JPH0476204B2 - - Google Patents
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- Publication number
- JPH0476204B2 JPH0476204B2 JP58231822A JP23182283A JPH0476204B2 JP H0476204 B2 JPH0476204 B2 JP H0476204B2 JP 58231822 A JP58231822 A JP 58231822A JP 23182283 A JP23182283 A JP 23182283A JP H0476204 B2 JPH0476204 B2 JP H0476204B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- melt
- substrate
- liquid phase
- phase epitaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2913—Materials being Group IIB-VIA materials
- H10P14/2917—Tellurides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/263—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using melted materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
- H10P14/3432—Tellurides
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は化合物半導体混晶の液相エピタキシヤ
ル結晶成長方法および装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method and apparatus for liquid phase epitaxial growth of compound semiconductor mixed crystals.
(b) 技術の背景
水銀(Hg)を含む化合物半導体結晶、例えば
水銀・カドミウム・テルル(Hg1-xCdxTe)等は
エネルギーギヤツプが狭く、赤外検知素子のよう
な光電変換素子の形成材料として用いられてい
る。(b) Technical background Compound semiconductor crystals containing mercury (Hg), such as mercury-cadmium-tellurium (Hg 1-x Cd x Te), have a narrow energy gap and are suitable for photoelectric conversion elements such as infrared detection elements. It is used as a forming material.
このようなHg1-xCdxTeの結晶を素子形成に都
合がよいように大きい面積で、しかも薄層の状態
で形成する方法として液相エピタキシヤル成長法
がある。 Liquid phase epitaxial growth is a method for forming such Hg 1-x Cd x Te crystals in a large area and in a thin layer for convenient device formation.
Hg1-xCdxTeのエピタキシヤル結晶は、通常石
英アンプルを傾斜してエピタキシヤル成長を行う
テイツピング(Tipping)方式、あるいはカーボ
ン製のスライドボートを用いた所謂ボートスライ
ド方式等の液相エピタキシヤル成長法によつて、
例えばホルル化カドミウム(CdTe)の結晶基板
上に結晶層として形成している。 Epitaxial crystals of Hg 1-x Cd x Te are usually grown using a liquid phase epitaxial method such as the Tipping method in which epitaxial growth is performed by tilting a quartz ampoule, or the so-called boat slide method using a carbon slide boat. By the growth method,
For example, it is formed as a crystal layer on a crystal substrate of cadmium foruride (CdTe).
これらの方法によつて得られた結晶は、半導体
発光、受光装置の特性および信頼性を支配するた
め、組成の安定化、欠陥の低減が要望される。 Crystals obtained by these methods govern the characteristics and reliability of semiconductor light emitting and light receiving devices, and are therefore required to have a stable composition and a reduction in defects.
(c) 従来技術と問題点
化合物半導体のLPE法として広く用いられて
いるボート・スライド法を第1図に示す。(c) Conventional technology and problems Figure 1 shows the boat slide method, which is widely used as an LPE method for compound semiconductors.
図において1は固定部、2はスライド部でいづ
れもカーボンよりなる。固定部にはくぼみ3およ
び4が設けられ、スライド部には孔5が設けられ
ている。くぼみ3には基板結晶6を、くぼみ4に
はソース・ウエハ(溶質源結晶)7を収容する。
基板結晶6の上にエピタキシヤル結晶成長を行
う。 In the figure, 1 is a fixed part and 2 is a sliding part, both of which are made of carbon. The fixed part is provided with recesses 3 and 4, and the sliding part is provided with a hole 5. A substrate crystal 6 is housed in the cavity 3, and a source wafer (solute source crystal) 7 is housed in the cavity 4.
Epitaxial crystal growth is performed on the substrate crystal 6.
まづ第1図aにおいて、所定の比率で結晶成分
をスライド部の孔5に入れ、所定温度で所定時間
置いて或る成分が未飽和のメルト(溶液)8を得
る。 First, in FIG. 1a, crystal components are put into the holes 5 of the slide part at a predetermined ratio and left at a predetermined temperature for a predetermined time to obtain a melt (solution) 8 in which a certain component is unsaturated.
