JPH0467340B2 - - Google Patents
Info
- Publication number
- JPH0467340B2 JPH0467340B2 JP58246202A JP24620283A JPH0467340B2 JP H0467340 B2 JPH0467340 B2 JP H0467340B2 JP 58246202 A JP58246202 A JP 58246202A JP 24620283 A JP24620283 A JP 24620283A JP H0467340 B2 JPH0467340 B2 JP H0467340B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- brazing
- lead terminals
- brazing filler
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、集積回路用セラミツクパツケージの
リード端子に用いるろう材付帯材に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a brazing filler metal supplement used for lead terminals of ceramic packages for integrated circuits.
従来、集積回路用セラミツクパツケージに於い
て、リード端子を取付ける場合、第１図ａに示す
如くFe−Ni42％又はFe−Ni29％−Co17％等より
成るリード端子用帯材１に予めAgろう（例えば
Ag−Cu28％）２をインレイ嵌合により接合した
帯材３を第１図ｂに示す如くプレス加工にて打抜
いて多数のリード端子４を配列形成し、これを切
断して第１図ｃに示す如く予めセラミツクス５上
に形成されたメタライズ層６の上にろう接する方
法が一般に多く採用されている。 Conventionally, when attaching lead terminals to ceramic packages for integrated circuits, Ag brazing ( for example
A strip material 3 made of Ag-Cu28%) 2 joined by inlay fitting is punched out by press working as shown in Fig. 1b to form a large number of lead terminals 4 in an array, and this is cut to form an array of lead terminals 4 as shown in Fig. 1c. As shown in FIG. 2, a method of soldering onto a metallized layer 6 previously formed on ceramics 5 is generally adopted.
この場合、リード端子４の断面は第１図ｃに示
されるようにAgろう２の存在した分だけ薄肉と
なつている為、ろう接によりAgろう２が溶融し
た際、外部からの力によつて第２図に示す如くリ
ード端子４が傾むくという欠点があつた。 In this case, the cross section of the lead terminal 4 is thinner due to the presence of the Ag solder 2, as shown in Figure 1c, so when the Ag solder 2 is melted during soldering, it is affected by external force. However, as shown in FIG. 2, there was a drawback that the lead terminals 4 were tilted.
リード端子４がろう接の際に動くことは、リー
ド端子４の位置ずれの原因となり、致命的な欠陥
となり易く、パツケージ製造の歩留りを低下させ
る大きな要因となつていた。 Movement of the lead terminal 4 during soldering causes positional deviation of the lead terminal 4, which is likely to cause a fatal defect, and has been a major factor in reducing the yield of package manufacturing.
本発明は斯かる問題を解消すべくなされたもの
で、リード端子がろう接の際、移動が少なくなる
ようにし、しかも少量のろう材で充分強固なろう
接が達成できるようにしたリード端子用ろう材付
帯材を提供せんとするものである。 The present invention has been made in order to solve such problems, and is a lead terminal that reduces the movement of the lead terminal during soldering, and also allows a sufficiently strong soldering to be achieved with a small amount of brazing material. The purpose is to provide brazing filler metals.
本発明のリード端子用ろう材付帯材は、外周に
Ag−Cu合金又はIn，Sn，Mn，Ni，Bi等を添加
したAg−Cu合金のろう材が配され内側に前記ろ
う材より融点の高いNi，Fe，Co，Ｗ，Mo，Ti
又はこれらの元素を主成分とする合金の芯材が配
されて成る複合ろう材が、Fe−Ni合金又はFe−
Ni−Co合金のリード端子用帯材の片側表面にイ
ンレイ接合にて設けられていることを特徴とする
ものである。 The brazing filler material for lead terminals of the present invention has a
A brazing filler metal made of Ag-Cu alloy or Ag-Cu alloy added with In, Sn, Mn, Ni, Bi, etc. is placed inside, and Ni, Fe, Co, W, Mo, Ti, which has a higher melting point than the brazing filler metal, is placed inside.
Or, a composite brazing filler metal with a core material of an alloy containing these elements as a main component may be a Fe-Ni alloy or a Fe-Ni alloy.
It is characterized in that it is provided by inlay bonding on one surface of a lead terminal strip made of Ni--Co alloy.
このように本発明のリード端子用ろう材付帯材
は、ろう材の内部にろう材が溶融しても溶融せ
ず、ろう材の特性を損なわない芯材を配した複合
ろう材を、帯材の片側表面にインレイ接合にて設
けたものであるから、このろう材付帯材から得ら
れるリード端子は、ろう接によりろう材が溶融し
た際、外部から一定の力が加わつても位置ずれや
傾き等の移動が殆んど生じないものである。 In this way, the brazing material for lead terminals of the present invention is made of a composite brazing material that has a core material inside the brazing material that does not melt even if the brazing material melts and does not impair the characteristics of the brazing material. The lead terminal obtained from this brazing material will not shift or tilt even if a certain external force is applied when the brazing material is melted during soldering. This means that almost no movement occurs.
