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JPH0466117B2 - - Google Patents
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JPH0466117B2 - - Google Patents

Info

Publication number
JPH0466117B2
JPH0466117B2 JP60045996A JP4599685A JPH0466117B2 JP H0466117 B2 JPH0466117 B2 JP H0466117B2 JP 60045996 A JP60045996 A JP 60045996A JP 4599685 A JP4599685 A JP 4599685A JP H0466117 B2 JPH0466117 B2 JP H0466117B2
Authority
JP
Japan
Prior art keywords
prepreg sheet
ultraviolet curable
epoxy resin
resin composition
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60045996A
Other languages
Japanese (ja)
Other versions
JPS61206292A (en
Inventor
Ikuzo Usami
Sakae Amamya
Keiji Kamimura
Hiroyuki Mikuni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ThreeBond Co Ltd
Original Assignee
ThreeBond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ThreeBond Co Ltd filed Critical ThreeBond Co Ltd
Priority to JP60045996A priority Critical patent/JPS61206292A/en
Publication of JPS61206292A publication Critical patent/JPS61206292A/en
Publication of JPH0466117B2 publication Critical patent/JPH0466117B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding

Landscapes

  • Moulding By Coating Moulds (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Reinforced Plastic Materials (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は家屋、自動車等におけるラジオ、テレ
ビジヨン等の各種民生機器或いはその他の電気装
置における立体配線基板の製造方法に関する。 〔従来の技術及びその問題点〕 上記民生機器においては一般に剛体よりなる配
線基板上に電気配線を設けているが、基板が剛体
であるのでその配置場所が制約されると共に固定
が困難となり、不便であつた。また、その基板の
固定に接着剤等を用いるとその硬化に時間を要
し、設備が高価になると共に作業性が悪く、中小
規模の量産では不都合であつた。 〔問題点を解決するための手段〕 本発明はかかる問題を解決するもので、紫外線
硬化型樹脂のプリプレグシートを用いることによ
り、上記欠点を除去すると共に自動車の車体等の
曲面或いは筒の内部等にも容易に設置することの
できる立体配線基板を提供するものである。 本発明は紫外線硬化型樹脂組成物により未硬化
のプリプレグシートを構成すると共にこの未硬化
の状態のプリプレグシート上にミシン掛けによつ
て形成した電気配線を設け、次にこのプリプレグ
シートを所要の立体形状に折曲し、このプリプレ
グシートに紫外線を照射し、このプリプレグシー
トを硬化せしめて立体配線基板を製造するもので
ある。 なお、本発明においてプリプレグシートとは必
ずしも含浸とは限らずチヨツプドストランド入り
シートコンパウンド等のものも含むものとする。
このチヨツプドストランド入りシートコンパウン
ドは例えば紫外線硬化型樹脂を被着した2枚の樹
脂フイルム間にチヨツプドストランドを介在させ
てプレスしシート状にしたもの(この場合チヨツ
プドストランドはマツト状にしたもので良い)、
或いはチヨツプドストランドと紫外線硬化型樹脂
とを混練したものを樹脂フイルム上に押し出しシ
ート状にしたもの等何れのものでも良い。 なお、実施例ではこのプリプレグシートはエポ
キシ樹脂よりなるものを用いているが、不飽和ポ
リエステル等他の樹脂よりなるプリプレグシート
を用いるようにしてもよい。また電気配線プリン
ト或いはミシン掛け等により形成しているが、そ
の他の手段例えば接着、トレーシング等により設
けてもよい。 前述の紫外線硬化型樹脂組成物としてはエポキ
シ樹脂の外に光重合性基を有する化合物、例えば
アクリロイル基、メタクリロイル基、アクリルア
ミド基、マレイン酸ジエステル基、アリル基、ビ
ニルエーテル基、ビニルアミノ基、グリシジル
基、アセチレン性不飽和基等を有する化合物が挙
げられる。 〔作用〕 上記紫外線硬化型樹脂組成物よりなるプリプレ
グシートは一旦紫外線を照射したならば1分以内
の短時間に硬化するので、作業性がよく、自動製
造ラインに組込むことができ、量産に適すると共
に設備費を安価にすむものである。 また、上記プリプレグシートよりなる配線基板
は自動車の車体等の曲面状或いは筒・支柱の内部
等にも容易に設置しうるものである。 〔実施例〕 第1図示のような上記紫外線硬化型エポキシ樹
脂組成物1はエポキシ樹脂2、エポキシ樹脂3、
有機硅素化合物4を100℃の状態で混合し、これ
に光硬化触媒5を加えて100℃の状態で混合した
ものである。 上記樹脂2,3、化合物4及び触媒5の材質及
び混合比は以下の通りである。 紫外線硬化型エポキシ樹脂組成物1 ・ 樹脂2:エピコート828 12重量部 (油化シエルエポキシ(株).ビスフエノールA型エ
ポキシ樹脂) ・ 樹脂3:エピコート1001 48重量部 (油化シエルエポキシ(株).ビスフエノールA型エ
ポキシ樹脂) ・化合物4:KBM202 2重量部 (信越化学工業.ジフエニルジメトキシシラン) ・光硬化触媒5:UVE−1014 0.6重量部 (ジエネラルエレクトリツク社.トリアリールス
ルホニウム塩のプロピレンカーボネート50%溶
液) 上記紫外線硬化型エポキシ樹脂組成物1をプリ
プレグシート6にするためにはこれを第2図示の
ように紫外線のない室内において含浸槽10内に
入れ、この含浸槽10を加熱装置11により約
100℃に加熱しつつロービング・クロス等の紫外
線を透過する材料よりなる基材12を含浸槽10
内に送り、次にその含浸した基材12の裏面に離
型紙13を当てつつ送つてコイル状に巻取つて製
品としたものである。 上記基材12の材料としては以下のものが挙げ
られる。 ガラス繊維(種々の加工形態があり、例えば
単繊維マツトとしてサーフエスマツト、長繊維マ
ツトとしてストランド)、有機繊維(線状ポリ
エステルなどの合成繊維、合成繊維の不織布)等
が用いられる。 上記プリプレグシートはその表面が乾燥状態の
