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JPH0475868B2 - - Google Patents
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JPH0475868B2 - - Google Patents

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Publication number
JPH0475868B2
JPH0475868B2 JP62134079A JP13407987A JPH0475868B2 JP H0475868 B2 JPH0475868 B2 JP H0475868B2 JP 62134079 A JP62134079 A JP 62134079A JP 13407987 A JP13407987 A JP 13407987A JP H0475868 B2 JPH0475868 B2 JP H0475868B2
Authority
JP
Japan
Prior art keywords
weight
parts
firing
temperature
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62134079A
Other languages
Japanese (ja)
Other versions
JPS63297264A (en
Inventor
Kenichi Hoshi
Shoichi Tosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP62134079A priority Critical patent/JPS63297264A/en
Publication of JPS63297264A publication Critical patent/JPS63297264A/en
Publication of JPH0475868B2 publication Critical patent/JPH0475868B2/ja
Granted legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions

Landscapes

  • Compositions Of Oxide Ceramics (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

[産業上の利用分野] 本発明は、単層又は多層の回路基板を提供する
ことができる絶縁性磁器の製造方法に関する。 [従来の技術] 従来の絶縁性磁器(セラミツク)基板は、アル
ミナを主成分(アルミナ90重量%以上)として形
成されている。しかしアルミナ磁器基板を得る場
合には原料混合物を1500〜1600℃の高温で焼成し
なければならないため、原料混合物のグリーンシ
ートと電極材料とを同時焼成するときに使用する
ことができる電極材料はモリブデン、タングステ
ン等の高融点金属に限られ、Au、Ag、Pd、Cu、
Ni等の電気特性に優れるが、融点の低い金属は
使用できなかつた。またアルミナ磁器基板を得る
ときの焼成温度が高いために、焼成炉のコストが
必然的に高くなつた。 上述の如き問題を解決するために、アルミナ−
ガラス系の低温焼成磁器が開発された。このアル
ミナ−ガラス系の低温焼成磁器は、アルミナ粉末
とガラス粉末とを重量比で1:1程度の割合に混
合したものを焼成することによつて得る。この低
温焼成磁器は1000℃以下の焼成で得られるので、
低融点のAu、Ag、Pd、Cu、Ni等の電極材料と
同時焼成することが可能になる。 [発明が解決しようとする問題点] しかし、従来の低温焼成磁器を製造する時に、
アルミナ原料に添加するガラス粉末として、硼珪
酸ガラス、硼珪酸バリウムガラス、硼珪酸カルシ
ウムガラス、硼珪酸鉛ガラス等を使用しているた
めに、ガラス粉末の原料コストが高くなり、完成
した磁器のコスト必然的に高くなつた。これを更
に詳しく説明すると、上記いずれのガラスの場合
も、原材料を高温で溶融した後急冷し、得られた
ガラスの固まりを機械的に粉砕することにより作
られる。このようにして作られるガラス粉末は生
産性が悪く高価である。またガラス粉末の粒径
は、少なくとも10μm以下望ましくは5μm以下に
する必要がある。粉砕が不十分で粒径が粗いガラ
スを用いた場合、焼成後のセラミツクの特性、特
に強度等にいちじるしい悪影響をあたえる。この
ため、ガラスの粉砕には特に注意が必要であり、
生産性が悪い。現在、アルミナ−ガラス径の低温
焼成磁器に用いられるガラス粉末の価格は10000
円/Kg程度である。アルミナ粉末は約300円/Kg
でガラス粉末とくらべてはるかに安いので、両者
を重量比で1:1に混合したアルミナ−ガラス系
低温焼成セラミツクは原料ベースで約5000円/Kg
ということになる。この価格は電子部品用セラミ
ツク基板としてはかなり高価であり、このため低
温焼成磁器基板が広く普及するにはいたつていな
い。 そこで、本発明の目的は、低温焼成磁器のコス
トを大幅に低減させることができる製造方法を提
供することにある。 [問題点を解決するための手段] 上記問題点を解決し、上記目的を達成するため
の本願の第1番目の発明は、50〜60重量部のムラ
イトと、25〜35重量部のダンブライトと、5〜20
重量部のペタライトと、2〜8重量部のフオルス
テライトとから成る混合物を用意し、この混合物
の成形体を形成し、この成形体を焼成することを
特徴とする絶縁性磁器の製造方法に係わるもので
ある。 本願の第2番目の発明は、第1番目の発明の混
合物に更に三酸化クロムを1〜5重量部添加した
ものの成形体を形成し、これを焼成することを特
徴とするものである。 [作用] 上記発明におけるムライト(mullite)は主成
分として3Al2O3・2SiO2を含有しているので、磁
器のアルミナ成分を提供することができる。但
し、このムライトは磁器におけるアルミナ成分を
主として提供するものであるから、磁器原料混合
物におけるムライトの量を50重量部未満にする
と、強度の大きな磁器を得ることができなくな
り、反対に65重量部を超える量にすると、1000℃
以下での焼成が不可能又は困難になる。 ダンブライト(danburite)は主成分として
CaSi2B2O8を含有しているので、低温焼成を可能
にするためのガラス成分として機能する。従つ
て、このダンブライトを25重量部未満にすると、
1000℃以下での焼成が困難又は不可能になり、反
対に35重量部を超えると磁器の強度が低下する。 ペタライト(petalite)はペタル石とも呼ばれ
るものであつて、主成分としてLi2O・
Al2O38SiO2を含むものである。従つて、低温焼
成を可能にするためのガラス成分を主として提供
するものであり、これが5重量部未満になると
1000℃以下での焼成が困難になり、20重量部を超
えると磁器の絶縁抵抗が低くなる。 フオルステライト(forsterite)は主成分とし
て2MgO・SiO2を含むものであつて、磁器の強度
を高めるために寄与する。このフオルステライト
が2重量部未満になると磁器の強度が低くなり、
8重量部を超えると1000℃以下での焼成が困難又
は不可能になる。 本願の第2番目の発明における三酸化クロム
(Cr2O3)は磁器を濃緑色に着色するものである。
この三酸化クロムが1重量部未満であれば十分な
着色が不可能であり、5重量部を超えると磁器の
強度が低下する。 実施例 1 次に、本発明の実施例1(比較例も含む)につ
いて説明する。 第1表の試料No.1に示す原料組成物を得るため
に、ムライト粉末550g(55重量部)、ダンブライ
ト粉末300g(30重量部)、ペタライト粉末100g
(10重量部)、フオルステライト粉末50g(5重量
部)を秤量し、ボールミルに入れた。次に溶媒と
してアセトン300g、トリクロロエチレン200gと
分散剤としてオレイン酸15gをボールミルに加え