つぎに第1図bにおいて、スライド部を動かし
未飽和メルト8をソース・ウエハ7上に導いて接
触させ、所定温度で所定時間保持する。この間に
おいて未飽和成分はソース・ウエハ7より未飽和
メルト8に溶解して飽和メルト8Aとなる。反対
にメルトが過飽和のときは過飽和成分がソース・
ウエハ7に析出してメルトは飽和し平衡溶液とな
る。 Next, in FIG. 1b, the slide section is moved to guide the unsaturated melt 8 onto the source wafer 7 and bring it into contact with it, and hold it at a predetermined temperature for a predetermined time. During this time, the unsaturated components are dissolved from the source wafer 7 into the unsaturated melt 8 to become a saturated melt 8A. Conversely, when the melt is supersaturated, the supersaturated components are
The melt is deposited on the wafer 7 and becomes saturated to become an equilibrium solution.
つぎに第1図cにおいて、さらにスライド部を
動かし飽和メルト8Aを基板結晶6に接触させ
て、所定温度で所定時間保持する。 Next, in FIG. 1c, the slide portion is further moved to bring the saturated melt 8A into contact with the substrate crystal 6 and hold it at a predetermined temperature for a predetermined time.
このようにしてメルトの成分と保持温度、時間
を制御して基板結晶6の上に所期の組成と厚さの
エピタキシヤル結晶を成長させることができる。 In this way, an epitaxial crystal having a desired composition and thickness can be grown on the substrate crystal 6 by controlling the melt components, holding temperature, and time.
第2図はテイツピング式LPE法の従来例で、
結晶成長装置の石英管に直角な断面を示す。図に
おいて第1図と同一番号は同一対象を、21は石
英管、22は石英よりなる基板結晶の保持板を示
す。 Figure 2 shows a conventional example of the taping type LPE method.
A cross section perpendicular to the quartz tube of the crystal growth apparatus is shown. In the figure, the same numbers as in FIG. 1 indicate the same objects, 21 indicates a quartz tube, and 22 indicates a holding plate for a substrate crystal made of quartz.
第2図aにおいて、基板結晶6とソース・ウエ
ハ7を保持板22の両面に夫々保持して保持板を
水平に保ち、保持板と離れてその下側に不飽和の
メルト8を所定温度で所定時間保持する。 In FIG. 2a, a substrate crystal 6 and a source wafer 7 are held on both sides of a holding plate 22, the holding plate is held horizontally, and an unsaturated melt 8 is placed on the underside of the holding plate at a predetermined temperature. Hold for a predetermined time.
つぎに第2図bにおいて、第2図aの状態より
石英管21を右に回転して保持板22が下側より
垂直に立つようにするとメルト8はソース・ウエ
ハ7に接触し、所定温度で所定時間保持する。こ
の間に不飽和のメルト8は第1図で説明したよう
に平衡状態に達し、飽和のメルト8Aを得る。 Next, in FIG. 2b, when the quartz tube 21 is rotated to the right from the state shown in FIG. Hold for a specified period of time. During this time, the unsaturated melt 8 reaches an equilibrium state as explained in FIG. 1, and a saturated melt 8A is obtained.
つぎに第2図cにおいて、第2図bの状態より
石英管21を左に回転して保持板22を水平に
し、基板結晶6をメルト8Aに接触させて基板結
晶6上にエピタキシヤル成長を行う。所定温度で
所定時間保持し所定冷却速度で冷却して所期の組
成と厚さのエピタキシヤル結晶層を得る。 Next, in FIG. 2c, the quartz tube 21 is rotated to the left from the state shown in FIG. conduct. The epitaxial crystal layer is maintained at a predetermined temperature for a predetermined time and cooled at a predetermined cooling rate to obtain an epitaxial crystal layer having a predetermined composition and thickness.
