JPH0468068B2 - - Google Patents
Info
- Publication number
- JPH0468068B2 JPH0468068B2 JP6187488A JP6187488A JPH0468068B2 JP H0468068 B2 JPH0468068 B2 JP H0468068B2 JP 6187488 A JP6187488 A JP 6187488A JP 6187488 A JP6187488 A JP 6187488A JP H0468068 B2 JPH0468068 B2 JP H0468068B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- powder
- mold powder
- dissolution rate
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000843 powder Substances 0.000 claims description 31
- 238000009749 continuous casting Methods 0.000 claims description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Substances [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910021538 borax Inorganic materials 0.000 claims description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- 239000004328 sodium tetraborate Substances 0.000 claims description 4
- 235000010339 sodium tetraborate Nutrition 0.000 claims description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 3
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims description 3
- 239000001632 sodium acetate Substances 0.000 claims description 3
- 235000017281 sodium acetate Nutrition 0.000 claims description 3
- 238000004090 dissolution Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 238000000465 moulding Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 150000003388 sodium compounds Chemical class 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Continuous Casting (AREA)
Description
〔産業上の利用分野〕
本発明は銅および銅合金、特に高温脆化しやす
い合金元素を含む銅合金の連続鋳造に用いるモー
ルドパウダーに関するものである。
〔従来の技術〕
銅および銅合金を両端開放の鋳型を用いて連続
鋳造するに当つては、溶湯金属の適正な凝固や鋳
塊と鋳型との粘着防止について配慮する必要があ
る。
そのため、従来容湯の保温、断熱、凝固し
た鋳片と鋳型間の潤滑などを目的としてモールド
パウダーが使用されている。
このモールドパウダーの使用に当つては、その
溶解速度を制御する必要がある。すなわち、溶解
速度が早すぎると添加したモールドパウダーは添
加と同時に液体状態となり、溶湯の保温効果が著
しく低下する。
一方、近年、連続鋳造の高速化に伴い、連続鋳
造用モールドパウダーには、非常に低粘度のもの
が要求されている。一般に粘度はモールドパウダ
ーの融点が低いほど低下する。したがつて、高速
連続鋳造用モールドパウダーは、一般に低融点の
ものが使用される。ところが、モールドパウダー
の融点を下げると溶解速度が大きくなり、このよ
うなモールドパウダーを鋳型内へ添加すると添加
と同時に液体状態となり、保温効果が著しく低下
する。
そこで、高速連続鋳造用には、低融点でありな
がら、溶解速度は遅いという矛盾した性質をもつ
たモールドパウダーが必要となる。
モールドパウダーの溶解速度を遅らせる手法と
しては、モールドパウダーに炭素粉末を添加する
ことが公知である。この手法は、モールドパウダ
ーへ添加した炭素粉末が、溶湯からモールドパウ
ダーへの熱伝達を遅らせる作用を利用したもので
ある。
そして、モールドパウダーが鋳型内へ添加され
ると、モールドパウダーの温度を上げるための熱
源は溶湯のみであるから、溶湯からモールドパウ
ダーへの熱伝達を遅らせる以外にはモールドパウ
ダーの溶解速度を遅らせることは不可能であると
考えられてきた。
〔発明が解決しようとする課題〕
本発明は、銅および銅合金の連続鋳造時に用い
るモールドパウダーにおいて、従来溶解速度がは
やいと考えられていた融点が低いものでも、溶解
速度の遅い材料を得ようとするものである。又、
炭素を添加するものは溶湯を汚染する恐れがある
が、そのような恐れのない材料を得ようとするも
のである。
〔課題を解決するための手段〕
本発明は、従来、モールドパウダーの融点が低
ければ溶解速度が速いと考えられていたところ
を、融点が低いモールドパウダーでも、熱の一部
を吸熱反応によつて吸熱反応熱に変換させ、かつ
生成した気体をモールドパウダー層から大気中へ
飛散させることによつて熱を逃し、これによつて
モールドパウダーの溶解速度を遅らせることがで
きることを知見してなされたものである。
すなわち、本発明はほう砂、無水ほう酸の１種
以上を10〜95重量％、ナトリウムの酢酸塩、重炭
酸塩、炭酸塩、水酸化物のうちの１種以上を５〜
90重量％よりなる銅および銅合金連続鋳造用モー
ルドパウダーである。
ほう砂、無水ほう酸は融点及び溶融状態のフラ
ツクス粘度を調整する主材料で、安価で取り扱い
が容易であり、溶湯を汚染しない物質として好適
であるが、10重量％未満では融点調整能力が低下
し、それに伴なつてフラツクスの粘度が高くなつ
て鋳塊の表面品質が劣化する。また95重量％を超
えると溶解速度の望ましい範囲を逸脱して好まし
くないので、これらほう砂、無水ほう酸の量は10
〜95重量％の範囲が良い。
又、上記ナトリウムの化合物は高温で熱分解を
引き起して凝集相と気体に分解する。例えば重炭
酸ナトリウムの場合、高温では下記反応によつて
気体を発生する。
２（NaHCO3）＝Na2O＋2CO2＋H2O
そして、この分解反応が吸熱反応であるので、
溶湯からモールドパウダーへ伝達された熱の一部
を吸熱反応熱に変換させ、かつこの吸熱反応によ
つて生成した気体をモールドパウダー層から大気
中へ逃散させることによつて熱を逃し、これによ
つてモールドパウダーの溶解速度を遅らせること
ができる。
これらの化合物の添加量が５重量％未満ではモ
ールドパウダーの溶解速度を十分に遅らせる効果
はない。又、90重量％を超えると吸熱反応が激し
くなり、モールドパウダーとして不安定な状態に
なる。
これらの化合物の代表的なものを例示すれば下
記のとおりである。
酢酸塩…酢酸ナトリウム（NaCH3CO2）
重炭酸塩…重炭酸ナトリウム（NaHCO3）
炭酸塩…炭酸ナトリウム（Na2CO3）
水酸化物…水酸化ナトリウム（NaOH）
本発明では上記必須の化合物の他に不可避化合
物が混入していても差支えない。
〔実施例〕
