JPH0458695B2 - - Google Patents
Info
- Publication number
- JPH0458695B2 JPH0458695B2 JP58119349A JP11934983A JPH0458695B2 JP H0458695 B2 JPH0458695 B2 JP H0458695B2 JP 58119349 A JP58119349 A JP 58119349A JP 11934983 A JP11934983 A JP 11934983A JP H0458695 B2 JPH0458695 B2 JP H0458695B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- internal
- bed
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、リードフレームの製造方法の改良に
関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a method for manufacturing a lead frame.
周知の如く、樹脂封止型半導体装置において、
個々の半導体チツプをパツケージングする工程は
銅等の導電性材料でできた第１図のリードフレー
ムを用いて行なわれる。図中の１は、外枠であ
る。この外枠１で囲まれた中央には半導体チツプ
のベツド部２が配設され、該ベツド部２は外枠１
に連結支持されている。前記ベツド部２の周囲に
は該ベツド部２に離間して多数の内部リード３…
…が配設され、該内部リード３は外部リード４…
…として延設されている。
As is well known, in resin-sealed semiconductor devices,
The process of packaging individual semiconductor chips is accomplished using a lead frame, shown in FIG. 1, made of a conductive material such as copper. 1 in the figure is an outer frame. A bed portion 2 of a semiconductor chip is disposed in the center surrounded by the outer frame 1, and the bed portion 2 is connected to the outer frame 1.
It is connected and supported. Around the bed part 2, there are a large number of internal leads 3 spaced apart from each other in the bed part 2.
... are arranged, and the internal lead 3 is connected to the external lead 4...
It has been extended as...
従来、こうしたリードフレームの形成方法とし
ては、所定の導電性材料上にレジストパターンを
マスクした後、写真蝕刻法によりエツチング液を
用いて行なう方法、あるいは金型によりプレスし
て打ち抜くことより行なう方法が採られている。 Conventionally, such lead frames have been formed by masking a resist pattern on a predetermined conductive material and then photolithography using an etching solution, or by pressing and punching with a mold. It is taken.
しかしながら、前述したリードフレームの形成
方法によれば、以下に示す欠点を有する。
However, the lead frame forming method described above has the following drawbacks.
(1) エツチング液を用いる方法：第２図に示す如
く、リードフレームの内部リード３……のボン
デイング部５……の先端がオーバエツチして丸
味をおびることを避けられない。したがつて、
半導体チツプのベツド部２と内部リード３……
のボンデイング部５……をボンデイングワイヤ
を用いてボンデイングする際、ボンデイングワ
イヤがボンデイング部５……の丸味をおびた部
分にカールした状態で係止され、接触不良の原
因になる。特に、ペレツトが大型化し、多ピン
化すると、内部リード３……のボンデイング部
５……が円形に近くなり、接触不良の問題が顕
著となる。(1) Method using etching liquid: As shown in FIG. 2, it is unavoidable that the tips of the bonding portions 5 of the internal leads 3 of the lead frame become overetched and rounded. Therefore,
The bed portion 2 of the semiconductor chip and the internal leads 3...
When bonding the bonding portions 5 . . . using a bonding wire, the bonding wire is locked in a curled state on the rounded portion of the bonding portion 5 , causing contact failure. In particular, as the pellet becomes larger and the number of pins increases, the bonding portions 5 of the internal leads 3 become nearly circular, and the problem of poor contact becomes more prominent.
(2) 金型による場合：前述した接触不良の問題は
解消できるものの、少量多品種の場合、金型代
が高くつく。また、ペレツトが大型化して多ピ
ン化すると、内部リード３……のボンデイング
部５……が細くなり、プレスだけでは打ち抜け
ない。(2) Using a mold: Although the above-mentioned problem of poor contact can be solved, the cost of molds is high when producing a wide variety of products in small quantities. Furthermore, as the pellet becomes larger and has more pins, the bonding portions 5 of the internal leads 3 become thinner and cannot be punched out with just a press.
〔発明の目的〕
本発明は上記事情に鑑みてなされたもので、ベ
ツド部と対向する内部リードの先端面のみを平坦
状に打ち抜く工程を具備することによつて、半導
体チツプのベツド部とボンデイング部の接続を良
好にできるとともに、低コスト化を達成し、多ピ
ン化した場合にも有用なリードフレームの製造方
法を提供することを目的とするものである。[Object of the Invention] The present invention has been made in view of the above-mentioned circumstances, and includes a step of punching out only the tip end face of the internal lead facing the bed part into a flat shape, thereby making it possible to form a bond with the bed part of a semiconductor chip. It is an object of the present invention to provide a method for manufacturing a lead frame that allows good connection between parts, achieves cost reduction, and is useful even when the number of pins is increased.
