JPH0470625B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a screen plate used in rotary screen printing and the like.

(Prior art) Rotary screen printing is a printing method that uses a cylindrical nickel screen plate to print predetermined patterns on various articles such as textile products, interior and exterior wall materials, flooring, confectionery, and electronic circuit boards. It is one of a kind. In this printing method, a cylindrical nickel screen plate, generally called a nickel cylinder, is used, which consists of a mesh-like bridge part and an opening (non-bridge part) formed to surround it. This is the part for printing the design.

Conventionally, the manufacturing method for this type of screen plate involves applying a photosensitive liquid to the surface of a nickel cylinder whose entire surface is mesh-shaped, then printing an image film thereon, and then removing the coating on the unexposed areas. In addition to the Lutzker method, two other methods are known: the galvano method and the piercing etching method (see, for example, Japanese Patent Publication No. 18944/1983).

Among these methods, the galvano method uses, for example, a stainless steel mother roll (mother roll surface polishing).
→ (Photosensitive liquid coating and drying) → (Basing of image film with mesh) → (Development) → (Water washing) → (Plating process) → (Removing the mesh roll from the mother roll) The screen plate (so-called This is a method of manufacturing a galvano plate.

In addition, the piercing etching method also uses a stainless steel mother roll, (mother roll surface polishing) → (plating treatment) → (photosensitive liquid coating and drying) →
A method of manufacturing a screen plate (so-called pierced etching plate) as a product by performing the following steps: (Printing of image film with mesh) → (Development) → (Washing) → (Etching treatment) → (Removal of mesh roll from mother roll) It is. According to this piercing etching method, after forming a nickel plating layer on a stainless steel mother roll (hereinafter referred to as the stainless mother roll), only the part corresponding to the pattern is etched, so compared to the galvano method, the aperture ratio (unit: The ratio of openings per area) can be obtained, and thin lines and points can be reproduced.

(Problem to be Solved by the Invention) By the way, when printing a predetermined pattern such as a figure or pattern on a printing substrate using the above-mentioned rotary screen printing method, depending on the type of printing substrate, the amount of paint or dye applied may be increased. However, this requires the use of a screen plate with a relatively large aperture ratio and thickness.

However, when attempting to manufacture such a screen plate by the above-mentioned galvano method, when the nickel plating layer A is formed to a certain degree of thickness as shown in FIG. ₁ (so-called side bleeding phenomenon), the opening C becomes smaller, and as a result, a problem arises in that a very large aperture ratio cannot be obtained.

On the other hand, in the piercing etching method, such a problem does not occur, but on the other _hand , as shown in FIG. The thickness of the plate is limited, and as a result,
The problem is that very thick screen plates cannot be manufactured.

The present invention addresses the above-mentioned conventional situation, and aims to provide a method for manufacturing a screen plate having a relatively large thickness while ensuring a required aperture ratio.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for manufacturing a screen plate of a predetermined thickness using a meshed image film and a mother roll or mother plate made of an alloy or alloy plating. It is characterized by the following structure.

That is, as a first step, a first nickel plating layer is formed on the surface of the mother roll or mother plate.

As a second step, the surface of the first nickel plating layer is coated with a photosensitive resin solution.

In the third step, the film is printed on the surface of the coating layer, developed, and washed with water.

In the fourth step, openings are formed by etching and removing the nickel portions exposed in the exposure and development processes in the third step.

As a fifth step, a nickel chloride plating layer and a copper plating layer of a predetermined thickness are sequentially formed on the surface of the first nickel plating layer with the opening filled with a non-conductive synthetic resin. The thickness of each plating layer of nickel chloride and copper formed in this step is small compared to the thickness of the first nickel plating layer.

As a sixth step, a second layer is applied to the surface of the copper plating layer.
Forms a nickel layer. The thickness of the plating layer formed in this step is approximately the same as the thickness of the first nickel plating layer.