上記従来方法においては、基板結晶6とソー
ス・ウエハ7が同一結晶のときでも2枚の結晶を
用意しなければならず、特に結晶成分の蒸気圧の
高い場合に用いられる閉管式のエピタキシヤル成
長においては結晶成分の蒸発を防ぐため石英管2
1内の自由空間を小さくするよう考慮する必要が
あり、石英管内の構成はできるだけ簡単にする方
がよい。 In the conventional method described above, even when the substrate crystal 6 and the source wafer 7 are the same crystal, two crystals must be prepared. During growth, a quartz tube 2 was used to prevent evaporation of crystal components.
Consideration must be given to reducing the free space within the quartz tube, and it is better to make the configuration within the quartz tube as simple as possible.
(d) 発明の目的
本発明の目的は従来技術の有する上記の欠点を
除去し、基板結晶の裏面をソース・ウエハとして
用いることにより、別にソース・ウエハを用意す
ることなくメルトを平衡状態に保ち、安定な成長
が行える液相エピタキシヤル結晶成長方法および
装置を提供することにある。(d) Purpose of the Invention The purpose of the present invention is to eliminate the above drawbacks of the prior art, and to maintain the melt in an equilibrium state by using the back side of the substrate crystal as a source wafer without preparing a separate source wafer. An object of the present invention is to provide a liquid phase epitaxial crystal growth method and apparatus that allow stable growth.
(e) 発明の構成
上記の目的は本発明によれば、
1 基板結晶上に液相エピタキシヤル法にて結晶
成長するに際し、予め該基板結晶の裏面を未飽
和メルトに接触させて、該未飽和メルトを飽和
させる工程と、その後該飽和メルトを該基板表
面に接触させて降温し該基板表面に結晶を成長
させる工程を有することを特徴とする液相エピ
タキシヤル結晶成長方法。(e) Structure of the Invention According to the present invention, the above object is achieved by: 1. When growing a crystal on a substrate crystal by a liquid phase epitaxial method, the back surface of the substrate crystal is brought into contact with an unsaturated melt in advance, and the unsaturated melt is grown on the substrate crystal. 1. A liquid phase epitaxial crystal growth method comprising the steps of: saturating a saturated melt; and then bringing the saturated melt into contact with the substrate surface to lower the temperature and grow crystals on the substrate surface.
2 飽和メルトから基板結晶上に結晶を析出させ
る液相エピタキシヤル結晶成長装置において、
水平な回転軸を有するメルト保持容器を該回転
軸に平行に該試料容器を2室に分離する基板保
持板と、該基板保持板に開孔され、該基板結晶
に表裏面がそれぞれ該2室に露出するように該
基板板結晶を保持する貫通孔と、該該基板結晶
保持板に設けられ、該メルト保持容器が前記回
転軸を軸として回転することにより、該メルト
が該2室間にて移動可能となるために開口部と
を有することを特徴とする液相エピタキシヤル
結晶成長装置。2. In a liquid phase epitaxial crystal growth apparatus that deposits crystals on a substrate crystal from a saturated melt,
A substrate holding plate that separates a melt holding container having a horizontal rotational axis into two chambers parallel to the rotational axis; and a substrate holding plate having a hole formed in the substrate holding plate and having a front and a back surface of the substrate crystal respectively separated into two chambers; A through hole is provided in the substrate crystal holding plate to hold the substrate plate crystal so as to be exposed to the melt, and when the melt holding container rotates about the rotation axis, the melt is transferred between the two chambers. What is claimed is: 1. A liquid phase epitaxial crystal growth apparatus, characterized in that it has an opening so that the liquid phase epitaxial crystal growth apparatus can be moved.
を提供することによつて達成される。This is achieved by providing
本発明は、これからその上にエピタキシヤル結
晶を成長しようとする基板結晶と、メルトが飽和
して平衡状態に達するために用いられるソース・
ウエハが同一結晶の場合に適用でき、使用する結
晶基板の節約と、結晶成長装置内構成の単純化に
より安定な成長を狙つたものである。 The present invention combines a substrate crystal on which an epitaxial crystal is to be grown and a source material used to saturate the melt and reach an equilibrium state.
