JPH0459766B2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a lead wire or a thin foil of a foil-type film capacitor which has a tab structure and has a lead wire or a thin foil-like lead led out in the opposite direction. The present invention relates to a method of manufacturing a chip-type film capacitor using a shaped lead itself as a chip electrode.

<Prior art> Most conventional chip capacitors have chip electrodes without lead wires, such as plate-shaped for rectangular capacitors and cap-shaped for cylindrical capacitors. There are many items that need to be molded or dipped in resin. In general, electronic components are required to be mounted on printed wiring boards with high density, so they are becoming lighter, thinner, and shorter.
As mentioned above, surface-mounted chip components that have plate-shaped, cap-shaped, etc. chip electrodes instead of lead wires are gaining popularity (see FIG. 5). In addition, film capacitors are more often made of metallized film than foil, in order to accommodate miniaturization.

On the other hand, foil-type film capacitors, in which a dielectric film and an electrode foil such as aluminum are wound, are becoming smaller and smaller, including those with a tab structure and those with a foil-extruding structure. The current situation is that they have become as small as those without lead wires, and this also plays a role in high-density packaging.

<Problems to be Solved by the Invention> The present invention aims to make it possible to use tab-structured foil-type film capacitors from which lead wires or thin foil leads are derived as chip-type film capacitors. Therefore, it is possible to use mass production equipment for this type of foil-type film capacitors, and to economically utilize lead wires or thin foil-like leads as chip-type film capacitors without increasing the number of types of film capacitors. Since it can be supplied, it is highly efficient in manufacturing, which is a major feature.

There is an invention based on this idea that was previously filed by the same applicant.
No. 287802) In that invention, a dielectric film, aluminum, etc., and metal electrode foil are wound, and in the middle of the winding, lead wires are led out from the metal electrode foil in the same direction, and only one lead wire is led out in the opposite direction. A method of manufacturing a chip-type film capacitor from an element protruding a predetermined length is presented.

<Object of the present invention> The present invention is a manufacturing method for producing a chip-shaped capacitor by directly utilizing the leads of a film capacitor element having a foil-shaped tab structure, similar to the above-mentioned earlier application. not in the same direction,
There is a major difference in that this invention presents a manufacturing method for producing chip-type film capacitors from elements derived in the opposite direction, and has the feature that it can be manufactured more easily and economically than the invention of the earlier application. .

The lead referred to in this application may be a lead wire as described above or may be a thin foil-like lead, but the case of a lead wire will be described below.

<Structure of the Invention> As described above, the present invention provides a capacitor having a tab structure in which a dielectric film and a metal foil such as aluminum are wound, and lead wires are led out at a predetermined interval in the opposite direction from the middle of the winding to form a flat shape. In the element, each lead wire of a predetermined length is bent along the lead-out end face toward the other lead wire side so that it fits tightly within the end face, and then the element and lead wires are coated with resin such as epoxy. After impregnation and/or sheathing, the resin-coated end faces are polished parallel to the end faces so that the lead wire portion is exposed, and electrodes are provided. This figure shows a method of manufacturing a chip-type film capacitor having an electrode structure.

In the film capacitor element described above, it is preferable to set the lead wire to a predetermined length in advance, but the long lead wire may be cut to a predetermined length after the element is formed.

In addition to the above invention, there is also a method of obtaining a chip-type film capacitor by impregnating the lead wire with a resin before bending it, then bending it, and subsequently subjecting it to exterior treatment and polishing, After impregnation treatment and lead wire bending, the lead wire is fixed to the end face with resin or adhesive, and the lead wire coating is polished to obtain a chip-shaped film capacitor.
The present invention also provides a manufacturing method obtained by partially changing the combination of steps such as lead wire bending, resin impregnation, and packaging.

<Function> By configuring the present invention as described above, the main gist is that the film capacitor has a tab structure, and lead wires of a predetermined length are led out in the opposite direction at a predetermined interval along the element end face, Chip-shaped lead electrodes can be easily provided by bending the lead wire, bringing it into close contact with the end face, and polishing the resin-coated lead wire portion.In other words, a tab-structured foil film capacitor can be used as a chip-shaped lead electrode. He demonstrated a method of manufacturing a chip-type film capacitor with the following characteristics. On top of that,
In the previous application, the lead wires were led out in the same direction, and one of the lead wires was made to protrude in the opposite direction in advance, whereas in the present application, the manufacturing method is simpler, and the manufacturing process is simpler. This is a more economical and effective method since there is no need to use extra lead wires.

Embodiments of the present invention will be described below based on the drawings.

FIG. 7 is a front view showing an example of a conventionally used square chip film capacitor, where 11 is the film capacitor body and 12 is an example of a plate-shaped chip electrode.