た後、24時間混合した。次にバインダーとしてポ
リビニルブチラール樹脂粉末80gと可塑剤として
フタル酸ジブチル80gを更にボールミルに加えた
後、12時間混合してスラリーとした。次いでこの
スラリーをドクターブレード法によつてスリツプ
キヤステイングし、乾燥することにより厚さ0.8
mmのグリーンシート(未焼結磁器シート)を得、
これを10cm角に切断した。 次に、このグリーンシートより3種類の試験片
を作つた。第1の試験片は上記グリーンシートを
直径20mmの円板形に打ち抜いたもので、絶縁抵抗
を調べるためのものである。第2の試験片は上記
グリーンシートを3枚重ねて温度90℃、圧力250
Kg/cm2の条件で熱圧着したものを、長さ40mm、幅
5mmの寸法に切断したもので、その厚さは約2.2
mmである。この第2の試験片は抵抗温度を調べる
ためのものである。 第3の試験片は、上記グリーンシートの一方の
主表面上にAg−Pdを主成分とする導電ペースト
を配線パターンとなるように印刷し、これを2枚
重ね、一番上に更に導電ペーストが印刷されてい
ないグリーンシートを1枚重ねて合計3枚とし、
これを圧着した後に、長さ3mm、幅15mmに切断し
たもので、その厚さは約2.2mmである。この第3
の試験片は低融点電極材料を同時焼成した場合の
電極形成状態を調べるためのものである。 次に、各試験片を、空気中で室温から焼成温度
である940℃まで毎時300℃割合で昇温し、940℃
を2時間維持した後、室温まで冷却することによ
り焼成した。 続いて、焼成後の各試験片について、それぞれ
次の方法で試験を行つた。 第1の試験片については、その両面に市販の
Agペーストを印刷し、空気中で800℃で焼付ける
ことにより、直径15mmの電極を形成し、DC100V
で絶縁抵抗を測定し、電極の直径と試験片の厚さ
から、磁器の抵抗率を計算した。その結果、試験
片10個の平均で2.0×1014Ω・cmであつた。 第2の試験片に関しては、スパン長20mmで試験
片を両持ち支持し、2つの支持箇所の中間点に曲
げ強度測定器によつて荷重を加え、最大曲げ荷重
と試験片の幅と厚みから曲げ強度(抗折強度)を
計算で求めた。その結果、試験片25個の平均で
2500Kg/cm2であつた。 第3の試験片に関しては、導電ペーストを印刷
し、同事焼成した後の配線導体の導電性を調べ
た。この結果、試料No.1及び本発明の範囲に属す
るすべての試料においては、配線導体として十分
に機能する導電性が得られた。 第1表の試料No.2〜20についても、原料組成及
び焼成温度を変えた他は、試料No.1と同一の条件
で各試験片を作り、同一の方法で特性を調べた。
[Industrial Field of Application] The present invention relates to a method for manufacturing insulating porcelain that can provide a single-layer or multi-layer circuit board. [Prior Art] A conventional insulating ceramic substrate is formed using alumina as a main component (90% by weight or more of alumina). However, in order to obtain an alumina porcelain substrate, the raw material mixture must be fired at a high temperature of 1500 to 1600°C, so the electrode material that can be used when simultaneously firing the raw material mixture green sheet and electrode material is molybdenum. , limited to high melting point metals such as tungsten, Au, Ag, Pd, Cu,
Metals such as Ni, which have excellent electrical properties but have low melting points, could not be used. Furthermore, since the firing temperature for obtaining the alumina ceramic substrate is high, the cost of the firing furnace has inevitably increased. In order to solve the above problems, alumina
Glass-based low-temperature fired porcelain was developed. This alumina-glass based low temperature fired porcelain is obtained by firing a mixture of alumina powder and glass powder in a weight ratio of approximately 1:1. This low-temperature fired porcelain is obtained by firing at temperatures below 1000℃, so
It becomes possible to co-fire with electrode materials such as low melting point Au, Ag, Pd, Cu, and Ni. [Problems to be solved by the invention] However, when manufacturing conventional low-temperature fired porcelain,
Since borosilicate glass, barium borosilicate glass, calcium borosilicate glass, lead borosilicate glass, etc. are used as the glass powder added to the alumina raw material, the raw material cost of the glass powder increases, and the cost of the finished porcelain increases. It inevitably got higher. To explain this in more detail, all of the above glasses are made by melting the raw materials at high temperatures, rapidly cooling them, and mechanically crushing the resulting glass lumps. Glass powder made in this way has poor productivity and is expensive. Further, the particle size of the glass powder needs to be at least 10 μm or less, preferably 5 μm or less. If glass is insufficiently pulverized and has a coarse particle size, it will have a significant negative effect on the properties of the ceramic after firing, especially its strength. For this reason, special care must be taken when shattering glass.