As a seventh step, the non-conductive synthetic resin is removed after the second nickel plating layer is formed.

As an eighth step, the plating roll or plate obtained in the seventh step is removed from the mother roll or mother plate.

(Function) According to the above structure, when the first to fourth steps are completed, the plate has the same structure as the piercing etching plate, that is, the mesh-like bridge portion adjacent to the opening is made of nickel. A nickel cylinder with a large aperture ratio can be produced, but at this point it is not yet thick enough. However, after that, the fifth and sixth steps are performed, whereby plating layers of nickel chloride, copper, and nickel are sequentially formed at predetermined thicknesses on the surface of the nickel constituting the bridge portion. . As a result, it is possible to produce a screen plate that is thicker than the conventional piercing etching plate by the thickness of each plating layer of nickel chloride, copper, and nickel.

In that case, the second nickel plating layer is not formed directly on the surface of the first nickel plating layer,
As described above, the relatively thin nickel chloride plating layer and the copper plating layer are sequentially formed, and then the second nickel plating layer is formed on the surface of the copper plating layer. It will not peel off easily. In other words, by performing the plating treatment as described above, the overall thickness can be formed without reducing the bonding properties between the respective plating layers.

In addition, each plating layer of nickel chloride, copper, and nickel is formed with the openings filled with non-conductive synthetic resin, so a screen plate with the same thickness as in this case can be used using the conventional galvano method. Compared to the case where the material is manufactured in this way, the incidence of side bleeding phenomenon is much smaller.

As a result, a screen plate having a relatively large thickness can be obtained while ensuring the required aperture ratio.

(Example) Examples of the present invention will be described below.

First, a so-called stainless steel mother roll made of stainless steel having a predetermined outer diameter is cylindrically polished, and the mother roll is degreased and neutralized.Then, as the first step, the mother roll is polished. By placing the mother roll in a nickel sulfamic acid bath and rotating it, a first nickel plating layer 2 of a predetermined thickness (for example, about 100 μm) is formed on the entire outer peripheral surface of the mother roll 1, as shown in FIG.

Next, as a second step, by spraying a photosensitive resin solution onto the surface of the first nickel plating layer 2, as shown in FIG.
A coating layer 3 made of photosensitive resin is formed on the surface.

Then, as a third step, as shown in FIG. 3, a predetermined meshed image film 4 is brought into close contact with the surface of the coating layer 3 formed in the second step.
In this state, the image film 4 is printed on the coating layer 3 by exposing it to light for a predetermined time using a metal halogen light source while rotating the mother roll 1, and when the work is completed, the image film 4 is exposed using a developer. After developing, wash with water to remove unnecessary materials. As a result, as shown in FIG. 4, the first nickel plating layer 2 is exposed on the surface side of the first nickel plating layer 2, including the portion A...A covered with the coating layer 3 made of photosensitive resin. Partial b...b can be done.

After developing and rinsing in this way, inspect for defects such as pinholes, correct the defects if any, and then apply fluorescent light for a predetermined period of time. The photosensitive resin is completely cured by exposing it to light from a chemical lamp.

Next, as a fourth step, the exposed portions of the first nickel plating layer 2 are removed by etching. This work is performed on the first nickel plating layer 2.
This is carried out by spray etching the mother roll 1 with a predetermined etching solution, and then rotating the mother roll 1 in that state until the nickel plating exposed portions are sufficiently corroded.
As a result, the outer peripheral surface of the mother roll 1 has a fifth
The first one is coated with photosensitive resin as shown in the figure.
Only the part of the nickel layer is the bridge part...
... remains as A', and the other nickel plated portions are removed, thereby forming openings R'...RO' as non-bridged parts. In this step as well, after performing the etching treatment, the unprocessed materials are sufficiently washed with water to remove unnecessary materials.

