JPH0474864B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tool holding mechanism used in tape bonders (inner lead bonders and outer lead bonders), pellet bonders, and the like.

[Conventional technology] Conventionally, tool holders to which tools are fixed are
It can be adjusted in the X direction horizontal to the tool holding portion of the bonder and in the Y direction horizontal perpendicular to the X direction using adjustment screws, and is fixed with a fixing screw.

Therefore, adjusting screws in the X and Y directions are used to align the lower surface of the tool with the bonding stage, and then a fixing screw is used to fix the tool holder to the tool holder.

[Problems to be Solved by the Invention] In the above-mentioned prior art, the parallelization of the tool is performed by delicate movements of the adjustment screw, so it is difficult to parallelize the tool and requires a large amount of adjustment time. In addition, the tool had no degree of freedom, and tilted samples could not be bonded well.

The purpose of the present invention is to facilitate parallel alignment of tools;
Another object of the present invention is to provide a bonder tool holding mechanism that can accommodate the inclination of the bonding surface of a sample without adjustment.

[Means for Solving the Problems] The problems of the above-mentioned conventional technology are that the tool holder to which the tool is fixed, the first leaf spring whose opposite ends are fixed to the tool holder, and the tool holding of the bonder. a second leaf spring having opposite ends fixed to the mounting body and opposite ends in a free state fixed to opposite ends in a free state of the first leaf spring; This can be solved by configuring it with a leaf spring.

[Function] Both ends of the first leaf spring in the X direction are free with respect to the second leaf spring and can be bent up and down, and both ends of the second leaf spring in the Y direction are attached to the mounting body. On the other hand, it is in a free state and can bend up and down. Therefore, when the tool descends and presses the lead part of the tape, the bonding surface of the lead part
If there is an inclination up or down in the direction, the first leaf spring is
deflect in the direction. Further, if the bonding surface of the lead portion is tilted vertically in the Y direction, the second leaf spring bends in the Y direction so that the lower surface of the tool follows the bonding surface. In this way, the X of the first leaf spring
The tool can be deflected in any direction by the vertical deflection in the Y direction and the vertical deflection in the Y direction of the second leaf spring, so the bottom surface of the tool can always follow the arbitrary inclination of the bonding surface. .

[Example] An example of the present invention will be described below with reference to FIGS. 1 to 5. The shaft portion 1a of the tool 1 is inserted into a hole 2a provided in a tool holder 2, and a presser plate 3 disposed on the side surface of the tool holder 2 is inserted into a screw 4.
It is fixed to the tool holder 2 by fixing it to the tool holder 2. Two opposing corners (both ends in the X direction) of a first leaf spring 5 are fixed to the lower surface of the tool holder 2 with screws 7 via spacers 6.

On the other hand, two opposite corners (both ends in the X direction) of the second leaf spring 11 are fixed with screws 13 via spacers 12 on the plane of the mounting body 10 fixed to a tool holding part (not shown) of the bonder. has been done. Then, the tool holder 2 is connected to the two opposite corners (both ends in the Y direction) of the second leaf spring 11 in a free state that is not fixed to the mounting body 10 with the screws 13 and the screws 7 of the first leaf spring 5. Collars 14 and 15 are arranged between two opposite corners (both ends in the Y direction) in a free state that is not fixed to the collar 1.
A spacer 16 is provided between the second leaf spring 11, the collar 14, and the spacer 1.
6, the collar 15 and the first leaf spring 5 are attached to the bolt 1
7 and a nut 18. Here, the mounting body 10, the second leaf spring 11, the spacer 1
6. Holes 10a, 11a, 16 that are sufficiently larger than the shaft portion 1a of the tool 1 are provided in the center of the first leaf spring 5.
a, 5a are provided.

Next, the effect will be explained. As mentioned above,
The first leaf spring 5 has both ends in the X direction fixed to the tool holder 2, the second leaf spring 11 has both ends in the X direction fixed to the mounting body 10, and the first leaf spring 5 has both ends in the Y direction fixed to the tool holder 2. Both ends in the free state and the second leaf spring 11
Since both ends of the first leaf spring 5 in the free state in the Y direction are fixed, both ends of the first leaf spring 5 in the X direction can bend vertically with respect to the second leaf spring 11, that is, the mounting body 10, Both ends of the second leaf spring 11 in the Y direction can be bent up and down with respect to the mounting body 10.

Now, as an example, the case of an inner lead bonder will be described. In the case of an inner lead bonder, bonding is performed by lowering the mounting body 10 and pressing the lead portion of the tape against the pellet with the tool 1. Therefore, when the tool 1 descends and presses the lead part of the tape, if the bonding surface of the lead part is tilted vertically in the Spring 5 is deflected in the X direction. Further, if the bonding surface of the lead portion is tilted vertically in the Y direction, the second leaf spring 11 is bent in the Y direction so that the lower surface of the tool 1 follows the bonding surface. In this way, the tool 1 can be bent in any direction due to the vertical deflection of the first leaf spring 5 in the X direction and the vertical deflection of the second leaf spring 11 in the Y direction. The lower surface of can always follow the arbitrary slope of the bonding surface.

FIG. 6 shows another embodiment of the present invention, in which the entire embodiment is used upside down. In the case of this embodiment, since it is not necessary to pass the shaft portion 1a of the tool 1 through the mounting body 10, the second leaf spring 11, the spacer 16, and the first leaf spring 5, the holes 10a, 11a, 1
There is no particular need to provide 6a and 5a. Even when used in this manner, the same effects as in the above embodiment can be obtained.

In addition, in each of the above embodiments, the leaf springs 5, 1
1 is illustrated in the case of a rectangular shape, but the shape may be circular. Further, the spacer 16 may not be particularly provided. Further, although the tool 1 is illustrated for use with a tape bonder, it may also be used for a pellet bonder. In this case, it goes without saying that the tool 1 is provided with a suction hole for sucking pellets, and the upper end of the tool 1 is connected to a pipe connected to a vacuum device.

[Effects of the Invention] As is clear from the above description, according to the present invention, the bonding surface of the tool follows the bonding surface of the sample, so no adjustment is necessary just by attaching the tool to the tool holder. In addition, even tilted samples can be bonded completely.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
2 is a front view, FIG. 3 is a left side view, FIG. 4 is a right side view, FIG. 5 is a plan view, and FIG. 6 is an exploded perspective view showing another embodiment of the present invention. 1: Tool, 2: Tool holder, 5: First leaf spring, 10: Mounting body, 11: Second leaf spring.

Claims (1)

[Claims] 1. A tool holder to which a tool is fixed, a first leaf spring having opposite ends fixed to the tool holder, a mounting body fixed to the tool holding part of the bonder, and both ends facing the mounting body. and a second leaf spring whose opposite ends in a free state are fixed to opposite ends in a free state of the first leaf spring, and the lower surface of the tool follows the bonding surface. A bonder tool holding mechanism that is capable of tilting.