Poor productivity. Currently, the price of glass powder used for low-temperature firing porcelain with alumina glass diameter is 10,000 yen.
It is about yen/kg. Alumina powder is approximately 300 yen/Kg
Since it is much cheaper than glass powder, alumina-glass low-temperature firing ceramic, which is a 1:1 mixture of both in a weight ratio, costs about 5,000 yen/kg based on raw materials.
It turns out that. This price is quite high for a ceramic substrate for electronic components, and for this reason, low-temperature fired ceramic substrates have not become widespread. Therefore, an object of the present invention is to provide a manufacturing method that can significantly reduce the cost of low-temperature fired porcelain. [Means for Solving the Problems] The first invention of the present application for solving the above problems and achieving the above objects consists of 50 to 60 parts by weight of mullite and 25 to 35 parts by weight of danbrite. and 5-20
A method for producing insulating porcelain, which comprises preparing a mixture consisting of parts by weight of petalite and 2 to 8 parts by weight of forsterite, forming a molded body of this mixture, and firing this molded body. It is something. The second invention of the present application is characterized in that 1 to 5 parts by weight of chromium trioxide is further added to the mixture of the first invention to form a molded body, and this is fired. [Function] Since the mullite in the above invention contains 3Al 2 O 3 .2SiO 2 as a main component, it can provide an alumina component for porcelain. However, since this mullite mainly provides the alumina component in porcelain, if the amount of mullite in the porcelain raw material mixture is less than 50 parts by weight, it will not be possible to obtain porcelain with high strength; If the amount exceeds 1000℃
It becomes impossible or difficult to perform firing under the following conditions. Danburite is the main ingredient
Since it contains CaSi 2 B 2 O 8 , it functions as a glass component to enable low-temperature firing. Therefore, if the amount of Danbrite is less than 25 parts by weight,
It becomes difficult or impossible to fire at temperatures below 1000°C, and on the other hand, if it exceeds 35 parts by weight, the strength of the porcelain decreases. Petalite is also called petalite, and its main component is Li 2 O.
It contains Al 2 O 3 8SiO 2 . Therefore, it mainly provides a glass component to enable low-temperature firing, and if this amount is less than 5 parts by weight,
It becomes difficult to fire at temperatures below 1000°C, and if it exceeds 20 parts by weight, the insulation resistance of the porcelain will decrease. Forsterite contains 2MgO.SiO 2 as a main component and contributes to increasing the strength of porcelain. If this forsterite is less than 2 parts by weight, the strength of the porcelain will decrease,
If it exceeds 8 parts by weight, firing at temperatures below 1000°C becomes difficult or impossible. Chromium trioxide (Cr 2 O 3 ) in the second invention of the present application colors porcelain dark green.
If the amount of chromium trioxide is less than 1 part by weight, sufficient coloring is not possible, and if it exceeds 5 parts by weight, the strength of the porcelain decreases. Example 1 Next, Example 1 (including a comparative example) of the present invention will be described. In order to obtain the raw material composition shown in Sample No. 1 in Table 1, 550 g (55 parts by weight) of mullite powder, 300 g (30 parts by weight) of danburite powder, and 100 g of petalite powder were used.
