JPH0460053B2 - - Google Patents
Info
- Publication number
- JPH0460053B2 JPH0460053B2 JP11761287A JP11761287A JPH0460053B2 JP H0460053 B2 JPH0460053 B2 JP H0460053B2 JP 11761287 A JP11761287 A JP 11761287A JP 11761287 A JP11761287 A JP 11761287A JP H0460053 B2 JPH0460053 B2 JP H0460053B2
- Authority
- JP
- Japan
- Prior art keywords
- silica
- particles
- fine powder
- powder particles
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 100
- 239000002245 particle Substances 0.000 claims description 49
- 239000000377 silicon dioxide Substances 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 9
- 239000012736 aqueous medium Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 230000006378 damage Effects 0.000 claims description 2
- 239000000945 filler Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000005350 fused silica glass Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000000057 synthetic resin Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000000635 electron micrograph Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000002609 medium Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910001018 Cast iron Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Pigments, Carbon Blacks, Or Wood Stains (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Silicon Compounds (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は角のまるまつたシリカ微粉末粒子の製
造方法、特に半導体素子封止用合成樹脂組成物の
充填剤に適したシリカ微粉末粒子の製造法に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for producing round-cornered silica fine powder particles, and in particular to a method for producing silica fine powder particles suitable as a filler for synthetic resin compositions for encapsulating semiconductor devices. Regarding manufacturing methods.
(従来の技術)(発明が解決しようとする問題点)
半導体素子はそれを外部環境から保護するため
にセラミツクパツケージまたは樹脂などで封止さ
れているが、この封止材料についてはコスト、生
産性等の面から無機充填剤を含有させた合成樹脂
組成物によるものが普及している。(Prior Art) (Problems to be Solved by the Invention) Semiconductor elements are encapsulated with ceramic packages or resin to protect them from the external environment. For these reasons, synthetic resin compositions containing inorganic fillers have become popular.
この合成樹脂組成物は、エポキシ樹脂などの合
成樹脂とシリカなどの無機充填剤とから構成され
ているが、これらの組成物は熱膨張係数が小さ
く、良熱伝導性、低透湿性で機械的特性等にすぐ
れ、しかも低コストのものとするということか
ら、この無機充填剤をその成形性の許す限り、で
きるだけ多量に配合する必要がある。 This synthetic resin composition is composed of a synthetic resin such as an epoxy resin and an inorganic filler such as silica, but these compositions have a small coefficient of thermal expansion, good thermal conductivity, low moisture permeability, and mechanical properties. In order to have excellent properties and low cost, it is necessary to incorporate this inorganic filler in as much amount as possible, as long as its moldability allows.
特に無機充填剤としては、シリカ系充填剤が最
適とされ、ほとんどの合成樹脂封止充填剤にこれ
が利用されている。シリカ系充填剤には結晶タイ
プ、非結晶タイプの2種類のものがある。結晶タ
イプのシリカは高純度の天然の白硅石や水晶を粉
砕精製して製造する。このタイプは熱伝導性に優
れている。 In particular, silica-based fillers are considered to be most suitable as inorganic fillers, and are used in most synthetic resin sealing fillers. There are two types of silica fillers: crystalline and amorphous. Crystal type silica is manufactured by crushing and refining highly pure natural white silica or crystal. This type has excellent thermal conductivity.
非結晶タイプのシリカには結晶シリカを高温で
溶融して製造する溶融シリカ、乾式や湿式の合成
シリカがある。この溶融非結晶シリカは熱膨張特
性が優れているため、工業的に使用される量も多
い。しかしながら、半導体素子の集積化が進むに
つれ熱伝導性を重視する傾向にあり、結晶シリカ
へのニーズも増加している。 Amorphous silica includes fused silica, which is produced by melting crystalline silica at high temperatures, and dry and wet synthetic silica. Since this fused amorphous silica has excellent thermal expansion characteristics, it is used in large quantities industrially. However, as the integration of semiconductor devices progresses, there is a tendency to emphasize thermal conductivity, and the need for crystalline silica is also increasing.