This method can be applied when the wafers are of the same crystal, and aims to achieve stable growth by saving the number of crystal substrates used and by simplifying the internal structure of the crystal growth apparatus.
(f) 発明の実施例
第3図は本発明の一実施例を示す保持板の実体
図で、第4図はこの保持板を閉管テイツピイング
式液相エピタキシヤル結晶成長方法に適用した例
を示す。図で前図と同一番号は同一対象を示す。(f) Embodiment of the Invention Fig. 3 is an actual diagram of a holding plate showing an embodiment of the present invention, and Fig. 4 shows an example in which this holding plate is applied to a closed-tube tapering liquid phase epitaxial crystal growth method. . In the figure, the same numbers as in the previous figure indicate the same objects.
第3図において、31は本発明に係る基板結晶
保持板、32は基板結晶を収容するくぼみ、33
は貫通孔を示しここで収容された基板結晶6の裏
面が露出するようになつている。 In FIG. 3, 31 is a substrate crystal holding plate according to the present invention, 32 is a recess for accommodating the substrate crystal, and 33
indicates a through hole through which the back surface of the substrate crystal 6 housed is exposed.
第4図aにおいて、基板結晶としてCdTe6を
保持板32に下面に保持して保持板を水平に保
ち、保持板と離れてその下側に不飽和のメルトと
して(Hg1-yCdy)1-zTez(y=0.8,z=0.1)8を
500℃で60分保持する。 In Fig. 4a, CdTe6 as a substrate crystal is held on the lower surface by a holding plate 32, keeping the holding plate horizontal, and unsaturated melt (Hg 1-y Cd y ) 1 is separated from the holding plate and placed below it. -z Te z (y=0.8, z=0.1)8
Hold at 500℃ for 60 minutes.
つぎに第4図bにおいて、第4図aの状態より
石英管21を右に回転して保持板32が下側より
垂直に立つようにするとメルト8はCdTe基板結
晶6の裏面に接触し、500℃で60分保持する。こ
の間に不飽和のメルト8は第1図で説明したよう
に平衡状態に達し、飽和のメルト8Aを得る。 Next, in FIG. 4b, when the quartz tube 21 is rotated to the right from the state shown in FIG. 4a so that the holding plate 32 stands vertically from the bottom, the melt 8 contacts the back surface of the CdTe substrate crystal 6 Hold at 500℃ for 60 minutes. During this time, the unsaturated melt 8 reaches an equilibrium state as explained in FIG. 1, and a saturated melt 8A is obtained.
つぎに第4図cにおいて、第4図bの状態より
石英管21を左に回転して保持板32を水平に
し、基板結晶6をメルト8Aに接触させて基板結
晶6上にエピタキシヤル成長を行う。500℃で60
分保持し、0.05℃/分の冷却速度で100分冷却す
る。所期の組成Hg1-xCdxTe(x=0.3)を有する
厚さ10μmのエピタキシヤル結晶層を得る。 Next, in FIG. 4c, the quartz tube 21 is rotated to the left from the state shown in FIG. 4b to make the holding plate 32 horizontal, and the substrate crystal 6 is brought into contact with the melt 8A to cause epitaxial growth on the substrate crystal 6. conduct. 60 at 500℃
Cool for 100 minutes at a cooling rate of 0.05°C/min. A 10 μm thick epitaxial crystal layer having the desired composition Hg 1-x Cd x Te (x=0.3) is obtained.
(g) 発明の効果
以上詳細に説明した様に本発明によれば、基板
結晶の裏面をソース・ウエハとして用いることに
より、別のソース・ウエハを用意することなくメ
ルトを平衡状態に保ち、安定な成長が行える液相
エピタキシヤル結晶成長方法および装置を提供す
ることができる。(g) Effects of the Invention As explained in detail above, according to the present invention, by using the back side of the substrate crystal as a source wafer, the melt can be kept in an equilibrium state and stabilized without preparing a separate source wafer. It is possible to provide a liquid phase epitaxial crystal growth method and apparatus that can perform growth.