パサパサ状或いは粘着状態のベトベト状或いはそ
の中間状態等任意の状態のものでよい。 第4図イ示のように上記のプリプレグシート6
はミシン30により、ロ示のような導線31を下
糸として上糸32により縫着する。この上糸32
も導線としてもよい。 第3図ハ示のようにこの
プリント基板21に抵抗22、コンデンサ23或
いはIC24を固定してもよい。 次にプリプレグシート6を第4図イ示のように
L形、ロ示のように蛇行状、ハ示のように台形
状、第4図ニ示のようにかまぼこ状に折曲し、第
4図イ示のようにそのプリプレグシート6に紫外
線25を照射する。これによつてプリプレグシー
ト6は一分以内の短時間で硬化し、任意の立体形
状のプリント配線基板が得られるものである。 第5図示のようにその導線31を縫着した面に
同様の紫外線硬化型樹脂組成物よりなる保護カバ
ー33を接着して導線31を封入してもよい。 かくして第6図示のようにプリプレグシート6
を所要の立体形状に折曲し、紫外線34を照射す
るとプリプレグシート6は一分以内の短時間で硬
化し、所要形状のプリント配線基板が得られるも
のである。この場合プリプレグシートをコイル状
に折曲すれば電気コイルをうることができる。ま
たアンテナのフイーダーのような長い配線にも好
適である。 実施例1 (ミシン縫込み) 紫外線硬化型エポキシ樹脂組成物1 ・ 樹脂2:エピコート828 12重量部 (油化シエルエポキシ(株).ビスフエノールA型エ
ポキシ樹脂) ・ 樹脂3:エピコート1001 48重量部 (油化シエルエポキシ(株).ビスフエノールA型エ
ポキシ樹脂) ・ 樹脂4:KBM202 2重量部 (信越化学工業.ジフエールジメトキシシラン) ・ 光硬化触媒5:UVE−1014 0.6重量部 (ジエネラルエレクトリツク社.トリアリールス
ルホニウム塩のプロピレンカーボネート50%溶
液) 基材12 WE13G104(平織ガラスクロス0.11日東紡績) 工程 プリプレグ定尺カツト(150mm×200mm) 一般家庭用ミシンの下糸のボビンに銅線
(0.1mmφ)をセツトしたものを用いて回路を縫
込む。 所定形状に変形後、紫外線照射(40mW/cm2
×30秒、ランプは出力4kWの高圧水銀灯) 完成 〔効果〕 以上のように本発明によれば一般ミシンにより
回路形成できる為、自由で任意の形状の立体形状
の配線基板をうることができるので、自動車の車
体或いは筒、支柱内部等に適用できる立体配線基
板を提供でき、またプリプレグシートに紫外線を
照射すればプリプレグシートは短時間に硬化する
ので作業性がよいと共に設備費も安く、中小規模
の量産に適するものである。
[Industrial Field of Application] The present invention relates to a method for manufacturing three-dimensional wiring boards for various consumer appliances such as radios and televisions in houses, automobiles, etc., and other electrical devices. [Prior art and its problems] In the above-mentioned consumer devices, electrical wiring is generally provided on a wiring board made of a rigid body, but since the board is a rigid body, its placement location is restricted and it is difficult to fix, making it inconvenient. It was hot. Furthermore, when an adhesive or the like is used to fix the substrate, it takes time to harden, the equipment becomes expensive, and the workability is poor, which is inconvenient for small- to medium-scale mass production. [Means for Solving the Problems] The present invention solves these problems, and by using a prepreg sheet made of ultraviolet curable resin, it eliminates the above-mentioned drawbacks and can also be used on curved surfaces such as the body of an automobile or the inside of a cylinder. The object of the present invention is to provide a three-dimensional wiring board that can be easily installed even in the 3D wiring board. In the present invention, an uncured prepreg sheet is constructed from an ultraviolet curable resin composition, electrical wiring is formed by sewing on this uncured prepreg sheet, and then this prepreg sheet is cut into a desired three-dimensional shape. A three-dimensional wiring board is produced by bending the prepreg sheet into a shape, irradiating the prepreg sheet with ultraviolet rays, and curing the prepreg sheet. In the present invention, the prepreg sheet does not necessarily have to be impregnated, but also includes sheet compounds containing chopped strands.
This chopped strand-containing sheet compound is made by pressing two resin films coated with ultraviolet curable resin with chopped strands interposed between them (in this case, chopped strands are (may be made into a matte shape),