In contrast, in the present invention, as shown in FIG. 1, a flat film capacitor element 1 is used in which the lead wires are led out from both end faces in opposite directions, but FIG. 3 shows a state in which they are horizontally taped. FIG. 2 shows a vertical taping state and also shows an embodiment to which the present invention is applied. In the figure, one lead is shortened to a predetermined length. Note that the tip 8 of the taped lead wire is bent to make it difficult for the element to move in consideration of the application of the present invention, but it is not normally necessary and may be straight.

FIG. 1 is a perspective view of a chip-type film capacitor obtained according to the present invention. Figure 1 1-4
shows the manufacturing method in the order of manufacturing steps.
2 to 2 are perspective views, and 3 to 4 are sectional views. That is, reference numeral 1 indicates a tab structure foil-shaped element as described above, which is made into a flat shape, and the lead wires are led out in the opposite direction not on the same axis but at a predetermined interval. As mentioned above, the length of the lead wire is preferably set to a predetermined length in advance, but if it is long, it is cut to a predetermined length. 2 shows the part where each lead wire 2 is bent along the flat end surface so as to be in close contact with the inside of the end surface, and 3 shows the element in this state, which is impregnated with resin such as epoxy and/or coated with resin by dip etc. One of the coating treatments was performed. The term "impregnation or exterior treatment" refers to a process of impregnating or exteriorizing with a resin, followed by heat curing.
In the next step 4, the chip-type film capacitor 5 of the present invention having lead electrodes 2, 2' is polished parallel to the end face to a predetermined 5-5' position so that the lead wire buried in the end face is exposed. is completed.

In addition, even if the resin coating is impregnated and then exteriorized, or if only one of impregnation and exteriorization is performed, the resin coating part will be 3.
It is shown.

FIG. 2 shows one embodiment in which the invention can be manufactured continuously. The process starts from a state A in which the elements 1 are vertically taped onto a mount 6 at regular intervals with adhesive tape 7. In this case, since the taping has one leg, in order to prevent the element from bending or moving, the tip of the lead wire is shaped like an L-shape as shown in 8.
It is desirable to have a zigzag shape, a gently curved shape, a flat shape, etc.

Next, in state B, the lead wire 2' has a predetermined length.
At the same time, as for the lead wire 2, the element 1 itself is rotated approximately 0 degrees as shown by the arrow to complete the bending of each lead, and the lead wire 2 is cut at a predetermined length at point 4. Next, in state C, the resin coating 3 is applied using a dip or the like, and in the next state D, the elements are individually covered with ten holding members. Although details of the holding member 10 are omitted, it is preferable to use an elastic member to prevent damage to the capacitor. In state D, the end face portion is polished and the lead electrode is exposed. 10 in state E
The chip-shaped film capacitor holding member separates,
The elements are separated into individual pieces and transported on a carrier to the next process such as inspection and packaging (the illustration is omitted). still,
In state B, the lead wire 2 may be left as it is and coated, one of the leads may be cut at the coated surface, and the same process may be continued. The resin-coated portion is indicated by coating 3 regardless of whether it is impregnated or coated, or either one of them.

FIG. 4 shows a second embodiment, in which the present invention is implemented using a horizontally taped device as shown in FIG. That is, by adding a step of cutting the first side 2' of the lead wire to a predetermined length as shown in FIG. 4, the chip-type film capacitor of the present invention can be manufactured continuously in the same manner as the embodiment shown in FIG. can do. However, in the case of Figure 4, one lead wire is held down with only two pieces of tape 7, 7, so it is preferable to bend the tip in advance to make it easier to fasten as shown in Figure 2. .

Further, since taping with only two tapes is unstable in production, it is desirable and easy to make continuous production by pasting on a mount or other jig.

In the above two examples, the lead wires were bent, coated with resin, and the end surfaces were polished, but in other cases, the lead wires were impregnated before being bent, and then bent and further coated, and then polished. A method of obtaining a lead electrode using the above-mentioned impregnation method, and embodiments of related inventions such as bending the lead wire after the above-mentioned impregnation, fixing the lead wire with a resin or adhesive, and polishing the lead wire to expose the lead electrode. state

FIG. 5 shows the above manufacturing method in the order of steps, and 1 indicates the element 1 used in the present invention, and the lead wire has a predetermined length. 2 is the one in which resin impregnation 3' was performed in this state, and 3 is 2.
4 shows the lead wires bent, 4 shows the capacitor coated with 3" of exterior resin, 5 shows the situation where the lead wire electrodes are exposed after polishing, and 6 shows the resulting chip-type film capacitor. It is.

In FIG. 6, as in FIG. 5, the element 1 is subjected to the impregnating process 3' at 2, and the lead wires are bent at 3 and tightly fixed with resin or adhesive 13.
This is a chip-type film capacitor 4 in which the lead wire resin coating 3 portions are polished to expose the electrodes.

In the above explanation, a lead wire was used, but the lead wire may be left as is, or the entire lead wire may be made into a flat shape in advance and then wound or pulled out. It's good to wear.