第1図、第2図は従来例による液相エピタキシ
ヤル結晶成長方法、第3図は本発明に係る基板結
晶保持板の実体図、第4図は本発明に係る液相エ
ピタキシヤル結晶成長方法を示す。
図において1は固定部、2はスライド部、3,
4はくぼみ、5は孔、6は基板結晶、7はソー
ス・ウエハ、8は不飽和メルト、8Aは飽和メル
ト、21は石英管、22,31は基板結晶保持
板、32はくぼみ、33は貫通孔を示す。
1 and 2 are conventional liquid phase epitaxial crystal growth methods, FIG. 3 is an actual diagram of a substrate crystal holding plate according to the present invention, and FIG. 4 is a liquid phase epitaxial crystal growth method according to the present invention. shows. In the figure, 1 is a fixed part, 2 is a sliding part, 3,
4 is a depression, 5 is a hole, 6 is a substrate crystal, 7 is a source wafer, 8 is an unsaturated melt, 8A is a saturated melt, 21 is a quartz tube, 22 and 31 are substrate crystal holding plates, 32 is a depression, 33 is a A through hole is shown.
Claims (1)
成長するに際し、予め該基板結晶の裏面を未飽和
メルトに接触させて、該未飽和メルトを飽和させ
る工程と、その後該飽和メルトを該基板表面に接
触させて降温し該基板表面に結晶を成長させる工
程とを有することを特徴とする液相エピタキシヤ
ル結晶成長方法。 2 飽和メルトから基板結晶上に結晶を析出させ
る液相エピタキシヤル結晶成長装置において、水
平な回転軸を有するメルト保持容器を該回転軸に
平行に該試料容器を2室に分離する基板保持板
と、該基板保持板に開孔され、該基板結晶に表裏
面がそれぞれ該2室に露出するように該基板結晶
を保持する貫通孔と、該該基板結晶保持板に設け
られ、該メルト保持容器が前記回転軸を軸として
回転することにより、該メルトが該2室間にて移
動可能となるために開口部とを有することを特徴
とする液相エピタキシヤル結晶成長装置。[Scope of Claims] 1. When growing a crystal on a substrate crystal by liquid phase epitaxial method, a step of bringing the back surface of the substrate crystal into contact with an unsaturated melt in advance to saturate the unsaturated melt; 1. A liquid phase epitaxial crystal growth method comprising the step of bringing a saturated melt into contact with the substrate surface to lower the temperature and growing a crystal on the substrate surface. 2. In a liquid phase epitaxial crystal growth apparatus for depositing crystals on a substrate crystal from a saturated melt, a melt holding container having a horizontal rotational axis is separated into two chambers by a substrate holding plate that separates the sample container into two chambers parallel to the rotational axis. , a through hole formed in the substrate holding plate and holding the substrate crystal so that the front and back surfaces of the substrate crystal are exposed to the two chambers, respectively; and a through hole provided in the substrate crystal holding plate and holding the melt holding container. A liquid phase epitaxial crystal growth apparatus characterized in that the liquid phase epitaxial crystal growth apparatus has an opening so that the melt can be moved between the two chambers by rotating around the rotation axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58231822A JPS60123024A (en) | 1983-12-08 | 1983-12-08 | Liquid-phase epitaxial crystal growth method and device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58231822A JPS60123024A (en) | 1983-12-08 | 1983-12-08 | Liquid-phase epitaxial crystal growth method and device thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60123024A JPS60123024A (en) | 1985-07-01 |
| JPH0476204B2 true JPH0476204B2 (en) | 1992-12-03 |
Family
ID=16929558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58231822A Granted JPS60123024A (en) | 1983-12-08 | 1983-12-08 | Liquid-phase epitaxial crystal growth method and device thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60123024A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5159074A (en) * | 1974-11-20 | 1976-05-22 | Tokyo Shibaura Electric Co | EKISOSEICHOSOCHI |
| JPS5228107A (en) * | 1975-08-28 | 1977-03-02 | Taiho Kensetsu Kk | Excavating bucket |
-
1983
- 1983-12-08 JP JP58231822A patent/JPS60123024A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60123024A (en) | 1985-07-01 |
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