以下、黄銅（２種、C2680）の連続鋳造につい
て、本発明の実施例を説明する。
表１には黄銅連続鋳造用として用いるモールド
パウダーの組成並びに融点を示す。試料No.１〜５
は実施例、試料No.６、７は比較例を示す。
これらを黄銅の連続鋳造鋳型内へ添加し、その
溶解速度と鋳塊品質を表２に示す。
[Industrial Application Field] The present invention relates to a mold powder used for continuous casting of copper and copper alloys, particularly copper alloys containing alloying elements that are susceptible to high temperature embrittlement. [Prior Art] When continuously casting copper and copper alloys using a mold with both ends open, it is necessary to take into account proper solidification of the molten metal and prevention of adhesion between the ingot and the mold. For this reason, mold powder has conventionally been used for purposes such as keeping hot water warm, insulating, and providing lubrication between the solidified slab and the mold. When using this mold powder, it is necessary to control its dissolution rate. That is, if the dissolution rate is too fast, the added molding powder becomes liquid at the same time as it is added, and the heat retention effect of the molten metal is significantly reduced. On the other hand, in recent years, as continuous casting speeds have increased, mold powders for continuous casting are required to have extremely low viscosity. Generally, the lower the melting point of the mold powder, the lower the viscosity. Therefore, molding powder for high-speed continuous casting generally has a low melting point. However, lowering the melting point of the molding powder increases the dissolution rate, and when such molding powder is added into the mold, it turns into a liquid state as soon as it is added, and the heat retention effect is significantly reduced. Therefore, for high-speed continuous casting, a molding powder with contradictory properties such as a low melting point but a slow dissolution rate is required. As a method for slowing down the dissolution rate of mold powder, it is known to add carbon powder to mold powder. This method utilizes the effect of carbon powder added to mold powder that delays heat transfer from the molten metal to the mold powder. When the mold powder is added into the mold, the only heat source to raise the temperature of the mold powder is the molten metal, so the only way to slow down the melting rate of the mold powder is to slow down the heat transfer from the molten metal to the mold powder. was thought to be impossible. [Problems to be Solved by the Invention] The present invention aims to obtain a material with a slow dissolution rate even when the mold powder used in continuous casting of copper and copper alloys has a low melting point, which was conventionally thought to have a fast dissolution rate. That is. or,
Materials that add carbon may contaminate the molten metal, but the aim is to obtain a material that does not have such a risk. [Means for Solving the Problems] Conventionally, it was thought that the lower the melting point of mold powder, the faster the dissolution rate. This was done based on the discovery that the heat can be released by converting the heat into endothermic reaction heat and scattering the generated gas from the mold powder layer into the atmosphere, thereby slowing down the dissolution rate of the mold powder. It is something. That is, the present invention contains 10 to 95% by weight of one or more of borax and boric anhydride, and 5 to 95% by weight of one or more of sodium acetate, bicarbonate, carbonate, and hydroxide.