After forming the bridge portions A'...A' and the openings R'...Ro' in the cylindrical first nickel plating layer 2 along the outer circumferential surface of the mother roll in this manner, in the present invention, further steps are performed in the present invention. Perform the following steps.

That is, as a fifth step, as shown in FIG. 6, with the non-conductive synthetic resin 5 filled in the openings R'...R', the surfaces of the bridge parts A'...A' are each coated with a thickness of, for example, 5 μm. Nickel chloride plating layer with a thickness of about 6
and copper plating layer 7 are sequentially formed. In that case, first of all,
...After coating the entire surface of the first nickel plating layer 2, etc. with the synthetic resin 5 without distinguishing between B' and the like, the first nickel plating layer 2 is exposed by polishing the surface side with, for example, 400# water paper. After that, the nickel chloride plating layer 6 and the copper plating layer 7 are formed on the exposed surface of the first nickel plating layer 2. At that time, the former is carried out at room temperature using a plating solution made by mixing 20 kg of nickel chloride in a mixture of 20 parts hydrochloric acid and 100 parts water, and the latter is carried out at room temperature using, for example, 250 g of sulfuric acid per This is carried out using a plating solution containing copper and 60 g of sulfuric acid at a temperature of about 50°C.

Here, as the non-conductive synthetic resin 5, for example, an alkali-soluble resin solution (phenolic resin dissolved in a predetermined solvent) sold as OP ink by Tokyo Ohka Kogyo Co., Ltd. is used.

Next, as a sixth step, as shown in FIG.
~130μm thick) second nickel plating layer 8
form. In this case, the work is carried out using, for example, a plating solution containing 390 g of nickel sulfamate and 37 g of boric acid per plating solution, and maintaining the solution temperature at about 55°C. As a result, nickel from the lower layer side,
Nickel chloride, copper, and nickel plating layers 2,
A matte roll 9 formed by laminating layers 6, 7, and 8 is formed on the outer circumferential surface of the mother roll 1.

Furthermore, Metsuki Roll 9 formed in this way
from the mother roll 1. In that case,
As shown in FIG. 8, first, in the seventh step, unnecessary materials such as the photosensitive resin 3 and the synthetic resin filled in the openings RO'...RO' are removed by washing with, for example, caustic soda. In the process, the mother roll 1 is cooled and the mating roll 9 is extracted from the mother roll 1 by utilizing the expansion difference between the mother roll 1 and the mating roll 9. After a final check for defects such as pinholes, an end ring is attached to the mating roll to complete the screen plate as a product.

According to the above configuration, when the first to fourth steps are completed, a piece having the same configuration as the piercing etching plate, that is, a mesh-shaped bridge portion adjacent to the opening hole ``...'' ...A nickel cylinder with a comparatively large aperture ratio, where A' is made of nickel, is produced, but at this point it is not yet sufficiently thick. However, after that, the fifth
By performing the sixth step, each plating layer of the nickel chloride plating layer 6, the copper plating layer 7, and the second nickel plating layer 8 is formed on the surface of the first nickel plating layer 2 constituting the bridge portions A'...A'. are sequentially formed with a predetermined thickness. As a result, the plating layers 6, 7, 8 of nickel chloride, copper, and nickel
It is possible to produce a screen plate that is thicker than a conventional piercing etching plate by the thickness of .

In that case, the second nickel plating layer 8 is not directly formed on the surface of the first nickel plating layer 2, but the relatively thin nickel chloride plating layer 6 and the copper plating layer 7 are sequentially formed as described above. Since the second nickel plating layer 8 is formed on the surface of the copper plating layer 7, the second nickel plating layer 8 is not easily peeled off. In other words, by performing the plating process as described above,
The entire plating layer 2, 6, 7, and 8 can be formed thick without deteriorating the bonding properties between them.