以下本発明によるリード端子用ろう材付帯材の
実施例を図によつて説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the brazing filler material for lead terminals according to the present invention will be described below with reference to the drawings.
第３図ａに示す如く外周にAg−Cu28％合金の
ろう材１０が配され、内側にFe−Ni42％合金の
芯材１１が配された複合ろう材１２（ろう材１０
の外径1.0mm、芯材１１の外径0.75mm）を作り、
次にこれを圧延加工して第３図ｂに示す如く幅２
mm、厚さ１mmのテープ状複合ろう材１２′を作り、
次いでこのテープ状複合ろう材１２′を第３図ｃ
に示す如く幅25mm、厚さ0.3mmのFe−Ni42％合金
のリード端子用帯材１３に熱間ロール接合法によ
りインレイ接合して、リード端子用ろう材付帯材
１４を得た。この時のテープ状複合ろう材１２′
に於ける内側の芯材１１の最大部の厚さは84μm
あつた。然してこのリード端子用ろう材付帯材１
４をプレス加工にて打抜いて第３図ｄに示す如き
リード端子１５を作り、このリード端子１５を多
数第３図ｅに示す如く予めセラミツクス５上に形
成されたメタライズ層６の上に820℃水素雰囲気
中にてろう付けした処、該リード端子１５は全て
セラミツクパツケージの正しい位置にろう付けさ
れていて、従来のリード端子のように位置ずれ、
傾き等の移動は全く見られなかつた。 As shown in FIG. 3a, a composite brazing filler metal 12 (brazing filler metal 10
The outer diameter of the core material 11 is 1.0 mm, the outer diameter of the core material 11 is 0.75 mm,
Next, this is rolled to give a width of 2 as shown in Figure 3b.
Make a tape-shaped composite brazing material 12' with a thickness of 1 mm and a thickness of 1 mm.
Next, this tape-shaped composite brazing material 12' is shown in FIG. 3c.
As shown in the figure, the lead terminal strip material 13 made of a 42% Fe-Ni alloy having a width of 25 mm and a thickness of 0.3 mm was inlay-bonded by hot roll bonding to obtain a brazing filler material 14 for a lead terminal. At this time, tape-shaped composite brazing material 12'
The maximum thickness of the inner core material 11 is 84 μm.
It was hot. However, this brazing filler material 1 for lead terminals
4 is punched out using a press to form lead terminals 15 as shown in FIG. 3 d, and a large number of these lead terminals 15 are placed on the metallized layer 6 previously formed on the ceramic 5 as shown in FIG. 3 e. When brazed in a ℃ hydrogen atmosphere, all the lead terminals 15 were brazed in the correct positions on the ceramic package, and they did not shift in position like conventional lead terminals.
No movement such as tilt was observed at all.
またそのろう付け部断面を顕微鏡にて観察した
処、テープ状複合ろう材１２′の内側のFe−Ni42
％合金の芯材１１の最大部の厚さは83μmになつ
ており、その形状は第４図に示すような略楕円の
断面形状であつた。このFe−Ni42％合金の芯材
１１は、Ag−Cu28％合金のろう材１０の溶融温
度では溶融せず、またAg及びCu中へのFe，Niの
拡散量が極めて少ない為、ろう材１０を変質させ
ることなく、ろう接が極めてスムースに行われて
いることが判る。 In addition, when the cross section of the brazed part was observed under a microscope, it was found that the Fe-Ni42 inside the tape-shaped composite brazing material 12'
% alloy core material 11 had a maximum thickness of 83 .mu.m, and had a substantially elliptical cross-sectional shape as shown in FIG. This Fe-Ni 42% alloy core material 11 does not melt at the melting temperature of the Ag-Cu 28% alloy brazing material 10, and the amount of diffusion of Fe and Ni into Ag and Cu is extremely small. It can be seen that the soldering is carried out extremely smoothly without deteriorating the quality of the material.
尚、本実施例で示したリード端子１５の各部分
の寸法は、従来のものと全く同じであり、従つて
複合ろう材１２′の内部にFe−Ni42％合金の芯材
１１を設けた分だけAg−Cu28％合金のろう材の
使用量は少なくなつているが、ろう接強度は変ら
ず、従来のリード端子の接合でも本実施例のリー
ド端子の接合でも、引張試験による接合強度はリ
ード端子の拡張力以上の値を示し、十分満足でき
るものであつた。 The dimensions of each part of the lead terminal 15 shown in this embodiment are exactly the same as those of the conventional one, and therefore, the core material 11 of 42% Fe-Ni alloy is provided inside the composite brazing filler metal 12'. Although the amount of Ag-Cu 28% alloy brazing material used has decreased, the brazing strength remains the same, and the tensile test results show that the joint strength of both the conventional lead terminal and the lead terminal of this example is the same as that of the lead. The expansion force was higher than that of the terminal, and was fully satisfactory.