Alternatively, any material such as a sheet formed by kneading chopped strands and an ultraviolet curable resin and extruding it onto a resin film may be used. In the examples, this prepreg sheet is made of epoxy resin, but prepreg sheets made of other resins such as unsaturated polyester may also be used. Further, although it is formed by electrical wiring printing, sewing, etc., it may be provided by other means such as adhesion, tracing, etc. The above-mentioned ultraviolet curable resin composition includes a compound having a photopolymerizable group in addition to the epoxy resin, such as an acryloyl group, a methacryloyl group, an acrylamide group, a maleic acid diester group, an allyl group, a vinyl ether group, a vinylamino group, and a glycidyl group. , a compound having an acetylenically unsaturated group, etc. [Function] Once the prepreg sheet made of the above-mentioned ultraviolet curable resin composition is irradiated with ultraviolet rays, it cures in a short time of less than 1 minute, so it has good workability and can be incorporated into an automatic production line, making it suitable for mass production. At the same time, equipment costs can be kept low. Further, the wiring board made of the prepreg sheet can be easily installed on a curved surface of an automobile body or inside a tube or support. [Example] The above-mentioned ultraviolet curable epoxy resin composition 1 as shown in the first diagram includes an epoxy resin 2, an epoxy resin 3,
Organic silicon compound 4 was mixed at 100°C, photocuring catalyst 5 was added thereto, and the mixture was mixed at 100°C. The materials and mixing ratio of the resins 2 and 3, compound 4, and catalyst 5 are as follows. Ultraviolet curable epoxy resin composition 1 - Resin 2: 12 parts by weight of Epicoat 828 (Yuka Ciel Epoxy Co., Ltd. Bisphenol A type epoxy resin) - Resin 3: 48 parts by weight of Epicoat 1001 (Yuka Ciel Epoxy Co., Ltd.) .Bisphenol A type epoxy resin) - Compound 4: 2 parts by weight of KBM202 (Shin-Etsu Chemical Co., Ltd., diphenyldimethoxysilane) - Photocuring catalyst 5: 0.6 parts by weight of UVE-1014 (General Electric Co., Ltd., triarylsulfonium salt) (propylene carbonate 50% solution) In order to make the prepreg sheet 6 from the ultraviolet curable epoxy resin composition 1, it is placed in an impregnating tank 10 in a room without ultraviolet rays as shown in the second diagram, and the impregnating tank 10 is heated. Approximately by device 11
A base material 12 made of a material that transmits ultraviolet rays, such as roving cloth, is heated to 100°C in an impregnating tank 10.
Then, the impregnated base material 12 is fed while applying a release paper 13 to the back surface thereof, and is wound into a coil to form a product. Examples of the material for the base material 12 include the following. Glass fibers (there are various processing forms; for example, surf-es mat as a single fiber mat, strand as a long fiber mat), organic fibers (synthetic fibers such as linear polyester, nonwoven fabrics of synthetic fibers), etc. are used. The surface of the prepreg sheet may be in any desired state, such as dry and dry, sticky or sticky, or an intermediate state thereof. As shown in Fig. 4A, the above prepreg sheet 6
is sewn using a sewing machine 30 with a needle thread 32 using a conductive wire 31 as shown in (b) as a lower thread. This upper thread 32
