JPH0464193B2 - - Google Patents
Info
- Publication number
- JPH0464193B2 JPH0464193B2 JP4553283A JP4553283A JPH0464193B2 JP H0464193 B2 JPH0464193 B2 JP H0464193B2 JP 4553283 A JP4553283 A JP 4553283A JP 4553283 A JP4553283 A JP 4553283A JP H0464193 B2 JPH0464193 B2 JP H0464193B2
- Authority
- JP
- Japan
- Prior art keywords
- transparent conductive
- conductive film
- section
- substrate
- amorphous semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
- H10F55/255—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電気信号を光信号に変換する発光素
子部及び前記光信号を電気信号に変換するアモル
フアス半導体構成の光起電力素子部からなる光結
合装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention comprises a light emitting element section that converts an electrical signal into an optical signal, and a photovoltaic element section having an amorphous semiconductor structure that converts the optical signal into an electrical signal. This invention relates to an optical coupling device.
従来、電気信号を光信号に変換する発光素子部
及び前記光信号を電気信号に変換するアモルフア
ス半導体構成の光起電力素子部とからなる光結合
素子は、第1図に示すように構成される。
Conventionally, an optical coupling device consisting of a light emitting element section that converts an electrical signal into an optical signal and a photovoltaic element section having an amorphous semiconductor structure that converts the optical signal into an electrical signal is configured as shown in FIG. .
同図において、1はガラス等の透光性基板、2
は基板1の一主面(下面)に形成された透明導電
膜、3は透明導電膜2の下面に形成されたアモル
フアスシリコン等のアモルフアス半導体層、4は
半導体層3の下面に形成された導電性電極であ
り、透明導電膜2、半導体層3および導電性電極
4により発光素子部5が構成されており、発光素
子部5により、接続線6を介して入力された電気
信号が光信号に変換される。 In the figure, 1 is a transparent substrate such as glass, 2
3 is an amorphous semiconductor layer such as amorphous silicon formed on the lower surface of the transparent conductive film 2; 4 is an amorphous semiconductor layer formed on the lower surface of the semiconductor layer 3; The transparent conductive film 2, the semiconductor layer 3, and the conductive electrode 4 constitute a light-emitting element section 5. The light-emitting element section 5 converts an electrical signal input via the connection line 6 into an optical signal. is converted to
7は基板1の他主面(上面)に形成された透明
導電膜、8は透明導電膜7の上面に形成されたア
モルフアスシリコン等のP−I−N構造のアモル
フアス半導体層、9は半導体層8の上面に形成さ
れた導電性電極であり、透明導電膜7、半導体層
8及び導電性電極9により光起電力素子部10が
構成されている。 7 is a transparent conductive film formed on the other main surface (upper surface) of the substrate 1, 8 is an amorphous semiconductor layer of a P-I-N structure such as amorphous silicon formed on the upper surface of the transparent conductive film 7, and 9 is a semiconductor. This is a conductive electrode formed on the upper surface of the layer 8, and the transparent conductive film 7, the semiconductor layer 8, and the conductive electrode 9 constitute a photovoltaic element section 10.
そして、第1図中の実線矢印に示す基板1を介
した発光素子部5の光信号は光起電力素子部10
により電気信号に変換され、この信号が接続線1
1を介して外部に取出される。 The optical signal from the light emitting element section 5 via the substrate 1 indicated by the solid arrow in FIG. 1 is transmitted to the photovoltaic element section 10.
is converted into an electrical signal by connecting wire 1.
1 to the outside.
前記従来装置の場合、光起電力素子部10から
出力される電気信号が微弱であるため、この電気
信号をそのまま利用することができず、何らかの
信号増幅手段を装置と別個に設ける必要があり、
実用性に欠ける問題点がある。
In the case of the conventional device, since the electrical signal output from the photovoltaic element section 10 is weak, this electrical signal cannot be used as it is, and it is necessary to provide some kind of signal amplification means separately from the device.