(10 parts by weight) and 50 g (5 parts by weight) of forsterite powder were weighed and put into a ball mill. Next, 300 g of acetone as a solvent, 200 g of trichloroethylene, and 15 g of oleic acid as a dispersant were added to a ball mill and mixed for 24 hours. Next, 80 g of polyvinyl butyral resin powder as a binder and 80 g of dibutyl phthalate as a plasticizer were further added to the ball mill and mixed for 12 hours to form a slurry. Next, this slurry was slip casted using a doctor blade method and dried to a thickness of 0.8 mm.
Obtain a green sheet (unsintered porcelain sheet) of mm,
This was cut into 10cm squares. Next, three types of test pieces were made from this green sheet. The first test piece was obtained by punching out the green sheet into a disk shape with a diameter of 20 mm, and was used to examine insulation resistance. The second test piece was made by stacking three of the above green sheets at a temperature of 90℃ and a pressure of 250℃.
It was heat-pressed under the conditions of Kg/cm 2 and cut into pieces with a length of 40 mm and a width of 5 mm, and the thickness was approximately 2.2 mm.
mm. This second test piece is for testing resistance temperature. The third test piece was made by printing a conductive paste containing Ag-Pd as a main component on one main surface of the green sheet to form a wiring pattern, stacking two sheets, and adding conductive paste on top. Stack one green sheet that is not printed on it for a total of 3 sheets,
After crimping this, it was cut into pieces of 3 mm in length and 15 mm in width, and the thickness was approximately 2.2 mm. This third
The test piece is for examining the state of electrode formation when low melting point electrode materials are co-fired. Next, each test piece was heated in air from room temperature to the firing temperature of 940°C at a rate of 300°C per hour.
After maintaining the temperature for 2 hours, the mixture was cooled to room temperature and fired. Subsequently, each test piece after firing was tested in the following manner. For the first specimen, commercially available
By printing Ag paste and baking it at 800℃ in air, we formed an electrode with a diameter of 15mm and applied a voltage of DC100V.
The insulation resistance was measured, and the resistivity of the porcelain was calculated from the diameter of the electrode and the thickness of the test piece. As a result, the average resistance of 10 test pieces was 2.0×10 14 Ω·cm. Regarding the second test piece, the test piece was supported on both sides with a span length of 20 mm, and a load was applied to the midpoint between the two supporting points using a bending strength measuring device. The bending strength (flexural strength) was determined by calculation. As a result, the average of 25 test pieces was
It was 2500Kg/ cm2 . Regarding the third test piece, the conductivity of the wiring conductor was examined after printing a conductive paste and firing the same. As a result, in sample No. 1 and all the samples falling within the scope of the present invention, conductivity sufficient to function as a wiring conductor was obtained. Regarding Samples Nos. 2 to 20 in Table 1, test pieces were made under the same conditions as Sample No. 1, except that the raw material composition and firing temperature were changed, and the characteristics were examined using the same method.