一般に充填剤として使用されている微粉末シリ
カ粒子は、通常の破砕工程で得られたものであ
り、粒子は第2図または第4図の写真に示すよう
に角をもつている。粒子が角をもつていると、樹
脂と混ぜ合わせて半導体素子を封止する際に粘度
が上昇し、金型の摩耗が大きく、作業性を低下さ
せるばかりでなく、金型の摩耗による不純物の混
入などの悪影響があり、従つて充填剤の混合量を
大きくできないので性能の向上に限界があつた。 The finely divided silica particles commonly used as fillers are obtained through a conventional crushing process, and the particles have corners as shown in the photographs in FIG. 2 or 4. If the particles have corners, their viscosity will increase when they are mixed with resin to seal a semiconductor element, which will cause a lot of wear on the mold, which will not only reduce workability, but also cause impurities to form due to wear on the mold. There are adverse effects such as contamination, and the amount of filler mixed cannot be increased, which limits the ability to improve performance.
非結晶タイプの溶融シリカについては、球状の
シリカの製造が試みられている。例えば、特開昭
58−145613号公報または、特開昭61−118131号公
報によれば結晶微粉末シリカをガス流と共にノズ
ルから噴出させ、粒子の分散、溶融、冷却等を適
当な条件に制御して球状の非結晶微粉末シリカ粒
子をつくる。しかしながら、この方法はコストが
高く溶融工程で粒子が相互に溶け合うため、所定
の粒度分布が得にくい、真球状のため樹脂組成物
の強度が低下する等の欠点があり、一部の特殊な
場合の使用用途に限られている。 Regarding amorphous type fused silica, attempts have been made to produce spherical silica. For example, Tokukai Akira
According to JP 58-145613 or JP 61-118131, crystalline fine powder silica is jetted out from a nozzle along with a gas flow, and particle dispersion, melting, cooling, etc. are controlled under appropriate conditions to form spherical non-silica particles. Create crystalline fine powder silica particles. However, this method has drawbacks such as high cost, particles melting into each other during the melting process, making it difficult to obtain a predetermined particle size distribution, and the strength of the resin composition decreasing due to the true spherical shape. It is limited to the intended use.
また、機械的方法によつて粒子を球状化させる
方法も知られている。例えば、パンミル、エツジ
ランナー等フレツトミルによる球状化、所要粒度
分布の調整が行われるが、この方法が適用可能な
粒子は最大粒子径が500ミクロンを越えるいわゆ
る中粒以上である。しかしながら、上記方法を最
大粒子径が500ミクロン程度ないしそれ以下のシ
リカ微粉末に応用しても微粒子同志が凝集した凝
集粒子間に多量の気泡を含むため摩擦抵抗が小さ
くなり、圧縮による体積破壊が起こるのみで摩砕
は起こらない。従つて、所期の目的である角の丸
まつたシリカ微粉末粒子を得ることはできない。 Furthermore, a method of spheroidizing particles using a mechanical method is also known. For example, spheroidization and adjustment of the required particle size distribution are performed using a fret mill such as a pan mill or an edge runner, but this method is applicable to particles of so-called medium or larger particles with a maximum particle size exceeding 500 microns. However, even if the above method is applied to fine silica powder with a maximum particle size of about 500 microns or less, the frictional resistance will be small because the fine particles will contain a large amount of air bubbles between the agglomerated particles, resulting in volume destruction due to compression. There is no abrasion. Therefore, it is not possible to obtain silica fine powder particles with rounded corners, which is the intended purpose.
従つて、結晶タイプの球状シリカの製造例は、
現在まで提案されていない。 Therefore, an example of manufacturing crystalline spherical silica is as follows:
Not proposed to date.
(問題点を解決するための手段)
本発明者等は、角のないシリカ微粉末粒子の低
コスト製造法について鋭意検討を続けた結果、結
晶シリカまたは非結晶シリカ微粉末粒子に外部か
ら廻転ローラー等で押圧力を加えながら水系媒体
存在下で微粉末の微粒子同志を互いにこすり合わ
せれば工業的に有利に角のあるシリカ微粒子に丸
味を帯びさせることができることを見出し、本発
明に至つたものである。(Means for Solving the Problems) As a result of intensive study on a low-cost manufacturing method for silica fine powder particles having no corners, the present inventors have discovered that crystalline silica or amorphous silica fine powder particles are heated by a rotating roller from the outside. It was discovered that angular silica fine particles can be industrially advantageously rounded by rubbing the fine powder particles against each other in the presence of an aqueous medium while applying pressing force with a silica powder, etc., and this has led to the present invention. be.