Furthermore, since the plating layers 6, 7, and 8 of nickel chloride, copper, and nickel are formed with the openings R'...R' filled with nonconductive synthetic resin, they have the same thickness as in this case. Compared to the case where a screen plate having a high density is manufactured by the conventional galvano method, the side bleeding phenomenon occurs at a much lower rate. Therefore, unless the thickness of all the plating layers 6, 7, 8 formed on the first nickel plating layer 2 is considerably increased, the openings R'...R' will not be narrowed.

As a result, a screen plate having a relatively large thickness can be obtained while ensuring the required large aperture ratio.

Although this embodiment relates to the production of a roll-shaped or cylinder-shaped screen plate using the mother roll 1, it goes without saying that the present invention is not limited to the production of screen plates of such a shape. be. For example, by using a flat mother plate instead of the mother roll 1, it is also possible to manufacture a screen plate that is not roll-shaped but plate-shaped.

(Effects of the Invention) As described above, according to the present invention, a nickel cylinder having a bridge portion and an opening (non-bridge portion) is formed in advance by a method similar to the conventional piercing etching method, and then the cylinder is The opening is filled with non-conductive synthetic resin, and the plating layers of nickel chloride, copper, and nickel are formed only on the bridge part, so the opening is thick enough without narrowing it. A screen version can be manufactured.

[Brief explanation of the drawing]

Fig. 1 to Fig. 8 show examples of the present invention, Fig. 1 is a process diagram showing the state in which the first nickel plating layer is formed on the surface of the mother roll, and Fig. 2 is a process diagram showing the state in which the first nickel plating layer is formed on the surface of the mother roll. Figure 3 is a process diagram showing the state in which the coating layer has been formed. Figure 3 is a process diagram showing the state in which the meshed image film is brought into close contact with the surface of the coating layer. Figure 4 is the state of the first nickel plating layer immediately before etching. FIG. 5 is a process diagram showing the state in which an opening is formed in the first nickel plating layer by etching process, and FIG. 6 is a process diagram showing the formation of a nickel chloride layer and a copper plating layer in a bridge portion that is not an opening. Figure 7 is a process diagram showing the state in which the second nickel plating layer is formed on the surface of the copper plating layer, and Figure 8 is a process diagram showing the state in which the non-conductive synthetic resin is removed from the plated roll. be. In addition, Figures 9 and 10 show the problems of the conventional method, respectively. Figure 9 is a longitudinal cross-sectional view showing a state in which sides bleeding occurs during plating in the galvano method, and Figure 10 is a vertical cross-sectional view showing the state where side bleeding occurs during plating in the galvano method. FIG. 3 is a vertical cross-sectional view showing a state in which side etching occurs during etching in the etching method. 1... Mother roll, 2... First nickel plating layer, 3... Coating layer (photosensitive resin), 4
...Mesh-containing image film, 5...Non-conductive synthetic resin, 6...Nickel chloride plating layer, 7...
...Copper plating layer, 8...Second nickel plating layer, 9
...Metsuki roll, I'...Bridge club, B'...
Opening (non-bridge part).

Claims (1)

[Claims] 1 A method for producing a screen plate of a predetermined thickness using a meshed image film and a mother roll or mother plate made of an alloy or alloy plating, the method comprising forming a first nickel plating layer on the surface of the mother roll or mother plate. a second step of coating the surface of the first nickel plating layer with a photosensitive resin solution; a third step of baking the film on the surface of the coating layer, developing it and washing it with water; and this third step. A fourth step of forming an opening by etching and removing the nickel portion exposed in the exposure and development process, and forming the first nickel plating layer with the opening filled with a non-conductive synthetic resin. a fifth step of sequentially forming a nickel chloride plating layer and a copper plating layer of a predetermined thickness on the surface; a sixth step of forming a second nickel plating layer on the surface of the copper plating layer; and after forming the second nickel plating layer, the above steps are performed. a seventh step of removing the non-conductive synthetic resin;
8. A method for producing a screen plate, comprising: an eighth step of removing the matte roll or plate obtained in the step from the mother roll or mother plate.