【表】【table】

【表】 本発明の範囲に属する第1表の試料No.1〜12の
原料組成によれば、1000℃以下の焼成温度(880
℃〜1000℃)で所望特性(抗折強度が2000Kg/cm2
以上、絶縁抵抗が1.0×1013Ω・cm以上)の磁器を
提供することができる。 一方、試料No.13〜20に示す本発明の範囲外の原
料組成によれば、焼成温度が100℃であつても焼
結体が得られないか、焼結体が得られたとしても
抗折強度が2000Kg/cm2未満になるか、又は絶縁抵
抗が1×1013Ω・cm未満になる。 本発明における原料組成の限定理由は次の通り
である。 ムライトが試料No.2に示す如く50重量部の場合
には900℃の焼成で所望特性を得ることができる
が、試料No.13に示す如く48重量部の場合には、抗
折強度が所望値未満になる。従つて、ムライトの
望ましい範囲の下限は50重量部である。ムライト
が試料No.4に示す如く65重量部の場合には1000℃
の焼成で所望特性を得ることができるが、試料No.
14に示す如く67重量部の場合には1000℃の焼成で
も焼結体が得られない。従つてムライトの望まし
い範囲の上限は65重量部である。 ダンブライトが試料No.5に示す如く25重量部の
場合は1000℃の焼成で所望特性が得られるが、試
料No.15に示す如く23重量部の場合は1000℃で焼成
しても焼結体が得られない。従つて、ダンブライ
トの望ましい範囲の下限は25重量部である。ダン
ブライトが試料No.6に示す如く35重量部の場合に
は所望特性が得られるが、試料No.16に示す如く37
重量部の場合には抗折強度が所望値よりも低くな
る。従つてダンブライトの望ましい範囲の上限は
35重量部である。 ペタライトが試料No.7に示す如く5重量部の場
合には所望の特性が得られるが、試料No.17に示す
如く4重量部の場合には所望の特性が得られな
い。従つて、ペタライトの望ましい範囲の下限は
5重量部である。ペタライトが試料No.9に示す如
く20重量部の場合は所望の特性が得られるが、試
料No.18に示す如く22重量部の場合には絶縁抵抗が
所望値よりも低くなる。従つて、ペタライトの望
ましい範囲の上限は20重量部である。 フオルステライトが試料No.10に示す如く2重量
部の場合には所望の特性が得られるが、試料No.19
に示す如く1重量部の場合には絶縁抵抗が所望値
よりも低くなる。従つてフオルステライトの望ま
しい範囲の下限は2重量部である。フオルステラ
イトが試料No.12に示す如く8重量部の場合は所望
の特性が得られるが、試料No.20に示す如く10重量
部の場合には1000℃の焼成でも焼結体が得られな
い。従つて、フオルステライトの望ましい範囲の
上限は8重量部である。 実施例 2 実施例1で得られる磁器は白色である。従つ
て、レーザー光線による磁器基板の切断の際の効
率が悪い。この種の問題を解決するために着色し
た磁器が要求される場合がある。実施例1では着
色するために三酸化クロムを第2表の原料組成の
欄に示すように添加して磁器を作製した。なお、
第2表の試料No.21〜26の各試験片は、三酸化クロ
ム(Cr3O3)粉末原料組成に含めた他は、試料No.
1と同一の方法で作製し、同一の方法で特性を測
定した。
[Table] According to the raw material compositions of samples No. 1 to 12 in Table 1, which belong to the scope of the present invention, the firing temperature is 1000°C or less (880°C
desired properties (flexural strength of 2000Kg/cm 2 )
As described above, it is possible to provide porcelain with an insulation resistance of 1.0×10 13 Ω·cm or more. On the other hand, according to the raw material compositions shown in Sample Nos. 13 to 20, which are outside the range of the present invention, a sintered body cannot be obtained even at a firing temperature of 100°C, or even if a sintered body is obtained, it has a strong resistance. The bending strength is less than 2000 kg/cm 2 or the insulation resistance is less than 1×10 13 Ω·cm. The reasons for limiting the raw material composition in the present invention are as follows. When mullite is 50 parts by weight as shown in sample No. 2, the desired properties can be obtained by firing at 900°C, but when mullite is 48 parts by weight as shown in sample No. 13, the desired flexural strength cannot be obtained. becomes less than the value. Therefore, the lower end of the desired range for mullite is 50 parts by weight. When mullite is 65 parts by weight as shown in sample No. 4, the temperature is 1000℃.
The desired characteristics can be obtained by firing sample No.
As shown in No. 14, in the case of 67 parts by weight, a sintered body cannot be obtained even by firing at 1000°C. Therefore, the upper limit of the desired range for mullite is 65 parts by weight. When Danbrite is 25 parts by weight as shown in sample No. 5, the desired properties can be obtained by firing at 1000°C, but when it is 23 parts by weight as shown in sample No. 15, sintering does not occur even when fired at 1000°C. I can't get a body. Therefore, the lower end of the desirable range for Danbrite is 25 parts by weight. Desired characteristics can be obtained when Danbrite is 35 parts by weight as shown in Sample No. 6, but when 37 parts by weight is used as shown in Sample No. 16.
In the case of parts by weight, the bending strength becomes lower than the desired value. Therefore, the upper limit of Danbright's desirable range is
It is 35 parts by weight. When the petalite content is 5 parts by weight as shown in Sample No. 7, the desired properties are obtained, but when the content is 4 parts by weight as shown in Sample No. 17, the desired properties are not obtained. Therefore, the lower end of the desirable range for petalite is 5 parts by weight. When the amount of petalite is 20 parts by weight as shown in sample No. 9, the desired characteristics are obtained, but when it is 22 parts by weight as shown in sample No. 18, the insulation resistance becomes lower than the desired value. Therefore, the upper limit of the desired range for petalite is 20 parts by weight. When the amount of forsterite is 2 parts by weight as shown in sample No. 10, the desired characteristics can be obtained, but as shown in sample No. 19, the desired characteristics can be obtained.
As shown in Figure 2, when the amount is 1 part by weight, the insulation resistance becomes lower than the desired value. Therefore, the lower limit of the desirable range for forsterite is 2 parts by weight. When the amount of forsterite is 8 parts by weight as shown in sample No. 12, the desired properties can be obtained, but when it is 10 parts by weight as shown in sample No. 20, a sintered body cannot be obtained even when fired at 1000 ° C. . Therefore, the upper limit of the desirable range for forsterite is 8 parts by weight. Example 2 The porcelain obtained in Example 1 is white. Therefore, the efficiency when cutting a ceramic substrate with a laser beam is poor. Colored porcelain may be required to solve this type of problem. In Example 1, porcelain was produced by adding chromium trioxide for coloring as shown in the raw material composition column of Table 2. In addition,
Each test piece of Samples Nos. 21 to 26 in Table 2 was sample No. 2, except that chromium trioxide (Cr 3 O 3 ) powder was included in the raw material composition.
It was produced using the same method as No. 1, and the characteristics were measured using the same method.