本発明者らは、ある水圧下で波の力により砂の
粒子同志がこすり合わされて角の部分が磨砕し、
真球状に近い形状となる鳴き砂の生成過程に着目
し、シリカ微粉末粒子同志をこすり合わせれば角
のとれた丸まつた微粒子ができると考え鋭意検討
を続けた結果、シリカ微粉末に外部から適当な押
圧力を加えることと、この押圧力を効果的にシリ
カ微粒子に到達させるため水系媒体を加えれば非
常に効果的であることを知つた。 The present inventors discovered that under a certain water pressure, the force of the waves causes the sand particles to rub against each other, causing the corners to be ground up.
Focusing on the formation process of singing sand, which has a shape close to a true spherical shape, we thought that by rubbing silica fine powder particles together, we could create rounded fine particles with rounded corners.As a result of our extensive research, we found that we could make silica fine powder particles from outside. It has been found that it is very effective to apply an appropriate pressing force and to add an aqueous medium to make this pressing force effectively reach the silica particles.
本発明に使用する水系媒体としてはシリカ微粒
子同志が相互に作用しあい、外部から粉体への圧
力が伝達し易い液体であればよく、水、アルコー
ル類、鉱油等の液状物質が有利に使用できるが、
媒体のコスト、操作時の取扱い易さ、操作後の分
離し易さなどから水単独または水にエタノール、
メタノール等のアルコール類を溶かした媒体が工
業的に最も有利に使用できる。 The aqueous medium used in the present invention may be any liquid that allows fine silica particles to interact with each other and easily transmits pressure from the outside to the powder, and liquid substances such as water, alcohols, and mineral oil can be advantageously used. but,
Due to the cost of the medium, ease of handling during operation, and ease of separation after operation, water alone or water with ethanol,
A medium in which an alcohol such as methanol is dissolved can be most advantageously used industrially.
本発明を実施する場合、本発明方法に適した機
器としては、先ずローラーミルがあげられる。ロ
ーラーミルはローターによつて廻転駆動される粉
砕ボウルと、この粉砕ボウル中で廻転軌道上を回
転する少なくとも二本の粉砕ローラーを有してお
り、ローラーを被粉砕物に押圧するために、空気
圧、油圧などの圧を加圧できるようになつてい
る。ローラーミルを使用して本発明を実施する場
合、もし、水系媒体を加えず、微粉体のみをロー
ラーミルに装入して角とりを行えば、微粉体がロ
ーラーから逃げてしまい効率が低い。適量の水な
どの媒体を加えるとローラーの押圧力の粉体への
伝達が円滑に行き、効率よく角とり操作が実施で
きる。 When carrying out the present invention, equipment suitable for the method of the present invention is firstly a roller mill. A roller mill has a grinding bowl rotated by a rotor and at least two grinding rollers rotating on a rotating track inside the grinding bowl, and uses air pressure to press the rollers against the material to be ground. It is designed to be able to apply pressure such as hydraulic pressure. When carrying out the present invention using a roller mill, if only the fine powder is charged into the roller mill and rounded without adding an aqueous medium, the fine powder will escape from the roller and the efficiency will be low. Adding an appropriate amount of water or other medium allows the pressing force of the roller to be smoothly transmitted to the powder, allowing efficient cornering operations.
本発明は、結晶シリカ微粉末粒子にも非結晶シ
リカ微粉末粒子にも同様に有利に適用できる。 The present invention can be applied equally advantageously to crystalline and amorphous silica fine powder particles.
本発明で原料として用いるシリカ微粉末の最大
粒子径は通常500ミクロン程度ないしそれ以下で
あり、このような大きさの微粉末をローラーミル
で角とり操作を実施する場合、加える水系媒体の
液量としては、0.5〜18重量%、好ましくは3〜
13重量%%が適当である。加える量が0.5重量%
より少ない場合、ローラーの押圧力が充分にシリ
カ微粉末に到達せず、所謂ローラーから逃げるよ
うな状態となり粒子同志の摩擦力が働かず効果が
劣つてくる。また加える液量がシリカ微粉末より
多くなるとシリカ微粉末が団子状になつたりある
いはスラリー状になるため角とり操作がうまく行
かなくなる。 The maximum particle size of the fine silica powder used as a raw material in the present invention is usually about 500 microns or less, and when cutting fine powder of such size with a roller mill, the amount of aqueous medium to be added is 0.5 to 18% by weight, preferably 3 to 18% by weight
13% by weight is suitable. The amount added is 0.5% by weight
If the amount is less, the pressing force of the roller will not reach the fine silica powder sufficiently, and the powder will escape from the roller, so that the frictional force between the particles will not work and the effect will be degraded. Furthermore, if the amount of liquid added is greater than the amount of fine silica powder, the fine silica powder will become lump-like or slurry-like, making the cornering operation difficult.
