upper layer marks) are placed at positions where marks 8 on the upper layer of printed matter overlap on at least two marks 9 on the lower layer of printed matter (hereinafter referred to as lower layer marks) as shown in FIG. 2a. The lower layer mark 9 and the upper layer mark 8 have different colors. For example, the color of the lower layer mark 9 is the color of the copper foil, and the color of the upper layer mark 8 is the color of the registration mark.

画像入力装置3は、マークの数に合わせた個数
とし、位置決め装置2上の印刷配線板7の前記上
下層マーク8,9を読み込み、読み込んだ画像デ
ータを色抽出装置10に電子信号で入力する。
The number of image input devices 3 corresponds to the number of marks, reads the upper and lower layer marks 8 and 9 of the printed wiring board 7 on the positioning device 2, and inputs the read image data to the color extraction device 10 as an electronic signal. .

制御装置6は、入力された画像データについて
初めは下層マーク9の色のみ抽出する指令を色抽
出装置10に与えて下層マーク9の画像データの
演算処理を画像処理装置4で行わしめる。
The control device 6 initially gives a command to the color extraction device 10 to extract only the color of the lower layer mark 9 from the input image data, and causes the image processing device 4 to perform arithmetic processing on the image data of the lower layer mark 9.

画像処理装置4は、下層マーク9の演算処理が
終了すると終了信号を制御装置6に発信し、同時
に内部に設けたメモリー部に演算データを記録
し、制御装置6から次に出される信号を待機する
状態になる。
When the arithmetic processing of the lower layer mark 9 is completed, the image processing device 4 sends an end signal to the control device 6, simultaneously records the arithmetic data in an internal memory section, and waits for the next signal issued from the control device 6. be in a state of doing so.

制御装置6は、前記の下層マーク9に関する終
了信号を受信すると、次に上層マーク8の画像デ
ータについての演算処理指令を画像処理装置4に
発信し、上記と同じ処理が行われて演算データが
記録される。同じ走査と処理と記録が、各マーク
について繰り返し行われ、上記操作が終了すると
下層マーク9と上層マーク8との相対位置につい
ての比較演算の実行指令が制御装置6から画像処
理装置4に発信され実行される。印刷ずれを防ぐ
ための、このようなマークの位置ずれの検査手順
を示したのが第3図のフローチヤートである。
When the control device 6 receives the end signal regarding the lower layer mark 9, it then sends an arithmetic processing command for the image data of the upper layer mark 8 to the image processing device 4, and the same processing as described above is performed and the arithmetic data is processed. recorded. The same scanning, processing, and recording are repeated for each mark, and when the above operations are completed, a command to execute a comparison calculation regarding the relative positions of the lower layer mark 9 and the upper layer mark 8 is sent from the control device 6 to the image processing device 4. executed. The flowchart in FIG. 3 shows a procedure for inspecting such a mark misalignment to prevent printing misalignment.

この比較演算結果は画像出力装置5に表示さ
れ、下層マーク9と上層マーク8との位置ずれ量
が許容値を超えたときには警報部6′のランプ表
示または警報音表示が行われ、位置ずれ量から印
刷機の調整が必要なことを警報する。この警報に
応じて、作業者は、印刷マスクの位置を修正し、
後続の印刷配線板に対する印刷の位置ずれが許容
値以内に入るようにする。
The results of this comparison calculation are displayed on the image output device 5, and when the amount of positional deviation between the lower layer mark 9 and the upper layer mark 8 exceeds the allowable value, a lamp display or an alarm sound is displayed on the alarm unit 6', and the amount of positional deviation is alerts you that the printing press needs adjustment. In response to this alarm, the operator should correct the position of the printing mask,
To ensure that the misalignment of printing on a subsequent printed wiring board is within an allowable value.

印刷の位置ずれ量が許容値内にあるときは、位
置決め装置2の固定が解かれ、印刷配線板7は搬
送装置1により搬出される。
When the printing misalignment amount is within the allowable value, the positioning device 2 is unfixed and the printed wiring board 7 is carried out by the conveying device 1.

位置マークとしては、第2図bに示すように、
下層のランド9′と上層のレジストの円孔の周縁
部8′を用いても同じである。
As a position mark, as shown in Fig. 2b,
The same effect can be obtained by using the land 9' in the lower layer and the peripheral edge 8' of the circular hole in the resist in the upper layer.