【表】 第2表の試料No.21〜24から明らかな如く、三酸
化クロムを1〜5重量部の範囲で添加すると、磁
器は緑、又は濃緑に着色され、且つ1000℃以下の
焼成で所望の特性が得られる。 一方、三酸化クロムの割合が試料No.25に示す如
く0.5重量部の場合は薄緑に着色されるのみであ
り、着色が不十分である。また三酸化クロムの割
合が試料No.26に示す如く6重量部の場合には着色
は十分であつても抗折強度が所望値よりも低くな
る。従つて、三酸化クロムの割合の好ましい範囲
は1〜5重量部である。 実施例 3 実施例1及び2では原料組成物の成形体を空気
中(酸化雰囲気中)で焼成したが、非酸化雰囲気
(中性又は還元性雰囲気)で焼成しても差し支え
ないことを調べるために、試料No.1と同一の方法
で試料No.1の第1、第2及び第3の試験片と同じ
試験片を作製した。但し、第3の試験片の導体ペ
ーストはAg−Pdペーストの代りにニツケルを主
成分とする導体ペーストを使用した。 次に、第1、第2及び第3の試験片を、空気中
で室温から600℃まで毎時300℃の割合で昇温し、
600℃を1時間維持した後、雰囲気を空気から
N290容積%、H210容積%からなる還元性雰囲気
(非酸化性雰囲気)に変えて600℃〜940℃まで毎
時300℃の割合で昇温し、940℃を2時間保持した
後、室温まで冷却することにより焼成した。 続いて、焼成後の第1の試験片については、そ
の両面に市販のCubペーストを印刷し、N2中で
800℃で焼付けることにより直径15mmの電極を形
成した。しかる後試料No.1の場合と同様に磁器の
抵抗率を求めた結果、試験片10個の平均で2.1×
1014Ω・cmであり、試料No.1と大差なかつた。ま
た焼成後の第2の試験片については、試料No.1と
同様な方法と条件で抗折強度を求めた結果、試験
片25個の平均で2500Kg/cm2であり、試料No.1と同
じ値であつた。また第3の試験片については、配
線導体として機能するニツケル層が得られている
ことが確認された。 試料No.22と同一の原料組成の各試験片も上記と
同様な方法で還元性雰囲気で焼成し、特性を測定
したところ、絶縁抵抗は2.0×1014Ω・cm、抗折強
度は2500Kg/cm2と空気中焼成の場合と大差なかつ
た。また着色に関しても、空気中焼成の試験片と
上記条件による試験片との間で差異は認められな
かつた。 [変形例] 本発明は上述の実施例に限定されるものではな
く、例えば次の変形例が可能なものである。 (1) 実施例1における酸化性雰囲気の焼成温度を
好ましく800℃〜1000℃の範囲で種々変えるこ
とができる。また、電極材料との関係で必要に
応じて1000℃よい高い温度で焼成してもよい。 (2) 実施例3における非酸化性雰囲気の焼成温度
を好ましくは800℃〜1000℃の範囲で種々変え
ることができる。また、電極材料との関係で必
要に応じて1000℃より高い温度で焼成してもよ
い。 (3) 実施例3の焼成工程において、還元性雰囲気
での焼成後に、酸化性雰囲気で500℃〜700℃程
度の温度で酸化加熱処理を施してもよい。 (4) 実施例3の焼成工程における酸化性雰囲気の
加熱処理を、500℃〜700℃程度の範囲の別の温
度で行うようにしてもよい。なお、酸化性雰囲
気及び還元性雰囲気の加熱温度は電極材料との
関係を考慮して決定しなければならない。 (5) 本発明の目的を阻害しない範囲で原料組成に
種々の添加物が含まれても差し支えない。 (6) グリーンシートを作成せずに、型を使用して
原料混合物の成形体を得る場合にも適用可能で
ある。 [発明の効果] 上述から明らかな如く、本発明では、従来の如
くアルミナ原料粉末とガラス粉末とを個々に用意
する必要がなく、天然の鉱物であるムライト、ダ
ンブライト、ペタライト、フオルステライトの各
粉末を混合、成形、焼成することによつて磁器が
得られる。従つて、磁器のコストを大幅に下げる
ことができる。即ち、従来のアルミナ−ガラス系
磁器の場合は、アルミナ粉末とガラス粉末との原
料コストが約500円/Kgであつたが、本発明の原
料コストは約250円/Kgとなり、従来の約20分の
1になる。 また、本発明によれば、1000℃以下の焼成で、
抗折強度が2000Kg/cm2以上、絶縁抵抗が1013Ω・
cm以上の磁器を得ることができる。従つて、多層
回路基板を作製する時に、Au、Ag、Pd、Cu、
Ni等の低融点金属材料を使用することが可能に
なる。また、非酸化性雰囲気で焼成することが可
能であるので、Ni、Cu等の卑金属を電極材料と
することができる。 本願の第2番目の発明によれば、緑色に着色さ
れ且つ所望特性を有する磁器を1000℃以下の低温
焼成で得ることができる。
[Table] As is clear from Samples No. 21 to 24 in Table 2, when chromium trioxide is added in the range of 1 to 5 parts by weight, the porcelain is colored green or dark green, and it cannot be fired at temperatures below 1000℃. Desired properties are obtained. On the other hand, when the proportion of chromium trioxide is 0.5 parts by weight as shown in sample No. 25, the sample is only colored light green, and the coloring is insufficient. Further, when the proportion of chromium trioxide is 6 parts by weight as shown in sample No. 26, the bending strength becomes lower than the desired value even though the coloring is sufficient. Therefore, the preferred range of the proportion of chromium trioxide is 1 to 5 parts by weight. Example 3 In Examples 1 and 2, the molded bodies of the raw material compositions were fired in air (in an oxidizing atmosphere), but in order to investigate whether they could be fired in a non-oxidizing atmosphere (neutral or reducing atmosphere). Next, test pieces identical to the first, second, and third test pieces of Sample No. 1 were prepared in the same manner as Sample No. 1. However, as the conductive paste for the third test piece, a conductive paste containing nickel as a main component was used instead of the Ag-Pd paste. Next, the first, second and third test pieces were heated in air from room temperature to 600°C at a rate of 300°C per hour,
After maintaining the temperature at 600℃ for 1 hour, remove the atmosphere from air.
The atmosphere was changed to a reducing atmosphere (non-oxidizing atmosphere) consisting of 90% by volume of N 2 and 10% by volume of H 2 , the temperature was raised from 600°C to 940°C at a rate of 300°C per hour, and after holding at 940°C for 2 hours, It was fired by cooling to room temperature. Next, for the first test piece after firing, commercially available Cub paste was printed on both sides, and it was soaked in N2.