本発明の方法により得られるシリカ微粉末粒子
の最大粒子径は通常300ミクロン以下であり、平
均粒子径は通常7〜35ミクロンである。 The maximum particle size of the silica fine powder particles obtained by the method of the present invention is usually 300 microns or less, and the average particle size is usually 7 to 35 microns.
また、外部からローラーに加える押圧力である
が、機械により押圧の仕方が異なるので数値的に
限定できないが、押圧力が余り強い場合、角とり
のみならず粒子の体積破砕がおき、粉砕が進行し
角とりが阻害される。また、余り弱い場合、角と
りの効率が低下してくるので、機器、原料、品種
(結晶質、非結晶)等に応じて、適切に決めれば
より。また、数mm以下の粗砕品を直接この角とり
工程に送つて、所望粒度への粉砕と同時に角とり
操作をおこなうこともできる。 In addition, the pressure applied to the roller from the outside cannot be numerically limited because the method of pressure differs depending on the machine, but if the pressure is too strong, not only the corners will be removed, but the particles will be crushed in volume, and the pulverization will progress. Cornering is inhibited. In addition, if it is too weak, the efficiency of cornering will decrease, so it is better to decide appropriately depending on the equipment, raw materials, type (crystalline, amorphous), etc. Furthermore, it is also possible to send coarsely crushed products of several mm or less directly to this squaring process, and perform the squaring operation at the same time as crushing to a desired particle size.
本発明を実施する場合の一例について第1図を
用いて説明する。 An example of implementing the present invention will be explained using FIG. 1.
先ず、の高純度の硅石塊または高純度溶融シ
リカインゴツト塊をのジヨークラツシヤー等の
粉砕器を用いて粗粉砕する。この場合汚染防止の
ため粉砕器のライナーは高純度のアルミナ等で製
作するのが好ましい。次いでのロールクラツシ
ヤー等で更に粗粉砕する。この場合も同様にロー
ル等は高純度のアルミナ等で製作すればよい。 First, a high-purity silica ingot or a high-purity fused silica ingot is coarsely ground using a crusher such as a geocrusher. In this case, to prevent contamination, the crusher liner is preferably made of high-purity alumina or the like. It is then further coarsely pulverized using a roll crusher or the like. In this case as well, the rolls etc. may be made of high purity alumina or the like.
通常の出口でシリカは数mm以下に粉砕さてる
が、更に通常これをのボールミル等で微粉砕
し、最大粒子径が500ミクロン程度ないしそれ以
下のシリカ微粉末を得る。ここで得られた微粉末
シリカをのローラーミル等の本発明の方式の角
とり工程へ送る。ローラーミルを使用する場合、
廻転ボウル、ローラー等のシリカ微粉末粒子と接
触する部分は、セラミツクスを用いるか、ポリウ
レタン樹脂等でライニングして磨損による汚染を
防止する。場合によつてはのロールクラツシヤ
ー等の粗粉砕品を直接の角とりの工程へ送り、
操作条件を適当に制御することにより、微粉砕と
角とりの操作を同時に実施することもできる。角
とり操作を終つたシリカ微粉末の最大粒子径は通
常300ミクロン以下となり、の乾燥工程におく
られ乾燥され製品とされる。 Silica is pulverized to several millimeters or less at a normal outlet, but this is usually further pulverized using a ball mill or the like to obtain fine silica powder with a maximum particle size of about 500 microns or less. The finely powdered silica thus obtained is sent to a squaring process using a roller mill or the like according to the present invention. When using a roller mill,
The parts of the rotating bowl, rollers, etc. that come into contact with the fine silica powder particles are made of ceramic or lined with polyurethane resin to prevent contamination due to abrasion. In some cases, coarsely crushed products such as roll crushers are sent directly to the rounding process.
By appropriately controlling the operating conditions, it is also possible to carry out the pulverization and cornering operations at the same time. The maximum particle size of the fine silica powder after the shaving operation is usually 300 microns or less, and it is sent to the drying process to be dried and made into a product.
本発明を実施する場合、通常のローラーミル等
がそのまま、あるいはシリカ微粉末と接触する部
分をセラミツクス材料にするか、またはポリウレ
タン樹脂ライニングするだけのわずかな改造のみ
で使用できるので有利であり、またランニングコ
ストも殆んどが廻転等の機械的動力費であり非常
に低い。 When carrying out the present invention, it is advantageous that an ordinary roller mill or the like can be used as is or with only a slight modification such as making the part that comes into contact with the fine silica powder a ceramic material or lining it with a polyurethane resin. Running costs are also very low, as most of them are mechanical power costs such as rotation.