このように、本実施例によれば、基準パターン
は不要であり、重なつて設けられている下層と上
層のマークを識別して相対的位置を演算処理を行
わしめることから、処理速度も早くなり、印刷配
線板を印刷機の処理速度に合わせて全数検査を実
施することが可能となり、信頼性を向上すること
ができる。
As described above, according to this embodiment, there is no need for a reference pattern, and the marks on the lower layer and the upper layer that are provided overlapping each other are identified and the relative positions are calculated, so the processing speed is fast. Therefore, it is possible to perform a complete inspection of printed wiring boards in accordance with the processing speed of the printing machine, and reliability can be improved.

また、印刷ラインに組み込んで自動的に検査す
るだけでなく、印刷ずれが許容値を超えたときに
は警報により直ちに印刷機の調整を行えるので不
良品の発生を最小限におさえられ経済性も向上す
る。
In addition to being integrated into the printing line and automatically inspecting it, if the printing misalignment exceeds the allowable value, an alarm can be issued and the printing press can be adjusted immediately, minimizing the occurrence of defective products and improving economic efficiency. .

〔発明の効果〕〔Effect of the invention〕

以上詳細に説明したように、本発明によれば、
各印刷層ごとに下層と上層との相対的な位置のず
れを、印刷機のタクトタイムに合つた処理タイム
で、自動的に調べて印刷時の相対的ずれ量を把握
する装置を提供することができる。
As explained in detail above, according to the present invention,
To provide a device that automatically checks the relative positional deviation between a lower layer and an upper layer for each printing layer in a processing time that matches the tact time of a printing machine and grasps the relative deviation amount during printing. I can do it.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の一実施例に係る検査装置の
構成を示す一部斜視図を含むブロツク図、第2図
は、印刷物上のマークを示す平面図、第3図は、
マークの位置ずれの検査手順を示すフローチヤー
トである。 1……搬送装置、2……位置決め装置、3……
画像入力装置、4……画像処理装置、5……画像
出力装置、6……制御装置、7……印刷配線板、
8……上層マーク、9……下層マーク、10……
色抽出装置、6′……警報部。
FIG. 1 is a block diagram including a partial perspective view showing the configuration of an inspection device according to an embodiment of the present invention, FIG. 2 is a plan view showing marks on printed matter, and FIG.
7 is a flowchart showing a procedure for inspecting mark positional deviation. 1... Conveyance device, 2... Positioning device, 3...
Image input device, 4... Image processing device, 5... Image output device, 6... Control device, 7... Printed wiring board,
8... Upper layer mark, 9... Lower layer mark, 10...
Color extraction device, 6'...alarm unit.

Claims (1)

【特許請求の範囲】 1 2層以上の印刷を行う印刷配線板の各層の位
置ずれを検出する装置において、 印刷配線板上に重なつて印刷されている下層の
マークと上層のマークとを読み込む入力装置と、 読み込んだ画像の色の違いおよび色の濃淡のい
ずれかで下層のマークと上層のマークとを識別す
る装置と、 識別された下層のマークと上層のマークとの相
対的偏差を演算する処理装置と、 該処理装置の演算結果を表示する出力装置と、 上記の各装置を関連的に制御する装置とからな
ることを特徴とする重なり合うマークの相対位置
を検出する装置。
[Claims] 1. A device for detecting misalignment of each layer of a printed wiring board that prints two or more layers, which reads lower layer marks and upper layer marks that are printed overlappingly on the printed wiring board. An input device, a device that identifies the lower layer mark and the upper layer mark based on either the difference in color or the shade of the color of the read image, and the device that calculates the relative deviation between the identified lower layer mark and the upper layer mark. 1. A device for detecting relative positions of overlapping marks, comprising: a processing device that performs the following operations; an output device that displays the calculation results of the processing device; and a device that controls each of the above devices in relation to each other.
JP63051517A 1988-03-07 1988-03-07 Device that detects the relative position of overlapping marks Granted JPH01226194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63051517A JPH01226194A (en) 1988-03-07 1988-03-07 Device that detects the relative position of overlapping marks

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63051517A JPH01226194A (en) 1988-03-07 1988-03-07 Device that detects the relative position of overlapping marks

Publications (2)

Publication Number Publication Date
JPH01226194A JPH01226194A (en) 1989-09-08
JPH0458197B2 true JPH0458197B2 (en) 1992-09-16

Family

ID=12889202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63051517A Granted JPH01226194A (en) 1988-03-07 1988-03-07 Device that detects the relative position of overlapping marks

Country Status (1)

Country Link
JP (1) JPH01226194A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5271006B2 (en) * 2008-08-28 2013-08-21 アンリツ株式会社 Printed solder inspection apparatus and printed solder inspection method
JP5243936B2 (en) * 2008-12-12 2013-07-24 アンリツ株式会社 Printed solder inspection equipment

Also Published As

Publication number Publication date
JPH01226194A (en) 1989-09-08

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