It can also be used as a conductor. As shown in FIG. 3C, a resistor 22, a capacitor 23, or an IC 24 may be fixed to this printed circuit board 21. Next, the prepreg sheet 6 is bent into an L shape as shown in FIG. As shown in the figure, the prepreg sheet 6 is irradiated with ultraviolet light 25. As a result, the prepreg sheet 6 is cured in a short time of one minute or less, and a printed wiring board of any three-dimensional shape can be obtained. As shown in FIG. 5, the conductive wire 31 may be enclosed by adhering a protective cover 33 made of a similar ultraviolet curable resin composition to the surface to which the conductive wire 31 is sewn. Thus, as shown in FIG. 6, the prepreg sheet 6
When the prepreg sheet 6 is bent into a desired three-dimensional shape and irradiated with ultraviolet rays 34, the prepreg sheet 6 is cured in a short time of one minute or less, and a printed wiring board having the desired shape is obtained. In this case, an electric coil can be obtained by bending the prepreg sheet into a coil shape. It is also suitable for long wiring such as antenna feeders. Example 1 (Sewing by sewing machine) Ultraviolet curable epoxy resin composition 1 - Resin 2: 12 parts by weight of Epicoat 828 (Yuka Ciel Epoxy Co., Ltd. Bisphenol A type epoxy resin) - Resin 3: 48 parts by weight of Epicoat 1001 (Yuka Ciel Epoxy Co., Ltd. Bisphenol A type epoxy resin) Resin 4: 2 parts by weight of KBM202 (Shin-Etsu Chemical Co., Ltd. Diphel dimethoxysilane) Photo-curing catalyst 5: 0.6 parts by weight of UVE-1014 (General Electric Co., Ltd.) Tsuku Co., Ltd. 50% propylene carbonate solution of triarylsulfonium salt) Base material 12 WE13G104 (plain weave glass cloth 0.11 Nitto Boseki) Process Prepreg fixed length cut (150 mm x 200 mm) Copper wire (0.1 Sew the circuit using a set of mmφ). After deforming into the specified shape, UV irradiation (40mW/cm 2
x 30 seconds, the lamp is a high-pressure mercury lamp with an output of 4 kW) Completion [Effect] As described above, according to the present invention, circuits can be formed using a general sewing machine, so a three-dimensional wiring board of any shape can be obtained. , we can provide three-dimensional wiring boards that can be applied to car bodies, cylinders, and the inside of pillars, etc. Also, if the prepreg sheet is irradiated with ultraviolet rays, the prepreg sheet will harden in a short time, so it is easy to work and has low equipment costs, making it suitable for small and medium-sized It is suitable for mass production.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明における紫外線硬化型樹脂組成
物の製造方法の説明図、第2図はそのプリプレグ
シートの製造方法の説明図、第3図イ,ロ,ハ,
ニは本発明方法の実施例の説明図、第4図イ,
ロ、第5図イ,ロ、第6図は本発明の他の実施例
の説明図である。 6……プリプレグシート、20……導電イン
ク、21……プリント基板、30……ミシン、3
1……導線、25,34……紫外線。
Fig. 1 is an explanatory diagram of the method for producing the ultraviolet curable resin composition in the present invention, Fig. 2 is an explanatory diagram of the method for producing the prepreg sheet, and Fig. 3 is a, b, c,
D is an explanatory diagram of an embodiment of the method of the present invention, FIG.
B, FIG. 5 A, B, and FIG. 6 are explanatory diagrams of other embodiments of the present invention. 6... prepreg sheet, 20... conductive ink, 21... printed circuit board, 30... sewing machine, 3
1... Conductor wire, 25, 34... Ultraviolet light.