Electrodes with a diameter of 15 mm were formed by baking at 800°C. After that, the resistivity of the porcelain was determined in the same way as for sample No. 1, and the average of the 10 test pieces was 2.1×
10 14 Ω·cm, which was not much different from sample No. 1. In addition, the bending strength of the second test piece after firing was determined using the same method and conditions as sample No. 1, and the average of 25 test pieces was 2500 Kg/cm 2 , which was the same as sample No. 1. The values were the same. Further, regarding the third test piece, it was confirmed that a nickel layer functioning as a wiring conductor was obtained. Each test piece with the same raw material composition as sample No. 22 was fired in a reducing atmosphere in the same manner as above, and its properties were measured. The insulation resistance was 2.0 x 10 14 Ωcm, and the bending strength was 2500 kg/cm. cm 2 was not significantly different from that in the case of firing in air. Also, regarding coloration, no difference was observed between the test pieces fired in air and the test pieces under the above conditions. [Modifications] The present invention is not limited to the above-described embodiments, and, for example, the following modifications are possible. (1) The firing temperature of the oxidizing atmosphere in Example 1 can be varied within the range of preferably 800°C to 1000°C. Furthermore, depending on the electrode material, firing may be performed at a higher temperature such as 1000° C. or higher. (2) The firing temperature of the non-oxidizing atmosphere in Example 3 can be varied, preferably within the range of 800°C to 1000°C. Furthermore, baking may be performed at a temperature higher than 1000° C. if necessary depending on the electrode material. (3) In the firing step of Example 3, after firing in a reducing atmosphere, oxidative heat treatment may be performed in an oxidizing atmosphere at a temperature of about 500°C to 700°C. (4) The heat treatment in the oxidizing atmosphere in the firing step of Example 3 may be performed at another temperature in the range of approximately 500°C to 700°C. Note that the heating temperatures of the oxidizing atmosphere and the reducing atmosphere must be determined in consideration of the relationship with the electrode material. (5) Various additives may be included in the raw material composition as long as they do not impede the purpose of the present invention. (6) It is also applicable when using a mold to obtain a molded body of the raw material mixture without creating a green sheet. [Effects of the Invention] As is clear from the above, in the present invention, there is no need to separately prepare alumina raw material powder and glass powder as in the past, and each of the natural minerals mullite, damburite, petalite, and forsterite can be prepared separately. Porcelain is obtained by mixing, molding, and firing the powders. Therefore, the cost of porcelain can be significantly reduced. That is, in the case of conventional alumina-glass porcelain, the raw material cost of alumina powder and glass powder was about 500 yen/Kg, but the raw material cost of the present invention is about 250 yen/Kg, which is lower than the conventional cost of about 200 yen/Kg. It becomes 1/1. Furthermore, according to the present invention, by firing at 1000°C or less,
The bending strength is 2000Kg/cm2 or more, and the insulation resistance is 10 13 Ω.
You can get porcelain larger than cm. Therefore, when manufacturing multilayer circuit boards, Au, Ag, Pd, Cu,
It becomes possible to use low melting point metal materials such as Ni. Furthermore, since it is possible to perform firing in a non-oxidizing atmosphere, base metals such as Ni and Cu can be used as electrode materials. According to the second invention of the present application, porcelain that is colored green and has desired characteristics can be obtained by firing at a low temperature of 1000°C or less.