本発明は、ベツド部と対向する内部リードの先
端面のみを平坦状に打ち抜く工程を具備すること
によつて、半導体チツプのベツド部と内部リード
のボンデイング部の接続を良好にできるととも
に、低コスト化を達成し、多ピン化した場合でも
有用であることを骨子とする。
The present invention has a step of punching out only the tip end face of the internal lead facing the bed part, thereby making it possible to improve the connection between the bed part of the semiconductor chip and the bonding part of the internal lead, and at a low cost. The main point is that it is useful even when the number of pins is increased.
即ち、本発明においては、ベツド部と対向する
内部リードの先端面つまりボンデイング部の先端
面を金型で打ちぬくことにより内部リードの先端
面のみ平坦状とするとともに、その他の部分をエ
ツチング液によりパターン化して上記効果を得る
ものである。 That is, in the present invention, only the end surface of the internal lead facing the bed portion, that is, the end surface of the bonding portion, is punched out with a mold to make only the end surface of the internal lead flat, and the other portions are etched with an etching liquid. The above effect is obtained by patterning.
以下、本発明の一実施例をその製造方法を併記
しつつ、第３図を参照して説明する。なお、第１
図図示の従来のリードフレームと同部材のものは
同符号を付して説明を省略する。
Hereinafter, an embodiment of the present invention will be described with reference to FIG. 3, together with a method of manufacturing the same. In addition, the first
Components that are the same as those of the conventional lead frame shown in the drawings are given the same reference numerals, and description thereof will be omitted.
まず、例えば厚み0.2mmの銅等の導電性材料上
の半導体チツプのベツド部形成予定部にレジスト
パターンを形成した。つづいて、このレジストパ
ターンをマスクとして前記導電性材料をエツチン
グ液により選択的に除去し、先端に丸味をおびた
ボンデイング部を有する内部リード３……、内部
リード３……に接続する外部リード４……及びベ
ツド部２を形成した。次いで、前記内部リード３
……の後端及び外部リード４……をテーピングし
た後、レジスタパターンを除去した。更に、ボン
デイング部の先端の丸みをおびた部分を金型で打
ちぬき（プレスレ）、先端面が角状のボンデイン
グ部１１を有する内部リード３……を形成し、リ
ードフレームを製造した。 First, a resist pattern was formed on a conductive material such as copper with a thickness of 0.2 mm at a portion where a bed portion of a semiconductor chip was to be formed. Next, using this resist pattern as a mask, the conductive material is selectively removed using an etching solution, and the internal leads 3 having rounded bonding portions at the tips and the external leads 4 connected to the internal leads 3 . ...and the bed portion 2 was formed. Next, the internal lead 3
After taping the rear end of . . . and the external lead 4 . . . , the resistor pattern was removed. Furthermore, the rounded end portion of the bonding portion was punched out with a die (pressing) to form an internal lead 3 having a bonding portion 11 with an angular end surface, thereby manufacturing a lead frame.
このようにして形成されるリードフレームは、
第３図に示す如く、内部リード３……のボンデイ
ング部１１の先端面が角状をした構造となつてい
る。 The lead frame formed in this way is
As shown in FIG. 3, the end surfaces of the bonding portions 11 of the internal leads 3 have an angular structure.
しかして、本発明によれば、内部リード３……
のボンデイング部１１……の先端面を金型でプレ
スして角状とするとともに、他の部分をエツチン
グ液によりパターン化した構造となつているた
め、以下に示す効果を有する。 According to the present invention, the internal lead 3...
Since the tip surfaces of the bonding portions 11 are pressed with a mold to form a square shape, and the other portions are patterned using an etching solution, the following effects are achieved.
(1) 内部リード３……のボンデイング部１１……
の先端面が角状であるため、ベツド部２とボン
デイング部１１……をボンデイングワイヤを用
いてボンデイングする際、ボンデイングワイヤ
がボンデイング部１１……でカールすることな
く、ベツド部１２とボンデイング部１１……の
接続を良好にできる。この効果は、ペレツドが
大型化し、多ピン化しても同様である。(1) Bonding part 11 of internal lead 3...