There are problems with its lack of practicality.
本発明は、前記の点に留意してなされたもので
あり、新規で実用的な光結合装置を提供すること
を目的とする。 The present invention has been made with the above points in mind, and an object of the present invention is to provide a novel and practical optical coupling device.
前記の目的を達成するために、本発明の光結合
装置においては、透光性基板12の一主面に形成
された発光素子部16と、基板12の他主面に形
成された透明導電膜18をゲート電極とする、ア
モルフアス半導体からなる電界効果トランジスタ
部27と、透明導電膜18と電界効果トランジス
タ部27のゲート絶縁膜23との間に介挿された
膜面に平行なpin接合を有するアモルフアス半導
体からなる光起電力素子部22と、により形成す
る。
In order to achieve the above object, the optical coupling device of the present invention includes a light emitting element portion 16 formed on one main surface of the transparent substrate 12 and a transparent conductive film formed on the other main surface of the substrate 12. A field effect transistor section 27 made of an amorphous semiconductor with 18 as a gate electrode, and a pin junction parallel to the film surface interposed between the transparent conductive film 18 and the gate insulating film 23 of the field effect transistor section 27. A photovoltaic element portion 22 made of an amorphous semiconductor is formed.
前記のように構成された本発明の光結合装置に
おいては、発光素子部16の光信号が基板12を
介して光起電力素子部22に受光され、この素子
部22により電気信号に変換される。
In the optical coupling device of the present invention configured as described above, an optical signal from the light emitting element section 16 is received by the photovoltaic element section 22 via the substrate 12, and is converted into an electrical signal by this element section 22. .
さらに、この電気信号は光起電力素子部22上
に設けられた電界効果トランジスタ部27により
増幅されて装置外に出力される。 Further, this electric signal is amplified by a field effect transistor section 27 provided on the photovoltaic element section 22 and outputted to the outside of the apparatus.
1実施例について、第2図及び第3図を参照し
て説明する。
One embodiment will be described with reference to FIGS. 2 and 3.
第2図においては、12はガラス等の透光性基
板、13は基板12の一主面(下面)に形成され
た透明導電膜、14は透明導電膜13の下面に形
成されたアモルフアスシリコン等のアモルフアス
半導体層、15は半導体層14の下面に形成され
た導電性電極であり、透明導電膜13、半導体層
14及び導電性電極15により発光素子部16が
構成されている。 In FIG. 2, 12 is a transparent substrate such as glass, 13 is a transparent conductive film formed on one main surface (lower surface) of the substrate 12, and 14 is amorphous silicon formed on the lower surface of the transparent conductive film 13. The amorphous semiconductor layer 15 is a conductive electrode formed on the lower surface of the semiconductor layer 14, and the transparent conductive film 13, the semiconductor layer 14, and the conductive electrode 15 constitute a light emitting element section 16.
そして、基板12の下側に形成された発光素子
部16により、接続線17を介して外部から入力
された電気信号が光信号に変換され、この光信号
が上方に放出される。 The light emitting element section 16 formed on the lower side of the substrate 12 converts an electrical signal input from the outside via the connection line 17 into an optical signal, and this optical signal is emitted upward.
18は基板12の他主面(上面)に形成された
酸化錫あるいは酸化インジウム等の透明導電膜、
19,20,21は透明導電膜18の上面に順次
積層して形成されたアモルフアスシリコン等のP
形、I形、N形のアモルフアス半導体層(以下そ
れぞれP層、I層、N層という)であり、P層1
9、I層20、N層21により光起電力素子部2
2が構成されている。 18 is a transparent conductive film such as tin oxide or indium oxide formed on the other main surface (upper surface) of the substrate 12;
19, 20, and 21 are P of amorphous silicon, etc., which are sequentially laminated on the upper surface of the transparent conductive film 18.