本発明の方法は、バツチ操作、あるいは連続操
作の何れでも実施することができる。 The method of the invention can be carried out either in batch or continuous operation.
尚、本明細書において平均粒子径は、レーザー
回折式粒度分布測定装置(CILAS、モデル715)
を用いて測定したものをいう。 In this specification, the average particle diameter is measured using a laser diffraction particle size distribution analyzer (CILAS, model 715).
Measured using
(実施例) 以下実施例により本発明を具体的に説明する。(Example) The present invention will be specifically explained below using Examples.
実施例 1
ローラーミル(MPV−0.5型 松本鋳造鉄工所
製)にあらかじめボールミルにより微粉砕した平
均粒子径23.2ミクロンの結果シリカ500gを仕込
み、同時に水60mlを添加した。ローラーの押圧力
40Kg/cm(線圧)、ローラーと底板とのクリアラ
ンス3mm、底板の回転数を42rpmに設定して、1
時間処理した結果、えられた処理物の平均粒子径
は19.4ミクロンであつた。その電子顕微鏡写真を
原料第2図(100倍)と比較して第3図(200倍)
に示したが原料に比べて処理したシリカ粒子形状
はかなり丸味をおびていた。Example 1 500 g of silica having an average particle diameter of 23.2 microns, which had been pulverized in advance by a ball mill, was placed in a roller mill (MPV-0.5 type, manufactured by Matsumoto Cast Iron Works), and 60 ml of water was added at the same time. Roller pressing force
40Kg/cm (linear pressure), the clearance between the roller and the bottom plate is 3mm, and the rotation speed of the bottom plate is set to 42rpm.
As a result of the time treatment, the average particle diameter of the obtained treated product was 19.4 microns. Compare the electron micrograph with the raw material figure 2 (100 times) and see figure 3 (200 times).
As shown in Figure 2, the shape of the treated silica particles was considerably rounder than that of the raw material.
実施例 2
ローラーミル(MPV−0.5型 松本鋳造鉄工所
製)にあらかじめ、ボールミルにより微粉砕した
平均粒子径24.6ミクロンの破砕状溶融シリカ500g
を仕込み、同時に水60mlを添加した。ローラーの
押圧力20Kg/cm(線圧)、ローラーと底板とのク
リアランス3mm、底板の回転数42rpmに設定し
て、1時間処理した。得られた処理物の平均粒子
径は18.6ミクロンであり、その電子顕微鏡写真を
原料第4図(100倍)と比較して第5図(250倍)
に示したが原料シリカに比べて処理したシリカの
粒子形状はかなり丸味をおびていた。Example 2 500 g of crushed fused silica with an average particle size of 24.6 microns was pulverized by a ball mill in advance in a roller mill (MPV-0.5 type, manufactured by Matsumoto Cast Iron Works).
and 60 ml of water was added at the same time. The treatment was carried out for 1 hour at a roller pressing force of 20 kg/cm (linear pressure), a clearance between the roller and the bottom plate of 3 mm, and a rotation speed of the bottom plate of 42 rpm. The average particle diameter of the obtained treated product was 18.6 microns, and the electron micrographs were compared with the raw materials in Figure 4 (100x) and Figure 5 (250x).
As shown in Figure 2, the particle shape of the treated silica was considerably rounder than that of the raw silica.
実施例 3
水60mlにかえて50%エタノール水溶液60mlを用
いた以外、全く実施例1と同様の処理を行つた結
果、得られた処理物の平均粒子径は19.7ミクロン
であり、そのその電子顕微鏡写真は第3図と同様
に、原料に比べて処理品はかなり丸味を帯びてい
た。Example 3 The same treatment as in Example 1 was carried out except that 60 ml of 50% ethanol aqueous solution was used instead of 60 ml of water. As shown in Figure 3, the photograph shows that the treated product was considerably rounder than the raw material.