A molding powder for continuous casting of copper and copper alloys consisting of 90% by weight. Borax and boric anhydride are the main materials that adjust the melting point and flux viscosity in the molten state.They are inexpensive and easy to handle, and are suitable as substances that do not contaminate the molten metal.However, if less than 10% by weight, the ability to adjust the melting point decreases. As a result, the viscosity of the flux increases and the surface quality of the ingot deteriorates. In addition, if the amount exceeds 95% by weight, the dissolution rate will deviate from the desired range and is undesirable, so the amount of borax and boric anhydride should be 10
A range of ~95% by weight is good. In addition, the sodium compound causes thermal decomposition at high temperatures and decomposes into an aggregated phase and gas. For example, in the case of sodium bicarbonate, a gas is generated by the following reaction at high temperatures. 2(NaHCO 3 ) = Na 2 O + 2CO 2 + H 2 O And since this decomposition reaction is an endothermic reaction,
Part of the heat transferred from the molten metal to the mold powder is converted into endothermic reaction heat, and the gas generated by this endothermic reaction is released from the mold powder layer into the atmosphere, thereby releasing the heat. Therefore, the dissolution rate of the mold powder can be slowed down. If the amount of these compounds added is less than 5% by weight, there is no effect of sufficiently slowing down the dissolution rate of the mold powder. Moreover, if it exceeds 90% by weight, the endothermic reaction becomes intense and the mold powder becomes unstable. Representative examples of these compounds are as follows. Acetate...Sodium acetate (NaCH 3 CO 2 ) Bicarbonate... Sodium bicarbonate (NaHCO 3 ) Carbonate... Sodium carbonate (Na 2 CO 3 ) Hydroxide... Sodium hydroxide (NaOH) In the present invention, the above-mentioned essential compounds There is no problem even if other unavoidable compounds are mixed in. [Example] Hereinafter, an example of the present invention will be described regarding continuous casting of brass (class 2, C2680). Table 1 shows the composition and melting point of mold powder used for continuous brass casting. Sample No.1~5
indicates an example, and Samples No. 6 and 7 indicate comparative examples. These were added to a brass continuous casting mold, and the dissolution rate and ingot quality are shown in Table 2.
【表】【table】
【表】【table】
本発明のモールドパウダーは、溶湯を汚染する
ことなく、十分に溶解速度を遅らせることがで
き、形状は勿論のこと、割れとかくぼみ等の表面
欠陥のない鋳塊を連続的に製造することが可能と
なる。
The molding powder of the present invention can sufficiently slow down the melting rate without contaminating the molten metal, making it possible to continuously produce ingots with no shape or surface defects such as cracks or depressions. becomes.
Claims (1)
％、ナトリウムの酢酸塩、重炭酸塩、炭酸塩、水
酸化物のうちの１種以上を５〜90重量％よりなる
ことを特徴とする銅および銅合金連続鋳造用モー
ルドパウダー。1. It is characterized by comprising 10 to 95% by weight of one or more of borax and boric anhydride, and 5 to 90% by weight of one or more of sodium acetate, bicarbonate, carbonate, and hydroxide. Mold powder for continuous casting of copper and copper alloys.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6187488A JPH0263653A (en) | 1988-03-17 | 1988-03-17 | Mold powder for continuous casting of copper and copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6187488A JPH0263653A (en) | 1988-03-17 | 1988-03-17 | Mold powder for continuous casting of copper and copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0263653A JPH0263653A (en) | 1990-03-02 |
| JPH0468068B2 true JPH0468068B2 (en) | 1992-10-30 |
Family
ID=13183713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6187488A Granted JPH0263653A (en) | 1988-03-17 | 1988-03-17 | Mold powder for continuous casting of copper and copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263653A (en) |
-
1988
- 1988-03-17 JP JP6187488A patent/JPH0263653A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0263653A (en) | 1990-03-02 |
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