These are amorphous semiconductor layers of type, I type, and N type (hereinafter referred to as P layer, I layer, and N layer, respectively), and P layer 1
9. Photovoltaic element part 2 by I layer 20 and N layer 21
2 are configured.
そして、基板12の上側に形成された光起電力
素子部22により、第2図中の実線矢印に示す基
板12を介した発光素子部16からの光信号が電
気信号に変換される。 The photovoltaic element section 22 formed on the upper side of the substrate 12 converts the optical signal from the light emitting element section 16 through the substrate 12, indicated by the solid arrow in FIG. 2, into an electrical signal.
23はN層21の上面に形成された絶縁性薄膜
構成のゲート絶縁膜、24,25はゲート絶縁膜
23の上面に形成された導電性電極、26はゲー
ト絶縁膜23及び両導電性電極24,25上に形
成されたアモルフアスシリコン等からなるN形ア
モルフアス半導体層であり、透明導電膜18、ゲ
ート絶縁膜23及び両導電性電極24,25、半
導体層26により電界効果トランジスタ部(以下
FET部という)27が構成されている。 23 is a gate insulating film having an insulating thin film structure formed on the upper surface of the N layer 21, 24 and 25 are conductive electrodes formed on the upper surface of the gate insulating film 23, and 26 is the gate insulating film 23 and both conductive electrodes 24. .
27 (referred to as an FET section) is configured.
すなわち、透明導電膜18とFET部27のゲ
ート絶縁膜23との間に膜面に平行なpin接合を
有する光起電力素子部22が介挿されている。 That is, the photovoltaic element section 22 having a pin junction parallel to the film surface is interposed between the transparent conductive film 18 and the gate insulating film 23 of the FET section 27.
そして、FET部27は透明導電膜18により
ゲートが形成されるとともに導電性電極24,2
5によりソース、ドレインが形成され、その等価
回路図は第3図に示すようになる。 The FET section 27 has a gate formed by the transparent conductive film 18 and conductive electrodes 24 and 2.
5 forms a source and a drain, the equivalent circuit diagram of which is shown in FIG.
第3図において、Gはゲート、Sはソース、D
はドレイン、DCはゲートGの直流バイアス電源
であり、第2図では省略している。 In Figure 3, G is the gate, S is the source, and D
is the drain, and DC is the DC bias power supply for the gate G, which are omitted in FIG.
そして、第3図の波形の矢印線に示す発光素子
部16からの光信号は、光起電力素子部22によ
り電気信号に変換され、この電気信号はFET部
27内で直流バイアス電源DCのバイアス電圧に
重畳されて適当に増幅される。 The optical signal from the light emitting element section 16 shown by the arrow line of the waveform in FIG. It is superimposed on the voltage and amplified appropriately.
この増幅によりFETを用いた信号増幅が行わ
れ、FET部27のソースS、ドレインDから前
記電気信号を増幅した出力が取出される。 Through this amplification, signal amplification using the FET is performed, and an output obtained by amplifying the electric signal is taken out from the source S and drain D of the FET section 27.
本発明は、以上説明したように構成されている
ため、以下に記載する効果を奏する。
Since the present invention is configured as described above, it produces the effects described below.
透光性基板12の一主面に発光素子部16を形
成し、基板12の他主面に透明導電膜18をゲー
ト電極とするアモルフアス半導体構成の電界効果
トランジスタ部27を形成し、透明導電膜18と
電界効果トランジスタ部27のゲート絶縁膜23
との間にアモルフアス半導体構成の光起電力素子
部22を介挿したため、発光素子部16の光信号
を変換した光起電力素子部22の電気信号が電界
効果トランジスタ部27により増幅されて装置外
に出力され、実用性の優れた光結合装置を容易に
提供することができる。 A light emitting element section 16 is formed on one principal surface of the transparent substrate 12, and a field effect transistor section 27 having an amorphous semiconductor structure having a transparent conductive film 18 as a gate electrode is formed on the other principal surface of the substrate 12. 18 and the gate insulating film 23 of the field effect transistor section 27
Since the photovoltaic element part 22 having an amorphous semiconductor structure is inserted between the photovoltaic element part 22 and the photovoltaic element part 22, the electric signal of the photovoltaic element part 22 that converts the optical signal of the light emitting element part 16 is amplified by the field effect transistor part 27 and is transmitted outside the device. It is possible to easily provide a highly practical optical coupling device.