(発明の効果)
従来微粉砕の技術分野においては、砕料に5重
量%以上の水を含むと砕料が粉砕機内に付着し、
緩衝作用により粉砕効率を著しく低下させるとさ
れていた。しかしながら、本発明においてはその
緩衝作用が予期に反して微粉末粒子の球状化に大
きな効果があることを見出した。これは、微粉末
粒子に対して0.5〜18重量%の水系媒体の存在が
微粉末の凝集した凝集粒子のふわふわした充填構
造から一次粒子の充填構造に変える作用があるた
めと思われる。(Effect of the invention) Conventionally, in the technical field of fine pulverization, it has been found that if the pulverized material contains 5% by weight or more of water, the pulverized material will adhere to the inside of the pulverizer.
It was believed that the buffering effect significantly reduced the grinding efficiency. However, in the present invention, it has been found that the buffering effect unexpectedly has a large effect on the spheroidization of fine powder particles. This seems to be because the presence of 0.5 to 18% by weight of the aqueous medium based on the fine powder particles has the effect of changing the fluffy packing structure of aggregated particles of the fine powder to the packing structure of primary particles.
本発明を実施することにより、結晶シリカ、非
結晶シリカのいずれにおいても、角のある破砕状
のシリカに丸味を帯びさせることができ、本発明
で得られるシリカを半導体素子の樹脂封止用充填
剤として用いれば、樹脂封止トランスフア成形工
程における作業性を向上させることができる。 By carrying out the present invention, it is possible to make angular and crushed silica rounded, whether it is crystalline silica or amorphous silica, and the silica obtained by the present invention can be used as a filler for resin sealing of semiconductor elements. When used as an agent, workability in the resin-sealed transfer molding process can be improved.
第1図は本発明の実施態様を示す工程図、第2
図および第3図は、実施例1の結晶シリカの処理
前、処理後の結晶の構造を示す電子顕微鏡写真、
第4図および第5図は、実施例2における溶融シ
リカの処理前、処理後の結晶の構造を示す電子顕
微鏡写真である。
Figure 1 is a process diagram showing an embodiment of the present invention, Figure 2 is a process diagram showing an embodiment of the present invention.
The figure and FIG. 3 are electron micrographs showing the crystal structure of the crystalline silica of Example 1 before and after the treatment;
4 and 5 are electron micrographs showing the crystal structure of the fused silica before and after the treatment in Example 2. FIG.
Claims (1)
外部から廻転ローラーにより押圧力を加えなが
ら、水系媒体存在下で微粉末粒子同志を体積破壊
を起こすことなく互いにこすり合わせて、角のあ
る粒子に丸味を帯びさせることを特徴とするシリ
カ微粉末粒子の製造方法。 2 水系媒体が水または水とアルコール類との混
合物である特許請求の範囲第1項記載の方法。 3 外部から廻転ローラーにより押圧力を加える
操作をローラーミルを用いて行う特許請求の範囲
第1項記載の方法。 4 得られるシリカ微粉末粒子の最大粒子径が
300ミクロン以下である特許請求の範囲第1項記
載の方法。[Scope of Claims] 1. While applying a pressing force to crystalline silica or amorphous silica fine powder particles from the outside with a rotating roller, the fine powder particles are rubbed against each other in the presence of an aqueous medium without causing volume destruction, thereby forming an angular shape. A method for producing fine silica powder particles characterized by rounding the particles. 2. The method according to claim 1, wherein the aqueous medium is water or a mixture of water and alcohol. 3. The method according to claim 1, in which the operation of applying pressing force from the outside with a rotating roller is performed using a roller mill. 4 The maximum particle size of the obtained silica fine powder particles is
The method according to claim 1, wherein the particle size is 300 microns or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11761287A JPS63282109A (en) | 1987-05-13 | 1987-05-13 | Production of silica fine powder particle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11761287A JPS63282109A (en) | 1987-05-13 | 1987-05-13 | Production of silica fine powder particle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63282109A JPS63282109A (en) | 1988-11-18 |
| JPH0460053B2 true JPH0460053B2 (en) | 1992-09-25 |
Family
ID=14716069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11761287A Granted JPS63282109A (en) | 1987-05-13 | 1987-05-13 | Production of silica fine powder particle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63282109A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750760B2 (en) * | 1988-12-21 | 1995-05-31 | 松下電工株式会社 | Resin molding material for semiconductor encapsulation |
| JPH02187055A (en) * | 1989-01-13 | 1990-07-23 | Nitto Denko Corp | Semiconductor device |
| JPH08124956A (en) * | 1995-10-06 | 1996-05-17 | Nitto Denko Corp | Semiconductor device |
-
1987
- 1987-05-13 JP JP11761287A patent/JPS63282109A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63282109A (en) | 1988-11-18 |
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