Claims (1)

【特許請求の範囲】[Claims] 1 紫外線硬化型樹脂組成物より未硬化のプリプ
レグシートを構成し、このプリプレグシート上に
ミシン掛けによつて形成した電気配線を設け、次
にこのプリプレグシートを所要の立体形状に折曲
してそれに紫外線を照射し、このプリプレグシー
トを硬化せしめてなる立体配線基板の製造方法。
1. Construct an uncured prepreg sheet from an ultraviolet curable resin composition, provide electrical wiring formed by sewing on this prepreg sheet, then bend this prepreg sheet into a required three-dimensional shape and A method for manufacturing a three-dimensional wiring board by curing this prepreg sheet by irradiating it with ultraviolet rays.
JP60045996A 1985-03-08 1985-03-08 Manufacture of three-dimensional wiring board Granted JPS61206292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60045996A JPS61206292A (en) 1985-03-08 1985-03-08 Manufacture of three-dimensional wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60045996A JPS61206292A (en) 1985-03-08 1985-03-08 Manufacture of three-dimensional wiring board

Publications (2)

Publication Number Publication Date
JPS61206292A JPS61206292A (en) 1986-09-12
JPH0466117B2 true JPH0466117B2 (en) 1992-10-22

Family

ID=12734716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60045996A Granted JPS61206292A (en) 1985-03-08 1985-03-08 Manufacture of three-dimensional wiring board

Country Status (1)

Country Link
JP (1) JPS61206292A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007058096A1 (en) * 2005-11-18 2009-04-30 日本電気株式会社 Mounting board and electronic equipment

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217500A (en) * 2001-01-16 2002-08-02 Alps Electric Co Ltd Flexible wiring board
JP2002252432A (en) * 2001-02-22 2002-09-06 Alps Electric Co Ltd Flexible wiring board
JP2008010730A (en) * 2006-06-30 2008-01-17 Hitachi Aic Inc Substrate
JP5534557B2 (en) * 2010-03-11 2014-07-02 三菱レイヨン株式会社 Manufacturing method of molded body
CN105027687B (en) * 2014-01-02 2017-03-08 皇家飞利浦有限公司 Method for manufacturing non-plane printed circuit board assembly
JP6794091B2 (en) * 2014-12-12 2020-12-02 凸版印刷株式会社 Wiring printed matter manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56108291A (en) * 1980-01-31 1981-08-27 Asahi Purinto Kogyo Kk Printed circuit board by ultraviolet ray machining
JPS57184287A (en) * 1981-05-08 1982-11-12 Matsushita Electric Works Ltd Curved surface machining and forming product with electric circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007058096A1 (en) * 2005-11-18 2009-04-30 日本電気株式会社 Mounting board and electronic equipment

Also Published As

Publication number Publication date
JPS61206292A (en) 1986-09-12

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