また、電界効果トランジスタ部27をアモルフ
アス半導体により形成したため、このトランジス
タ部27の製作を容易に行なうことができるとと
もに、装置を立体的に容易に構成することができ
る利点もある。 Further, since the field effect transistor section 27 is formed of an amorphous semiconductor, there is an advantage that the transistor section 27 can be easily manufactured and the device can be easily constructed three-dimensionally.
第1図は従来の光結合装置の正面図、第2図は
本発明の光結合装置の1実施例の正面図、第3図
は第2図の等価回路図である。
12……透光性基板、16……発光素子部、1
8……透明導電膜、22……光起電力素子部、2
3……ゲート絶縁膜、27……電界効果トランジ
スタ部。
FIG. 1 is a front view of a conventional optical coupling device, FIG. 2 is a front view of one embodiment of the optical coupling device of the present invention, and FIG. 3 is an equivalent circuit diagram of FIG. 2. 12... Transparent substrate, 16... Light emitting element section, 1
8...Transparent conductive film, 22...Photovoltaic element portion, 2
3...Gate insulating film, 27...Field effect transistor section.
Claims (1)
子部16と、 前記基板12の他主面に形成された透明導電膜
18をゲート電極とする、アモルフアス半導体か
らなる電界効果トランジスタ部27と、 上記透明導電膜18と上記電界効果トランジス
タ部27のゲート絶縁膜23との間に介挿された
膜面に平行なpin接合を有するアモルフアス半導
体からなる光起電力素子部22と、 からなることを特徴とする光結合装置。[Scope of Claims] 1. An amorphous semiconductor having a light emitting element portion 16 formed on one main surface of a transparent substrate 12 and a transparent conductive film 18 formed on the other main surface of the substrate 12 as gate electrodes. A photovoltaic element made of an amorphous semiconductor having a pin junction parallel to the film surface interposed between the transparent conductive film 18 and the gate insulating film 23 of the field effect transistor part 27. An optical coupling device comprising: a portion 22;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58045532A JPS59171181A (en) | 1983-03-17 | 1983-03-17 | Photo coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58045532A JPS59171181A (en) | 1983-03-17 | 1983-03-17 | Photo coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59171181A JPS59171181A (en) | 1984-09-27 |
| JPH0464193B2 true JPH0464193B2 (en) | 1992-10-14 |
Family
ID=12722005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58045532A Granted JPS59171181A (en) | 1983-03-17 | 1983-03-17 | Photo coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59171181A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4023036A4 (en) | 2019-08-30 | 2023-09-27 | TAE Technologies, Inc. | HIGH QUALITY ION BEAM FORMING SYSTEMS, DEVICES AND METHODS |
| US12057243B2 (en) | 2019-08-30 | 2024-08-06 | Tae Technologies, Inc. | Systems, devices, and methods for beam position monitoring and beam imaging |
| US11355303B2 (en) | 2019-09-03 | 2022-06-07 | Tae Technologies, Inc. | Systems, devices, and methods for contaminant resistant insulative structures |
| EP4162777B1 (en) | 2020-07-23 | 2024-08-21 | TAE Technologies, Inc. | Method for blisters reduction in lithium targets |
| WO2022212821A1 (en) | 2021-04-02 | 2022-10-06 | Tae Technologies, Inc. | Materials and configurations for protection of objective materials |
-
1983
- 1983-03-17 JP JP58045532A patent/JPS59171181A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59171181A (en) | 1984-09-27 |
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