In addition, in the present invention, the drawer lead wire is bent as it is without being flattened, but it is also desirable to provide a step in between to form it into a flat shape so that it fits closely to the main body before bending, and this can be freely adopted. can do.

The lead wire is generally an annealed copper wire plated with solder or tin, or a similarly plated copper-clad steel core wire. In addition to the lead wire, a thin foil lead may also be used. Generally copper, iron 0.1~0.45mm
It is appropriate to use foil with a certain thickness, and it is even more desirable to use solder to stabilize the surface.

In addition, if all the lead wires are made flat in advance, or if foil leads are used, the winding element is heated and pressed to make them flat, so that each lead can be bent along the flat end surface. It is necessary to set the parameters in advance to create the element.

In addition, it is preferable to use epoxy resin or adhesive 13 for fixing the lead wire and the end surface in 3 of FIG. 6 above, but in carrying out the present invention,
Other resins or adhesives may be used as long as they support similar curing.

<Effects of the Present Invention> As described above, the method for manufacturing a chip-shaped film capacitor of the present invention utilizes a capacitor element with pull-out leads in opposite directions, and performs a lead bending process, a resin coating process, and a lead exposure polishing process. Through simple operations, electrodes for chip-type film capacitors can be formed without using expensive manufacturing means such as dedicated lead frames and molds as in conventional methods.

Since it is possible to use substantially the same manufacturing process, manufacturing equipment, and equipment as in the manufacturing method of conventional drawer-lead type film capacitors, it is said to be economical with excellent compatibility and mass production. It has various advantages.

Furthermore, the present invention is compared to the previously filed method for producing a tab-structured film capacitor in which the leads are led out from the same direction, and a flat chip-shaped film capacitor in which one of the leads is made to protrude in the opposite direction in advance. However, since the present invention is of a type in which the leads are led out in the opposite direction in advance, it is an economical and mass-produced method that reduces the number of leads that are wasted due to cutting during continuous production. This is an extremely valuable method for manufacturing chip-type film capacitors.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a method of manufacturing a chip-type film capacitor according to the present invention. 5 is a perspective view of a chip-type film capacitor manufactured according to the present invention.
FIG. 2 is a perspective view showing Embodiment 1 of the continuous manufacturing method of the present invention. FIG. 3 is a perspective view of horizontal taping of a film capacitor element used in the present invention. Fourth
The figure shows a second embodiment of the continuous manufacturing method of the present invention using the taping-like element shown in FIG. 5 and 6 show a manufacturing method of another invention of the present application.
FIG. 7 is a front view showing an example of a conventional chip type capacitor. 1... Film capacitor element used in the present invention, 2, 2'... Lead wire, 3'... Impregnated resin,
3''... Exterior resin, 3... Overall coating resin, 4... Lead wire cutting position, 5-5'
...position indicating the polishing direction (arrow) of the resin-coated end surface, 6...taping mount, 7...adhesive tape,
8...Bending shape of the lead wire end (arbitrary), 1
0... Chip-shaped capacitor holding member, 11... An example of a conventional chip-shaped molded film capacitor main body, 12... An example of a chip-shaped capacitor electrode terminal, 13... Resin or adhesive.

Claims (1)

[Scope of Claims] 1. A dielectric film and a metal foil such as aluminum are wound, and lead wires or thin foil-like leads (hereinafter referred to as leads) are drawn out at a predetermined interval in the opposite direction from the middle of the winding. In the flat film capacitor element, each lead lead of a predetermined length is bent along the end face and toward the other lead side so that it fits tightly within the end face, and then the film capacitor element is folded into a resin. A chip characterized in that after impregnation and/or exterior coating with resin, both end faces are polished parallel to the end faces so that the leads are exposed to form lead electrodes. Method of manufacturing film capacitors. 2. A flat-shaped film in which a dielectric film and a metal foil such as aluminum are wound, and lead wires or thin foil leads (hereinafter referred to as leads) are drawn out at a predetermined interval in the opposite direction from the middle of the winding. In the capacitor element, after impregnating a film capacitor element with each lead lead to a predetermined length with resin, each lead lead is placed along the end face and toward the other leads so that they are in close contact with the inside of the end face. A lead electrode is provided by bending the wire into a shape, then applying a resin coating on the wire, and polishing both resin-coated end surfaces parallel to the end surfaces so that the leads are exposed. Manufacturing method for chip-type film capacitors. 3. A flat film in which a dielectric film and a metal foil such as aluminum are wound, and lead wires or thin foil leads (hereinafter referred to as leads) are drawn out at a predetermined interval in the opposite direction from the middle of the winding. In the capacitor element, after impregnating the capacitor element with each lead to a predetermined length with resin, each lead is bent inside the end face along the end face and toward the other lead side. Alternatively, a method for manufacturing a chip-shaped film capacitor, characterized in that a lead electrode is provided by fixing the capacitor to the end face with an adhesive and then polishing the end face parallel to the end face so that the leads on both end faces are exposed.