以上の説明で判るように本発明のリード端子用
ろう材付帯材は、ろう材中に芯材を挿入した複合
ろう材をリード端子用帯材の表面に設けたもので
あるから、これから得られたリード端子は、ろう
接によりろう材が溶融した際、外部から一定の力
が加わつても位置ずれや傾き等の移動を防止で
き、またろう材の主成分である高価なAgを節約
でき、しかも少量のろう材で充分強固なろう接が
達成できる等の優れた効果がある。 As can be seen from the above explanation, the brazing material for lead terminals of the present invention is obtained by providing a composite brazing material in which a core material is inserted into the brazing material on the surface of the strip material for lead terminals. These lead terminals can prevent misalignment, tilting, and other movements even when a certain external force is applied when the filler metal melts during soldering, and can save expensive Ag, which is the main component of the filler metal. Furthermore, it has excellent effects such as being able to achieve sufficiently strong soldering with a small amount of brazing material.
第１図ａ乃至ｃはセラミツクパツケージにリー
ド端子を製作して取付ける工程を示す図、第２図
はリード端子の取付け不良状態を示す拡大断面
図、第３図ａ乃至ｅは本発明のリード端子用ろう
材付帯材の製作からリード端子をセラミツクパツ
ケージに取付ける迄の工程を示す図、第４図は第
３図ｅに示されるリード端子の取付け状態を示す
拡大断面図である。
５……セラミツクス、６……メタライズ層、１
０……ろう材、１１……芯材、１２……複合ろう
材、１２′……テープ状複合ろう材、１３……リ
ード端子用帯材、１４……リード端子用ろう材付
帯材、１５……リード端子。
1A to 1C are views showing the process of manufacturing and attaching a lead terminal to a ceramic package, FIG. 2 is an enlarged cross-sectional view showing a lead terminal that is improperly attached, and FIGS. 3A to 3E are views showing the lead terminal of the present invention. FIG. 4 is an enlarged cross-sectional view showing the state in which the lead terminal shown in FIG. 3e is attached. 5... Ceramics, 6... Metallized layer, 1
0... Brazing material, 11... Core material, 12... Composite brazing material, 12'... Tape-shaped composite brazing material, 13... Band material for lead terminals, 14... Brazing material banding material for lead terminals, 15 ...Lead terminal.
Claims (1)
Bi等を添加したAg−Cu合金のろう材が配され、
内側に前記ろう材より融点の高いNi，Fe，Co，
Ｗ，Mo，Ti又はこれらの元素を主成分とする合
金の芯材が配されて成る複合ろう材が、Fe−Ni
合金又はFe−Ni−Co合金のリード端子用帯材の
片側表面にインレイ接合にて設けられていること
を特徴とするリード端子用ろう材付帯材。1 Ag-Cu alloy or In, Sn, Mn, Ni,
A brazing filler metal of Ag-Cu alloy added with Bi etc. is arranged,
The inside contains Ni, Fe, Co, which has a higher melting point than the brazing filler metal.
A composite brazing filler metal with a core material of W, Mo, Ti, or an alloy containing these elements as main components is Fe-Ni.
A brazing filler material for lead terminals, characterized in that it is provided by inlay bonding on one surface of a strip material for lead terminals made of alloy or Fe-Ni-Co alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58246202A JPS60138991A (en) | 1983-12-27 | 1983-12-27 | Sodering material bonding band blank for lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58246202A JPS60138991A (en) | 1983-12-27 | 1983-12-27 | Sodering material bonding band blank for lead terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60138991A JPS60138991A (en) | 1985-07-23 |
| JPH0467340B2 true JPH0467340B2 (en) | 1992-10-28 |
Family
ID=17145029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58246202A Granted JPS60138991A (en) | 1983-12-27 | 1983-12-27 | Sodering material bonding band blank for lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60138991A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62199041A (en) * | 1986-02-27 | 1987-09-02 | Tanaka Kikinzoku Kogyo Kk | Manufacture of lead fame with silver brazing |
| JP2670098B2 (en) * | 1988-08-09 | 1997-10-29 | 田中貴金属工業株式会社 | Brazed lead frame |
| JPH04100910U (en) * | 1991-02-05 | 1992-09-01 | 株式会社日本クライメイトシステムズ | Automotive air conditioner |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH025542Y2 (en) * | 1980-12-12 | 1990-02-09 |
-
1983
- 1983-12-27 JP JP58246202A patent/JPS60138991A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60138991A (en) | 1985-07-23 |
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