Since the end surface of the bonding part 11 is square, when the bonding wire is used to bond the bed part 2 and the bonding part 11 . . . , the bonding wire does not curl at the bonding part 11 . It is possible to improve the connection between... This effect remains the same even when the pellet becomes larger and the number of pins increases.
(2) 金型でプレスしてパターン化する部分は、内
部リード３のボンデイング部１１……の先端面
だけであるため、少量多品種の場合でも金型代
を従来と比べ低減できる。(2) Since the only part to be pressed and patterned with a mold is the tip end face of the bonding part 11 of the internal lead 3, the cost of the mold can be reduced compared to the conventional method even in the case of a small quantity of a wide variety of products.
なお、上記実施例では、ベツド部形成予定部を
除く導電性材料をエツチング液によりパターン化
した後、内部リードのボンデイング部を金型によ
り打ちぬいて形成する場合について述べたが、こ
れに限定されず、手順を逆にしてもよい。 In the above embodiment, a case has been described in which the conductive material excluding the portion where the bed portion is to be formed is patterned using an etching solution, and then the bonding portion of the internal lead is punched out using a mold, but the present invention is not limited to this. Alternatively, the procedure may be reversed.
以上詳述した如く本発明によれば、半導体チツ
プのベツド部と内部リードのボンデイング部の接
続を良好にできるとともに、低コスト化を達成
し、かつ多ピン化した場合でも有用な高信頼性の
リードフレームの製造方法を提供できるものであ
る。
As described in detail above, according to the present invention, it is possible to improve the connection between the base part of the semiconductor chip and the bonding part of the internal leads, achieve cost reduction, and achieve high reliability that is useful even when the number of pins is increased. A method for manufacturing a lead frame can be provided.
第１図は従来のリードフレームの平面図、第２
図は第１図のリードフレームを部分的に拡大した
平面図、第３図は本発明の一実施例に係るリード
フレームの部分平面図である。
１……枠体、２……ベツド部、３……内部リー
ド、４……外部リード、１１……ボンデイング
部。
Figure 1 is a plan view of a conventional lead frame, Figure 2 is a plan view of a conventional lead frame.
The figure is a partially enlarged plan view of the lead frame shown in FIG. 1, and FIG. 3 is a partial plan view of the lead frame according to an embodiment of the present invention. 1...Frame body, 2...Bed part, 3...Internal lead, 4...External lead, 11...Bonding part.
Claims (1)
枠に連結支持されたベツド部と、このベツド部の
周囲に該ベツド部に離間して配設された内部リー
ドと、この内部リードに延設された外部リードと
を具備するリードフレームの製造方法において、
ベツド部と対向する内部リードの先端面のみを平
坦状に打ち抜く工程を具備することを特徴とする
リードフレームの製造方法。1. An outer frame, a bed portion disposed approximately in the center of the outer frame and connected and supported by the outer frame, an internal lead disposed around the bed portion at a distance from the bed portion; In a method for manufacturing a lead frame including an external lead extending from an internal lead,
A method for manufacturing a lead frame, comprising the step of punching out only the tip end face of the internal lead facing the bed part into a flat shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58119349A JPS6010759A (en) | 1983-06-30 | 1983-06-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58119349A JPS6010759A (en) | 1983-06-30 | 1983-06-30 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6010759A JPS6010759A (en) | 1985-01-19 |
| JPH0458695B2 true JPH0458695B2 (en) | 1992-09-18 |
Family
ID=14759286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58119349A Granted JPS6010759A (en) | 1983-06-30 | 1983-06-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6010759A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2637175B2 (en) * | 1988-07-05 | 1997-08-06 | 日立電線株式会社 | Method of manufacturing multi-pin lead frame for semiconductor |
| JP2775453B2 (en) * | 1989-01-26 | 1998-07-16 | マツダ株式会社 | Engine intake structure |
| JP2527444Y2 (en) * | 1991-09-02 | 1997-02-26 | 日産自動車株式会社 | Engine negative pressure supply device |
| KR100212376B1 (en) * | 1995-07-27 | 1999-08-02 | 전주범 | A pulsator in a washing machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5650420A (en) * | 1979-10-02 | 1981-05-07 | Fuji Heavy Ind Ltd | Operation device of speed change gear for car |
-
1983
- 1983-06-30 JP JP58119349A patent/JPS6010759A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6010759A (en) | 1985-01-19 |
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