Claims (1)

【特許請求の範囲】 1 50〜65重量部のムライトと、 25〜35重量部のダンブライトと、 5〜20重量部のペタライトと、 2〜8重量部のフオルステライトと から成る混合物を用意し、この混合物の成形体を
形成し、この成形体を焼成することを特徴とする
絶縁性磁器の製造方法。 2 前記混合物の成形体を形成することは、前記
混合物のグリーンシートを形成し、このグリーン
シートを所望形状に切断することである特許請求
の範囲第1項記載の絶縁性磁器の製造方法。 3 前記焼成は、前記成形体を酸化性雰囲気、
800℃〜1000℃の範囲の温度で焼成することであ
る特許請求の範囲第1項又は第2項記載の絶縁性
磁器の製造方法。 4 前記焼成は、前記成形体を酸化性雰囲気で
500℃〜700℃の範囲で加熱処理し、且つ非酸化性
雰囲気で800℃〜1000℃の範囲で焼成することで
ある特許請求の範囲第1項又は第2項記載の絶縁
性磁器の製造方法。 5 50〜65重量部のムライトと、 25〜35重量部のダンブライトと、 5〜20重量部のペタライトと、 2〜8重量部のフオルステライトと、 1〜5重量部の三酸化クロムと の混合物を用意し、この混合物の成形体を形成
し、この成形体を焼成することを特徴とする絶縁
性磁器の製造方法。 6 前記混合物の成形体を形成することは、前記
混合物のグリーンシートを形成し、このグリーン
シートを所望形状に切断することである特許請求
の範囲第5項記載の絶縁性磁器の製造方法。 7 前記焼成は、前記成形体を酸化性雰囲気、
800℃〜1000℃の範囲の温度で焼成することであ
る特許請求の範囲第5項又は第6項記載の絶縁性
磁器の製造方法。 8 前記焼成は、前記成形体を酸化性雰囲気で
500℃〜700℃の範囲の温度で熱処理し、且つ非酸
化性雰囲気で800℃〜1000℃の範囲の温度で焼成
することである特許請求の範囲第5項又は第6項
記載の絶縁性磁器の製造方法。
[Claims] 1. A mixture consisting of 50 to 65 parts by weight of mullite, 25 to 35 parts by weight of damburite, 5 to 20 parts by weight of petalite, and 2 to 8 parts by weight of forsterite is prepared. A method for producing insulating porcelain, which comprises forming a molded body of this mixture and firing the molded body. 2. The method for manufacturing insulating porcelain according to claim 1, wherein forming a molded body of the mixture includes forming a green sheet of the mixture and cutting the green sheet into a desired shape. 3 The firing involves placing the molded body in an oxidizing atmosphere,
3. The method for producing insulating porcelain according to claim 1 or 2, which comprises firing at a temperature in the range of 800°C to 1000°C. 4 The above-mentioned calcination is performed by heating the above-mentioned molded body in an oxidizing atmosphere.
The method for producing insulating porcelain according to claim 1 or 2, which comprises heat treating at a temperature of 500°C to 700°C and firing at a temperature of 800°C to 1000°C in a non-oxidizing atmosphere. . 5 50 to 65 parts by weight of mullite, 25 to 35 parts by weight of damburite, 5 to 20 parts by weight of petalite, 2 to 8 parts by weight of forsterite, and 1 to 5 parts by weight of chromium trioxide. A method for producing insulating porcelain, comprising preparing a mixture, forming a molded body of the mixture, and firing the molded body. 6. The method for manufacturing insulating porcelain according to claim 5, wherein forming a molded body of the mixture includes forming a green sheet of the mixture and cutting the green sheet into a desired shape. 7 The firing involves placing the molded body in an oxidizing atmosphere,
7. The method for producing insulating porcelain according to claim 5 or 6, which comprises firing at a temperature in the range of 800°C to 1000°C. 8 In the firing, the molded body is placed in an oxidizing atmosphere.
The insulating porcelain according to claim 5 or 6, which is heat treated at a temperature in the range of 500°C to 700°C and fired at a temperature in the range of 800°C to 1000°C in a non-oxidizing atmosphere. manufacturing method.
JP62134079A 1987-05-29 1987-05-29 Production of insulating ceramic Granted JPS63297264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62134079A JPS63297264A (en) 1987-05-29 1987-05-29 Production of insulating ceramic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62134079A JPS63297264A (en) 1987-05-29 1987-05-29 Production of insulating ceramic

Publications (2)

Publication Number Publication Date
JPS63297264A JPS63297264A (en) 1988-12-05
JPH0475868B2 true JPH0475868B2 (en) 1992-12-02

Family

ID=15119909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62134079A Granted JPS63297264A (en) 1987-05-29 1987-05-29 Production of insulating ceramic

Country Status (1)

Country Link
JP (1) JPS63297264A (en)

Also Published As

Publication number Publication date
JPS63297264A (en) 1988-12-05

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